CN213366554U

CN213366554U - Automatic feeding device for polishing silicon wafers

Info

Publication number: CN213366554U
Application number: CN202022824990.4U
Authority: CN
Inventors: 還勝欽; 李漢生; 蔡雪良
Original assignee: Kunshan Zhongchen Silicon Crystal Co ltd
Current assignee: Kunshan Zhongchen Silicon Crystal Co ltd; Kunshan Sino Silicon Technology Co Ltd
Priority date: 2020-11-30
Filing date: 2020-11-30
Publication date: 2021-06-04
Anticipated expiration: 2030-11-30

Abstract

The utility model discloses an automatic feeding device is used in silicon wafer polishing, the on-line screen storage device comprises a base, the bottom fixed mounting of base has the supporting leg, the top fixed mounting of base has the support column, the inboard fixed mounting of support column has the diaphragm, the top of diaphragm is provided with polishing mechanism, the top fixed mounting of base has first backup pad, the top fixed mounting of first backup pad has first motor, the power transmission end transmission of first motor is connected with the belt. The utility model discloses a set up the push pedal, cooperation second motor and lead screw push away polishing on the conveyer belt to the clamp splice, through setting up first motor, belt, screw rod, threaded sleeve and connecting rod, make the clamp splice remove about can, will polish a centre gripping or loosen, set up the discharge gate, make and can directly discharge the polishing platform after polishing to avoid operating personnel and polishing to contact at polishing in-process, thereby realize automatic feeding unloading process.

Description

Automatic feeding device for polishing silicon wafers

Technical Field

The utility model relates to a processing equipment technical field specifically is an automatic feeding device is used in silicon wafer polishing.

Background

Silicon is a semiconductor material and its own conductivity is not very good. However, its resistivity can be precisely controlled by adding appropriate dopants. Before semiconductor manufacturing, silicon must be converted into wafers, which are then cut, ground, polished, and the like.

At present, when silicon wafers are polished, an operator is required to place the silicon wafers on a polishing table, the polishing table is used for polishing after the silicon wafers are fixed, the polished silicon wafers are taken out, the polishing process needs a large amount of manpower for operation, and particles such as dust on the operator easily contact the silicon wafers in the feeding and taking processes, so that the silicon wafers are contaminated, and the follow-up processing is not facilitated.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an automatic feeding device is used in silicon wafer polishing to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an automatic feeding device for polishing a silicon wafer comprises a base, wherein a supporting leg is fixedly installed at the bottom of the base, a supporting column is fixedly installed at the top of the base, a transverse plate is fixedly installed on the inner side of the supporting column, a polishing mechanism is arranged at the top of the transverse plate, a first supporting plate is fixedly installed at the top of the base, a first motor is fixedly installed at the top of the first supporting plate, a belt is connected to the power transmission end of the first motor in a transmission manner, a screw rod is connected to the power transmission end of the first motor in a transmission manner, a supporting block is fixedly installed at the top of the base, a screw rod is movably connected to the inside of the supporting block, a discharge hole is formed in the bottom of the base, a threaded sleeve is in threaded connection with the surface of the screw rod, a first sleeve is fixedly installed inside, the back of connecting rod is provided with the clamp splice, the top fixed mounting of base has the bracing piece, the inboard of bracing piece is provided with the conveyer belt, the inside swing joint of connecting rod has the second sleeve, the fixed surface of clamp splice installs the fixed block, the inside movable mounting of fixed block has the third sleeve, the surface of clamp splice is provided with polishes, the surface of conveyer belt is provided with the push pedal, the top fixed mounting of base has fixed box, the top fixed mounting of base has the second backup pad, the top fixed mounting of second backup pad has the second motor, the power transmission end transmission of second motor is connected with the lead screw.

Preferably, two identical screws are arranged at two ends of the belt.

Preferably, the threaded sleeve is movably connected with the connecting rod through a first sleeve.

Preferably, the surface of the second sleeve is provided with two identical connecting rods, and the connecting rods are crossed with the second sleeve as a center.

Preferably, one end, far away from the screw rod, of the connecting rod is movably connected with the third sleeve, and the fixing block is movably connected with the connecting rod through the third sleeve.

