CN213275841U

CN213275841U - Modularization PCB board test needle bed

Info

Publication number: CN213275841U
Application number: CN201922150528.8U
Authority: CN
Inventors: 张太彬
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-12-05
Filing date: 2019-12-05
Publication date: 2021-05-25
Anticipated expiration: 2029-12-05

Abstract

The utility model discloses a printed circuit board (PCB board) modular test needle bed. The testing plane of the needle bed is formed by splicing square unit modules, and the unit modules are selected from a standard module library. The unit module mainly comprises a cuboid electric signal acquisition module with a contact array, a test needle fixing pore plate and a spring test needle. When the PCB is tested, computer software selects a proper signal acquisition module and a test pin fixing pore plate from a prefabricated module library according to the distribution condition of test points of the PCB, or the test pin fixing pore plate is independently manufactured according to special test requirements. The utility model discloses utilize the orderly distribution of signal acquisition module check shape contact and the nimble of the fixed orifice plate hole site of test needle to select and realize the accurate counterpoint to all kinds of shape PCB board test points. By using the modularized testing needle bed, the process of independently manufacturing a needle bed jig for each PCB with high cost can be omitted.

Description

Modularization PCB board test needle bed

Technical Field

The utility model relates to a with the working face split into a plurality of square checks to modular PCB test needle bed.

Background

After the PCB is produced, the electrical performance of each routing wire or each bonding pad on the PCB needs to be verified, which mainly relates to short circuit, open circuit, lead resistance measurement and the like.

Because the PCB tested points are distributed randomly, the needle bed testing machine needs to install a spring testing needle on the needle bed jig substrate for each tested point according to the distribution condition of the PCB tested points, and connect an electric signal line to the electric signal analyzer for each testing needle. In practical application, different PCB boards need to be manufactured with needle bed jigs separately, and the needle bed jigs do not have the commonality. In addition, the manufacturing cycle of the needle bed jig is long, the processing difficulty is high, and great resource waste is caused. The utility model discloses an application of modularization needle bed will be can to a great extent solve the problem in this aspect.

Disclosure of Invention

The utility model discloses a modular PCB test needle bed, the working face of needle bed is formed by the concatenation of the needle bed micromodule of independent horizontal piece ization. The utility model utilizes three variable plane spaces of different distances and sizes of square test needle contacts of the electric signal acquisition module, the offset of the positions of the fixed pore plates of the test needles and the size of the PCB test points, automatically selects the prefabricated electric signal acquisition module and the fixed pore plates of the test needles after the distribution condition of the tested PCB test points is analyzed by a computer, and can finish the alignment and the electric parameter test of most PCB circuit board test points; the test needle fixing pore plate can also be manufactured independently according to the specific requirements of the PCB to be tested so as to achieve the purpose of accurate alignment.

Technical scheme

The modular testing needle bed of this design show mainly comprises two parts: cuboid test module and mainboard module. The cuboid test module consists of an electric signal acquisition module, a test needle fixing pore plate and a spring test needle; the mainboard module is fixed the signal of telecommunication collection module through the square mounting groove, and the fixed orifice plate parallel mount of test needle is at the test face of the signal of telecommunication collection module, and the spring test needle is fixed in the hole of orifice plate.

Furthermore, the mainboard module sets electric signal butt joints for the electric signal acquisition modules and performs centralized processing on all the module electric signals; the test data after centralized processing is connected to a computer through a computer communication port, and a test result is judged by computer software; the main board module also executes a test instruction transmitted by the computer analysis software; the main base of the main board module comprises a mechanical mounting hole, a square mounting groove, an electric signal butt joint point, a power supply access port and a computer communication port.

Furthermore, a plurality of electric signal acquisition modules form an electric signal acquisition module library, the distances (X) and the sizes (E) of square test needle contacts which are distributed in a grid shape on each electric signal acquisition module test panel in the module library are different, and different acquisition modules in the module library are flexibly selected for splicing according to different distribution of tested points on a PCB (printed circuit board) during use. The electric signal acquisition module consists of an analog switch board with an analog switch electronic chip and an FPC (flexible printed circuit) flat cable socket, an FPC flat cable, a test panel with grid-shaped distributed square test needle contacts, an output panel with electric signal ports and other support frames, wherein the square test needle contacts on the test panel are not directly electrically communicated with each other. The testing panel is composed of a PCB (printed Circuit Board), a mounting metal needle is arranged in the contact range of a square testing needle on the testing panel, one end of the metal needle is tightly contacted with the FPC flat cable through the extrusion of an elastic material, and the other end of the FPC flat cable is connected with an FPC flat cable socket on the analog switch board; the analog switch board is a plurality of strip-shaped PCB boards vertical to the test panel, and the analog switch board is connected with the output panel of the electric signal acquisition module through a signal output socket.

