CN213411521U - Semiconductor material grinds machine - Google Patents
Semiconductor material grinds machine Download PDFInfo
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- CN213411521U CN213411521U CN202022299261.1U CN202022299261U CN213411521U CN 213411521 U CN213411521 U CN 213411521U CN 202022299261 U CN202022299261 U CN 202022299261U CN 213411521 U CN213411521 U CN 213411521U
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- grinder
- semiconductor material
- grinding
- roller shaft
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Abstract
The utility model relates to a semiconductor processing technology field, concretely relates to semiconductor material grinds machine, include: the top of the base is provided with a lower grinder, and the top of the lower grinder is provided with a grinding plane which moves horizontally and linearly; the upper grinder is arranged above the base through an adjusting bracket, and the bottom of the upper grinder is provided with a horizontal grinding plane vertical to the working direction of the upper grinder; the middle positioning sheet is horizontally arranged between the lower grinder and the upper grinder, and a die hole which simultaneously corresponds to the grinding planes of the lower grinder and the upper grinder is formed in the center of the middle positioning sheet; the first driver of the lower grinder and the second driver of the upper grinder are electrically connected with the controller respectively, and the controller is electrically connected with the power supply. The utility model discloses grind two faces of semiconductor material respectively to save artifical dismouting semiconductor material's step, improved semiconductor material's machining efficiency.
Description
Technical Field
The utility model relates to a semiconductor processing technology field, concretely relates to semiconductor material grinds machine.
Background
In semiconductor manufacturing, need grind semiconductor material, consequently, need use grinder, because the grinding operation will go on in two faces, after accomplishing the operation of one face, need manually take off semiconductor material after upset material refastening just can carry out the grinding operation of second face, complex operation inefficiency, repeated installation dismantlement have certain influence to semiconductor material and also can cause the condition that the secondary is fixed unstably.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor material grinds machine can grind two faces of semiconductor material respectively to save artifical dismouting semiconductor material's step, improved semiconductor material's machining efficiency.
In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor material grinding machine comprising: the top of the base is provided with a lower grinder, and the top of the lower grinder is provided with a grinding plane which moves horizontally and linearly; the upper grinder is arranged above the base through an adjusting bracket, and the bottom of the upper grinder is provided with a horizontal grinding plane vertical to the working direction of the upper grinder; the middle positioning sheet is horizontally arranged between the lower grinder and the upper grinder, and a die hole which simultaneously corresponds to the grinding planes of the lower grinder and the upper grinder is formed in the center of the middle positioning sheet; the first driver of the lower grinder and the second driver of the upper grinder are electrically connected with the controller respectively, and the controller is electrically connected with the power supply.
Preferably, the lower grinder is composed of a lower lining plate which is horizontally arranged and a first roller shaft system which surrounds the periphery of the lower lining plate, the first driver drives any one roller shaft in the first roller shaft system to rotate, and the lower grinder further comprises a lower grinding belt which is matched with the first roller shaft system; the upper grinder is composed of an upper lining plate and second roller shaft systems, wherein the upper lining plate is horizontally arranged, the second roller shaft systems surround the upper lining plate, the second driver drives any one of the second roller shaft systems to rotate, and the upper grinder further comprises an upper grinding belt which is matched with the second roller shaft systems.
Preferably, both sides of the upper abrasive belt and the lower abrasive belt are respectively covered with an abrasion resistant layer in a region not overlapping with the die hole.
Preferably, the middle locating plate passes through the revolving stage with the cooperation of frame top, the revolving stage has two distributions to be in the arc board of grinder both sides constitutes down, the middle locating plate is the disc structure to through edge and two the inside wall cooperation of arc board, free rotation.
Preferably, each inner wall of the arc plate is provided with a supporting platform for supporting the bottom of the middle positioning piece, each supporting platform is provided with teeth, and the bottom of the middle positioning piece corresponds to the tooth driver positioning strip.
Preferably, the adjusting bracket is composed of a plurality of guide rails vertically and fixedly arranged at the top of the base and sliding sleeves matched with the guide rails, and the upper grinder is fixedly connected with each sliding sleeve and moves up and down along the guide rails; the grinding device also comprises a supporting spring arranged between the upper grinder and the base; the outer side walls of the tops of any two opposite guide rails are provided with screw sleeves, adjusting screws extending downwards are matched in the screw sleeves, and the bottom ends of the adjusting screws are in contact fit with the tops of the upper grinders.
Preferably, the device further comprises a first scale vertically arranged on each guide rail, and a second scale fixedly arranged on the sliding sleeve and corresponding to the first scale.
The utility model has the advantages that: the semiconductor workpiece to be ground is placed into the corresponding die hole in the middle positioning sheet, the middle positioning sheet is inserted between the lower grinder and the upper grinder, the operation of the lower grinder and the operation of the upper grinder are respectively controlled by the controller, and the die hole is arranged in a vertically through mode, so that the top and the bottom of the semiconductor workpiece are respectively contacted with the grinding platform of the upper grinder and the grinding platform of the lower grinder, and grinding operation is performed. In the process, the upper grinder and the lower grinder can independently work under the action of the controller to grind the top and the bottom of the semiconductor workpiece respectively, so that the operation of manually turning the semiconductor workpiece is avoided, and the upper grinder is adjusted up and down under the action of the adjusting bracket, so that the grinding size of the semiconductor workpiece is changed. The wear-resistant layer is slightly higher than the surfaces of the sand layers of the upper grinding belt and the lower grinding belt, so that the middle positioning sheet is isolated from the surface of the sand layer by the wear-resistant layer, and the middle positioning is prevented from being ground together when the semiconductor workpiece is ground. The rotatable middle positioning plate realizes the adjustment of the grinding angle of the semiconductor workpiece, and avoids the eccentric grinding problem of the semiconductor workpiece. Through the cooperation of locating bar and tooth, form auto-lock resistance to middle spacer, avoid because of the uncontrolled rotation of middle spacer that grinding effort leads to. The height of the upper grinder is adjusted by adjusting the screw to overcome the acting force of the supporting spring. The first scale and the second scale realize the measuring principle of the vernier caliper through the corresponding relation of the scales, so that an operator can intuitively master the grinding data of the semiconductor material.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the upper grinder of the present invention;
fig. 3 is a schematic view of the adjusting bracket of the present invention.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings of the present invention, and obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The first embodiment is as follows:
according to fig. 1, 2 and 3, a semiconductor material grinding machine includes: the grinding machine comprises a machine base 1, wherein a lower grinder 2 is arranged at the top of the machine base, and a grinding plane moving horizontally and linearly is arranged at the top of the lower grinder 2; the upper grinder 3 is arranged above the base through an adjusting bracket, and the bottom of the upper grinder 3 is provided with a horizontal grinding plane vertical to the working direction of the upper grinder 3; the middle positioning plate 4 is horizontally arranged between the lower grinder 2 and the upper grinder 3, and a die hole 5 which simultaneously corresponds to the grinding planes of the lower grinder 2 and the upper grinder 3 is formed in the center of the middle positioning plate 4; and the first driver of the lower grinder 2 and the second driver of the upper grinder 3 are respectively electrically connected with the controller, and the controller is electrically connected with a power supply. The lower grinder 2 comprises a lower lining plate 21 arranged horizontally and a first roller shaft system surrounding the periphery of the lower lining plate 21, the first driver drives any one roller shaft in the first roller shaft system to rotate, and the lower grinder also comprises a lower grinding belt 9 matched with the first roller shaft system; the upper grinder 3 is composed of an upper lining plate 20 and second roller shaft systems, wherein the upper lining plate 20 is horizontally arranged, the second roller shaft systems surround the upper lining plate 20, the second driver drives any one of the second roller shaft systems to rotate, and the upper grinder 3 further comprises an upper grinding belt 8 which is matched with the second roller shaft systems.
In the above arrangement, the semiconductor workpiece to be ground is placed in the corresponding die hole 5 in the middle positioning plate 4, the middle positioning plate 4 is inserted between the lower grinder 2 and the upper grinder 3, the operation of the lower grinder 2 and the operation of the upper grinder 3 are respectively controlled by the controller, and the top and the bottom of the semiconductor workpiece are respectively contacted with the grinding platforms of the upper grinder 3 and the lower grinder 2 and are ground due to the fact that the die hole 5 is arranged in a vertically through manner. In the process, the upper grinder 3 and the lower grinder 2 can independently work under the action of the controller to grind the top and the bottom of the semiconductor workpiece respectively, so that the operation of manually turning the semiconductor workpiece is avoided, and the upper grinder 3 is adjusted up and down under the action of the adjusting bracket, so that the grinding size of the semiconductor workpiece is changed.
Example two:
both sides of the upper abrasive belt 8 and the lower abrasive belt 9 are covered with abrasion resistant layers 10 in regions not overlapping with the die holes 5, respectively.
In the above arrangement, the abrasion resistant layer 10 is slightly higher than the sand layer surfaces of the upper abrasive belt 8 and the lower abrasive belt 9, so that the abrasion resistant layer 10 isolates the middle positioning sheet 4 from the sand layer surface, and the middle positioning sheet is prevented from being polished together when the semiconductor workpiece is polished.
Example three:
In the above arrangement, the rotatable intermediate positioning plate 4 realizes the adjustment of the polishing angle of the semiconductor workpiece, thereby avoiding the problem of eccentric wear of the semiconductor workpiece.
Example four:
the inner wall of each arc plate 11 is provided with a supporting platform 12 for supporting the bottom of the middle positioning piece 4, each supporting platform 12 is provided with teeth, and the bottom of the middle positioning piece 4 corresponds to the tooth driver positioning strip.
In the above arrangement, the positioning strip is matched with the teeth to form self-locking resistance to the intermediate positioning sheet 4, thereby avoiding uncontrolled rotation of the intermediate positioning sheet 4 caused by grinding acting force.
Example five:
the adjusting bracket is composed of a plurality of guide rails 13 vertically and fixedly arranged on the top of the base 1 and sliding sleeves 14 matched on the guide rails 13, and the upper grinder 3 is fixedly connected with each sliding sleeve 14 and moves up and down along the guide rails 13; the grinding device also comprises a supporting spring 15 arranged between the upper grinder 3 and the base 1; the outer side walls of the tops of any two opposite guide rails 13 are provided with screw sleeves 16, adjusting screws 17 extending downwards are matched in the screw sleeves 16, and the bottom ends of the adjusting screws 17 are in contact fit with the tops of the upper grinders 3.
In the above arrangement, the height of the upper grinder 3 is adjusted by the adjusting screw 17 against the urging force of the supporting spring 15.
Example six:
the device also comprises a first scale 18 vertically arranged on each guide rail 13 and a second scale 19 fixedly arranged on the sliding sleeve 14 and corresponding to the first scale 18.
In the above arrangement, the first scale 18 and the second scale 19 realize the measurement principle of the vernier caliper through the corresponding relationship of the scales, so that an operator can intuitively control the grinding data of the semiconductor material.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. A semiconductor material grinding machine, comprising:
the top of the base is provided with a lower grinder, and the top of the lower grinder is provided with a grinding plane which moves horizontally and linearly;
the upper grinder is arranged above the base through an adjusting bracket, and the bottom of the upper grinder is provided with a horizontal grinding plane vertical to the working direction of the upper grinder;
the middle positioning sheet is horizontally arranged between the lower grinder and the upper grinder, and a die hole which simultaneously corresponds to the grinding planes of the lower grinder and the upper grinder is formed in the center of the middle positioning sheet;
the first driver of the lower grinder and the second driver of the upper grinder are electrically connected with the controller respectively, and the controller is electrically connected with the power supply.
2. The semiconductor material grinding machine according to claim 1, wherein: the lower grinder is composed of a lower lining plate and a first roller shaft system surrounding the periphery of the lower lining plate, the first driver drives any one roller shaft in the first roller shaft system to rotate, and the lower grinder also comprises a lower grinding belt matched on the first roller shaft system; the upper grinder is composed of an upper lining plate and second roller shaft systems, wherein the upper lining plate is horizontally arranged, the second roller shaft systems surround the upper lining plate, the second driver drives any one of the second roller shaft systems to rotate, and the upper grinder further comprises an upper grinding belt which is matched with the second roller shaft systems.
3. A grinder for semiconductor materials, according to claim 2, wherein: and two sides of the upper grinding belt and the lower grinding belt are respectively covered with an anti-wear layer in the area which is not overlapped with the die hole.
4. A grinder for semiconductor materials, according to claim 3, wherein: the middle locating plate is matched with the top of the machine base through a rotating table, the rotating table is provided with two arc plates which are distributed on two sides of the lower grinder, the middle locating plate is of a disc structure and is matched with the inner side walls of the arc plates through edges to rotate freely.
5. The semiconductor material grinding machine according to claim 4, wherein: supporting platforms for supporting the bottom of the middle positioning piece are arranged on the inner wall of each arc plate respectively, teeth are arranged on the supporting platforms, and the bottom of the middle positioning piece corresponds to the tooth driver positioning strip.
6. The semiconductor material grinding machine according to claim 5, wherein: the adjusting bracket is composed of a plurality of guide rails vertically and fixedly arranged at the top of the base and sliding sleeves matched with the guide rails, and the upper grinder is fixedly connected with each sliding sleeve and moves up and down along the guide rails; the grinding device also comprises a supporting spring arranged between the upper grinder and the base; the outer side walls of the tops of any two opposite guide rails are provided with screw sleeves, adjusting screws extending downwards are matched in the screw sleeves, and the bottom ends of the adjusting screws are in contact fit with the tops of the upper grinders.
7. The semiconductor material grinding machine according to claim 6, wherein: the sliding sleeve is characterized by further comprising first scales vertically arranged on the guide rails and second scales fixedly arranged on the sliding sleeve and corresponding to the first scales.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022299261.1U CN213411521U (en) | 2020-10-15 | 2020-10-15 | Semiconductor material grinds machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022299261.1U CN213411521U (en) | 2020-10-15 | 2020-10-15 | Semiconductor material grinds machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213411521U true CN213411521U (en) | 2021-06-11 |
Family
ID=76268053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022299261.1U Active CN213411521U (en) | 2020-10-15 | 2020-10-15 | Semiconductor material grinds machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213411521U (en) |
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2020
- 2020-10-15 CN CN202022299261.1U patent/CN213411521U/en active Active
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