CN213339707U - Novel thermosetting conductive adhesive film - Google Patents
Novel thermosetting conductive adhesive film Download PDFInfo
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- CN213339707U CN213339707U CN202022552601.7U CN202022552601U CN213339707U CN 213339707 U CN213339707 U CN 213339707U CN 202022552601 U CN202022552601 U CN 202022552601U CN 213339707 U CN213339707 U CN 213339707U
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- conductive adhesive
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Abstract
The utility model provides a novel thermosetting conductive adhesive film relates to conductive adhesive film technical field. Including glued membrane roller, conductive adhesive membrane and last metallic shield, be provided with on the glued membrane roller conductive adhesive membrane, conductive adhesive membrane includes conductive adhesive layer, be provided with conductive particle in the conductive adhesive layer, conductive adhesive layer upper end is provided with insulating glue layer, it is provided with the bond line to go up insulating glue layer upper end, it is provided with to go up the bond line upper end go up metallic shield, the conductive adhesive layer lower extreme is provided with down insulating glue layer, the insulating glue layer lower extreme is provided with down the bond line, the bond line lower extreme is provided with down metallic shield down. The utility model discloses a through set up metal shield and lower metal shield, can make conductive adhesive film have splendid electromagnetic shielding performance, can not disturbed by external electromagnetic field, make conductive adhesive film have better job stabilization nature.
Description
Technical Field
The utility model relates to a conductive adhesive film technical field specifically is a novel thermosetting conductive adhesive film.
Background
The conductive adhesive is an adhesive which has certain conductivity after being cured or dried. It can connect multiple conductive materials together to form an electrical path between the connected materials. In the electronics industry, conductive adhesives have become an indispensable new material. The variety of the conductive adhesive is various, and the conductive adhesive can be divided into a general conductive adhesive and a special conductive adhesive from the application angle. The general conductive adhesive only has certain requirements on the conductivity and the adhesive bonding strength of the conductive adhesive, and the special conductive adhesive has certain special requirements on the conductivity and the adhesive bonding strength. Such as high temperature resistance, ultra-low temperature resistance, instant curing, anisotropy, transparency and the like. The conductive paste can be classified into silver-based conductive paste, gold-based conductive paste, copper-based conductive paste, carbon-based conductive paste, and the like according to the kind of conductive particles in the conductive paste, and the most widely used conductive paste is silver-based conductive paste.
The existing conductive adhesive film is easily interfered by an external electromagnetic field during working, the working stability is poor, the practicability is not enough, and the insulation protection performance of the existing conductive adhesive film after surface abrasion is poor.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a novel thermosetting conductive adhesive film to the problem of proposing among the above-mentioned background art of solution.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides a novel thermosetting conductive adhesive film, includes glued membrane roller, conductive adhesive film and last metallic shield, be provided with on the glued membrane roller conductive adhesive film, conductive adhesive film includes conductive adhesive layer, be provided with conductive particle in the conductive adhesive layer, the conductive adhesive layer upper end is provided with the insulating glue film, it is provided with the bond line to go up insulating glue film upper end, it is provided with to go up the bond line upper end go up metallic shield, the conductive adhesive layer lower extreme is provided with down insulating glue film, the insulating glue film lower extreme is provided with down the bond line down, the bond line lower extreme is provided with down metallic shield down.
Preferably, the conductive adhesive film is wound and connected with the adhesive film roller, the conductive particles are bonded with the conductive adhesive layer, and the conductive particles are metal particles.
Preferably, the conductive adhesive layer upper end with it splices to go up the insulating adhesive layer lower extreme, the conductive adhesive layer lower extreme with insulating adhesive layer splices down, go up insulating adhesive layer and insulating adhesive layer all adopts insulating resin to make down.
Preferably, go up the insulating glue layer upper end with it bonds to go up the bond line lower extreme, down the insulating glue layer lower extreme with it bonds to go up the bond line upper end down, go up metal shielding layer lower extreme with it bonds to go up the bond line upper end.