Further, the test pin fixing hole plate is composed of a hard insulating material layer and a soft insulating material layer, and the test pin fixing hole plate can be divided into two types: the prefabricated test needle fixing pore plate and the customized test needle fixing pore plate. The prefabricated test needle fixing pore plates form a pore plate library, and the pore space and the size of each test needle fixing pore plate in the pore plate library are different; and the holes of the fixed pore plate of the customized test needle are individually customized and processed according to actual test requirements.

Furthermore, the test needle fixing hole plate is composed of a soft layer and a hard layer, the hole of the soft layer is slightly smaller than the test needle, the spring test needle can be clamped, and the hole of the hard layer can accommodate and fix the test needle. The spring test needle is installed in the orifice plate hole, chooses retractable PCB board test needle for use, and test needle diameter and length follow and select in a flexible way according to the actual demand.

Description of the drawings:

description of reference numerals: the testing device comprises a 1-spring testing pin, a 2-testing pin fixing hole plate, a 3-electric signal acquisition module, a 4-main board module, a 5-analog switch plate, a 6-output panel, a 7-FPC (flexible printed circuit) flat cable, an 8-metal pin, a 9-testing panel, a 10-square testing pin contact, an 11-signal output socket, a 12-elastic material, a 13-FPC flat cable socket, a 14-analog switch chip, a 41-electric signal butt joint point, a 42-square mounting groove, a 43, a computer communication port, a 44-power port, a 45-mechanical mounting hole, a 101-cuboid testing module, and electric signal ports a, b, c, d, e and f.

FIG. 1 is a sectional view of a needle bed of a PCB testing machine and a partial sectional view of a rectangular parallelepiped testing module (101).

FIG. 2 is a schematic top sectional view of the main plate module (4) showing the mounting position of the rectangular parallelepiped needle bed module (101).

FIG. 3 is a diagram of the test pin contact distribution of the test contact face (A) and the interface of the output face (B) of the electrical signal acquisition module.

Fig. 4 is a layout diagram of the installation of the analog switch board (5), the concentration board (6), the FPC cable (7), etc. inside the electrical signal collection module.

Fig. 5 is a schematic view of the double-layer structure of the test pin fixing orifice plate (2) and the installation of the spring test pin (1).

The specific implementation mode is as follows:

fig. 1 shows the overall structure of a PCB testing needle bed. The needle bed is composed of two needle bed assemblies M1 and M2 which are positioned on the upper surface and the lower surface of a tested PCB and are opposite to each other, and the two needle bed assemblies are respectively arranged on a three-axis numerical control motion sliding table HT capable of moving along X, Y, Z three directions. The triaxial numerical control motion sliding table controls the needle bed component M to respectively approach to two sides of the PCB to be tested, so that the spring testing needles (1) of the needle bed are in close contact with corresponding testing points on the PCB to realize the function of testing electrical signal parameters of the PCB to be tested.

The assemblies M1 and M2 are composed of a main board module (4) and a plurality of rectangular needle bed sub-modules (101). The cuboid needle bed submodule (101) mainly comprises an electric signal acquisition module (3), a test needle fixed pore plate (2), a spring test needle (1) and the like.

FIG. 2 is a sectional view of the main board module (4), a needle bed sub-module (101) is arranged in a square mounting groove (42), and six contacts (41) in the mounting groove are connected with six interfaces on the B surface of the electric signal acquisition module (3); the main board module (4) is provided with a power access port 43 and a USB communication port 44 (or other communication interfaces with a computer).

Fig. 3 shows the external form and contact distribution of the electrical signal acquisition module (3). The module is the cuboid that length width height is about 30mm, 300mm respectively, and the test needle contact surface (A) of cuboid module sets up latticed square piece contact array. In the prefabricated module library, the grid interval (X) of the contact points of the test needles of each module can be set as follows: 0.50mm, 0.635mm, 0.65mm,0.75mm, 0.80mm, 0.89mm, 1.0mm, etc., but are not limited to this spacing and size. The number of electrical contact blocks of each module varies with the pitch (X). Such as: the module with the spacing of 0.5mm, the number of the square contacts is 60 x 60=3600 theoretically; if the electrical contact block spacing (X) is increased, the corresponding block number is decreased and the block size (E) is increased accordingly.

