CN213335977U - Laser displacement sensor through air-cooling and water-cooling heat dissipation - Google Patents
Laser displacement sensor through air-cooling and water-cooling heat dissipation Download PDFInfo
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- CN213335977U CN213335977U CN202022297289.1U CN202022297289U CN213335977U CN 213335977 U CN213335977 U CN 213335977U CN 202022297289 U CN202022297289 U CN 202022297289U CN 213335977 U CN213335977 U CN 213335977U
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- operation joint
- heat dissipation
- displacement sensor
- laser displacement
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Abstract
The utility model discloses a laser displacement sensor radiating heat through air cooling and water cooling, which comprises a shell, a first quick coupling, a second quick coupling, a cover plate and a sealing ring; the casing openly installs electronic component, and the casing back is provided with the cavity, and first quick-operation joint and second quick-operation joint are installed on the casing, and first quick-operation joint and second quick-operation joint below are provided with the passageway respectively and are linked together with the cavity, and the cavity edge has and is used for the installation the sealing washer groove of sealing washer, the apron is installed at the casing back, is provided with the heat dissipation pipeline on the apron, and the pipeline import and the pipeline export of heat dissipation pipeline are connected respectively in the passageway department of first quick-operation joint and second quick-operation joint below. The utility model discloses a mode that ventilates and lead to water takes away the heat of casing and comes for heat dissipation such as electronic component, has kept apart heat dissipation medium and electronic component well, and the effectual heat dissipation medium that has prevented causes the components and parts damage with the electronic component contact.
Description
Technical Field
The utility model relates to a laser displacement sensor technical field especially relates to a through forced air cooling water-cooling heat dissipation's laser displacement sensor.
Background
The welding robot can produce a large amount of heat in the welding process, and the heat can be conducted to the laser displacement sensor, and the heat is gathered to a certain extent to cause the damage of electronic components in the laser displacement sensor.
The existing laser displacement sensor is used for heat dissipation based on a heat dissipation pipe, the production, processing and assembly of the laser displacement sensor are complex due to the heat dissipation mode, and a heat dissipation medium is easy to leak and damages and corrodes internal elements.
SUMMERY OF THE UTILITY MODEL
The utility model provides a through forced air cooling water-cooling heat dissipation's laser displacement sensor to laser displacement sensor radiating mode leads to production, processing, equipment complicacy among the solution prior art, and the radiating medium leaks easily, damages the corruption internal element problem.
The utility model adopts the technical proposal that: a laser displacement sensor capable of dissipating heat through air cooling and water cooling comprises a shell, a first quick coupling, a second quick coupling, a cover plate and a sealing ring; the casing openly installs electronic component, the casing back is provided with the cavity, first quick-operation joint with second quick-operation joint installs on the casing, first quick-operation joint with second quick-operation joint below be provided with respectively the passageway with the cavity is linked together, the cavity edge has and is used for the installation the seal ring groove of sealing washer, the apron is installed the casing back, be provided with the heat dissipation pipeline on the apron, the pipeline import and the pipeline export of heat dissipation pipeline are connected respectively first quick-operation joint with the passageway department of second quick-operation joint below.
Preferably, the first quick connector and the second quick connector are detachably mounted on the housing.
Preferably, the first quick connector and the second quick connector are connected to the housing by a snap or a screw.
Preferably, the cover plate has a thickness of 3 to 8 mm.
Preferably, high-strength sealant is coated at the sealing ring groove, the periphery of the concave cavity, and the joints of the first quick joint and the second quick joint with the shell.
The utility model has the advantages that: the utility model discloses a mode that ventilates and lead to water takes away the heat of casing and comes for heat dissipation such as electronic component, has kept apart heat dissipation medium and electronic component well, and the effectual heat dissipation medium that has prevented causes the components and parts damage with the electronic component contact.
Drawings
Fig. 1 is a schematic structural view of the back side of the laser displacement sensor disclosed in the present invention;
fig. 2 is a schematic view of the cover plate structure disclosed in the present invention;
fig. 3 is the utility model discloses a laser displacement sensor front structure schematic diagram.
Reference numerals: 1. a housing; 11. a concave cavity; 2. a first quick coupling; 3. a second quick coupling; 4. a cover plate; 5. a heat dissipation pipe; 51. a pipeline inlet; 52. and (4) a pipeline outlet.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, but the embodiments of the present invention are not limited thereto.
Example 1:
referring to fig. 1, a laser displacement sensor capable of dissipating heat through air cooling and water cooling comprises a shell 1, a first quick coupling 2, a second quick coupling 3, a cover plate 4 and a sealing ring.
