CN213244726U - Heat-dissipation insulation fixing device for electronic component - Google Patents

Abstract

The utility model discloses an insulating fixing device of electronic components heat dissipation, electronic components on solid core plate, insulating pad and block mounting line board, seted up a cell body one, two cell bodies two, a hole one and two holes two on the solid core plate, and hole one is linked together with cell body one, and hole two communicates with cell body two phase, draw-in groove one has been seted up on the circuit board, insulating pad is fixed in cell body one, two equal slidable mounting has the slider in the cell body two, and equal fixed mounting has one and cell body two phase fit's stopper on two sliders, fixed mounting has spring two between slider upper end and the two tops of cell body. Has the advantages that: the electronic component is convenient to replace, the circuit board has good protection effect, the heat dissipation insulating part is recycled, the heat dissipation of the electronic component is accelerated, the service life of a machine or an instrument is prolonged, and the manufacturing cost of the heat dissipation insulating part is saved.

Description

Heat-dissipation insulation fixing device for electronic component

Technical Field

The utility model relates to an insulating fixed technical field especially relates to an electronic components heat dissipation insulation fixing device.

Background

Electronic components mainly radiate heat through a radiating insulating part, the radiating insulating part is generally fixed on the surface of the electronic components in a hot melting mode, but the fixing mode is very complicated when the electronic components are damaged and need to be replaced, the bottom of the electronic components needs to be cut short, then new electronic components are pasted with a circuit board through hot melting conductors (when the electronic components are detached, the radiating insulating part fixed with the electronic components is detached along with the electronic components), and at the moment, the electronic components need to be installed again to completely radiate the radiating insulating part, so that the waste of the radiating insulating part is caused.

Therefore, the novel heat dissipation insulation fixing device for the electronic component can be adopted to solve the defects in the prior art.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving among the prior art hot melt insulation heat dissipation material snap-on electronic components, there is not any fixed safeguard measure, increases electronic components self weight for the load increase of circuit board leads to the problem of the unable most powerful work of electronic components, still makes electronic components renew simultaneously portably, reduces insulating material's consumption and the insulating fixing device of an electronic components heat dissipation that proposes.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat dissipation insulation fixing device for an electronic component comprises a solid plate, an insulation pad and the electronic component clamped on a mounting circuit board, wherein a first groove body, two second groove bodies, a first hole and two second holes are formed in the solid plate, the first hole is communicated with the first groove body, the second hole is communicated with the second groove body, a first clamping groove is formed in the circuit board, the insulation pad is fixed in the first groove body, sliding blocks are arranged in the two second groove bodies in a sliding mode, limiting blocks matched with the second groove bodies are fixedly arranged on the two sliding blocks, a second spring is fixedly arranged between the upper end of each sliding block and the top of the second groove body, a bracket, a shaft rod and a first clamping block are fixedly arranged on the two sliding blocks, a second clamping block is rotatably arranged on the shaft rod, a first spring is fixedly arranged between the second clamping block and the bracket, and a third clamping block is, and a second clamping groove matched with the three phases of the clamping blocks is formed in the electronic component, a radiating block is fixedly installed in the first hole, and the lower part of the radiating block is in contact with the insulating pad.

In the above insulating fixing device for heat dissipation of electronic components, the heat dissipation block is made of crystalline silicon.

In the above heat dissipation insulation fixing device for an electronic component, the shapes of the end surfaces of the first clamping block, the second clamping block and the third clamping block are all triangular and made of rubber materials.

In the above heat-dissipating, insulating and fixing device for an electronic component, a vertical distance from the first clamping block to the second hole is equal to a vertical distance from the center of the shaft rod to the lower end of the solid plate.

In the above heat dissipation insulation fixing device for an electronic component, the length of the second fixture block is greater than the thickness of the circuit board.

Compared with the prior art, the utility model discloses the advantage lies in:

1. through the cooperation use of fixture block three, draw-in groove for the connected mode is the block installation between electronic components and the circuit board, replaces the connected mode of hot melt conductor, conveniently changes the electronic components who damages, and is easy and simple to handle, and this part reuse, avoids cutting out the problem that electronic components caused the damage to the circuit board many times.

2. Through the cooperation use of fixture block one, support, spring one, spring two and solid slab for the heat dissipation insulating part carries out the block with electronic components and is connected, when electronic components damaged, can take off the heat dissipation insulating part and reuse.

3. The heat dissipation block 4 is arranged, so that heat absorbed by the insulating pad made of the insulating heat dissipation material can be dissipated, the dissipation of the heat on the electronic component is accelerated, and the electronic component can work to the maximum extent.

To sum up, the utility model discloses it is convenient to have electronic components to change, has the reuse of good guard action, heat dissipation insulating part and accelerates the radiating benefit of electronic components to the circuit board, prolongs the life of machine or instrument, practices thrift the manufacturing cost of heat dissipation insulating part.

Drawings

Fig. 1 is a schematic structural view of a heat dissipation insulation fixing device for electronic components according to the present invention;

FIG. 2 is a detail perspective view of a solid plate;

fig. 3 is an enlarged view of a portion a in fig. 1.

In the figure: the structure comprises a solid plate 1, an insulating pad 2, an electronic component 3, a heat dissipation block 4, a circuit board 5, a sliding block 6, a bracket 7, a first spring 8, a first clamping block 9, a second spring 10, a second clamping block 11, a shaft rod 12 and a third clamping block 13.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, a heat dissipation insulation fixing device for an electronic component comprises a solid plate 1, an insulation pad 2 and an electronic component 3 clamped on a mounting circuit board 5, wherein the solid plate 1 is provided with a first groove body, two second groove bodies, a first hole and two second holes, the first hole is communicated with the first groove body, the second hole is communicated with the second groove body, the circuit board 5 is provided with a first clamping groove, the insulation pad 2 is fixed in the first groove body, sliding blocks 6 are slidably mounted in the two second groove bodies, and a limiting block matched with the second groove body is fixedly mounted on each sliding block 6;

the following points are notable:

1. the radiating block 4 is made of crystalline silicon, so that the heat conducting effect is achieved, and heat on the electronic component 3 is dissipated through the insulating pad 2 and transmitted to the radiating block 4 to be radiated.

