CN213315706U - Adsorb stable electronic component production and use resistance rubber coating device - Google Patents
Adsorb stable electronic component production and use resistance rubber coating device Download PDFInfo
- Publication number
- CN213315706U CN213315706U CN202021597006.9U CN202021597006U CN213315706U CN 213315706 U CN213315706 U CN 213315706U CN 202021597006 U CN202021597006 U CN 202021597006U CN 213315706 U CN213315706 U CN 213315706U
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- Prior art keywords
- plate
- electronic component
- rod
- placing plate
- rubber coating
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 238000010073 coating (rubber) Methods 0.000 title claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 33
- 238000009434 installation Methods 0.000 claims abstract description 16
- 238000003860 storage Methods 0.000 claims abstract description 12
- 238000001179 sorption measurement Methods 0.000 claims description 14
- 239000000428 dust Substances 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 abstract description 17
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses an adsorb stable resistance rubber coating device for electronic component production, glue case, delivery pump, rubber coating rifle and servo motor including mounting panel, storage, the truss is installed to the top of mounting panel, and the upper right side of truss is provided with stores up and glues the case, store up the left side of gluing the case and install the delivery pump, and the output of delivery pump is connected with the rubber coating rifle, the outside of rubber coating rifle is provided with the installation piece, the inboard of mounting panel is connected with places the board, the upper end surface of adjusting lever is provided with reset spring, the bottom inboard of placing the board is provided with the connecting plate, both ends all are connected with the movable block around the fixed plate, the below of movable block is provided with the worm. This adsorb stable resistance rubber coating device for electronic component production, the adjustment of being convenient for is glued the position, and convenient to use, and can make electronic component adsorb more stable, can prevent moreover that debris from getting into, avoids influencing the normal use of device.
Description
Technical Field
The utility model relates to an electronic component produces technical field, specifically is an adsorb stable electronic component production and use resistance rubber coating device.
Background
Along with the continuous development of the information age, the application of electronic products is more and more extensive, the electronic products can bring great convenience to the life and work of people, electronic accessories need to be installed on the surface of an electronic board in the production process of electronic elements, and a resistor gluing device is needed for stable connection;
however, the common electronic glue coating device on the market is inconvenient for adjusting the glue dispensing position, so that the use is inconvenient, the electronic element cannot be adsorbed more stably, and the device is inconvenient to avoid impurities from entering and influencing the normal use of the device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an adsorb stable electronic component production and use resistance rubber coating device to propose the adjustment point of being not convenient for and glue the position in solving above-mentioned background, cause and use inconveniently, and can not make electronic component adsorb more stable, inconvenient debris of avoiding moreover get into, influence the problem of the normal use of device.
In order to achieve the above object, the utility model provides a following technical scheme: a resistance gluing device for electronic component production with stable adsorption comprises a mounting plate, a glue storage box, a conveying pump, a gluing gun and a servo motor, wherein a truss is mounted above the mounting plate, the glue storage box is arranged above the right of the truss, the conveying pump is mounted on the left side of the glue storage box, the output end of the conveying pump is connected with the gluing gun, a mounting block is arranged on the outer side of the gluing gun, a first connecting rod is connected to the top end of the mounting block, second connecting rods are arranged inside the left end and the right end of the first connecting rod, a placing plate is connected to the inner side of the mounting plate, an adjusting rod is mounted in the middle of the placing plate, a reset spring is arranged on the outer surface of the upper end of the adjusting rod, a dust-proof plate is fixed to the bottom of the adjusting rod, a connecting plate is arranged inside the bottom of the placing plate, a fixing plate is fixed below the connecting plate, and the inside of movable block is connected with the installation pole, the below of movable block is provided with the worm, and the worm is connected with servo motor's output.
Preferably, the glue gun and the mounting block form a detachable structure, the first connecting rod penetrates through the mounting block, and the first connecting rod forms a front-back sliding structure on the outer side of the second connecting rod.
Preferably, the connection mode of placing board and adjustment bar is connected for the block, and the inboard of placing the board is provided with arc groove-shaped structure to its groove-shaped structure is the one-to-one setting with the dust guard.
