CN213289072U - Automatic change cutting chip laser cutting mechanism - Google Patents
Automatic change cutting chip laser cutting mechanism Download PDFInfo
- Publication number
- CN213289072U CN213289072U CN202021447611.8U CN202021447611U CN213289072U CN 213289072 U CN213289072 U CN 213289072U CN 202021447611 U CN202021447611 U CN 202021447611U CN 213289072 U CN213289072 U CN 213289072U
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- Prior art keywords
- slide rail
- laser
- xyr
- chip
- moving mechanism
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- 230000007246 mechanism Effects 0.000 title claims abstract description 39
- 238000003698 laser cutting Methods 0.000 title claims abstract description 18
- 230000008859 change Effects 0.000 title claims abstract description 7
- 239000000047 product Substances 0.000 abstract 4
- 239000013589 supplement Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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Abstract
The utility model discloses an automatic change cutting chip laser cutting mechanism, including laser instrument subassembly, lift platform and XYR axle moving mechanism, guiding mechanism is installed to the lift platform bottom, the laser instrument subassembly is installed on the lift platform top, the CCD camera is installed to laser instrument subassembly one side, CCD camera below is provided with XYR axle moving mechanism. The utility model can adjust the height of the laser component through the lifting platform, can supplement and correct the position of the product through the CCD camera, and can compensate the position of the product through the XYR shaft moving mechanism; the product can be subjected to laser cutting through the laser assembly; convenient to use can carry out diversified regulation to the product position.
Description
Technical Field
The utility model relates to a chip laser cutting technical field specifically is an automatic change cutting chip laser cutting mechanism.
Background
Laser cutting is a common mode in laser processing and is widely applied, and laser cutting is used for cutting various materials along with the wide application of laser cutting in various fields.
The existing chip laser cutting mechanism cannot be well adjusted, is low in precision and is inconvenient to use.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an automatic change cutting chip laser cutting mechanism to solve the problem among the prior art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an automatic change cutting chip laser cutting mechanism, includes laser instrument subassembly, lift platform and XYR axle moving mechanism, guiding mechanism is installed to the lift platform bottom, the laser instrument subassembly is installed on the lift platform top, the CCD camera is installed to laser instrument subassembly one side, CCD camera below is provided with XYR axle moving mechanism.
Preferably, the number of the guide mechanisms is four, the guide mechanisms are composed of guide rods and guide sleeves, and the guide rods penetrate through the guide sleeves.
Preferably, the lifting platform adopts a hydraulic lifting platform or an electric lifting platform.
Preferably, XYR axle moving mechanism places the platform by horizontal slide rail driving motor subassembly, horizontal slide rail, vertical slide rail driving motor subassembly, vertical slide rail and chip and constitutes, horizontal slide rail driving motor subassembly is installed to horizontal slide rail one end, slidable mounting has vertical slide rail on the horizontal slide rail, vertical slide rail driving motor subassembly is installed to vertical slide rail one end, slidable mounting has the chip to place the platform on the vertical slide rail.
Compared with the prior art, the beneficial effects of the utility model are that: the height of the laser assembly can be adjusted through the lifting platform, the position of a product can be corrected through the CCD camera, and the position of the product can be compensated through the XYR shaft moving mechanism; the product can be subjected to laser cutting through the laser assembly; convenient to use can carry out diversified regulation to the product position.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of the moving mechanism of the present invention.
In the figure: 1. a laser assembly; 2. a lifting platform; 3. a guide bar; 4. a guide sleeve; 5. a CCD camera; 6. a moving mechanism; 601. the transverse sliding rail drives the motor assembly; 602. a transverse slide rail; 603. the longitudinal slide rail drives the motor assembly; 604. a longitudinal slide rail; 605. and a chip placing table.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 and 2, in an embodiment of the present invention, an automatic chip cutting laser cutting mechanism includes a laser assembly 1, a lifting platform 2 and a XYR axis moving mechanism 6, a guide mechanism is installed at a bottom end of the lifting platform 2, the laser assembly 1 is installed at a top end of the lifting platform 2, a CCD camera 5 is installed at one side of the laser assembly 1, the XYR axis moving mechanism 6 is installed below the CCD camera 5, the number of the guide mechanisms is four, the guide mechanism is composed of a guide rod 3 and a guide sleeve 4, the guide rod 3 penetrates through the guide sleeve 4, the lifting platform 2 adopts a hydraulic lifting platform or an electric lifting platform, the XYR axis moving mechanism 6 is composed of a transverse sliding rail driving motor assembly 601, a transverse sliding rail 602, a longitudinal sliding rail driving motor assembly 603, a longitudinal sliding rail 604 and a chip placing table, the transverse sliding rail driving motor assembly 601 is installed at one end of the transverse sliding rail 602, a longitudinal slide rail 604 is slidably mounted on the transverse slide rail 602, a longitudinal slide rail driving motor assembly 603 is mounted at one end of the longitudinal slide rail 604, and a chip placing table 605 is slidably mounted on the longitudinal slide rail 604; the height of the laser component 1 can be adjusted through the lifting platform 2, the position of a product can be corrected through the CCD camera 5, and the position of the product can be compensated through the XYR shaft moving mechanism 6; the product can be laser cut by the laser assembly 1.
