CN213382804U - Mold cooling device convenient for fixing mold for production of electronic and photoelectric devices - Google Patents
Mold cooling device convenient for fixing mold for production of electronic and photoelectric devices Download PDFInfo
- Publication number
- CN213382804U CN213382804U CN202022304150.5U CN202022304150U CN213382804U CN 213382804 U CN213382804 U CN 213382804U CN 202022304150 U CN202022304150 U CN 202022304150U CN 213382804 U CN213382804 U CN 213382804U
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- Prior art keywords
- cooling
- heat absorption
- pipe
- mold
- cooling pipe
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- 238000001816 cooling Methods 0.000 title claims abstract description 166
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000010521 absorption reaction Methods 0.000 claims abstract description 86
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 229910000838 Al alloy Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000498 cooling water Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000005693 optoelectronics Effects 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 16
- 230000005855 radiation Effects 0.000 description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model provides a mold cooling device convenient for fixing a mold for producing an electronic and photoelectric device, which comprises a cooling box, a cooler, an outer circulation cooling pipe, a heat absorption cooling ring, an inner circulation cooling pipe, a heat absorption and heat dissipation mechanism, a mold fixing cavity, a mold body and a mold upper cover, wherein the cooler is arranged on the outer side surface of the cooling box through a bolt, one side of the cooler is hermetically connected with the outer circulation cooling pipe, and the outer circulation cooling pipe is wound on the inner peripheral surface of the cooling box; the inner circumferential surface of the outer circulation cooling pipe is provided with an heat absorption cooling ring, the inner circulation cooling pipe is wound on the inner circumferential surface of the heat absorption cooling ring, and one end of the inner circulation cooling pipe is hermetically connected to one end of the cooler. The utility model discloses outer circulative cooling pipe, heat absorption heat dissipation mechanism, the setting of heat absorption pipe and heat absorption cooling ring, heat absorption radiating effect is good when the cooling, the circulative cooling of being convenient for during the cooling, and the cooling effect is good, the fixed mould of being convenient for, the marketing and the application of being convenient for.
Description
Technical Field
The utility model relates to an electron photoelectric device equipment field especially relates to an electron photoelectric device production is with mould cooling device who is convenient for fixed mould.
Background
The photoelectric device refers to a device manufactured according to photoelectric effect, which is called a photoelectric device and is also called a photosensitive device. The photoelectric devices are in various types, but the working principle is based on the physical basis of photoelectric effect. The photoelectric devices mainly comprise a photoelectric tube, a photomultiplier, a photoresistor, a photosensitive diode, a photosensitive triode, a photoelectric cell and a photoelectric coupler. The structure, operation principle, parameters and basic characteristics of these optoelectronic devices will be described below.
Electronic photoelectric devices need to be processed through a mold during production, the mold needs to be cooled after injection molding, and a special mold cooling device is needed for cooling during cooling. However, the existing mold cooling device for producing electronic and photoelectric devices still has the problems that the heat absorption and heat dissipation effects are poor during cooling, the circular cooling is inconvenient during cooling, the cooling effect is poor, and the mold is inconvenient to fix.