Preferably, the connecting plate and the fixing plate are connected by bolts, the length and width of the connecting plate are equal to those of the inner side of the bottom of the placing plate, and the placing plate forms a lifting structure on the outer side of the connecting plate.
Preferably, the outer surface of the movable block is in a toothed structure, the movable block and the mounting rod are welded to form an integrated structure, the mounting rod is symmetrically arranged in the front and back direction of the central axis of the fixing plate, and the thread structures of the front end and the back end of the worm below the mounting rod are opposite.
Preferably, the cross section of installation pole is "C" shape structure, and the both ends inboard all is provided with rectangle slot-like structure about the installation pole to the installation pole is connected for the block with the connected mode of placing the board.
Compared with the prior art, the beneficial effects of the utility model are that: the stable-adsorption resistance gluing device for electronic component production is convenient to adjust the glue dispensing position, convenient to use, and capable of enabling the electronic component adsorption to be more stable, preventing impurities from entering and avoiding influencing the normal use of the device;
1. the glue gun is arranged on the inner side of the mounting block, and the first connecting rods are symmetrically arranged in the front and back direction of the central axis of the mounting block, so that the mounting block can drive the glue gun to stably slide left and right, and the second connecting rods are arranged at the left end and the right end of the first connecting rod, so that the first connecting rod can slide back and forth, and the aims of conveniently adjusting the glue dispensing position and using are fulfilled;
2. the electronic component adsorption device is provided with a placing plate and an installation rod, the placing plate and a connecting plate slide relatively in the upward moving process of the placing plate, so that negative pressure is formed on the inner side of the placing plate, the circuit board is closely adsorbed through a groove-shaped structure arranged on the inner side of the placing plate, and the electronic component adsorption can be more stable;
3. be provided with adjusting lever and dust guard, when the device does not use, manual pushing the adjusting lever downwards to rotate the adjusting lever and drive the dust guard and rotate, will place inboard slot-like structure and seal, can prevent that debris from getting into, avoid influencing the normal use of device, and loosen the adjusting lever, make its effect at reset spring reset, and through the bulge column structure in the adjusting lever outside with place the board block, thereby be convenient for carry on spacingly to the adjusting lever.
Drawings
Fig. 1 is a schematic view of the front cross-sectional structure of the present invention;
FIG. 2 is a schematic side view of the connection between the mounting rod and the worm according to the present invention;
FIG. 3 is a schematic view of the connection overlooking structure of the glue gun and the mounting block of the present invention;
FIG. 4 is a schematic view of the top view structure of the fixed plate and the movable block of the present invention;
FIG. 5 is a schematic view of the connection between the placement board and the adjustment rod;
fig. 6 is an enlarged schematic view of a portion a in fig. 1 according to the present invention.
In the figure: 1. mounting a plate; 2. a truss; 3. a glue storage box; 4. a delivery pump; 5. gluing guns; 6. mounting blocks; 7. a first link; 8. a second link; 9. placing the plate; 10. an adjusting lever; 11. a return spring; 12. a dust-proof plate; 13. a connecting plate; 14. a fixing plate; 15. a movable block; 16. mounting a rod; 17. a worm; 18. a servo motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a resistance gluing device for electronic component production with stable adsorption comprises a mounting plate 1, a truss 2, a glue storage box 3, a conveying pump 4, a gluing gun 5, a mounting block 6, a first connecting rod 7, a second connecting rod 8, a placing plate 9, an adjusting rod 10, a reset spring 11, a dust guard 12, a connecting plate 13, a fixing plate 14, a movable block 15, a mounting rod 16, a worm 17 and a servo motor 18, wherein the truss 2 is mounted above the mounting plate 1, the glue storage box 3 is arranged above the right of the truss 2, the conveying pump 4 is mounted on the left side of the glue storage box 3, the output end of the conveying pump 4 is connected with the gluing gun 5, the mounting block 6 is arranged on the outer side of the gluing gun 5, the first connecting rod 7 is connected to the top end of the mounting block 6, the second connecting rods 8 are arranged inside the left end and the right end of the first connecting rod 7, the placing plate 9 is connected to the inner side of the mounting plate 1, the adjusting rod, the outer surface of the upper end of the adjusting rod 10 is provided with a return spring 11, the bottom of the adjusting rod 10 is fixed with a dust guard 12, the inner side of the bottom of the placing plate 9 is provided with a connecting plate 13, a fixing plate 14 is fixed below the connecting plate 13, the front end and the rear end of the fixing plate 14 are both connected with movable blocks 15, the movable blocks 15 are internally connected with installing rods 16, a worm 17 is arranged below the movable blocks 15, and the worm 17 is connected with the output end of a servo motor 18.
