CN213340303U - Fast recovery module packaging structure based on multiple chips - Google Patents

Fast recovery module packaging structure based on multiple chips Download PDF

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Publication number
CN213340303U
CN213340303U CN202022690089.2U CN202022690089U CN213340303U CN 213340303 U CN213340303 U CN 213340303U CN 202022690089 U CN202022690089 U CN 202022690089U CN 213340303 U CN213340303 U CN 213340303U
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plate
rotating
sliding
bevel gear
fixing
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CN202022690089.2U
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黄昌民
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Wuxi Deli Core Semiconductor Technology Co ltd
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Wuxi Deli Core Semiconductor Technology Co ltd
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Abstract

The utility model discloses a fast recovery module packaging structure based on multicore piece relates to circuit board equipment technical field. The utility model comprises a base plate, wherein the upper side of the base plate is provided with a motor, a fixed cylinder, a sliding component and two first fixed plates, the output end of the motor is provided with a first rotating component, one side of the first rotating component is provided with a first bevel gear, and one side of the first rotating component is matched with a first rotating plate in a rotating way; one end of the sliding component is provided with a second bevel gear. The utility model discloses a slip subassembly that sets up, slip subassembly drive the sliding plate and slide in order to made things convenient for the chip to encapsulate, improved the chip and carried out encapsulation efficiency, the device power consumption sets up less, thereby reduced the power consumption of device, and the first fixed plate of setting has reduced the condition emergence that the sliding plate rocked when sliding, thereby has improved the stability of device.