The back of casing 1 sets up a cavity 11, and first quick-operation joint 2 and second quick-operation joint 3 pass through buckle or screw thread and install at the top of casing 1, and first quick-operation joint 2 and second quick-operation joint 3 below are provided with the passageway respectively and are linked together with cavity 11. The edge of the cavity 11 is provided with a sealing ring groove for mounting a sealing ring. The utility model discloses set the position of prior art's laser displacement sensor installation cooling tube to cavity 11, so laser displacement sensor's whole thickness does not change, and consequently the improvement cost is very low. It should be noted that the thickness is not changed and is not a limitation of the present invention.
Referring to fig. 2, a heat dissipation duct 5 is provided on the cover plate 4, and the heat dissipation duct 5 has a duct inlet 51 and a duct outlet 52. After the cover plate 4 is installed on the back of the casing 1, the pipeline inlet 51 is communicated with the channel below the first quick coupling 2, the pipeline outlet 52 is communicated with the channel below the second quick coupling 3, and the heat dissipation medium enters the heat dissipation pipeline 5 through the first quick coupling 2 and then goes out from the second quick coupling 3, so that the purpose of heat dissipation is achieved. The cover plate 4 is designed to be thickened, and the thickness is 3-8 mm. When a pressurized heat radiation medium passes through the heat radiation pipe 5, a sufficient strength can be secured.
Fig. 3 is a schematic structural diagram of the front surface of the housing 1, in which an electronic component to be cooled is mounted in a cavity on the front surface of the housing 1, and since the cavity 11 on the back surface of the housing 1 is completely isolated from the cavity on the front surface of the housing 1, the component damage caused by the contact between the cooling medium and the electronic component can be effectively prevented.
In the installation process, firstly, a sealing ring is installed in a sealing ring groove at the edge of the concave cavity 11, then high-strength sealant is coated at the sealing ring groove, the periphery of the concave cavity 11 and a screw hole, then the cover plate 4 is covered and fastened by screws, finally, the high-strength sealant is coated on the first quick connector 2 and the second quick connector 3, and the first quick connector 2 and the second quick connector 3 are installed at the top of the shell 1.
The heat dissipation medium in this embodiment may be water, cold air, coolant, or the like.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (5)
1. A laser displacement sensor capable of dissipating heat through air cooling and water cooling comprises a shell, and is characterized by further comprising a first quick coupling, a second quick coupling, a cover plate and a sealing ring; the casing openly installs electronic component, the casing back is provided with the cavity, first quick-operation joint with second quick-operation joint installs on the casing, first quick-operation joint with second quick-operation joint below be provided with respectively the passageway with the cavity is linked together, the cavity edge has and is used for the installation the seal ring groove of sealing washer, the apron is installed the casing back, be provided with the heat dissipation pipeline on the apron, the pipeline import and the pipeline export of heat dissipation pipeline are connected respectively first quick-operation joint with the passageway department of second quick-operation joint below.
2. The laser displacement sensor capable of dissipating heat through air cooling and water cooling as claimed in claim 1, wherein the first quick coupling and the second quick coupling are detachably mounted on the housing.
3. The laser displacement sensor capable of dissipating heat through air cooling and water cooling as claimed in claim 2, wherein the first quick coupling and the second quick coupling are connected to the housing through a snap or a screw.
4. The laser displacement sensor capable of dissipating heat through air cooling and water cooling as claimed in claim 1, wherein the cover plate has a thickness of 3-8 mm.
5. The laser displacement sensor capable of dissipating heat through air cooling and water cooling as claimed in claim 1, wherein a high strength sealant is coated on the sealing ring groove, the periphery of the concave cavity, and the joints between the first quick coupling and the second quick coupling and the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022297289.1U CN213335977U (en) | 2020-10-15 | 2020-10-15 | Laser displacement sensor through air-cooling and water-cooling heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022297289.1U CN213335977U (en) | 2020-10-15 | 2020-10-15 | Laser displacement sensor through air-cooling and water-cooling heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213335977U true CN213335977U (en) | 2021-06-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022297289.1U Active CN213335977U (en) | 2020-10-15 | 2020-10-15 | Laser displacement sensor through air-cooling and water-cooling heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213335977U (en) |
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2020
- 2020-10-15 CN CN202022297289.1U patent/CN213335977U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 610000 No. 42, Huatai Road, Chenghua District, Chengdu, Sichuan Patentee after: Chengdu kanop Robot Technology Co.,Ltd. Address before: No.199, Huaguan Road, Longtan Industrial Park, Chenghua District, Chengdu, Sichuan 610000 Patentee before: CHENGDU CRP AUTOMATION CONTROL TECHNOLOGY Co.,Ltd. |