The utility model discloses a theory of operation is: the height of the laser component 1 can be adjusted through the lifting platform 2, the position of a product can be corrected through the CCD camera 5, and the position of the product can be compensated through the XYR shaft moving mechanism 6; the product can be laser cut by the laser assembly 1.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (4)
1. The utility model provides an automatic change cutting chip laser cutting mechanism, includes laser instrument subassembly (1), lift platform (2) and XYR axle moving mechanism (6), its characterized in that: guiding mechanism is installed to lift platform (2) bottom, laser instrument subassembly (1) is installed on lift platform (2) top, CCD camera (5) are installed to laser instrument subassembly (1) one side, CCD camera (5) below is provided with XYR axle moving mechanism (6).
2. The laser cutting mechanism for the automatic cutting chip of claim 1, wherein: the guide mechanism is provided with four, the guide mechanism is composed of a guide rod (3) and a guide sleeve (4), and the guide rod (3) penetrates through the guide sleeve (4).
3. The laser cutting mechanism for the automatic cutting chip of claim 1, wherein: the lifting platform (2) adopts a hydraulic lifting platform or an electric lifting platform.
4. The laser cutting mechanism for the automatic cutting chip of claim 1, wherein: XYR axle moving mechanism (6) are placed platform (605) by horizontal slide rail driving motor subassembly (601), horizontal slide rail (602), vertical slide rail driving motor subassembly (603), vertical slide rail (604) and chip and are constituteed, horizontal slide rail driving motor subassembly (601) is installed to horizontal slide rail (602) one end, slidable mounting has vertical slide rail (604) on horizontal slide rail (602), vertical slide rail driving motor subassembly (603) is installed to vertical slide rail (604) one end, slidable mounting has the chip to place platform (605) on vertical slide rail (604).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021447611.8U CN213289072U (en) | 2020-07-21 | 2020-07-21 | Automatic change cutting chip laser cutting mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021447611.8U CN213289072U (en) | 2020-07-21 | 2020-07-21 | Automatic change cutting chip laser cutting mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213289072U true CN213289072U (en) | 2021-05-28 |
Family
ID=76021474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021447611.8U Active CN213289072U (en) | 2020-07-21 | 2020-07-21 | Automatic change cutting chip laser cutting mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213289072U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114800643A (en) * | 2022-04-26 | 2022-07-29 | 泉州兰姆达仪器设备有限公司 | Laser chip individual solving device and working method thereof |
-
2020
- 2020-07-21 CN CN202021447611.8U patent/CN213289072U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114800643A (en) * | 2022-04-26 | 2022-07-29 | 泉州兰姆达仪器设备有限公司 | Laser chip individual solving device and working method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231122 Address after: Room 103, Management Office, Floor 1, Building 3, the Taihu Lake New Town Science and Technology Innovation Park, No. 18, Suzhou River Road, East the Taihu Lake Ecological Tourism Resort (the Taihu Lake New Town), Wujiang District, Suzhou City, Jiangsu Province, 215000 Patentee after: Yuanhuachuang Electronic Technology (Suzhou) Co.,Ltd. Address before: 215300 room 5, 88 Baifu Road, Kunshan Development Zone, Suzhou City, Jiangsu Province Patentee before: Suzhou molexin Electronic Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231215 Address after: Room 1703-25, Building 1, Paddy Internet Industrial Park, No. 399, Xiarong Street, East the Taihu Lake Ecological Tourism Resort (the Taihu Lake New Town), Wujiang District, Suzhou City, Jiangsu Province, 215000 Patentee after: Solid core semiconductor technology (Suzhou) Co.,Ltd. Address before: Room 103, Management Office, Floor 1, Building 3, the Taihu Lake New Town Science and Technology Innovation Park, No. 18, Suzhou River Road, East the Taihu Lake Ecological Tourism Resort (the Taihu Lake New Town), Wujiang District, Suzhou City, Jiangsu Province, 215000 Patentee before: Yuanhuachuang Electronic Technology (Suzhou) Co.,Ltd. |
|
| TR01 | Transfer of patent right |