CN106018113A - Device for measuring mechanical intensity of silicon chip by air pressure method - Google Patents
Device for measuring mechanical intensity of silicon chip by air pressure method Download PDFInfo
- Publication number
- CN106018113A CN106018113A CN201610597546.9A CN201610597546A CN106018113A CN 106018113 A CN106018113 A CN 106018113A CN 201610597546 A CN201610597546 A CN 201610597546A CN 106018113 A CN106018113 A CN 106018113A
- Authority
- CN
- China
- Prior art keywords
- silicon chip
- housing
- step surface
- air pressure
- casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
- G01N3/10—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces generated by pneumatic or hydraulic pressure
- G01N3/12—Pressure testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/0003—Steady
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0016—Tensile or compressive
- G01N2203/0019—Compressive
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/0042—Pneumatic or hydraulic means
- G01N2203/0044—Pneumatic means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/003—Generation of the force
- G01N2203/0042—Pneumatic or hydraulic means
- G01N2203/0044—Pneumatic means
- G01N2203/0046—Vacuum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0058—Kind of property studied
- G01N2203/0076—Hardness, compressibility or resistance to crushing
- G01N2203/0087—Resistance to crushing
Abstract
The invention discloses a device for measuring the mechanical intensity of a silicon chip by an air pressure method. The device comprises a casing, wherein one end of the casing is communicated with a vacuum pump; no cover is arranged on the other end of the casing; a step surface used for containing the silicon chip is arranged inside the casing; the device also comprises a passage for realizing air circulation between the step surface and the inside of the casing positioned under the silicon chip; the outer diameter of the passage is smaller than the outer diameter of the silicon chip; a first vacuum meter used for detecting the air pressure inside the casing is inserted and arranged on the side wall, positioned between the vacuum pump and the step surface, of the casing. The initial atmospheric pressure value is measured through the first vacuum meter; then, the silicon chip is put onto the step surface for completely covering the passage; then, the air pressure differences at the upper side and the lower side of the silicon chip are changed by the vacuum pump; the mechanical intensity of the silicon chip is expressed by the difference value of the inside air pressure measured through the first vacuum meter and the initial atmospheric pressure value. The mechanical intensity of the silicon chip is detected through the atmospheric pressure uniformly exerted on the silicon chip; the defects that the test point is only in point contact or line contact with the silicon chip, and the force field distribution is not uniform, so that the measuring value of the mechanical performance of the silicon chip is not accurate enough are overcome.
Description
Technical field
The present invention relates to technical field of solar, more particularly, it relates to a kind of pneumatic process measures silicon chip machine
The device of tool intensity.
Background technology
Solar energy uses the mechanical strength of silicon chip in silicon chip, solaode and component manufacturing processes
Fragment rate has extreme influence, and only silicon chip reaches enough mechanical strengths and just can ensure that yield rate.
Generally use line-of-sight course or five-spot that the mechanical strength of silicon chip is surveyed in presently relevant industry
Amount, due to test point and silicon chip point cantact, force distribution is uneven, and causing silicon chip mechanical performance to measure can not
Enough represent the mechanical strength of full wafer silicon chip, the most above-mentioned method of testing obtain about silicon chip mechanical strength
Conclusion is the most not accurate enough.
In sum, how to efficiently solve the problem that the mechanical strength test of silicon chip is not accurate enough, be mesh
Front those skilled in the art's urgent problem.
Summary of the invention
In view of this, it is an object of the invention to provide a kind of pneumatic process and measure the device of silicon chip mechanical strength,
The structure design of this device can efficiently solve the problem that the mechanical strength test of silicon chip is not accurate enough.
In order to achieve the above object, the present invention provides following technical scheme:
A kind of pneumatic process measures the device of silicon chip mechanical strength, including one end connect with vacuum pump the other end without
The housing of lid, enclosure interior is provided with the step surface for holding silicon chip, also includes for step surface and be positioned at silicon
The passage of gas circulation between the inside of the housing below sheet, the external diameter of passage is less than the external diameter of silicon chip, shell
The sidewall that body is positioned between vacuum pump and step surface is inserted with the first vacuum for detecting enclosure interior air pressure
Meter.