Preferably, the lower end of the lower bonding layer is glued to the upper end of the lower metal shielding layer, and the upper metal shielding layer and the lower metal shielding layer are of net-shaped structures woven by metal wires.
Preferably, the upper end of the upper metal shielding layer is connected with an upper thermosetting layer in an adhesive manner, the lower end of the lower metal shielding layer is connected with a lower thermosetting layer in an adhesive manner, the upper thermosetting layer and the lower thermosetting layer are made of thermosetting resin, and a through hole is formed in the middle of the adhesive film roller.
Preferably, the upper end of the upper thermosetting layer is connected with an upper protective film in an adhesive mode, the lower end of the lower thermosetting layer is connected with a lower protective film in an adhesive mode, and the upper protective film and the lower protective film are both transparent plastic films.
The utility model provides a novel thermosetting conductive adhesive film, its beneficial effect who possesses as follows:
1. the utility model has the advantages that by arranging the upper metal shielding layer and the lower metal shielding layer, the conductive adhesive film has excellent electromagnetic shielding performance and can not be interfered by an external electromagnetic field, so that the conductive adhesive film has better working stability, and the problems that the existing conductive adhesive film is easily interfered by the external electromagnetic field during working, the working stability is poor and the practicability is insufficient are solved;
2. the utility model discloses a through setting up insulating glue film and lower insulating glue film, can make conductive adhesive film increase the insulating protection of one deck again on thermosetting protective layer's basis, can guarantee that the inside conductive part of conductive adhesive film has splendid insulating protection to prevent conductive adhesive film from taking place the short circuit scheduling problem at the during operation, solved the relatively poor problem of insulating protective properties behind the current conductive adhesive film surface wear.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention wound on a glue film roll;
FIG. 2 is a schematic structural view of the conductive adhesive film of the present invention;
FIG. 3 is a cross-sectional view of the conductive adhesive film of the present invention;
fig. 4 is the overall structure schematic diagram of the middle glue film roller of the present invention.
In the figure: 1. a film roll; 2. a conductive adhesive film; 3. a conductive adhesive layer; 4. conductive particles; 5. an insulating glue layer is arranged; 6. an upper adhesive layer; 7. an upper metal shielding layer; 8. a lower insulating glue layer; 9. a lower adhesive layer; 10. a lower metal shielding layer; 11. an upper thermosetting layer; 12. a lower thermoset layer; 13. a through hole; 14. coating a protective film; 15. and a lower protective film.
Detailed Description
The embodiment of the utility model provides a novel thermosetting conductive adhesive film, as shown in fig. 1-4, including gluing membrane roller 1, conductive adhesive film 2 and last metallic shield 7, be provided with conductive adhesive film 2 on gluing membrane roller 1, conductive adhesive film 2 includes conductive adhesive layer 3, be provided with conductive particle 4 in the conductive adhesive layer 3, conductive adhesive layer 3 upper end is provided with insulating glue film 5, it is provided with bond line 6 to go up insulating glue film 5 upper end, it is provided with metallic shield 7 to go up bond line 6 upper end, 3 lower extremes of conductive adhesive layer are provided with down insulating glue film 8, 8 lower extremes of lower insulating glue film are provided with down bond line 9, 9 lower extremes of bond line are provided with down metallic shield 10, it can make conductive adhesive film 2 have splendid electromagnetic shielding performance to go up metallic shield 7 and lower metallic shield 10, make conductive adhesive film 2 have better job stabilization nature.