Therefore, it is necessary to provide a mold cooling device for electronic and optoelectronic device production, which is convenient for fixing the mold.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides an electron photoelectric device production is with mould cooling device of fixed mould of being convenient for to it is poor still to have the heat absorption radiating effect when the cooling in the mould cooling device for solving current electron photoelectric device production, and the circulative cooling of not being convenient for during the cooling, the cooling effect is poor, the problem of fixed mould of not being convenient for. A mold cooling device convenient for fixing a mold for producing electronic and photoelectric devices comprises a cooling box, a cooler, an outer circulation cooling pipe, a heat absorption cooling ring, an inner circulation cooling pipe, a heat absorption and heat dissipation mechanism, a mold fixing cavity, a mold body and a mold upper cover, wherein the cooler is installed on the outer side surface of the cooling box through bolts, one side of the cooler is hermetically connected with the outer circulation cooling pipe, and the outer circulation cooling pipe is wound on the inner peripheral surface of the cooling box; the inner circumferential surface of the outer circulation cooling pipe is provided with a heat absorption cooling ring, the inner circumferential surface of the heat absorption cooling ring is wound with an inner circulation cooling pipe, and one end of the inner circulation cooling pipe is hermetically connected with one end of the cooler; the inner circumferential surface of the inner circulation cooling pipe is provided with a heat absorption and dissipation mechanism, and the middle part of the heat absorption and dissipation mechanism is provided with a mold fixing cavity; a die body is embedded and fixed in the die fixing cavity, and a die upper cover is fixed at the upper end of the die body; the heat absorption and dissipation mechanism comprises a heat dissipation shell, a heat dissipation cavity, heat absorption pipes and clamping blocks, the heat dissipation cavity is arranged inside the heat dissipation shell, the heat absorption pipes are fixed inside the heat dissipation cavity, and the clamping blocks are fixed on the inner peripheral surface of the heat dissipation shell.
The outer circulative cooling pipe is cylindrical aluminum alloy tube, and the inside cooling water that has poured into of outer circulative cooling pipe, and the inside cooling water circulation of this outer circulative cooling pipe flows and carries out cooling work through the cooler, and the both ends of this outer circulative cooling pipe are all sealed to be fixed in the one end of cooler, and the circulating pump is installed in the outside of this cooler, mutually supports through outer circulative cooling pipe and inner cooling pipe and adsorbs the inside heat of mould, and can constantly circulate and use circulative cooling, very high cooling effect.
The heat absorption and radiation mechanism is tightly attached to the inner peripheral surface of the inner circulation cooling pipe, the heat absorption pipes are distributed in the inner array of the heat radiation shell, clamping blocks are distributed on the inner peripheral surface of the heat radiation shell in four places and above, a magnet layer is arranged on the outer side surface of each clamping block, the clamping blocks are clamped inside clamping grooves in the outer peripheral surface of the die body, heat emitted by the die is absorbed by the heat absorption and radiation mechanism and then is transmitted to the outer circulation cooling pipe and the inner circulation cooling pipe for cooling, and the heat absorption and radiation effect is good.
The heat absorption pipe adopts the aluminum alloy copper pipe of wave cylinder shape, and all is provided with a layer copper layer on the interior periphery of heat absorption pipe, and the diameter of this heat absorption pipe is 12mm-15mm, and the heat absorption pipe is provided with every row of multirow and is provided with a plurality ofly, adsorbs the heat through the heat absorption pipe, and the heat absorption pipe is that wave pipe adsorption area is big, carries out some cooling by oneself when the transmission, can improve follow-up cooling efficiency, improves the cooling effect simultaneously.
The heat absorption cooling ring is a cylindrical annular aluminum alloy ring, the thickness of the heat absorption cooling ring is 8-12 mm, the periphery of the heat absorption cooling ring is tightly attached to the outer circulation cooling pipe, and the inner periphery of the heat absorption cooling ring is tightly attached to the inner circulation cooling pipe.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses the setting of outer circulative cooling pipe is mutually supported through outer circulative cooling pipe and inner cooling pipe and is adsorbed the inside heat of mould, and can constantly recycle the cooling cycle, very high cooling effect.
2. The utility model discloses the setting of heat absorption heat dissipation mechanism adsorbs the back through heat absorption heat dissipation mechanism and transmits for outer circulation cooling tube and inner loop cooling tube and cool off, the fixed mould of being convenient for, and fixed simple, the heat absorption radiating effect is good.
3. The utility model discloses the setting of heat-absorbing pipe adsorbs the heat through the heat-absorbing pipe, and the heat-absorbing pipe is the wave pipe adsorption area big, and self carries out partly cooling when the transmission, can improve follow-up cooling efficiency, improves the cooling effect simultaneously.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic top view of the present invention.