Description

Fast recovery module packaging structure based on multiple chips
Technical Field
The utility model belongs to the technical field of circuit board equipment, especially, relate to a fast recovery module packaging structure based on multicore piece.
Background
Chips integrated circuits in which circuitry is fabricated on the surface of a semiconductor chip are also known as thin film integrated circuits. Another type of thick film integrated circuit is a miniaturized circuit formed by a discrete semiconductor device and passive components integrated into a substrate or wiring board.
Most of the traditional chip recovery module packaging structures are single-layer and low in efficiency, so that the economic benefit of a producer is reduced, and the device consumes more energy when being used for a long time.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a based on multi-chip resumes module packaging structure soon, through the slip subassembly that sets up, the slip subassembly drives the sliding plate and slides in order to made things convenient for the chip to encapsulate, improved the chip and carried out encapsulation efficiency, the device power consumption sets up lessly, thereby reduced the power consumption of device, and the first fixed plate of setting has reduced the condition emergence that the sliding plate rocked when sliding, thereby has improved the stability of device, has solved the problem that exists among the above-mentioned prior art.
In order to achieve the purpose, the utility model is realized by the following technical proposal:
a multi-chip fast recovery module-based packaging structure comprises a substrate, wherein a motor, a fixed cylinder, a sliding assembly and two first fixed plates are arranged on the upper side of the substrate, a first rotating assembly is mounted at the output end of the motor, a first bevel gear is mounted on one side of the first rotating assembly, and a first rotating plate is rotatably matched with one side of the first rotating assembly; one end of the sliding component is provided with a second bevel gear which is meshed with the first bevel gear, the peripheral side of the first rotating plate is rotationally matched with a second rotating component, the peripheral side of the second rotating component is rotationally matched with a sliding rod, and the sliding rod is slidably matched with the fixed cylinder; the sliding plate is in sliding fit with the inside of one first fixing plate, two first fixing rods are installed on one side of the sliding plate and are in sliding fit with the other first fixing plate, and the two first fixing rods are in elastic fit with the sliding assembly.
Optionally, an L-shaped plate is installed on one side of the first fixing plate, a fixing block is installed on one side of one L-shaped plate, a groove is formed in the fixing block, the motor is located in the groove, a baffle is installed on one side of the other L-shaped plate, a second rotating rod is rotatably matched with the inside of the baffle, a third bevel gear and a fourth bevel gear are installed at two ends of the second rotating rod respectively, the fourth bevel gear is meshed with the second bevel gear, and the third bevel gear is meshed with the first bevel gear.
Optionally, the first rotating assembly and the second rotating assembly each include: the end parts of the two first rotating rods are provided with connecting plates, a second fixing rod is arranged between the two connecting plates, and the two second fixing rods are in running fit with the first rotating plate.
Optionally, the output end of the motor is connected with one of the first rotating rods, the sliding rod is in running fit with one of the second fixing rods, and the first bevel gear is mounted at the end of one of the first rotating rods.
Optionally, a first limiting plate is installed between the two first fixing rods, two springs are installed on one side of the first limiting plate, the two springs are connected with one of the first fixing plates, the two springs are respectively sleeved on the peripheral sides of the two first fixing rods, and a second limiting plate is installed on the upper side of the first limiting plate.
Optionally, the sliding assembly comprises: two second fixed plates, and two second fixed plates all install the upside at the base plate, and normal running fit has the third dwang between two second fixed plates, and the second rotor plate is installed to the upside of third dwang, and second rotor plate and second limiting plate normal running fit, and a plurality of bracing pieces are installed to the bottom of base plate.
The embodiment of the utility model has the following beneficial effect:
the utility model discloses an embodiment is through the slip subassembly that sets up, and the slip subassembly drives the sliding plate and slides in order to made things convenient for the chip to encapsulate, improved the chip and carried out encapsulation efficiency, the device power consumption sets up less, thereby reduced the power consumption of device, and the first fixed plate of setting has reduced the condition emergence that the sliding plate rocked when sliding, thereby has improved the stability of device.
Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.
Drawings
The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic perspective view of an embodiment of the present invention;
fig. 2 is a schematic structural view of a first fixing plate and a second fixing plate according to an embodiment of the present invention;
fig. 3 is a schematic view of a first fixing rod according to an embodiment of the present invention.
Wherein the figures include the following reference numerals:
the device comprises a base plate 1, a supporting rod 2, a first fixing plate 3, a second fixing plate 4, a fixing barrel 5, an L-shaped plate 6, a fixing block 7, a first rotating rod 8, a connecting plate 9, a sliding rod 10, a second fixing rod 11, a first rotating plate 12, a first bevel gear 13, a baffle plate 14, a third bevel gear 15, a second rotating rod 16, a fourth bevel gear 17, a third rotating rod 18, a second bevel gear 19, a second rotating plate 20, a sliding plate 21, a first fixing rod 22, a first limiting plate 23, a spring 24 and a second limiting plate 25.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
To maintain the following description of the embodiments of the present invention clear and concise, detailed descriptions of well-known functions and components may be omitted.
Referring to fig. 1-3, in the present embodiment, a multi-chip-based fast recovery module package structure is provided, including: the device comprises a base plate 1, wherein a motor, a fixed cylinder 5, a sliding assembly and two first fixed plates 3 are arranged on the upper side of the base plate 1, a first rotating assembly is arranged at the output end of the motor, a first bevel gear 13 is arranged on one side of the first rotating assembly, and a first rotating plate 12 is rotatably matched with one side of the first rotating assembly; one end of the sliding component is provided with a second bevel gear 19, the second bevel gear 19 is meshed with the first bevel gear 13, the peripheral side of the first rotating plate 12 is rotatably matched with a second rotating component, the peripheral side of the second rotating component is rotatably matched with a sliding rod 10, and the sliding rod 10 is slidably matched with the fixed cylinder 5; a sliding plate 21 is slidably fitted inside one of the first fixing plates 3, two first fixing rods 22 are mounted on one side of the sliding plate 21, the two first fixing rods 22 are slidably fitted with the other first fixing plate 3, and the two first fixing rods 22 are elastically fitted with the sliding assembly.
The application of one aspect of the embodiment is as follows: when the chip is required to be packaged, firstly, the chip is respectively placed on the substrate 1 and the upper side of the sliding plate 21, then the motor is started, the output end of the motor drives the first bevel gear 13 through the first rotating component, the first rotating plate 12 rotates, the first rotating plate 12 drives the sliding rod 10 to slide in the fixed cylinder 5 through the second rotating component, the first bevel gear 13 drives the sliding component to rotate through the second bevel gear 19, the sliding component drives the sliding plate 21 to slide in the inside of one of the first fixed plates 3 through the two first fixed rods 22, and the sliding rod 10 respectively packages the chip on the upper side of the substrate 1 and the sliding plate 21, so that the chip packaging is completed. It should be noted that the motor referred to in this application may be powered by a battery or an external power source.
Through the sliding assembly who sets up, the sliding assembly drives sliding plate 21 and slides in order to made things convenient for the chip to encapsulate, improved the chip and capsulated efficiency, the device power consumption sets up lessly, thereby has reduced the power consumption of device, and the first fixed plate 3 that sets up has reduced the condition emergence that sliding plate 21 rocked when sliding, thereby has improved the stability of device.
L shaped plate 6 is installed to one side of the first fixed plate 3 of this embodiment, fixed block 7 is installed to one side of one of them L shaped plate 6, the recess has been seted up to the inside of fixed block 7, and the motor is located the recess, baffle 14 is installed to one side of another L shaped plate 6, the inside normal running fit of baffle 14 has second dwang 16, third bevel gear 15 is installed respectively at the both ends of second dwang 16, fourth bevel gear 17, and fourth bevel gear 17 and the meshing of second bevel gear 19, third bevel gear 15 and the meshing of first bevel gear 13, through the recess that sets up, be convenient for protect the motor.
The first rotating assembly and the second rotating assembly of the embodiment both comprise: two first rotating rod 8, connecting plate 9 is all installed to the tip of two first rotating rod 8, installs second dead lever 11 between two connecting plate 9, and two second dead levers 11 all with first rotation board 12 normal running fit.
The output end of the motor of the embodiment is connected with one of the first rotating rods 8, the sliding rod 10 is in rotating fit with one of the second fixing rods 11, and the first bevel gear 13 is arranged at the end part of one of the first rotating rods 8.
Install first limiting plate 23 between two first dead levers 22 of this embodiment, two springs 24 are installed to one side of first limiting plate 23, and two springs 24 all are connected with one of them first fixed plate 3, and two springs 24 overlap respectively and establish the week side at two first dead levers 22, and second limiting plate 25 is installed to the upside of first limiting plate 23.
The sliding assembly of the present embodiment includes: two second fixed plates 4, and two second fixed plates 4 are all installed at the upside of base plate 1, and normal running fit has third dwang 18 between two second fixed plates 4, and second dwang 20 is installed to the upside of third dwang 18, and second dwang 20 and second limiting plate 25 normal running fit, and a plurality of bracing pieces 2 are installed to the bottom of base plate 1, through the bracing piece 2 that sets up, are convenient for support substrate 1.
The above embodiments may be combined with each other.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are capable of operation in sequences other than those illustrated or described herein.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Claims (6)