The implementation mode is specifically as follows: the conductive adhesive film 2 is wound and connected with the adhesive film roller 1, the conductive particles 4 are glued with the conductive adhesive layer 3, the adhesive film roller 1 is used for bearing the conductive adhesive film 2, the conductive particles 4 are metal particles, the conductive particles 4 can enable the conductive adhesive film 2 to have excellent conductive performance, the conductive particles 4 are connected with electrodes between the IC chip and the substrate, the conductive adhesive film can be conducted, and meanwhile, the conduction short circuit between two adjacent electrodes can be avoided; the upper end of the conductive adhesive layer 3 is glued with the lower end of the upper insulating adhesive layer 5, the lower end of the conductive adhesive layer 3 is glued with the lower insulating adhesive layer 8, the upper insulating adhesive layer 5 and the lower insulating adhesive layer 8 are both made of insulating resin, and the upper insulating layer and the lower insulating layer can protect the conductive adhesive layer 3 to insulate the periphery of the conductive adhesive layer 3; go up 5 upper ends of insulating glue layer and the lower extreme of last bond line and splice, 8 lower extremes of lower insulating glue layer and the upper end of lower bond line 9 splice, go up 7 lower extremes of metal shielding layer and the upper end of last bond line and splice, go up bond line 6 and bond line 9 down and have splendid cohesiveness and pliability, can make conductive adhesive film 2's wholeness better to make conductive adhesive film 2's pliability better.
The lower end of the lower bonding layer 9 is glued with the upper end of the lower metal shielding layer 10, the upper metal shielding layer 7 and the lower metal shielding layer 10 are both of a net structure woven by metal wires, and the upper metal shielding layer 7 and the lower metal shielding layer 10 both have good flexibility and can play a role in electromagnetic shielding in the conductive adhesive film 2, so that the conductive adhesive film 2 cannot be interfered by external electromagnetic interference; the upper end of the upper metal shielding layer 7 is connected with an upper thermosetting layer 11 in an adhesive manner, the lower end of the lower metal shielding layer 10 is connected with a lower thermosetting layer 12 in an adhesive manner, the upper thermosetting layer 11 and the lower thermosetting layer 12 are both made of thermosetting resin, a through hole 13 is formed in the middle of the adhesive film roller 1, the upper thermosetting layer 11 and the lower thermosetting layer 12 made of thermosetting resin are cured and insoluble after being heated, and the conductive adhesive film 2 has the performances of heat insulation, wear resistance, insulation, high-voltage resistance and the like, and can be heated, cured and shaped after the conductive adhesive film 2 is arranged, so that the conductive adhesive film 2 is protected in a severe environment; an upper protective film 14 is glued to the upper end of the upper thermosetting layer 11, a lower protective film 15 is glued to the lower end of the lower thermosetting layer 12, the upper protective film 14 and the lower protective film 15 are both transparent plastic films, the upper protective film 14 and the lower protective film 15 can protect the surface of the conductive adhesive film 2 from the conductive adhesive film 2, and the upper protective film 14 and the lower protective film 15 can be torn off when the conductive adhesive film 2 is used.
The working principle is as follows: when the conductive adhesive film 2 is used, the upper protective film 14 and the lower protective film 15 need to be torn off, after the conductive adhesive layer 3 is connected with the electrodes, the conductive particles 4 are connected with the electrodes between the IC chip and the substrate, so that the conductive adhesive film can be conducted, and meanwhile, the conduction short circuit between two adjacent electrodes can be avoided, the conductive adhesive layer 3 can be protected by the upper insulating layer and the lower insulating layer, so that the periphery of the conductive adhesive layer 3 is insulated, the upper bonding layer 6 and the lower bonding layer 9 have excellent adhesiveness and flexibility, so that the integrity of the conductive adhesive film 2 is better, the flexibility of the conductive adhesive film 2 is better, the upper metal shielding layer 7 and the lower metal shielding layer 10 can play a role of electromagnetic shielding in the conductive adhesive film 2, so that the conductive adhesive film 2 cannot be interfered by external electromagnetism, the conductive adhesive film 2 has better working stability, the upper thermosetting layer 11 and the lower thermosetting layer 12 made of thermosetting resin are cured and insoluble after being, the conductive adhesive film has the performances of heat insulation, wear resistance, insulation, high-voltage resistance and the like, and can be heated, cured and shaped after the conductive adhesive film 2 is arranged, so that the conductive adhesive film 2 is protected in a severe environment.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. The utility model provides a novel thermosetting conductive adhesive film, includes glued membrane roller (1), conductive adhesive film (2) and goes up metal shielding layer (7), its characterized in that: be provided with on glued membrane roller (1) conductive adhesive film (2), conductive adhesive film (2) are including conductive adhesive layer (3), be provided with conductive particle (4) in conductive adhesive layer (3), conductive adhesive layer (3) upper end is provided with insulating glue layer (5), it is provided with bond line (6) to go up insulating glue layer (5) upper end, it is provided with to go up bond line (6) upper end go up metallic shield layer (7), conductive adhesive layer (3) lower extreme is provided with down insulating glue layer (8), insulating glue layer (8) lower extreme is provided with down bond line (9), bond line (9) lower extreme is provided with down metallic shield layer (10) down.
