CN213275878U - Ceramic package core detection device - Google Patents
Ceramic package core detection device Download PDFInfo
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- CN213275878U CN213275878U CN202022488613.8U CN202022488613U CN213275878U CN 213275878 U CN213275878 U CN 213275878U CN 202022488613 U CN202022488613 U CN 202022488613U CN 213275878 U CN213275878 U CN 213275878U
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- suction nozzle
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Abstract
The utility model discloses a pottery encapsulation core detection device, include: the test base, the upside center of test base has the electrical property test bottom plate through first mounting screw, have through the second mounting screw on the test base of both sides around the electrical property test bottom plate and walk the line base, walk and install the connecting wire between the line base, the radio frequency joint is installed respectively to the left and right sides of electrical property test bottom plate, the center of electrical property test bottom plate is equipped with chip test chamber, the utility model relates to a ceramic package core detection device's advantage is: compact structure installs ceramic package nature chip and tests on the electrical property test bottom plate, detects at radio frequency articulate detection device, and the pressure head adsorbs under rubber suction nozzle's effect and compresses tightly, and rubber suction nozzle is adsorbed by the control of suction nozzle vacuum column, and the pressure head is convenient for change and maintains, and the pressure head is the PU material, can not disturb chip radio frequency signal, and test effect is good, and the test rate of accuracy is high.
Description
Technical Field
The utility model relates to a chip test technical field especially relates to a ceramic package core detection device.
Background
With the continuous development of electronic chip technology, the testing technology of ceramic chips also becomes an important technical key for ensuring the production quality and accelerating the production flow in the electronic industry. The quality of the ceramic chip performance is directly related to the overall performance of the sensor, so the detection of the ceramic chip is an important process in the production process of the oxygen sensor. At present, domestic enterprises stop mostly at manual operation and detect, need the workman to collect the arrangement with ceramic chip one by one, and ceramic chip detects that fixed knot constructs insecure, and the test effect is poor, and ceramic chip detects speed and rate of accuracy and is low, consequently designs a pressure equipment firm, and the test effect is good and the test rate of accuracy is high.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the ceramic packaging core detection device is stable in press mounting, good in test effect and high in test accuracy.
In order to solve the technical problem, the utility model discloses a technical scheme is: a ceramic package core testing apparatus comprising: the testing base is provided with an electrical testing bottom plate at the center of the upper side of the testing base through a first screw, wiring bases are arranged on the testing bases on the front side and the rear side of the electrical testing bottom plate through second screws, connecting wires are arranged between the wiring bases, radio frequency connectors are respectively arranged on the left side and the right side of the electrical testing bottom plate, a chip testing cavity is arranged at the center of the electrical testing bottom plate, cushion blocks are arranged on the testing bases around the electrical testing bottom plate, an iron plate is arranged on the cushion blocks through third screws, an anti-static plate is arranged between the iron plate and the cushion blocks, a through cavity is arranged at the center of the iron plate, a cover plate is connected to the upper side of the iron plate, a suction nozzle vacuum column mounting cavity is arranged between the cover plate and the iron plate, a suction nozzle vacuum column is arranged at the lower end, the downside of rubber suction nozzle is connected with the pressure head, the upper end of apron has the base station through fourth screw mounting, spring mounting groove is installed at the upper end center on the base station, install the spring in the spring mounting groove, the upside of spring is installed and is ventilated and be responsible for, the upside of being responsible for of ventilating is installed and is fixed the sealed lid at the base station, sealed covering is equipped with the inlet port, install the sealing washer on the inlet port, the lower extreme of base station is installed and is divided the pipe with ventilating of suction nozzle vacuum column installation cavity, it is connected with suction nozzle vacuum column to ventilate to divide the pipe, the pressure head passes logical chamber and communicates with each.
Furthermore, hooks are further installed on two sides of the base platform.
Further, the pressure head is made of PU materials.
The utility model relates to a pottery encapsulation core detection device's advantage is: compact structure installs ceramic package nature chip and tests on the electrical property test bottom plate, detects at radio frequency articulate detection device, and the pressure head adsorbs under rubber suction nozzle's effect and compresses tightly, and rubber suction nozzle is adsorbed by the control of suction nozzle vacuum column, and the pressure head is convenient for change and maintains, and the pressure head is the PU material, can not disturb chip radio frequency signal, and test effect is good, and the test rate of accuracy is high.
Drawings
Fig. 1 is a schematic structural view of the ceramic package core detection device of the present invention.
Detailed Description
The invention will be further elucidated by means of specific embodiments in the following description, in conjunction with the drawings, in which: for those skilled in the art, modifications of the invention in various equivalent forms will fall within the scope of the appended claims without departing from the principles of the invention.