Preferably, the surface of the screw rod is fixedly installed with the bottom of the push plate, and the top of the fixing box is provided with a rectangular long groove for the push plate to move.

Compared with the prior art, the beneficial effects of the utility model are that: this automatic feeding device is used in silicon wafer polishing, through setting up the push pedal, cooperation second motor and lead screw, push away polishing piece on the conveyer belt to the clamp splice on, through setting up first motor, the belt, the screw rod, threaded sleeve and connecting rod, make the clamp splice can control the removal, will polish a centre gripping or loosen, set up the discharge gate, but make polishing piece polishing back direct discharge polishing platform, thereby avoid operating personnel and polishing piece to contact at the polishing in-process, thereby realize automatic feeding unloading process, reach the practicality.

Drawings

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic top view of the present invention;

fig. 3 is a schematic view of the structure of the clamping block of the present invention.

In the figure: 1. a base; 2. supporting legs; 3. a support pillar; 4. a transverse plate; 5. a polishing mechanism; 6. a first support plate; 7. a first motor; 8. a belt; 9. a screw; 10. a support block; 11. a discharge port; 12. a threaded sleeve; 13. a first sleeve; 14. a connecting rod; 15. a clamping block; 16. a support bar; 17. a conveyor belt; 18. a second sleeve; 19. a fixed block; 20. a third sleeve; 21. a polishing member; 22. pushing the plate; 23. a fixing box; 24. a second support plate; 25. a second motor; 26. and a screw rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides an embodiment: an automatic feeding device for polishing a silicon wafer comprises a base 1, wherein supporting legs 2 are fixedly installed at the bottom of the base 1, a supporting column 3 is fixedly installed at the top of the base 1, a transverse plate 4 is fixedly installed on the inner side of the supporting column 3, a polishing mechanism 5 is arranged at the top of the transverse plate 4, a first supporting plate 6 is fixedly installed at the top of the base 1, a first motor 7 is fixedly installed at the top of the first supporting plate 6, a power transmission end of the first motor 7 is in transmission connection with a belt 8, a power transmission end of the first motor 7 is in transmission connection with a screw rod 9, two ends of the belt 8 are provided with two same screw rods 9, the two screw rods 9 rotate in the same direction through the belt 8, a supporting block 10 is fixedly installed at the top of the base 1, the screw rods 9 are movably connected inside the supporting block 10, a discharging hole 11 is formed in the bottom, the surface of the screw 9 is in threaded connection with a threaded sleeve 12, a first sleeve 13 is fixedly installed inside the threaded sleeve 12, a connecting rod 14 is movably connected to the surface of the first sleeve 13, the threaded sleeve 12 is movably connected with the connecting rod 14 through the first sleeve 13, a clamping block 15 is arranged on the back of the connecting rod 14, a supporting rod 16 is fixedly installed at the top of the base 1, a conveyor belt 17 is arranged on the inner side of the supporting rod 16, a second sleeve 18 is movably connected to the inside of the connecting rod 14, two identical connecting rods 14 are arranged on the surface of the second sleeve 18 and are arranged in a crossed mode with the second sleeve 18 as the center, a fixing block 19 is fixedly installed on the surface of the clamping block 15, a third sleeve 20 is fixedly installed inside the fixing block 19, one end, far away from the screw 9, of the connecting rod 14 is movably connected with the third sleeve 20, the fixing block 19 is movably connected with the connecting, The polishing device comprises a belt 8, a screw rod 9, a threaded sleeve 12 and a connecting rod 14, the clamping block 15 can move left and right, the polishing piece 21 is clamped or loosened, the polishing piece 21 is arranged on the surface of the clamping block 15, a push plate 22 is arranged on the surface of a conveyor belt 17, a fixing box 23 is fixedly arranged at the top of the base 1, a second supporting plate 24 is fixedly arranged at the top of the base 1, a second motor 25 is fixedly arranged at the top of the second supporting plate 24, a power transmission end of the second motor 25 is in transmission connection with a screw rod 26, the surface of the screw rod 26 is fixedly arranged at the bottom of the push plate 22, a rectangular long groove for the push plate 22 to move is formed in the top of the fixing box 23, the polishing piece 21 on the conveyor belt 17 is pushed onto the clamping block 15 by arranging the push plate 22 and matching with the second motor 25 and the screw rod.

