CN213366618U

CN213366618U - Waterproof LED packaging module

Info

Publication number: CN213366618U
Application number: CN202022683390.0U
Authority: CN
Inventors: 郑冬
Original assignee: Shenzhen Duming Synthetic Optoelectronic Technology Co ltd
Current assignee: Shenzhen Duming Synthetic Optoelectronic Technology Co ltd
Priority date: 2020-11-18
Filing date: 2020-11-18
Publication date: 2021-06-04
Anticipated expiration: 2030-11-18

Abstract

The utility model discloses a waterproof type LED encapsulation module, including solid fixed ring, closing cap, lamp pearl subassembly, base plate, inserted bar, jack, shrink groove, separation blade and spring. This waterproof type LED encapsulation module, under the pristine condition, the closing cap cover is in solid fixed ring's the outside, the spring drives the inserted bar through the cooperation between shrink groove and the separation blade and inserts in the jack, make the closing cap fixed form the protection to lamp pearl subassembly in solid fixed ring's the outside, when needs use lamp pearl subassembly, stimulate the inserted bar this moment, pull out the inserted bar from the jack, thereby conveniently take off the closing cap from solid fixed ring, make lamp pearl subassembly expose, then through the circuit connection point fixed connection with the electrode slice of base plate bottom surface and external LED lamp, accomplish being connected with the LED lamp of lamp pearl subassembly, when the LED lamp begins work, wafer work in the lamp pearl subassembly this moment, the outside of base plate is derived through the heat conduction pole to the produced heat energy of wafer this moment, accomplish the heat dissipation work of wafer.

Description

Waterproof LED packaging module

Technical Field

The utility model relates to a LED encapsulates the field, specifically is a waterproof type LED encapsulation module.

Background

As a high-efficiency light source in the new century, the LED has incomparable characteristics of a common light source, such as high luminous efficiency, low power consumption, long service life, no stroboflash, high safety and reliability, environmental protection, vibration resistance, high response speed, a cold light source and the like, and is widely applied to the fields of daily illumination, indicator lights, signal lights, display screens, landscape illumination and the like.

The LED lamp mainly comprises a wafer, the wafer and other components are combined into the LED lamp bead through a packaging method, and the LED lamp bead is partially damaged in daily life, so that the LED lamp bead needs to be replaced, the LED lamp can be continuously used, the existing LED lamp bead does not have a protection effect, the lens layer on the surface of the LED lamp bead is easily scratched in the carrying process of the LED lamp bead, and the LED lamp bead is not favorable for use.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a waterproof type LED encapsulation module to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme:

the utility model provides a waterproof type LED encapsulation module, includes the base plate, the top surface middle part of base plate is equipped with lamp pearl subassembly, and lamp pearl subassembly is including fixing base, wafer, gold thread, electrode slice, casing, encapsulation glue film, heat conduction pole, fluorescent layer and lens layer, and lamp pearl subassembly's outside cover is equipped with solid fixed ring, gu the top surface fixed connection of solid fixed ring and base plate, gu the outside cover of fixed ring is equipped with the closing cap rather than the looks adaptation, the circumference is equipped with fixed establishment between closing cap and the solid fixed ring, fixed establishment is including jack, inserted bar, shrink groove, separation blade and spring.

As a further aspect of the present invention: the fixing seat is fixedly connected to the top surface of the substrate, the shell is sleeved on the outer side of the fixing seat and fixedly connected with the top surface of the substrate, the lens layer is fixedly connected to the inner side of the top of the shell, the wafer is fixedly connected to the inner side of the top of the fixing seat, the fluorescent layer is arranged above the wafer and fixedly connected with the inner wall of the fixing seat.

As a further aspect of the present invention: electrode slice symmetry fixed connection is on the both sides outer wall of casing, and one side of electrode slice inserts the base plate and flushes with the bottom surface of base plate, and in the opposite side of electrode slice inserted the casing, the one end and the electrode slice fixed connection of gold thread, the other end and the wafer fixed connection of gold thread, the encapsulation glue film is established between lens layer and fluorescent layer.

As a further aspect of the present invention: the circumference of the heat conducting rod is provided with a plurality of heat conducting rods, the heat conducting rods are made of heat conducting materials, one end of each heat conducting rod penetrates through the fixing seat to be in contact with the bottom surface of the wafer, and the other end of each heat conducting rod is inserted into the substrate and is flush with the outer wall of the substrate.

As a further aspect of the present invention: the jack is seted up on solid fixed ring, and the inserted bar corresponds and the adaptation with the jack, and the one end of inserted bar slides and runs through the closing cap, and the other end of inserted bar slides and runs through the shrink groove, one side of shrink groove and the outer wall fixed connection of closing cap.