As shown in fig. 1, 3, 5 and 6, the glue gun 5 and the mounting block 6 form a disassembly structure, the first connecting rod 7 penetrates through the mounting block 6, and the first connecting rod 7 forms a front-back sliding structure on the outer side of the second connecting rod 8, so as to facilitate precise adjustment of the glue dispensing position, the use is convenient, the placing plate 9 and the adjusting rod 10 are connected in a clamping manner, the inner side of the placing plate 9 is provided with an arc-shaped groove-shaped structure, the groove-shaped structures of the placing plate and the dust-proof plates 12 are arranged in a one-to-one correspondence manner, so as to facilitate the absorption of electronic components, the connecting plate 13 is connected with the fixing plate 14 in a bolt manner, the length and the width of the connecting plate 13 are equal to the length and the width of the inner side of the bottom of the placing plate 9, the placing plate 9 forms a lifting structure on the outer side of the connecting plate 13, so that the inner side of the placing plate, the stable adsorption of the electronic element is facilitated;
as shown in fig. 1, 2 and 4, the outer surface of the movable block 15 is in a toothed structure, the movable block 15 and the mounting rod 16 are welded to form an integrated structure, the mounting rod 16 is symmetrically arranged in front and back of the central axis of the fixing plate 14, the thread structures of the front end and the back end of the worm 17 below the mounting rod 16 are opposite, the single body of the mounting rod 16 is driven to rotate reversely, the lifting of the placing plate 9 is controlled, the cross section of the mounting rod 16 is in a C-shaped structure, the inner sides of the left end and the right end of the mounting rod 16 are both provided with rectangular groove-shaped structures, the connecting mode of the mounting rod 16 and the placing plate 9 is in clamping connection, and the lifting stability of the placing plate 9 is improved.
The working principle is as follows: when the stable-adsorption resistance gluing device for electronic component production is used, a circuit board is firstly placed on the inner side of a placing plate 9 in the drawing 1, a servo motor 18 in the drawing 2 is started, so that worms 17 with opposite thread structures at the front end and the rear end rotate, and under the action of a movable block 15 with a tooth-shaped outer surface, installation rods 16 with groove-shaped structures arranged on the inner sides of the left end and the right end are driven to synchronously rotate in opposite directions, and the installation rods 16 are connected with the placing plate 9 in a clamping manner, so that the placing plate 9 moves upwards and slides relative to a connecting plate 13 in the drawing 1, and therefore, under the action of the connecting plate 13, negative pressure can be formed inside the placing plate 9, the circuit board is tightly adsorbed through the groove-shaped structures arranged on the inner side of the placing plate 9, and the electronic component adsorption is more stable;
by starting the delivery pump 4 in fig. 1, the glue solution in the glue storage tank 3 is conveniently smeared on the surface of the circuit board through the glue gun 5 for gluing, and in the gluing process, through the first connecting rods 7 which are penetrated through and symmetrically arranged in front and back of the central axis of the mounting block 6 in fig. 3, the mounting block 6 is conveniently controlled to drive the glue gun 5 to stably slide left and right, and under the action of the second connecting rods 8 arranged at the left and right ends of the first connecting rods 7, the first connecting rods 7 are conveniently pushed to slide back and forth, so that the glue dispensing position is conveniently and accurately adjusted, the use of the device is convenient, after the gluing operation is completed, the adjusting rods 10 in the glue storage tank 6 are manually and downwards extruded and rotated to drive the dust guard 12 to rotate, so that the groove-shaped structure at the inner side of the placing plate 9 is conveniently sealed, the phenomenon that sundries enter the device to influence subsequent use can be avoided, after the sealing, the adjusting rods 10, make it reset under reset spring 11's effect to through the bulge column structure in adjusting lever 10 outside and place the block of board 9, thereby be convenient for adjusting lever 10 to carry on spacingly, just accomplish a series of operations of this adsorb stable resistance gluing device for electronic component production above.