1. A fast recovery module packaging structure based on multiple chips is characterized by comprising: the device comprises a base plate (1), wherein a motor, a fixed cylinder (5), a sliding assembly and two first fixed plates (3) are arranged on the upper side of the base plate (1), a first rotating assembly is installed at the output end of the motor, a first bevel gear (13) is installed on one side of the first rotating assembly, and a first rotating plate (12) is rotatably matched on one side of the first rotating assembly;
one end of the sliding component is provided with a second bevel gear (19), the second bevel gear (19) is meshed with the first bevel gear (13), the peripheral side of the first rotating plate (12) is rotatably matched with a second rotating component, the peripheral side of the second rotating component is rotatably matched with a sliding rod (10), and the sliding rod (10) is slidably matched with the fixed cylinder (5);
the sliding plate (21) is in sliding fit with the inside of one first fixing plate (3), two first fixing rods (22) are installed on one side of the sliding plate (21), the two first fixing rods (22) are in sliding fit with the other first fixing plate (3), and the two first fixing rods (22) are in elastic fit with the sliding assembly.
2. The multi-chip-based fast recovery module packaging structure according to claim 1, wherein the L-shaped plate (6) is installed at one side of the first fixing plate (3), the fixing block (7) is installed at one side of one of the L-shaped plates (6), a groove is formed in the fixing block (7), the motor is located in the groove, the baffle (14) is installed at one side of the other L-shaped plate (6), the second rotating rod (16) is rotatably fitted in the baffle (14), the third bevel gear (15) and the fourth bevel gear (17) are installed at two ends of the second rotating rod (16) respectively, the fourth bevel gear (17) is meshed with the second bevel gear (19), and the third bevel gear (15) is meshed with the first bevel gear (13).
3. The multi-chip-based fast recovery module package structure of claim 1, wherein the first rotating assembly and the second rotating assembly each comprise: the two first rotating rods (8) are respectively provided with a connecting plate (9) at the end part of each first rotating rod (8), a second fixing rod (11) is arranged between the two connecting plates (9), and the two second fixing rods (11) are respectively matched with the first rotating plate (12) in a rotating mode.
4. A module package structure based on multi-chip fast recovery according to claim 3, wherein the output end of the motor is connected to one of the first rotating rods (8), the sliding rod (10) is rotatably engaged with one of the second fixing rods (11), and the first bevel gear (13) is installed at the end of one of the first rotating rods (8).
5. The packaging structure based on the multi-chip fast recovery module according to claim 1, wherein a first limiting plate (23) is installed between the two first fixing rods (22), two springs (24) are installed on one side of the first limiting plate (23), the two springs (24) are both connected to one of the first fixing plates (3), the two springs (24) are respectively sleeved on the peripheral sides of the two first fixing rods (22), and a second limiting plate (25) is installed on the upper side of the first limiting plate (23).
6. The multi-chip-based fast recovery module package structure of claim 5, wherein the sliding assembly comprises: two second fixed plates (4), and two second fixed plates (4) are all installed at the upside of base plate (1), and normal running fit has third dwang (18) between two second fixed plates (4), and second rotor plate (20) are installed to the upside of third dwang (18), and second rotor plate (20) and second limiting plate (25) normal running fit, and a plurality of bracing pieces (2) are installed to the bottom of base plate (1).
CN202022690089.2U 2020-11-19 2020-11-19 Fast recovery module packaging structure based on multiple chips Active CN213340303U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022690089.2U CN213340303U (en) 2020-11-19 2020-11-19 Fast recovery module packaging structure based on multiple chips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022690089.2U CN213340303U (en) 2020-11-19 2020-11-19 Fast recovery module packaging structure based on multiple chips

Publications (1)

Publication Number Publication Date
CN213340303U true CN213340303U (en) 2021-06-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022690089.2U Active CN213340303U (en) 2020-11-19 2020-11-19 Fast recovery module packaging structure based on multiple chips

Country Status (1)

Country Link
CN (1) CN213340303U (en)

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