Preferably, in said apparatus, step surface is provided with the sealing ring for holding silicon chip, the first vacuum
It is provided with sealing ring between meter and the lateral wall of housing.
Preferably, in said apparatus, vacuum pump connects with the bottom of housing, and housing is specially the shell without top
Body.
Preferably, in said apparatus, the sidewall being positioned at the housing above silicon chip is inserted with for detecting housing
Second vacuometer of air pressure inside.
Preferably, in said apparatus, the inside of housing is provided with screen cloth near the side of vacuum pump, and screen cloth is opened
It is provided with through hole.
Preferably, in said apparatus, sealing ring is specially caulking gum.
Preferably, in said apparatus, screen cloth is specially metallic sieve.
The pneumatic process that the present invention provides measures the device of silicon chip mechanical strength, connects with vacuum pump including one end
The housing of other end uncovered, enclosure interior is provided with the step surface for holding silicon chip, also includes for step surface
And the passage of gas circulation between the inside of the housing below silicon chip, the external diameter of passage is less than silicon chip
External diameter, housing sidewall between vacuum pump and step surface is inserted with for detecting enclosure interior air pressure
First vacuometer.
When the pneumatic process that the application present invention provides measures the device of silicon chip mechanical strength, when silicon chip is not also put into
During this device, initial atmosphere pressure value can be measured by the first vacuometer, then silicon chip is positioned over step
On face so that passage is all covered by silicon chip, it is then turned on vacuum pump and changes the gas of the upper and lower both sides of silicon chip
Pressure reduction, provides certain pressure to silicon chip, afterwards by the first vacuometer Measuring Vacuum and step surface it
Between the air pressure inside of change, characterize corresponding silicon chip by the difference of air pressure inside and initial atmosphere pressure value
Mechanical strength.Use the atmospheric pressure being uniformly applied on silicon chip to detect the mechanical strength of silicon chip, it is to avoid
Test point only with silicon chip point or linear contact lay, force distribution is uneven, causes silicon chip mechanical performance measured value not
The drawback of the mechanical strength of full wafer silicon chip can be represented.
If need measurement is the ultimate mechanical strength of silicon chip, it is also possible to make pressure by the first vacuometer
Difference is sufficiently large to be crushed silicon chip, reads the maximum value of the difference of internal pressure and initial atmosphere pressure value,
In order to characterize the ultimate mechanical strength of silicon chip.
Meanwhile, the pneumatic process that the present invention provides is measured the device of silicon chip mechanical strength and is avoided tradition bikini
Or the complex operations that five-point type is measured, saves the labour force of workman, improves efficiency.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to reality
Execute the required accompanying drawing used in example or description of the prior art to be briefly described, it should be apparent that below,
Accompanying drawing in description is only some embodiments of the present invention, for those of ordinary skill in the art,
On the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 measures the main TV structure of the device of silicon chip mechanical strength for the pneumatic process that the embodiment of the present invention provides
Schematic diagram.
In accompanying drawing, labelling is as follows:
Housing 1, step surface 2, passage the 3, first vacuometer 4, sealing ring the 5, second vacuometer 6, screen cloth 7,
Through hole 8, silicon chip 9.
Detailed description of the invention
The embodiment of the invention discloses a kind of pneumatic process and measure the device of silicon chip mechanical strength, to avoid test
Point only with silicon chip point or linear contact lay, force distribution is uneven, causes the silicon chip mechanical performance measured value can not generation
The drawback of the mechanical strength of table full wafer silicon chip, improves the accuracy that silicon chip mechanical strength is measured.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the present invention, and
It is not all, of embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under creative work premise, broadly fall into the scope of protection of the invention.
Refer to Fig. 1, Fig. 1 and measure the device of silicon chip mechanical strength for the pneumatic process that the embodiment of the present invention provides
Main TV structure schematic diagram.
The embodiment provides a kind of pneumatic process and measure the device of silicon chip mechanical strength, including one end
Connect the housing 1 of other end uncovered with vacuum pump, housing 1 is internal is provided with the step surface for holding silicon chip 9
2, also include for the passage of gas circulation between step surface 2 and the inside of the housing below silicon chip 91
3, the bore all standing of passage 3 can be lived by the external diameter of passage 3 less than the external diameter of silicon chip 9, silicon chip 9, shell
The body 1 sidewall between vacuum pump and step surface 2 be inserted with for detect housing 1 air pressure inside
One vacuometer 4.
When the pneumatic process that application above-described embodiment provides measures the device of silicon chip 9 mechanical strength, when silicon chip 9 is gone back
When not putting into this device, initial atmosphere pressure value can be measured by the first vacuometer 4, then silicon chip 9 be put
It is placed on step surface 2 so that passage 3 is all covered by silicon chip 9, is then turned on vacuum pump and changes silicon chip 9
The draught head of both sides up and down, is provided certain pressure to silicon chip 9, is measured very by the first vacuometer 4 afterwards
The air pressure inside of the change between empty pump and step surface 2, by air pressure inside and the difference of initial atmosphere pressure value
Characterize the mechanical strength of corresponding silicon chip 9.Use the atmospheric pressure being uniformly applied on silicon chip 9 to detect silicon chip 9
Mechanical strength, it is to avoid test point only with silicon chip 9 or linear contact lay, force distribution is uneven, causes silicon chip
9 mechanical performance measured values can not represent the drawback of the mechanical strength of full wafer silicon chip 9.
If need measurement is the ultimate mechanical strength of silicon chip 9, it is also possible to made by the first vacuometer 4
Pressure reduction is sufficiently large to be crushed silicon chip 9, reads the maximum of difference of internal pressure and initial atmosphere pressure value definitely
Value, in order to characterize the ultimate mechanical strength of silicon chip 9.
Meanwhile, the pneumatic process that above-described embodiment provides is measured the device of silicon chip mechanical strength and is avoided tradition three
The complex operations that point type or five-point type are measured, saves the labour force of workman, improves efficiency.
Certainly, the device using embodiments of the invention to provide, the machinery being possible not only to record silicon chip 9 is strong
Degree, the intensity of other sheetings all can use this device to measure.
In order to optimize step surface 2 and the using effect of the first vacuometer 4, step surface 2 in above-described embodiment
It is provided with the sealing ring 5 for holding silicon chip 9, is provided with between the first vacuometer 4 and the lateral wall of housing 1
Sealing ring 5.Owing to using this measurement device mechanical strength, need to make material both sides produce draught head, therefore
Need good sealing property, corresponding be provided with on step surface 2 sealing ring 5 for holding silicon chip 9,
It is provided with sealing ring 5, it is ensured that the lay down location of silicon chip 9 between first vacuometer 4 and the lateral wall of housing 1
It is respectively provided with good sealing with at the plug-in mounting of the first vacuometer 4.
In another specific embodiment of the present invention, vacuum pump connects with the bottom of housing 1, and housing 1 has
Body is the housing 1 without top.Preferably employing vacuum pump to connect with the bottom of housing 1, housing 1 is specially without top
Housing 1 so that downside that vacuum pump is silicon chip 9 provides negative pressure, and the installation of vacuum pump with connect also
More convenient.Certainly, vacuum pump connects with the top of housing 1, housing 1 is specially bottomless housing 1
Also being feasible, the upside that now vacuum pump is silicon chip 9 provides malleation.By malleation or negative pressure
To characterize the mechanical strength of silicon chip 9.
In another specific embodiment of the present invention, the sidewall being positioned at the housing 1 above silicon chip 9 is inserted with
For detecting the second vacuometer 6 of housing 1 air pressure inside.Permissible by preferably employing the form of double vacuometer
Monitoring wafer 9 upper and lower air pressure and the situation of change of pressure reduction in real time, one of them measures Real-Time Atmospheric pressure
Value, there is the air pressure inside at malleation or negative pressure in another in then measuring housing 1.Can also be preferably by
One vacuometer 4 is connected with smart machines such as outer computers respectively with the second vacuometer 6, passes through computer
Read real-time atmospheric pressure value and even draw pressure change curve, can more convenient and science obtain silicon chip 9
Mechanical strength.
In order to optimize the using effect of above-described embodiment middle shell 1, the inside of housing 1 is near vacuum pump
Side is provided with screen cloth 7, and screen cloth 7 offers through hole 8.Can be by because of the pressure that oversteps the extreme limit by screen cloth 7
And broken silicon chip 9 stops, in order to avoid fragment enters vacuum pump when vacuum pump is installed on housing 1 bottom
In, certain screen cloth 7 should offer through hole 8, in order to the vacuum pump regulation and control to housing 1 internal gas flow.
In order to optimize the using effect of sealing ring 5 in previous embodiment, sealing ring 5 is specially caulking gum.
Preferably employ caulking gum and can bear bigger pressure and sealing effectiveness as sealing ring 5, one side
Good, on the other hand service life is long.
In order to optimize the using effect of screen cloth 7 in above-described embodiment, screen cloth 7 is specially metallic sieve.Due to
Screen cloth 7 needs to bear the impact of silicon chip 9 fragment, and therefore preferably metallic sieve is to ensure its service life.When
So, using filter cloth is also feasible technical scheme.
In this specification, each embodiment uses the mode gone forward one by one to describe, and each embodiment stresses
Being the difference with other embodiments, between each embodiment, identical similar portion sees mutually.
Also, it should be noted in this manual, the relational terms of such as first and second or the like is only
Only be used for by an entity or operation separate with another entity or operating space, and not necessarily require or
Person implies relation or the order that there is any this reality between these entities or operation.And, term
" include ", " comprising " or its any other variant are intended to comprising of nonexcludability, so that include
The process of a series of key elements, method, article or equipment not only include those key elements, but also include not
There are other key elements being expressly recited, or also include for this process, method, article or equipment institute
Intrinsic key element.In the case of there is no more restriction, statement " including ... " key element limited,
It is not precluded from there is also in including the process of described key element, method, article or equipment other identical
Key element.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses
The present invention.Multiple amendment to these embodiments will be aobvious and easy for those skilled in the art
See, generic principles defined herein can without departing from the spirit or scope of the present invention,
Realize in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein,
And it is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (7)
1. the device of a pneumatic process measurement silicon chip mechanical strength, it is characterised in that include one end and vacuum
The housing (1) of pump connection other end uncovered, described housing (1) is internal to be provided with for holding silicon chip (9)
Step surface (2), also include for described step surface (2) and be positioned at below described silicon chip (9) described
The passage (3) of gas circulation between the inside of housing (1), the external diameter of described passage (3) is less than described
The external diameter of silicon chip (9), described housing (1) is positioned between described vacuum pump and described step surface (2)
Sidewall is inserted with the first vacuometer (4) for detecting described housing (1) air pressure inside.
Device the most according to claim 1, it is characterised in that described step surface (2) is provided with
For holding the sealing ring (5) of described silicon chip (9), described first vacuometer (4) and described housing (1)
Lateral wall between be provided with described sealing ring (5).
Device the most according to claim 2, it is characterised in that described vacuum pump and described housing (1)
Bottom connection, described housing (1) be specially without top housing (1).
4. according to the device described in any one of claims 1 to 3, it is characterised in that be positioned at described silicon chip
(9) sidewall of the described housing (1) of top is inserted with for detecting described housing (1) air pressure inside
Second vacuometer (6).
Device the most according to claim 4, it is characterised in that the inside of described housing (1) is leaned on
The side of nearly described vacuum pump is provided with screen cloth (7), and described screen cloth (7) offers through hole (8).
Device the most according to claim 2, it is characterised in that described sealing ring (5) is specially
Caulking gum.