The working principle is as follows: this automatic feeding device is used in silicon wafer polishing, place conveyer belt 17 with polishing piece 21, first motor 7 work, belt 8 rotates along with it, transmit two screw rods 9 again, threaded sleeve 12 on the screw rod 9 removes to the centre, promote clamp splice 15 through connecting rod 14, promote two clamp splices 15 together, be used for centre gripping polishing piece 21, second motor 25 work, promote push pedal 22 through lead screw 26, thereby promote polishing piece 21 to between two clamp splice 15, after the polishing is accomplished, make threaded sleeve 12 reset through first motor 7, thereby separate two clamp splice 15, polishing piece 21 after the polishing drops to discharge gate 11, thereby reach the effect of automatic feeding unloading.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or scope of the present invention. Accordingly, the embodiments of the present invention are exemplary, and not limiting. The scope of the invention is indicated by the appended claims rather than by the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. An automatic feeding device for polishing silicon wafers comprises a base (1) and is characterized in that: the polishing machine is characterized in that supporting legs (2) are fixedly mounted at the bottom of the base (1), a supporting column (3) is fixedly mounted at the top of the base (1), a transverse plate (4) is fixedly mounted on the inner side of the supporting column (3), a polishing mechanism (5) is arranged at the top of the transverse plate (4), a first supporting plate (6) is fixedly mounted at the top of the base (1), a first motor (7) is fixedly mounted at the top of the first supporting plate (6), a belt (8) is connected to the power transmission end of the first motor (7) in a transmission manner, a screw rod (9) is connected to the power transmission end of the first motor (7) in a transmission manner, a supporting block (10) is fixedly mounted at the top of the base (1), a screw rod (9) is movably connected inside the supporting block (10), a discharge hole (11) is formed in the bottom of the base (1), and a, the inner fixed mounting of the threaded sleeve (12) is provided with a first sleeve (13), the surface of the first sleeve (13) is movably connected with a connecting rod (14), the back of the connecting rod (14) is provided with a clamping block (15), the top of the base (1) is fixedly provided with a supporting rod (16), the inner side of the supporting rod (16) is provided with a conveyor belt (17), the inner movable connection of the connecting rod (14) is provided with a second sleeve (18), the surface of the clamping block (15) is fixedly provided with a fixing block (19), the inner movable fixed mounting of the fixing block (19) is provided with a third sleeve (20), the surface of the clamping block (15) is provided with a polishing piece (21), the surface of the conveyor belt (17) is provided with a push plate (22), the top of the base (1) is fixedly provided with a fixing box (23), the top of the base (1) is fixedly provided with, the top of the second supporting plate (24) is fixedly provided with a second motor (25), and the power transmission end of the second motor (25) is in transmission connection with a screw rod (26).

2. The automatic feeding device for silicon wafer polishing as set forth in claim 1, wherein: two same screw rods (9) are arranged at two ends of the belt (8).

3. The automatic feeding device for silicon wafer polishing as set forth in claim 1, wherein: the threaded sleeve (12) is movably connected with the connecting rod (14) through the first sleeve (13).

4. The automatic feeding device for silicon wafer polishing as set forth in claim 1, wherein: the surface of the second sleeve (18) is provided with two identical connecting rods (14) which are arranged in a crossed manner by taking the second sleeve (18) as the center.

5. The automatic feeding device for silicon wafer polishing as set forth in claim 1, wherein: one end, far away from the screw rod (9), of the connecting rod (14) is movably connected with the third sleeve (20), and the fixing block (19) is movably connected with the connecting rod (14) through the third sleeve (20).

6. The automatic feeding device for silicon wafer polishing as set forth in claim 1, wherein: the surface of the screw rod (26) is fixedly installed with the bottom of the push plate (22), and the top of the fixed box (23) is provided with a rectangular long groove for the push plate (22) to move.