As shown in fig. 1, a ceramic package core inspection apparatus includes: the testing device comprises a testing base 1, an electrical testing bottom plate 3 is installed at the center of the upper side of the testing base 1 through a first screw 2, wiring bases 5 are installed on the testing base 1 on the front side and the rear side of the electrical testing bottom plate 3 through second screws 4, a connecting wire 6 is installed between the wiring bases 5, radio frequency connectors 7 are installed on the left side and the right side of the electrical testing bottom plate 3 respectively, a chip testing cavity 8 is arranged at the center of the electrical testing bottom plate 3, cushion blocks 9 are installed on the testing base 1 around the electrical testing bottom plate 3, an iron plate 11 is installed on the cushion blocks 9 through third screws 10, an antistatic plate 12 is installed between the iron plate 11 and the cushion blocks 9, a through cavity 13 is arranged at the center of the iron plate 12, a cover plate 14 is connected to the upper side of the iron plate 11, a suction nozzle vacuum column installation cavity 15 is installed between the cover plate 14 and the iron plate 11, rubber suction nozzle 17 is installed to the lower extreme of suction nozzle vacuum column 16, rubber suction nozzle 17's downside is connected with pressure head 18, apron 14's upper end is installed base station 20 through fourth screw 19, spring mounting groove 21 is installed at the upper end center on the base station 20, install spring 22 in the spring mounting groove 21, the upside of spring 22 is installed and is ventilated and be responsible for 23, ventilate and be responsible for 23 the upside and install sealed lid 24 of fixing at base station 20, be equipped with inlet port 25 on the sealed lid 24, install sealing washer 26 on the inlet port 25, the lower extreme of base station 20 is installed and is divided the pipe 27 with ventilating of suction nozzle vacuum column installation cavity 15, it is connected with suction nozzle vacuum column 16 to ventilate to divide pipe 27, pressure head 18 passes logical chamber 13 and chip test cavity 8 communicates with each.
Preferably, hooks 28 are further installed on both sides of the base 20.
Preferably, the ram 18 is made of PU.
The utility model relates to a pottery encapsulation core detection device, compact structure installs pottery encapsulation nature chip (not marked in the figure) and tests on the electric property test bottom plate, connects detection device at the radio frequency and detects, and the pressure head adsorbs under the effect of rubber suction nozzle and compresses tightly, and rubber suction nozzle is adsorbed by the control of suction nozzle vacuum column, installs couple 28 on the base station 20, conveniently connects with air inlet unit; the pressure head is the PU material, and the pressure head is convenient for change the maintenance, can not disturb chip radio frequency signal, and test effect is good, and the test rate of accuracy is high.
Claims (3)
1. A ceramic package core testing apparatus, comprising: the testing device comprises a testing base (1), an electrical testing bottom plate (3) is installed at the center of the upper side of the testing base (1) through a first screw (2), wiring bases (5) are installed on the testing base (1) on the front side and the rear side of the electrical testing bottom plate (3) through a second screw (4), connecting wires (6) are installed between the wiring bases (5), radio frequency connectors (7) are installed on the left side and the right side of the electrical testing bottom plate (3) respectively, a chip testing cavity (8) is arranged at the center of the electrical testing bottom plate (3), cushion blocks (9) are installed on the testing base (1) on the periphery of the electrical testing bottom plate (3), an iron plate (11) is installed on the cushion blocks (9) through third screws (10), an anti-static plate (12) is installed between the iron plate (11) and the cushion blocks (9), a through cavity (13) is arranged at the, the upper side of the iron plate (11) is connected with a cover plate (14), a suction nozzle vacuum column installation cavity (15) is installed between the cover plate (14) and the iron plate (11), a suction nozzle vacuum column (16) is installed at the lower end of the suction nozzle vacuum column installation cavity (15), a rubber suction nozzle (17) is installed at the lower end of the suction nozzle vacuum column (16), a pressure head (18) is connected to the lower side of the rubber suction nozzle (17), a base platform (20) is installed at the upper end of the cover plate (14) through a fourth screw (19), a spring installation groove (21) is installed at the upper end center on the base platform (20), a spring (22) is installed in the spring installation groove (21), a ventilation main pipe (23) is installed at the upper side of the spring (22), a sealing cover (24) fixed on the base platform (20) is installed at the upper side of the ventilation, the device is characterized in that a sealing ring (26) is installed on the air inlet hole (25), a ventilating branch pipe (27) of the suction nozzle vacuum column installation cavity (15) is installed at the lower end of the base platform (20), the ventilating branch pipe (27) is connected with the suction nozzle vacuum column (16), and the pressure head (18) penetrates through the through cavity (13) to be communicated with the chip testing cavity (8).
2. The apparatus of claim 1, wherein hooks (28) are further mounted on both sides of the base (20).
3. The apparatus of claim 1, wherein the ram (18) is PU.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022488613.8U CN213275878U (en) | 2020-11-02 | 2020-11-02 | Ceramic package core detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022488613.8U CN213275878U (en) | 2020-11-02 | 2020-11-02 | Ceramic package core detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213275878U true CN213275878U (en) | 2021-05-25 |
Family
ID=75952066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022488613.8U Active CN213275878U (en) | 2020-11-02 | 2020-11-02 | Ceramic package core detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213275878U (en) |
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2020
- 2020-11-02 CN CN202022488613.8U patent/CN213275878U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211027 Address after: No. 410 Jucai Road, Binjiang District, Hangzhou City, Zhejiang Province Patentee after: HANGZHOU CHANGCHUAN TECHNOLOGY Co.,Ltd. Address before: 215000 1st floor, No.4 workshop, 118 Putian Road, Weiting, Suzhou Industrial Park, Jiangsu Province Patentee before: Suzhou wulechuan Precision Electronics Co.,Ltd. |
|
| TR01 | Transfer of patent right |