2. The novel thermosetting conductive adhesive film as claimed in claim 1, wherein: the conductive adhesive film (2) is connected with the adhesive film roller (1) in a winding mode, the conductive particles (4) are connected with the conductive adhesive layer (3) in a bonding mode, and the conductive particles (4) are metal particles.
3. The novel thermosetting conductive adhesive film as claimed in claim 1, wherein: conductive adhesive layer (3) upper end with it splices to go up insulating adhesive layer (5) lower extreme, conductive adhesive layer (3) lower extreme with insulating adhesive layer (8) splice down, go up insulating adhesive layer (5) and insulating adhesive layer (8) all adopt insulating resin to make down.
4. The novel thermosetting conductive adhesive film as claimed in claim 1, wherein: go up insulating glue film (5) upper end with go up bond line (6) lower extreme and splice, lower insulating glue film (8) lower extreme with bond line (9) upper end is spliced down, go up metallic shield (7) lower extreme with go up bond line (6) upper end and splice.
5. The novel thermosetting conductive adhesive film as claimed in claim 1, wherein: lower bond line (9) lower extreme with metal shielding layer (10) upper end is glued joint down, go up metal shielding layer (7) and metal shielding layer (10) are the network structure that the wire was worked out down.
6. The novel thermosetting conductive adhesive film as claimed in claim 1, wherein: go up metal shielding layer (7) upper end cement joint has last thermosetting layer (11), metal shielding layer (10) lower extreme cement joint has lower thermosetting layer (12) down, go up thermosetting layer (11) and thermosetting layer (12) all adopt thermosetting resin to make down, the shaping of plastic film roller (1) middle part has through-hole (13).
7. The novel thermosetting conductive adhesive film as claimed in claim 6, wherein: the upper end of the upper thermosetting layer (11) is connected with an upper protective film (14) in an adhesive mode, the lower end of the lower thermosetting layer (12) is connected with a lower protective film (15) in an adhesive mode, and the upper protective film (14) and the lower protective film (15) are both transparent plastic films.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022552601.7U CN213339707U (en) | 2020-11-07 | 2020-11-07 | Novel thermosetting conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022552601.7U CN213339707U (en) | 2020-11-07 | 2020-11-07 | Novel thermosetting conductive adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213339707U true CN213339707U (en) | 2021-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022552601.7U Expired - Fee Related CN213339707U (en) | 2020-11-07 | 2020-11-07 | Novel thermosetting conductive adhesive film |
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| CN (1) | CN213339707U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116376455A (en) * | 2023-04-28 | 2023-07-04 | 合肥联宝信息技术有限公司 | Conductive adhesive tape and preparation process and application thereof |
-
2020
- 2020-11-07 CN CN202022552601.7U patent/CN213339707U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116376455A (en) * | 2023-04-28 | 2023-07-04 | 合肥联宝信息技术有限公司 | Conductive adhesive tape and preparation process and application thereof |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210601 Termination date: 20211107 |