2. The setting of stopper is in order to prevent that slider 6 from droing in the cell body two that offer on solid plate 1, leads to whole device to lose the problem of fixed effect and takes place.

3. The first clamping groove is arranged for enabling the electronic component 3 to be tightly contacted with the circuit board 5, and the probability of falling-off is reduced.

A second spring 10 is fixedly arranged between the upper end of each sliding block 6 and the top of the second groove body, a bracket 7, a shaft rod 12 and a first clamping block 9 are fixedly arranged on the two sliding blocks 6, a second clamping block 11 is rotatably arranged on the shaft rod 12, a first spring 8 is fixedly arranged between the second clamping block 11 and the bracket 7, and a third clamping block 13 is fixedly arranged on the circuit board 5;

the following points are notable:

1. the end faces of the first clamping block 9, the second clamping block 11 and the third clamping block 13 are all triangular and are made of rubber materials, and the material and shape arrangement has the advantage that the clamping or the splitting between the first clamping block 9 and the second hole and between the third clamping block 13 and the second clamping groove is facilitated.

2. The vertical distance from the first clamping block 9 to the second hole is equal to the vertical distance from the center of the shaft rod 12 to the lower end of the solid plate 1, so that the first clamping block 9 is clamped with the second hole when the second clamping block 11 clamps the circuit board 5, and the problem that the second clamping block 11 cannot clamp the circuit board 5 is solved.

3. The length of the second clamping block 11 is larger than the thickness of the circuit board 5, so that the second clamping block 11 can clamp the circuit board 5.

A second clamping groove matched with the third clamping block 13 is formed in the electronic component 3, a heat dissipation block 4 is fixedly installed in the first hole, and the lower portion of the heat dissipation block 4 is in contact with the insulating pad 2;

the above is noteworthy: the effect that the radiating block 4 set up is the heat on absorbing insulating pad 2, then the heat on external heat abstractor to radiating block 4 of rethread gives off for electronic components 3 rapid cooling.

In the utility model, firstly, the electronic component 3 is inserted into the first slot on the circuit board 5, and the electronic component 3 and the circuit board 5 are fixed through the third fixture block 13 fixedly installed on the circuit board 5 and the second slot arranged on the circuit board 5;

move solid plate 1 down, and move down the in-process and need pay attention to make electronic components 3 fully by insulating pad 2 parcel, move down the in-process, slider 6 and circuit board 5 contact of slidable mounting in cell body one, need continue to move down solid plate 1 this moment, because circuit board 5 plays the effect that stops moving down to slider 6, make solid plate 1 continue to move down, thereby make two 10 compressions of spring, when the outer wall of two 11 outer walls of fixture block that rotate to install on axostylus axostyle 12 and the outer wall of cell body one paste mutually, two 11 can be close to circuit board 5 of fixture block, make two 11 pairs of circuit board 5 of fixture block centre gripping, one 9 of fixture block just blocks with two looks mutual block in hole this moment, accomplish fixed mounting.

With the above operation, the insulating pad 2 is fixedly mounted on the electronic component 3 in a snap-fit manner, so that the heat dissipation insulating fixing operation of the electronic component 3 is completed.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (5)

1. A heat dissipation and insulation fixing device for electronic components comprises a solid plate (1), an insulation pad (2) and electronic components (3) on a clamping installation circuit board (5), and is characterized in that a first groove body, two second groove bodies, a first hole and two second holes are formed in the solid plate (1), the first hole is communicated with the first groove body and communicated with the second groove body, a first clamping groove is formed in the circuit board (5), the insulation pad (2) is fixed in the first groove body, sliding blocks (6) are arranged in the two groove bodies in a sliding mode, limiting blocks matched with the two groove bodies are fixedly arranged on the two sliding blocks (6), a second spring (10) is fixedly arranged between the upper end of each sliding block (6) and the top of the corresponding groove body, a support (7), a shaft lever (12) and a first clamping block (9) are fixedly arranged on the two sliding blocks (6), the improved LED lamp is characterized in that a second clamping block (11) is rotatably mounted on the shaft rod (12), a first spring (8) is fixedly mounted between the second clamping block (11) and the support (7), two third clamping blocks (13) are fixedly mounted on the circuit board (5), a second clamping groove matched with the third clamping blocks (13) is formed in the electronic component (3), a radiating block (4) is fixedly mounted in the first hole, and the lower portion of the radiating block (4) is in contact with the insulating pad (2).

2. The heat dissipation, insulation and fixation device for electronic components as claimed in claim 1, wherein the heat dissipation block (4) is made of crystalline silicon.

3. The heat dissipation, insulation and fixation device for the electronic component as claimed in claim 1, wherein the shapes of the end surfaces of the first clamping block (9), the second clamping block (11) and the third clamping block (13) are triangular and are made of rubber materials.

4. The heat dissipation, insulation and fixation device for the electronic component as recited in claim 1, wherein the vertical distance from the first fixture block (9) to the second hole is equal to the vertical distance from the center of the shaft rod (12) to the lower end of the solid plate (1).

5. The heat dissipation, insulation and fixation device for the electronic component as recited in claim 1, wherein the length of the second clamping block (11) is greater than the thickness of the circuit board (5).

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