Fig. 3 is a schematic view of the structure of the external circulation cooling pipe of the present invention.
Fig. 4 is a schematic structural view of the heat absorbing and dissipating mechanism of the present invention.
In the figure:
1-cooling box, 2-cooler, 3-external circulation cooling pipe, 4-heat absorption cooling ring, 5-internal circulation cooling pipe, 6-heat absorption and heat dissipation mechanism, 61-heat dissipation shell, 62-heat dissipation cavity, 63-heat absorption pipe, 64-fixture block, 7-mold fixing cavity, 8-mold body and 9-mold upper cover.
Detailed Description
In order to make the technical solution of the present invention better understood, the technical solution of the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The invention is further described below with reference to the accompanying drawings:
example (b):
as shown in figures 1 to 4:
the utility model provides a mould cooling device convenient for fixing a mould for producing an electronic and photoelectric device, which comprises a cooling box 1, a cooler 2, an outer circulation cooling pipe 3, a heat absorption cooling ring 4, an inner circulation cooling pipe 5, a heat absorption and heat dissipation mechanism 6, a heat dissipation shell 61, a heat dissipation cavity 62, a heat absorption pipe 63, a fixture block 64, a mould fixing cavity 7, a mould body 8 and a mould upper cover 9, wherein the cooler 2 is arranged on the outer side surface of the cooling box 1 through bolts, one side of the cooler 2 is hermetically connected with the outer circulation cooling pipe 3, and the outer circulation cooling pipe 3 is wound on the inner peripheral surface of the cooling box 1; an inner circumferential surface of the outer circulation cooling pipe 3 is provided with a heat absorption cooling ring 4, an inner circulation cooling pipe 5 is wound on the inner circumferential surface of the heat absorption cooling ring 4, and one end of the inner circulation cooling pipe 5 is hermetically connected with one end of the cooler 2; a heat absorption and dissipation mechanism 6 is arranged on the inner circumferential surface of the inner circulation cooling pipe 5, and a mold fixing cavity 7 is arranged in the middle of the heat absorption and dissipation mechanism 6; a die body 8 is embedded and fixed in the die fixing cavity 7, and a die upper cover 9 is fixed at the upper end of the die body 8; a heat dissipation cavity 62 is arranged inside the heat dissipation shell 61, a heat absorption pipe 63 is fixed inside the heat dissipation cavity 62, and a clamping block 64 is fixed on the inner circumferential surface of the heat dissipation shell 61; the outer circulation cooling pipe 3 is a cylindrical aluminum alloy pipe, cooling water is filled in the outer circulation cooling pipe 3, the cooling water in the outer circulation cooling pipe 3 flows through the cooler 2 in a circulating manner to perform cooling work, two ends of the outer circulation cooling pipe 3 are fixed at one end of the cooler 2 in a sealing manner, and a circulating pump is installed on the outer side of the cooler 2; the heat absorption and dissipation mechanism 6 is tightly attached to the inner peripheral surface of the inner circulation cooling pipe 5, a plurality of heat absorption pipes 63 are distributed in the heat dissipation shell 61 in an array manner, four or more fixture blocks 64 are distributed in the inner peripheral surface of the heat dissipation shell 61 in an array manner, a magnet layer is arranged on the outer side surface of each fixture block 64, and the fixture blocks 64 are clamped in clamping grooves in the outer peripheral surface of the mold body 8; the heat absorption pipe 63 is made of a wavy cylindrical aluminum alloy copper pipe, a copper layer is arranged on the inner peripheral surface of the heat absorption pipe 63, the diameter of the heat absorption pipe 63 is 12mm-15mm, and the number of the heat absorption pipes 63 is multiple; the heat absorption cooling ring 4 is a cylindrical annular aluminum alloy ring, the thickness of the heat absorption cooling ring 4 is 8mm-12mm, the periphery of the heat absorption cooling ring 4 is tightly attached to the outer circulation cooling pipe 3, and the inner periphery of the heat absorption cooling ring 4 is tightly attached to the inner circulation cooling pipe 5.