Fig. 3 shows the B-side of the electrical signal acquisition module. The surface is provided with six ports such as electric parameter transmission and acquisition points a and b, power supply ports c and d and communication ports e and f.

Fig. 4 shows the installation form of the analog switch board (5), the concentration board (6), the FPC cable (7), and the like in the electric signal acquisition module (3). Any electric contact block on the A surface of the acquisition module (3) is in analog conduction with the port a or B on the B surface through the analog switch array of the switch board (5).

FIG. 5 shows the shape of the test pin holding well plate (2). The orifice plate is composed of a hard insulating material layer D1 and a soft insulating material layer D2. The hard material punching hole is slightly larger than the diameter of the test needle so as to accommodate and fix the test needle; the punching size of the soft rubber layer is smaller than that of the test needle, so that the purposes of clamping the spring test needle and preventing the spring test needle from falling off the pore plate are achieved.

Claims

1. The utility model provides a modularization PCB board test needle bed, its characterized in that, the working face is formed by the concatenation of a plurality of square piece, the square piece is cuboid test module's terminal surface, cuboid test module installs side by side on mainboard module.

2. Test needle bed according to claim 1, characterized in that the cuboid test module consists of three parts, namely a spring test needle, a test needle fixed orifice plate and an electrical signal acquisition module.

3. The test needle bed according to claim 2, wherein the test needle holding hole plate is divided into a prefabricated test needle holding hole plate and a customized test needle holding hole plate.

4. The testing needle bed according to claim 2, wherein the electrical signal collection module is a rectangular parallelepiped with a square upper and lower opposite surfaces, the upper and lower opposite surfaces of the electrical signal collection module are respectively provided with a testing panel and an output panel, the testing panel is provided with square testing needle contacts distributed in a grid shape, and the output panel is provided with a plurality of electrical signal ports.

5. A test bed according to claim 4, wherein each square test needle contact on the test panel of the electrical signal acquisition module is not in direct electrical communication with the other contacts.

6. A testing needle bed according to claim 3, wherein the size of the prefabricated testing needle fixing hole plate is the same as that of the testing panel of the electric signal acquisition module according to claim 4, holes of the hole plate are distributed in a grid shape, and the grid spacing of the holes of each module is different.

7. The testing needle bed according to claim 3, wherein the size of the fixed orifice plate of the customized testing needle is the same as the size of the testing panel of the electric signal acquisition module according to claim 4, and the holes of the orifice plate are arranged according to the distribution of the tested PCB and are individually customized.

8. Testing needle bed according to claim 2, characterized in that the test needle holding hole plate consists of a soft layer D2 and a hard layer D1, the soft layer hole being slightly smaller than the test needle, gripping the test needle; the hard layer hole can accommodate and fix the test needle; the test pin fixing hole plate is installed in parallel with the test panel of the electrical signal acquisition module of claim 4.

9. Testing needle bed according to claim 1, characterized in that the main board module is provided with a grid-shaped mounting groove; a cuboid test module according to claim 2 is fixedly arranged in the mounting groove; a plurality of electric signal butt joints are arranged at the bottom of the mounting groove; the electrical signal pair points are respectively contacted with an electrical signal port of an output panel of the electrical signal acquisition module of claim 4; the main board module is provided with a power access port, a computer communication port and a mechanical mounting hole.

10. The testing needle bed according to claim 2, characterized in that the testing panel of the electric signal acquisition module is composed of a PCB printed board, square testing needle contacts distributed in a grid shape are arranged on the testing panel, mounting metal needles are arranged in the contact range, one ends of the metal needles are tightly contacted with an FPC (flexible printed circuit) cable through extrusion of elastic materials, and the other ends of the FPC cable are connected with an analog switch board.

11. The testing needle bed according to claim 10, wherein the analog switch board of the electric signal collection module is a plurality of strip-shaped PCB boards perpendicular to the testing panel, and the analog switch board is provided with an analog electronic switch chip, an FPC cable socket, and an electric signal output socket.

12. Testing needle bed according to claim 10 or 11, characterized in that a plurality of analog switch boards are connected with the output panel of the electrical signal acquisition module through signal output sockets.