CN213278412U - Connecting structure of high-power IGBT module - Google Patents
Connecting structure of high-power IGBT module Download PDFInfo
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- CN213278412U CN213278412U CN202022834397.8U CN202022834397U CN213278412U CN 213278412 U CN213278412 U CN 213278412U CN 202022834397 U CN202022834397 U CN 202022834397U CN 213278412 U CN213278412 U CN 213278412U
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- circuit board
- printed circuit
- igbt module
- power igbt
- connection
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Abstract
The utility model discloses a connection structure of high-power IGBT module, including printed circuit board, connecting terminal and high-power IGBT module, connecting terminal with printed circuit board fixed connection, high-power IGBT module passes through connecting terminal is fixed to be set up printed circuit board's below. The utility model discloses pass through welding process with connecting terminal and printed circuit board and be connected the back, pass through fastening screw fixed connection with high-power IGBT module again to realize that high-power IGBT module is connected with printed circuit board's electricity, this connection structure can shorten power line length, improves device contact reliability, simplifies the assembling process, practices thrift product cost.
Description
Technical Field
The utility model relates to a semiconductor application technology field specifically is a connection structure of high-power IGBT module.
Background
The IGBT is a novel power electronic device for controlling a transistor by using an MOS, has the characteristics of high voltage, large current, high frequency, small on-resistance and the like, is widely applied to an inverter circuit of a frequency converter, and along with the development of an IGBT element to a high-power direction, the heat productivity of the IGBT element is larger and larger, the temperature of the IGBT element can be correspondingly increased, so that certain influence can be caused on the use of the IGBT element.
At present, the connection mode of the high-power IGBT module and the printed circuit board is as follows: the cold pressing terminal is welded on the printed circuit board, and the high-power IGBT module is connected with the cold pressing terminal through a section of copper bar. The above connection method has the following problems: the introduction of the cold pressing terminal and the copper bar can not only lead to the increase of the length of the power circuit and the reduction of the power density of the equipment, but also lead to the complicated production and assembly, and the two ends of the power circuit are fixed by fastening screws, thereby increasing possible fault points on the circuit and improving the fault rate.
SUMMERY OF THE UTILITY MODEL
In order to solve the problem, the utility model provides a connection structure of high-power IGBT module can shorten power line's length, improves the reliability of device contact, simplifies the assembling process, practices thrift manufacturing cost.
In order to achieve the above object, the utility model provides a following technical scheme: the connecting structure of the high-power IGBT module comprises a printed circuit board, a connecting terminal and the high-power IGBT module, wherein the connecting terminal is fixedly connected with the printed circuit board, and the high-power IGBT module is fixedly arranged below the printed circuit board through the connecting terminal.
Further, connecting terminal includes the base plate, the one end of base plate be provided with printed circuit board assorted first connecting portion, first connecting hole has been seted up on the base plate.
Furthermore, a second connecting portion matched with the first connecting portion is arranged on the printed circuit board, and a second connecting hole matched with the first connecting hole is arranged on the printed circuit board.
And the fastening part penetrates through the second connecting hole and the first connecting hole in sequence and then is fixedly connected with the high-power IGBT module.
Further, the fastening member is a fastening screw.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses pass through welding process with connecting terminal and printed circuit board and be connected the back, pass through fastening screw fixed connection with high-power IGBT module again to realize that high-power IGBT module is connected with printed circuit board's electricity, this connection structure can shorten power line length, improves device contact reliability, simplifies the assembling process, practices thrift product cost.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a side view of the present invention;
fig. 3 is a schematic view of the connection structure between the connection terminal and the printed circuit board according to the present invention.
In the figure: a high-power IGBT module 1; a printed circuit board 2; a connection terminal 3; a fastening member 4; a second connecting portion 21; the second connection hole 22; a substrate 31; the first connection portion 32; a first connection hole 33.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Fig. 1 and fig. 2 show a schematic structural diagram of a connection structure of a high-power IGBT module of this embodiment, which includes a printed circuit board 2, a connection terminal 3 and a high-power IGBT module 1, where the connection terminal 3 is fixedly connected to the printed circuit board 2, and the high-power IGBT module 1 is fixedly disposed below the printed circuit board 2 through the connection terminal 3. In the present embodiment, the connection terminals 3 are formed by stamping a copper plate, and the connection terminals 3 are connected to the printed circuit board 2 by a soldering process.
As shown in fig. 3, the connection terminal 3 serves as an intermediate connector between the IGBT module and the printed circuit board 2, the connection terminal 3 includes a substrate 31, a first connection portion 32 matched with the printed circuit board 2 is disposed at one end of the substrate 31, and a first connection hole 33 is disposed on the substrate 31.
As shown in fig. 3, the printed circuit board 2 is provided with a second connection portion 21 matching the first connection portion 32, and the printed circuit board 2 is provided with a second connection hole 22 matching the first connection hole 33.
As shown in fig. 1 and fig. 2, the connection structure of the high power IGBT module of the present embodiment further includes a fastening component 4, and the fastening component 4 is fixedly connected to the high power IGBT module 1 after sequentially passing through the second connection hole 22 and the first connection hole 33. Preferably, the fastening member 4 is a fastening screw.
As shown in fig. 3, after the connection terminal 3 is connected to the printed circuit board 2 by a soldering process, the first connection portion 32 is fixedly connected to the second connection portion 21, the first connection hole 33 is fixedly connected to the second connection hole 22, so as to form a hole for the fastening member 4 to pass through, and then the fastening screw 4 sequentially passes through the second connection hole 22 and the first connection hole 33 and is fixedly connected to the high-power IGBT module, thereby electrically connecting the high-power IGBT module 1 to the printed circuit board 2. This mode has been solved traditional connected mode and has need colded pressing terminal and copper bar cooperation, leads to power density low because of the increase of circuit length, and manufacturing cost is high, installs loaded down with trivial details drawback.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element. The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (5)
1. The connecting structure of the high-power IGBT module is characterized by comprising a printed circuit board, a connecting terminal and the high-power IGBT module, wherein the connecting terminal is fixedly connected with the printed circuit board, and the high-power IGBT module is fixedly arranged below the printed circuit board through the connecting terminal.
2. The connection structure according to claim 1, wherein the connection terminal includes a substrate, a first connection portion is provided at one end of the substrate to be mated with the printed circuit board, and a first connection hole is provided in the substrate.
3. The connection structure according to claim 2, wherein a second connection portion is provided on the printed circuit board to match the first connection portion, and a second connection hole is provided on the printed circuit board to match the first connection hole.
4. The connecting structure of claim 3, further comprising a fastening component, wherein the fastening component is fixedly connected with the high-power IGBT module after sequentially passing through the second connecting hole and the first connecting hole.
5. The connecting structure according to claim 4, wherein the fastening member is a fastening screw.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022834397.8U CN213278412U (en) | 2020-11-30 | 2020-11-30 | Connecting structure of high-power IGBT module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022834397.8U CN213278412U (en) | 2020-11-30 | 2020-11-30 | Connecting structure of high-power IGBT module |
Publications (1)
Publication Number | Publication Date |
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CN213278412U true CN213278412U (en) | 2021-05-25 |
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Family Applications (1)
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CN202022834397.8U Active CN213278412U (en) | 2020-11-30 | 2020-11-30 | Connecting structure of high-power IGBT module |
Country Status (1)
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CN (1) | CN213278412U (en) |
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2020
- 2020-11-30 CN CN202022834397.8U patent/CN213278412U/en active Active
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