When in use, the die body 8 is embedded in the die fixing cavity 7, the fixture block 64 is clamped and fixed in the groove on the peripheral surface of the die body 8, the magnet on the outer side surface of the fixture block 64 is absorbed in the groove on the periphery of the die body 8 for reinforcement, after the fixture is fixed, the raw material is poured into the die body 8, the upper die cover 9 is covered for sealing, cooling is needed after the pouring, when in cooling, the die body 8 radiates heat to the heat radiation shell 61, the heat radiation shell 61 transmits the heat to the heat absorption pipe 63, the heat absorption pipe 63 absorbs the heat, the heat absorption pipe 63 is in a wave structure and can absorb a large amount of heat and transmit the heat, cooling work is carried out when the heat is transmitted by the heat absorption and radiation mechanism 6, the sucked heat is transmitted to the inner circulation cooling pipe 5, two ends of the inner circulation cooling pipe 5 are both connected at the cooler 2, water in the inner circulation cooling pipe 5 continuously passes through the cooler 2, inside water is cooled down when 2 through the cooler, then the heat that flows on 6 faces of heat absorption heat dissipation mechanism cools off, heat absorption cooling ring 4 carries out the heat part when inner circulation cooling tube 5 cools off and adsorbs the dispersion heat, and outer circulation cooling tube 3 cools off once more, the both ends of outer circulation cooling tube 3 are all connected in 2 departments of cooler, the inside water of inner circulation cooling tube 5 constantly circulates, pass through cooler 2 when circulating, inside water is cooled down when 2 through the cooler, outer circulation cooling tube, heat absorption heat dissipation mechanism, the setting of heat absorption pipe and heat absorption cooling ring, heat absorption radiating effect is good when cooling, the circulative cooling of being convenient for during the cooling, the cooling effect is good, be convenient for fixed mould, be convenient for marketing and application.
Utilize technical scheme, or technical personnel in the field are in the utility model discloses under technical scheme's the inspiration, design similar technical scheme, and reach above-mentioned technological effect, all fall into the utility model discloses a protection scope.
Claims (5)
1. The utility model provides an electron photoelectric device production is with mould cooling device of fixed mould of being convenient for which characterized in that: the cooling device comprises a cooling box (1), a cooler (2), an outer circulation cooling pipe (3), a heat absorption cooling ring (4), an inner circulation cooling pipe (5), a heat absorption and heat dissipation mechanism (6), a mold fixing cavity (7), a mold body (8) and a mold upper cover (9), wherein the cooler (2) is installed on the outer side surface of the cooling box (1) through bolts, the outer circulation cooling pipe (3) is connected to one side of the cooler (2) in a sealing mode, and the outer circulation cooling pipe (3) is wound on the inner peripheral surface of the cooling box (1); the inner circumferential surface of the outer circulating cooling pipe (3) is provided with a heat absorption cooling ring (4), the inner circumferential surface of the heat absorption cooling ring (4) is wound with an inner circulating cooling pipe (5), and one end of the inner circulating cooling pipe (5) is hermetically connected with one end of the cooler (2); a heat absorption and dissipation mechanism (6) is arranged on the inner circumferential surface of the inner circulation cooling pipe (5), and a mold fixing cavity (7) is arranged in the middle of the heat absorption and dissipation mechanism (6); a mould body (8) is embedded and fixed in the mould fixing cavity (7), and a mould upper cover (9) is fixed at the upper end of the mould body (8); the heat absorption and dissipation mechanism (6) comprises a heat dissipation shell (61), a heat dissipation cavity (62), a heat absorption pipe (63) and a clamping block (64), the heat dissipation cavity (62) is arranged inside the heat dissipation shell (61), the heat absorption pipe (63) is fixed inside the heat dissipation cavity (62), and the clamping block (64) is fixed on the inner circumferential surface of the heat dissipation shell (61).