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an adsorb stable electronic component production and use resistance rubber coating device, includes mounting panel (1), stores up gluey case (3), delivery pump (4), glue gun (5) and servo motor (18), its characterized in that: the glue spreading device is characterized in that a truss (2) is installed above the mounting plate (1), a glue storage box (3) is arranged above the right of the truss (2), a conveying pump (4) is installed on the left side of the glue storage box (3), the output end of the conveying pump (4) is connected with a glue spreading gun (5), an installation block (6) is arranged on the outer side of the glue spreading gun (5), a first connecting rod (7) is connected to the top end of the installation block (6), second connecting rods (8) are arranged inside the left end and the right end of the first connecting rod (7), a placing plate (9) is connected to the inner side of the mounting plate (1), an adjusting rod (10) is installed in the middle of the placing plate (9), a reset spring (11) is arranged on the outer surface of the upper end of the adjusting rod (10), a dust guard (12) is fixed to the bottom of the adjusting rod (10), and a connecting plate (13, and the below of connecting plate (13) is fixed with fixed plate (14), both ends all are connected with movable block (15) around fixed plate (14), and the internal connection of movable block (15) has installation pole (16), the below of movable block (15) is provided with worm (17), and worm (17) are connected with servo motor (18) output.
2. The resistance gumming device for producing electronic component with stable adsorption of claim 1, wherein: glue gun (5) and installation piece (6) constitute and dismantle the structure, and first connecting rod (7) run through in the inside of installation piece (6) to first connecting rod (7) constitute the front and back sliding structure in the outside of second connecting rod (8).
3. The resistance gumming device for producing electronic component with stable adsorption of claim 1, wherein: the placing plate (9) is connected with the adjusting rod (10) in a clamping mode, an arc-shaped groove-shaped structure is arranged on the inner side of the placing plate (9), and the groove-shaped structure and the dust guard (12) are arranged in a one-to-one correspondence mode.
4. The resistance gumming device for producing electronic component with stable adsorption of claim 1, wherein: the connecting plate (13) and the fixing plate (14) are connected through bolts, the length and the width of the connecting plate (13) are equal to those of the inner side of the bottom of the placing plate (9), and the placing plate (9) forms a lifting structure on the outer side of the connecting plate (13).
5. The resistance gumming device for producing electronic component with stable adsorption of claim 1, wherein: the outer surface of the movable block (15) is of a toothed structure, the movable block (15) and the mounting rod (16) are welded to form an integrated structure, the mounting rod (16) is symmetrically arranged in the front and back direction of the central axis of the fixing plate (14), and the thread structures of the front end and the back end of the worm (17) below the mounting rod (16) are opposite.
6. The resistance gumming device for producing electronic component with stable adsorption of claim 1, wherein: the cross section of the installation rod (16) is of a C-shaped structure, the inner sides of the left end and the right end of the installation rod (16) are both provided with rectangular groove-shaped structures, and the installation rod (16) is connected with the placing plate (9) in a clamping mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021597006.9U CN213315706U (en) | 2020-08-05 | 2020-08-05 | Adsorb stable electronic component production and use resistance rubber coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021597006.9U CN213315706U (en) | 2020-08-05 | 2020-08-05 | Adsorb stable electronic component production and use resistance rubber coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213315706U true CN213315706U (en) | 2021-06-01 |
Family
ID=76094012
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021597006.9U Expired - Fee Related CN213315706U (en) | 2020-08-05 | 2020-08-05 | Adsorb stable electronic component production and use resistance rubber coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213315706U (en) |
-
2020
- 2020-08-05 CN CN202021597006.9U patent/CN213315706U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210601 |
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| CF01 | Termination of patent right due to non-payment of annual fee |