As a further aspect of the present invention: the separation blade and spring all establish in the shrink groove, separation blade and shrink groove's inner wall sliding connection, and the spring housing is established in the outside of inserted bar, and the one end of spring touches with the outer wall of separation blade, and the other end of spring touches with the inner wall of shrink groove.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a base plate, lamp pearl subassembly, cooperation between solid fixed ring and the closing cap is used, make lamp pearl subassembly protected, the condition of lens layer fish tail has been avoided lamp pearl subassembly to appear carrying the storage in-process, through fixed establishment, the jack, the inserted bar, the shrink groove, cooperation between separation blade and the spring is used, make can be convenient between solid fixed ring and the closing cap fix and dismantle, thereby make this waterproof type LED encapsulation module have the guard action, can be convenient protect through the closing cap when storing up and carrying, convenient taking off the closing cap when using simultaneously.

2. Through the cooperation use between base plate, fixing base and the heat conduction pole for the produced heat energy of wafer work can be convenient pass through the heat conduction pole and transmit out lamp pearl subassembly, thereby make this waterproof type LED encapsulation module have the radiating function of being convenient for.

Drawings

Fig. 1 is a schematic structural diagram of a waterproof LED package module.

Fig. 2 is a front sectional view of a waterproof type LED package module.

Fig. 3 is a side sectional view of a waterproof type LED package module.

Fig. 4 is a perspective view of an opened state of a waterproof type LED package module.

In the figure: the LED lamp comprises a substrate 1, a lamp bead component 2, a fixing ring 3, a sealing cover 4, a fixing mechanism 5, a jack 6, an inserting rod 7, a shrinkage groove 8, a blocking piece 9, a spring 10, a fixing seat 11, a wafer 12, a gold thread 13, an electrode plate 14, a shell 15, a packaging adhesive layer 16, a heat conducting rod 17, a fluorescent layer 18 and a lens layer 19.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-4, in the embodiment of the utility model, a waterproof type LED encapsulation module, including base plate 1, base plate 1's top surface middle part is equipped with lamp pearl subassembly 2, lamp pearl subassembly 2 is including fixing base 11, wafer 12, gold thread 13, electrode slice 14, casing 15, encapsulation glue film 16, heat-conducting rod 17, fluorescent layer 18 and lens layer 19, lamp pearl subassembly 2's outside cover is equipped with solid fixed ring 3, gu fixed ring 3 and base plate 1's top surface fixed connection, gu fixed ring 3's outside cover is equipped with the closing cap 4 rather than the looks adaptation, the circumference is equipped with fixed establishment 5 between closing cap 4 and the solid fixed ring 3, fixed establishment 5 is including jack 6, inserted bar 7, shrink groove 8, separation blade 9 and spring 10.

Fixing base 11 fixed connection is at the top surface of base plate 1, and casing 15 cover is established in the outside of fixing base 11, and casing 15 and base plate 1's top surface fixed connection, lens layer 19 fixed connection are inboard at the top of casing 15, and wafer 12 fixed connection is inboard at the top of fixing base 11, and fluorescent layer 18 establishes in the top of wafer 12, and fluorescent layer 18 and fixing base 11's inner wall fixed connection.

Electrode slice 14 symmetry fixed connection is on the both sides outer wall of casing 15, and one side of electrode slice 14 inserts base plate 1 and flushes with the bottom surface of base plate 1, and in the opposite side of electrode slice 14 inserted casing 15, the one end and the electrode slice 14 fixed connection of gold thread 13, the other end and the wafer 12 fixed connection of gold thread 13, and encapsulating glue film 16 establishes between lens layer 19 and fluorescent layer 18.

The circumference of the heat conducting rod 17 is provided with a plurality of heat conducting rods 17, the heat conducting rod 17 is made of heat conducting materials, one end of the heat conducting rod 17 penetrates through the fixed seat 11 to touch the bottom surface of the wafer 12, and the other end of the heat conducting rod 17 is inserted into the substrate 1 and is flush with the outer wall of the substrate 1.

The jack 6 is seted up on solid fixed ring 3, and inserted bar 7 corresponds and the adaptation with jack 6, and the one end of inserted bar 7 slides and runs through closing cap 4, and the other end of inserted bar 7 slides and runs through shrinkage pool 8, one side of shrinkage pool 8 and the outer wall fixed connection of closing cap 4.

Separation blade 9 and spring 10 all establish in shrink groove 8, and separation blade 9 and shrink groove 8's inner wall sliding connection, spring 10 cover is established in the outside of inserted bar 7, and the one end of spring 10 touches with the outer wall of separation blade 9, and the other end of spring 10 touches with shrink groove 8's inner wall.

The utility model discloses a theory of operation is:

under the cooperation use between the fixed seat 11, the wafer 12, the gold thread 13, the electrode plate 14, the shell 15, the packaging adhesive layer 16, the heat conducting rod 17, the fluorescent layer 18 and the lens layer 19, the packaging of the lamp bead component is completed, in an original state, the sealing cover 4 is sleeved on the outer side of the fixed ring 3, the spring 10 drives the inserting rod 7 to be inserted into the inserting hole 6 through the cooperation between the shrinkage groove 8 and the blocking piece 9, so that the sealing cover 4 is fixed on the outer side of the fixed ring 3 to protect the lamp bead component 2, when the lamp bead component 2 needs to be used, the inserting rod 7 is pulled at the moment to pull out the inserting rod 7 from the inserting hole 6, thereby the sealing cover is conveniently taken down from the fixed ring 3, the lamp bead component 2 is exposed, then the electrode plate 14 on the bottom surface of the substrate 1 is fixedly connected with the circuit connection point of an external LED lamp, the connection between the lamp bead component 2 and the LED lamp is completed, when the LED lamp, the heat energy that wafer 12 produced is exported the outside of base plate 1 through heat conduction pole 17 this moment, accomplishes wafer 12's heat dissipation work, reduces the heat energy of wafer 12 and piles up the condition that causes fluorescent layer 18 and packaging adhesive layer 16 to produce expend with heat and contract with cold, reduces the influence of the volume change of fluorescent layer 18 and packaging adhesive layer 16 to the leakproofness of lamp pearl subassembly 2 to improve lamp pearl subassembly 2's waterproof performance.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A waterproof type LED encapsulation module, includes base plate (1), its characterized in that: the utility model discloses a lamp bead assembly, including base plate (1), lamp bead assembly (2) is including fixing base (11), wafer (12), gold thread (13), electrode slice (14), casing (15), encapsulation glue film (16), heat conduction pole (17), fluorescent layer (18) and lens layer (19), the outside cover of lamp bead assembly (2) is equipped with solid fixed ring (3), gu fixed ring (3) and the top surface fixed connection of base plate (1), gu the outside cover of solid fixed ring (3) is equipped with closing cap (4) rather than the looks adaptation, the circumference is equipped with fixed establishment (5) between closing cap (4) and solid fixed ring (3), fixed establishment (5) are including jack (6), inserted bar (7), shrink groove (8), separation blade (9) and spring (10).

2. The waterproof LED packaging module according to claim 1, wherein: fixing base (11) fixed connection is in the top surface of base plate (1), and casing (15) cover is established in the outside of fixing base (11), and casing (15) and the top surface fixed connection of base plate (1), lens layer (19) fixed connection are inboard at the top of casing (15), and wafer (12) fixed connection is inboard at the top of fixing base (11), and fluorescent layer (18) are established in the top of wafer (12), and fluorescent layer (18) and the inner wall fixed connection of fixing base (11).

3. The waterproof LED packaging module according to claim 1, wherein: electrode slice (14) symmetry fixed connection is on the both sides outer wall of casing (15), and one side of electrode slice (14) inserts base plate (1) and flushes with the bottom surface of base plate (1), and in the opposite side of electrode slice (14) inserted casing (15), the one end and electrode slice (14) fixed connection of gold thread (13), the other end and wafer (12) fixed connection of gold thread (13), and encapsulation glue film (16) are established between lens layer (19) and fluorescent layer (18).

4. The waterproof LED packaging module according to claim 1, wherein: the circumference of the heat conducting rod (17) is provided with a plurality of heat conducting rods, the heat conducting rod (17) is made of heat conducting materials, one end of the heat conducting rod (17) penetrates through the fixed seat (11) to touch the bottom surface of the wafer (12), and the other end of the heat conducting rod (17) is inserted into the substrate (1) and is flush with the outer wall of the substrate (1).

5. The waterproof LED packaging module according to claim 1, wherein: jack (6) are seted up on solid fixed ring (3), and inserted bar (7) correspond and the adaptation with jack (6), and the one end of inserted bar (7) slides and runs through closing cap (4), and the other end of inserted bar (7) slides and runs through shrink groove (8), the outer wall fixed connection of one side and closing cap (4) of shrink groove (8).

6. The waterproof LED packaging module according to claim 1, wherein: separation blade (9) and spring (10) all establish in shrink groove (8), separation blade (9) and the inner wall sliding connection of shrink groove (8), and the outside at inserted bar (7) is established in spring (10) cover, and the one end of spring (10) touches with the outer wall of separation blade (9), and the other end of spring (10) touches with the inner wall of shrink groove (8).