2. The mold cooling apparatus for facilitating mold fixing in the production of electronic and optoelectronic devices as claimed in claim 1, wherein: outer circulative cooling pipe (3) are the aluminum alloy pipe of cylinder shape, and the inside cooling water that has poured into of outer circulative cooling pipe (3), and the inside cooling water circulation of this outer circulative cooling pipe (3) flows through subcooler (2) and carries out cooling work, and the both ends of this outer circulative cooling pipe (3) are all sealed the one end of fixing at subcooler (2), and the circulating pump is installed in the outside of this subcooler (2).
3. The mold cooling apparatus for facilitating mold fixing in the production of electronic and optoelectronic devices as claimed in claim 1, wherein: the heat absorption and dissipation mechanism (6) is tightly attached to the inner peripheral surface of the inner circulation cooling pipe (5), a plurality of heat absorption pipes (63) are distributed in the heat dissipation shell (61) in an array mode, clamping blocks (64) are distributed on four positions and above four positions in the inner peripheral surface of the heat dissipation shell (61) in an array mode, a magnet layer is arranged on the outer side face of each clamping block (64), and the clamping blocks (64) are clamped inside clamping grooves in the outer peripheral surface of the die body (8).
4. The mold cooling apparatus for facilitating mold fixing in the production of electronic and optoelectronic devices as claimed in claim 1, wherein: the heat absorption pipe (63) is made of a wavy cylindrical aluminum alloy copper pipe, a copper layer is arranged on the inner peripheral surface and the outer peripheral surface of the heat absorption pipe (63), the diameter of the heat absorption pipe (63) is 12mm-15mm, and the heat absorption pipe (63) is provided with a plurality of rows and a plurality of rows.
5. The mold cooling apparatus for facilitating mold fixing in the production of electronic and optoelectronic devices as claimed in claim 1, wherein: the heat absorption cooling ring (4) is a cylindrical annular aluminum alloy ring, the thickness of the heat absorption cooling ring (4) is 8-12 mm, the periphery of the heat absorption cooling ring (4) is tightly attached to the outer circulation cooling pipe (3), and the inner periphery of the heat absorption cooling ring (4) is tightly attached to the inner circulation cooling pipe (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022304150.5U CN213382804U (en) | 2020-10-16 | 2020-10-16 | Mold cooling device convenient for fixing mold for production of electronic and photoelectric devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022304150.5U CN213382804U (en) | 2020-10-16 | 2020-10-16 | Mold cooling device convenient for fixing mold for production of electronic and photoelectric devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213382804U true CN213382804U (en) | 2021-06-08 |
Family
ID=76187932
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022304150.5U Expired - Fee Related CN213382804U (en) | 2020-10-16 | 2020-10-16 | Mold cooling device convenient for fixing mold for production of electronic and photoelectric devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213382804U (en) |
-
2020
- 2020-10-16 CN CN202022304150.5U patent/CN213382804U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: The utility model relates to a mould cooling device convenient for fixing moulds for the production of electronic photoelectric devices Effective date of registration: 20210628 Granted publication date: 20210608 Pledgee: Changde Finance Guarantee Co.,Ltd. Pledgor: Hunan Youde Electronic Technology Co.,Ltd. Registration number: Y2021980005393 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20220720 Granted publication date: 20210608 Pledgee: Changde Finance Guarantee Co.,Ltd. Pledgor: Hunan Youde Electronic Technology Co.,Ltd. Registration number: Y2021980005393 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A mold cooling device for the production of electronic optoelectronic devices that is convenient for fixing the mold Effective date of registration: 20220725 Granted publication date: 20210608 Pledgee: Changde Finance Guarantee Co.,Ltd. Pledgor: Hunan Youde Electronic Technology Co.,Ltd. Registration number: Y2022980011189 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210608 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |