CN213401104U - Cooling mechanism for bonding memory chip - Google Patents
Cooling mechanism for bonding memory chip Download PDFInfo
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- CN213401104U CN213401104U CN202022343137.0U CN202022343137U CN213401104U CN 213401104 U CN213401104 U CN 213401104U CN 202022343137 U CN202022343137 U CN 202022343137U CN 213401104 U CN213401104 U CN 213401104U
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Abstract
The utility model discloses a cooling mechanism for memory chip bonds, including mounting bracket and the platform of pasting of setting at the mounting bracket top, it is provided with fixed subassembly to paste the platform both sides, just paste platform bottom inboard and seted up the heat dissipation chamber, the air intake has been seted up to heat dissipation chamber bottom one side, the air outlet has been seted up to heat dissipation chamber bottom opposite side, just the inside fan that is provided with of air intake, heat dissipation chamber top inboard is provided with the heating panel, just heat dissipation intracavity portion is provided with radiator unit. The utility model discloses an adopt the coolant liquid to carry out quick heat transfer to the heat on the heating panel, and then guaranteed the radiating effect of device to improved the protection effect of device to the memory, further through adopting fixed subassembly to make things convenient for the user to the fixing of memory, and further strengthened the device to the fixed stability of memory through twisting fixing bolt, and then make the result of use of device better.
Description
Technical Field
The utility model relates to a relevant technical field of memory production and processing specifically is a cooling mechanism for bonding of memory chip.
Background
The memory is a collection of a plurality of memory cells, which are arranged according to the sequence of cell numbers, and can be divided into a main memory and an auxiliary memory, wherein the main memory works in a mode of storing or reading various information according to the addresses of the memory cells, which is generally called accessing the memory, a chip required for storage needs to be connected with the memory in a bonding mode in the production process of the memory, and a cooling mechanism is needed to cool the memory in order to reduce the damage to the memory in the bonding process.
The defects of the prior art are as follows: traditional cooling mechanism all adopts conducting strip cooperation radiator fan to realize the heat dissipation cooling effect, and then leads to the cooling effect of device relatively poor to it is relatively poor to lead to the device to the protective effect of memory.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cooling mechanism for memory chip bonds, solved traditional cooling mechanism and all adopted conducting strip cooperation radiator fan to realize heat dissipation cooling effect, and then the cooling effect that leads to the device is relatively poor to lead to the relatively poor problem of protection effect of device to the memory.
In order to achieve the above object, the utility model provides a following technical scheme: a cooling mechanism for bonding a memory chip comprises a mounting frame and a bonding platform arranged at the top of the mounting frame, wherein fixing assemblies are arranged on two sides of the bonding platform, a heat dissipation cavity is formed in the inner side of the bottom of the bonding platform, an air inlet is formed in one side of the bottom of the heat dissipation cavity, an air outlet is formed in the other side of the bottom of the heat dissipation cavity, a fan is arranged in the air inlet, a heat dissipation plate is arranged on the inner side of the top of the heat dissipation cavity, a heat dissipation assembly is arranged in the heat dissipation cavity, a groove is formed in the middle position of the top of the bonding platform, heat conduction fins are arranged in the groove, heat conduction copper pipes are fixedly connected to the bottoms of the heat conduction fins;
the cooling module comprises heat dissipation pipeline, the liquid supply tank, the pump body and cooler, heat dissipation pipeline top with heat dissipation board bottom fixed connection, the liquid supply tank, the pump body and cooler all set up at heat dissipation chamber bottom inboard, just the liquid supply tank, the pump body and cooler set gradually by a left side to the right side, just liquid supply tank one side with heat dissipation pipeline one end is connected, liquid supply tank opposite side is provided with first connecting tube, liquid supply tank opposite side through first connecting tube with pump body one side is connected, the pump body is kept away from liquid supply tank one side and is provided with the second connecting tube, pump body one side through the second connecting tube with the cooler is connected, the cooler keep away from pump body one side with the heat dissipation pipeline other end is connected.
Preferably, the grooves are provided with three groups, the three groups of grooves are internally provided with heat conducting fins, and the three groups of grooves are uniformly arranged in the middle of the top of the pasting platform.
Preferably, fixed subassembly comprises riser, grip block, pull rod, compression spring, riser one side with paste platform one end outer wall fixed connection, the through-hole has been seted up to riser inside, the grip block setting is close to recess one side at the riser, pull rod one end with grip block one side outer wall fixed connection, the pull rod other end runs through-hole fixedly connected with pull plate, compression spring set up at the grip block with between the riser, just the compression spring cover is established at the pull rod outer wall.
Preferably, the clamping plate is far away from riser one side fixedly connected with first protection pad, first protection pad adopts rubber to form for the material preparation.
Preferably, the fixed diaphragm of grip block top fixedly connected with, fixed screw has been seted up to fixed diaphragm inside, fixed diaphragm bottom is provided with the butt plate, the butt plate top is provided with the bearing, the bearing top is provided with fixing bolt, fixing bolt top runs through fixed screw, just fixing bolt with fixed screw closes soon and is connected.
Preferably, the bottom of the abutting plate is fixedly connected with a second protection pad, and the second protection pad is made of rubber.
The utility model provides a cooling mechanism for memory chip bonds possesses following beneficial effect:
(1) the utility model discloses a set up heat dissipation chamber, conducting strip, heat conduction copper pipe, fan, heating panel and radiator unit, when using, through opening fan, the pump body and cooler for the heat that the memory chip produced with memory bonding in-process can carry out the heat transfer through heating panel and the inside coolant liquid of heat dissipation pipeline fast, and then has guaranteed the radiating effect of device, thereby has improved the protection effect of device to the memory.
(2) The utility model discloses a set up fixed subassembly, fixed diaphragm, fixed screw, the butt plate, fixing bolt, when using, the user can be through the pulling arm-tie, make the grip block can carry out the displacement, make compression spring compressed simultaneously, then the user places the memory that will carry out processing and pastes the platform top, make the grip block can carry out quick fixed to the memory under compression spring's effect through loosening the arm-tie, and then improved the convenience that the device is fixed to the memory, further user makes the butt plate can carry out further fixed to the memory through twisting fixing bolt, thereby the stability of memory in carrying out the course of working has also been guaranteed.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the pasting platform of the present invention;
FIG. 3 is a schematic view of the structure of the pull rod of the present invention;
fig. 4 is an enlarged view of the structure at a in fig. 1 of the present invention.
In the figure: 1. a mounting frame; 2. a pasting platform; 3. a heat dissipation cavity; 4. a fan; 5. a heat dissipation plate; 6. a groove; 7. a heat conductive sheet; 8. a heat conducting copper pipe; 9. a heat dissipation pipe; 10. a liquid supply tank; 11. a pump body; 12. a cooler; 13. a vertical plate; 14. a clamping plate; 15. a pull rod; 16. a compression spring; 17. a first protection pad; 18. fixing the transverse plate; 19. fixing screw holes; 20. a butt joint plate; 21. fixing the bolt; 22. a second protection pad.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1:
as shown in fig. 1-2, the utility model provides a technical solution: a cooling mechanism for bonding a memory chip comprises a mounting frame 1 and a bonding platform 2 arranged at the top of the mounting frame 1, wherein fixing assemblies are arranged on two sides of the bonding platform 2, a heat dissipation cavity 3 is formed in the inner side of the bottom of the bonding platform 2, an air inlet is formed in one side of the bottom of the heat dissipation cavity 3, an air outlet is formed in the other side of the bottom of the heat dissipation cavity 3, a fan 4 is arranged in the air inlet, a heat dissipation plate 5 is arranged on the inner side of the top of the heat dissipation cavity 3, a heat dissipation assembly is arranged in the heat dissipation cavity 3, a groove 6 is formed in the middle of the top of the bonding platform 2, heat conducting fins 7 are arranged in the groove 6, heat conducting copper pipes 8 are fixedly connected to the bottoms of the heat conducting copper pipes 7, and the;
the heat dissipation assembly consists of a heat dissipation pipeline 9, a liquid supply tank 10, a pump body 11 and a cooler 12, the top of the heat dissipation pipeline 9 is fixedly connected with the bottom of the heat dissipation plate 5, the liquid supply tank 10, the pump body 11 and the cooler 12 are all arranged on the inner side of the bottom of the heat dissipation cavity 3, the liquid supply tank 10, the pump body 11 and the cooler 12 are arranged from left to right in sequence, one side of the liquid supply tank 10 is connected with one end of the heat dissipation pipeline 9, the other side of the liquid supply tank 10 is provided with a first connecting pipeline, the other side of the liquid supply tank 10 is connected with one side of the pump body 11 through the first connecting pipeline, a second connecting pipeline is arranged on one side of the pump body 11 far away from the liquid supply tank 10, one side of the pump body 11 is connected with the cooler 12 through the second connecting pipeline, the side of the cooler 12 away from the pump body 11 is connected with the other end of the heat dissipation pipeline 9.
Further, recess 6 is provided with three groups, three groups recess 6 is inside all to be provided with conducting strip 7, and three groups recess 6 evenly sets up pasting 2 top intermediate positions of platform, through setting up three groups recess 6 and conducting strip 7 and then improved the heat conduction effect of device to make the cooling effect of device better.
Example 2:
as shown in fig. 1, 3 and 4, the difference from embodiment 1 is that: fixed subassembly comprises riser 13, grip block 14, pull rod 15, compression spring 16, riser 13 one side with paste 2 one end outer wall fixed connection of platform, the through-hole has been seted up to riser 13 inside, grip block 14 sets up and is close to recess 6 one side at riser 13, pull rod 15 one end with grip block 14 one side outer wall fixed connection, the pull rod 15 other end runs through-hole fixedly connected with pull plate, compression spring 16 set up at grip block 14 with between the riser 13, just compression spring 16 cover is established at pull rod 15 outer wall.
Furthermore, the clamping plate 14 is far away from the riser 13 and is fixedly connected with a first protection pad 17, the first protection pad 17 is made of rubber, and the first protection pad 17 is arranged, so that damage of the device in the fixing process of the memory can be reduced.
Further, 14 top fixedly connected with fixed diaphragm 18 of grip block, fixed diaphragm 18 has seted up fixed screw 19 inside, fixed diaphragm 18 bottom is provided with butt plate 20, butt plate 20 top is provided with the bearing, the bearing top is provided with fixing bolt 21, fixing bolt 21 top runs through fixed screw 19, just fixing bolt 21 with fixed screw 19 closes soon and is connected, when using, the user can make fixing bolt 21 can drive butt plate 20 and carry out further spacing fixed to the memory through twisting fixing bolt 21, and then makes the device better to the fixed effect of memory.
Furthermore, the bottom of the abutting plate 20 is fixedly connected with a second protection pad 22, the second protection pad 22 is made of rubber, and the second protection pad 22 is arranged, so that damage to the memory when the memory is fixed can be reduced.
The working principle is as follows: when in use, a user can pull the pulling plate to enable the clamping plate 14 to displace and simultaneously enable the compression spring 16 to be compressed, then the user places a memory to be processed on the top of the adhering platform 2 to enable the memory to be in contact with the heat conducting fins 7, after the pulling plate is loosened to enable the clamping plate 14 to fix the memory, then the user enables the abutting plate 20 to further fix the memory by screwing the fixing bolt 21, after the fixing is completed, the user can open the pump body 11, the fan 4 and the cooler 12, the opening of the fan 4 can enhance the air flow inside the heat dissipation cavity 3, the heat generated during the process that the user adheres the chip on the top of the memory can be quickly led out through the heat conducting fins 7 and then flows to the heat dissipation plate 5 through the heat conducting copper pipe 8, and the cooling liquid pumped out of the liquid supply tank 10 through the pump body 11 is cooled by the cooler 12, the temperature difference between the heat dissipation plate 5 and the cooling liquid is large, so that the heat dissipation plate 5 can perform quick heat exchange with the cooling liquid flowing through the heat dissipation pipeline 9, and the cooling treatment of the storage is achieved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a cooling mechanism for bonding of memory chip, includes mounting bracket (1) and sets up pasting platform (2) at mounting bracket (1) top, its characterized in that: fixing components are arranged on two sides of the pasting platform (2), a heat dissipation cavity (3) is formed in the inner side of the bottom of the pasting platform (2), an air inlet is formed in one side of the bottom of the heat dissipation cavity (3), an air outlet is formed in the other side of the bottom of the heat dissipation cavity (3), a fan (4) is arranged in the air inlet, a heat dissipation plate (5) is arranged in the inner side of the top of the heat dissipation cavity (3), a heat dissipation component is arranged in the heat dissipation cavity (3), a groove (6) is formed in the middle position of the top of the pasting platform (2), heat conducting fins (7) are arranged in the groove (6), heat conducting copper pipes (8) are fixedly connected to the bottoms of the heat conducting fins (7), and the bottoms of the heat conducting copper pipes (8) penetrate through the heat;
the heat dissipation assembly is composed of a heat dissipation pipeline (9), a liquid supply tank (10), a pump body (11) and a cooler (12), the top of the heat dissipation pipeline (9) is fixedly connected with the bottom of the heat dissipation plate (5), the liquid supply tank (10), the pump body (11) and the cooler (12) are all arranged on the inner side of the bottom of the heat dissipation cavity (3), the liquid supply tank (10), the pump body (11) and the cooler (12) are sequentially arranged from left to right, one side of the liquid supply tank (10) is connected with one end of the heat dissipation pipeline (9), the other side of the liquid supply tank (10) is provided with a first connecting pipeline, the other side of the liquid supply tank (10) is connected with one side of the pump body (11) through the first connecting pipeline, one side of the pump body (11) far away from the liquid supply tank (10) is provided with a second connecting pipeline, one side of the pump body (11) is connected with the cooler (12) through the second connecting pipeline, and one side of the cooler (12) far away from the pump body (11) is connected with the other end of the heat dissipation pipeline (9).
2. The cooling mechanism for memory chip bonding of claim 1, wherein: the groove (6) is provided with three groups, the three groups of grooves (6) are internally provided with heat conducting fins (7), and the three groups of grooves (6) are uniformly arranged in the middle of the top of the pasting platform (2).
3. The cooling mechanism for memory chip bonding of claim 1, wherein: fixed subassembly comprises riser (13), grip block (14), pull rod (15), compression spring (16), riser (13) one side with paste platform (2) one end outer wall fixed connection, the through-hole has been seted up to riser (13) inside, grip block (14) set up and are close to recess (6) one side at riser (13), pull rod (15) one end with grip block (14) one side outer wall fixed connection, through-hole fixedly connected with pull plate is run through to pull rod (15) other end, compression spring (16) set up grip block (14) with between riser (13), just compression spring (16) cover is established at pull rod (15) outer wall.
4. The cooling mechanism for memory chip bonding of claim 3, wherein: the clamping plate (14) is far away from a first protection pad (17) fixedly connected to one side of the vertical plate (13), and the first protection pad (17) is made of rubber.
5. The cooling mechanism for memory chip bonding of claim 3, wherein: the fixing device is characterized in that a fixing transverse plate (18) is fixedly connected to the top of the clamping plate (14), a fixing screw hole (19) is formed in the fixing transverse plate (18), a butt plate (20) is arranged at the bottom of the fixing transverse plate (18), a bearing is arranged at the top of the butt plate (20), a fixing bolt (21) is arranged at the top of the bearing, the fixing screw hole (19) is penetrated through the top of the fixing bolt (21), and the fixing bolt (21) is connected with the fixing screw hole (19) in a screwing mode.
6. The cooling mechanism for memory chip bonding of claim 5, wherein: the bottom of the abutting plate (20) is fixedly connected with a second protection pad (22), and the second protection pad (22) is made of rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022343137.0U CN213401104U (en) | 2020-10-20 | 2020-10-20 | Cooling mechanism for bonding memory chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022343137.0U CN213401104U (en) | 2020-10-20 | 2020-10-20 | Cooling mechanism for bonding memory chip |
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| Publication Number | Publication Date |
|---|---|
| CN213401104U true CN213401104U (en) | 2021-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022343137.0U Active CN213401104U (en) | 2020-10-20 | 2020-10-20 | Cooling mechanism for bonding memory chip |
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| CN (1) | CN213401104U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114102253A (en) * | 2021-12-01 | 2022-03-01 | 徐州宏武纳米科技有限公司 | Cooling equipment for control equipment processing |
| CN114935234A (en) * | 2022-07-26 | 2022-08-23 | 山东沂光集成电路有限公司 | Cooling device for integrated circuit semiconductor processing |
-
2020
- 2020-10-20 CN CN202022343137.0U patent/CN213401104U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114102253A (en) * | 2021-12-01 | 2022-03-01 | 徐州宏武纳米科技有限公司 | Cooling equipment for control equipment processing |
| CN114935234A (en) * | 2022-07-26 | 2022-08-23 | 山东沂光集成电路有限公司 | Cooling device for integrated circuit semiconductor processing |
| CN114935234B (en) * | 2022-07-26 | 2022-10-21 | 山东沂光集成电路有限公司 | Cooling device for integrated circuit semiconductor processing |
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