Device the most according to claim 5, it is characterised in that described screen cloth (7) is specially gold
Belong to screen cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610597546.9A CN106018113A (en) | 2016-07-27 | 2016-07-27 | Device for measuring mechanical intensity of silicon chip by air pressure method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610597546.9A CN106018113A (en) | 2016-07-27 | 2016-07-27 | Device for measuring mechanical intensity of silicon chip by air pressure method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106018113A true CN106018113A (en) | 2016-10-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610597546.9A Pending CN106018113A (en) | 2016-07-27 | 2016-07-27 | Device for measuring mechanical intensity of silicon chip by air pressure method |
Country Status (1)
| Country | Link |
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| CN (1) | CN106018113A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107560941A (en) * | 2017-11-01 | 2018-01-09 | 唐靖鸿 | A kind of medical device |
| CN108095831A (en) * | 2017-11-01 | 2018-06-01 | 唐靖鸿 | A kind of new type medical equipment device |
| CN108095830A (en) * | 2017-11-01 | 2018-06-01 | 唐靖鸿 | A kind of medical instrument device |
| CN110702526A (en) * | 2019-10-14 | 2020-01-17 | 中芯集成电路制造(绍兴)有限公司 | Wafer air pressure resistance reliability testing equipment and testing method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424634A (en) * | 1994-02-18 | 1995-06-13 | International Business Machines Corporation | Non-destructive flex testing method and means |
| US5992242A (en) * | 1998-05-04 | 1999-11-30 | Lsi Logic Corporation | Silicon wafer or die strength test fixture using high pressure fluid |
| CN1320813A (en) * | 2000-04-21 | 2001-11-07 | 浙江大学 | Method for testing mechanical strength of silicon material |
| CN101762682A (en) * | 2008-12-23 | 2010-06-30 | 北京化工大学 | Method and device for plastic tensile stress-strain testing |
| CN102288481A (en) * | 2011-07-08 | 2011-12-21 | 中国飞机强度研究所 | Vacuumizing loading equipment and test method thereof |
| CN202837109U (en) * | 2012-11-05 | 2013-03-27 | 华北电力大学 | Device for synchronously measuring elasticity modulus and air tightness of ceramic material |
| CN102998184A (en) * | 2012-11-23 | 2013-03-27 | 温州市大荣纺织仪器有限公司 | Air pressure burst strength testing instrument |
| CN105699199A (en) * | 2016-03-30 | 2016-06-22 | 杭州亚慧生物科技有限公司 | Bursting strength detection device of sealant for surgical operation |
| CN205861463U (en) * | 2016-07-27 | 2017-01-04 | 晶科能源有限公司 | A kind of pneumatic process measures the device of silicon chip mechanical strength |
-
2016
- 2016-07-27 CN CN201610597546.9A patent/CN106018113A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5424634A (en) * | 1994-02-18 | 1995-06-13 | International Business Machines Corporation | Non-destructive flex testing method and means |
| US5992242A (en) * | 1998-05-04 | 1999-11-30 | Lsi Logic Corporation | Silicon wafer or die strength test fixture using high pressure fluid |
| CN1320813A (en) * | 2000-04-21 | 2001-11-07 | 浙江大学 | Method for testing mechanical strength of silicon material |
| CN101762682A (en) * | 2008-12-23 | 2010-06-30 | 北京化工大学 | Method and device for plastic tensile stress-strain testing |
| CN102288481A (en) * | 2011-07-08 | 2011-12-21 | 中国飞机强度研究所 | Vacuumizing loading equipment and test method thereof |
| CN202837109U (en) * | 2012-11-05 | 2013-03-27 | 华北电力大学 | Device for synchronously measuring elasticity modulus and air tightness of ceramic material |
| CN102998184A (en) * | 2012-11-23 | 2013-03-27 | 温州市大荣纺织仪器有限公司 | Air pressure burst strength testing instrument |
| CN105699199A (en) * | 2016-03-30 | 2016-06-22 | 杭州亚慧生物科技有限公司 | Bursting strength detection device of sealant for surgical operation |
| CN205861463U (en) * | 2016-07-27 | 2017-01-04 | 晶科能源有限公司 | A kind of pneumatic process measures the device of silicon chip mechanical strength |
Non-Patent Citations (1)
| Title |
|---|
| 王淦等: "用三点弯方法研究微氮硅单晶机械强度", 《半导体学报》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107560941A (en) * | 2017-11-01 | 2018-01-09 | 唐靖鸿 | A kind of medical device |
| CN108095831A (en) * | 2017-11-01 | 2018-06-01 | 唐靖鸿 | A kind of new type medical equipment device |
| CN108095830A (en) * | 2017-11-01 | 2018-06-01 | 唐靖鸿 | A kind of medical instrument device |
| CN110702526A (en) * | 2019-10-14 | 2020-01-17 | 中芯集成电路制造(绍兴)有限公司 | Wafer air pressure resistance reliability testing equipment and testing method thereof |
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Application publication date: 20161012 |
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