CN213244500U

CN213244500U - High temperature resistant multilayer printed circuit board

Info

Publication number: CN213244500U
Application number: CN202022111945.4U
Authority: CN
Inventors: 陈明全; 黄帅; 张国乾
Original assignee: Fujian Milky Way Technology Co ltd
Current assignee: Fujian Milky Way Technology Co ltd
Priority date: 2020-09-23
Filing date: 2020-09-23
Publication date: 2021-05-18
Anticipated expiration: 2030-09-23

Abstract

The utility model discloses a high temperature resistance multilayer printed circuit board, including first circuit board, second circuit board and third circuit board, the top of first circuit board is provided with the second circuit board, the top of second circuit board is provided with the third circuit board, the one end of slider is fixed with the fixture block, the top of third circuit board is provided with dustproof construction. The utility model discloses a be provided with the dismouting structure, take the third circuit board, promote the slider again into the spout, when mutual block between fixture block and the draw-in groove, stop promoting, accomplish the equipment of third circuit board this moment, when needs pull down the third circuit board, the circuit board is held to the staff, then upwards mention, break away from between fixture block and the draw-in groove this moment, again with the inside roll-off of slider from the spout this moment, can accomplish the dismantlement of third circuit board, the installation and the dismantlement of being convenient for to the third circuit board have been realized, greatly increased the convenience of this multilayer printed circuit board when using.

Description

High temperature resistant multilayer printed circuit board

Technical Field

The utility model relates to a multilayer printed circuit board technical field specifically is a high temperature resistance multilayer printed circuit board.

Background

Along with the development of economy, the national living standard is improved, the technology is developed more and more quickly, a plurality of high-technology products are greatly convenient for people to live, the high-technology products need brains to command operation when in use, the brains of the high-technology products need to be loaded on a circuit board to operate, and in order to enable the high-technology products to operate more smoothly, a special high-temperature-resistant multilayer printed circuit board is needed;

however, when the conventional printed circuit boards in the market are used, the conventional printed circuit boards are inconvenient to assemble conveniently among the multilayer printed circuit boards, and the practicability of the printed circuit boards in use is reduced, so that a high-temperature resistant multilayer printed circuit board is developed to solve the problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high temperature resistant multilayer printed circuit board to propose the inconvenient problem of assembling between the multilayer circuit board in solving above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistant multilayer printed circuit board, includes first circuit board, second circuit board and third circuit board, the top of first circuit board is provided with the second circuit board, the top of second circuit board is provided with the third circuit board, the bottom of first circuit board, second circuit board and third circuit board all is provided with cooling structure, first circuit board, second circuit board and third circuit board top all are provided with the dismouting structure with the corner of bottom, the dismouting structure includes fixture block, draw-in groove, slider and spout, the spout all fixed with the top of first circuit board, second circuit board and third circuit board, the inside one end of spout is fixed with the draw-in groove, the inside of spout is provided with the slider, the one end of slider is fixed with the fixture block, the top of third circuit board is provided with dustproof construction.

Preferably, the cross section of the sliding groove is larger than that of the sliding block, and a sliding structure is formed between the sliding groove and the sliding block.

Preferably, the sliding grooves are arranged in two groups, and the two groups of sliding grooves are symmetrically distributed around the central axis of the third circuit board.

Preferably, the cooling structure includes absorber plate, louvre, fixed slot and fixed block, the fixed slot all sets up in one side of slider, the inside of fixed slot is provided with the fixed block, one side of fixed block all is fixed with the absorber plate, the inside of absorber plate all is provided with the louvre.

Preferably, twelve groups of heat dissipation holes are arranged, and the twelve groups of heat dissipation holes are distributed in the heat absorbing plate at equal intervals.

Preferably, dustproof construction includes dust screen, spring, connecting axle, movable block and mount pad, the edge on third circuit board top is fixed in to the mount pad, the inside both sides of mount pad all are fixed with the spring, one side of spring all is fixed with the movable block, the dust screen sets up in the top of third circuit board, four corners of dust screen bottom all are fixed with the connecting axle.

Compared with the prior art, the beneficial effects of the utility model are that: the high-temperature-resistant multilayer printed circuit board not only realizes convenient assembly among the multilayer printed circuit boards, realizes heat dissipation of the circuit boards, reduces the temperature of the circuit boards, but also realizes enhancement of the dustproof capacity of the circuit boards;

1. the disassembly and assembly structures are arranged at the top ends and the bottom ends of the first circuit board, the second circuit board and the third circuit board, the third circuit board is taken, the sliding block is pushed into the sliding groove, when the clamping block and the clamping groove are clamped with each other, the pushing is stopped, the third circuit board is assembled at the moment, when the third circuit board needs to be disassembled, a worker holds the circuit board and lifts the circuit board upwards, the clamping block and the clamping groove are separated at the moment, the sliding block slides out of the inside of the sliding groove at the moment, the third circuit board can be disassembled, the third circuit board can be conveniently assembled and disassembled, and the convenience of the multilayer printed circuit board in use is greatly improved;

2. the bottom ends of the first circuit board, the second circuit board and the third circuit board are provided with cooling structures, the heat absorbing plate is taken out, the fixing block is placed in the fixing groove, and the heat absorbing plate is installed;

3. be provided with dustproof construction through the top at the third circuit board, take out the dust screen, then place into the inside of movable block with the connecting axle, the spring receives the effect of elasticity drive movable block forward extend and with the connecting axle block, accomplish the installation of dust screen, the use of dust screen makes the difficult surface that falls into the third circuit board of dust simultaneously, has realized having certain dustproof effect to the third circuit board, greatly increased the practicality of third circuit board when using.

Drawings

Fig. 1 is a schematic front view of a cross-sectional structure of the present invention;

FIG. 2 is a schematic view of the top view of the partial cross-sectional structure of the detachable structure of the present invention;

fig. 3 is a schematic view of the enlarged structure of a part a in fig. 1 according to the present invention;

fig. 4 is a schematic view of the front view partial section structure of the dustproof structure of the present invention.

In the figure: 1. a first circuit board; 2. a second circuit board; 3. a third circuit board; 4. a cooling structure; 401. a heat absorbing plate; 402. heat dissipation holes; 403. fixing grooves; 404. a fixed block; 5. a disassembly and assembly structure; 501. a clamping block; 502. a card slot; 503. a slider; 504. a chute; 6. a dust-proof structure; 601. a dust screen; 602. a spring; 603. a connecting shaft; 604. a movable block; 605. and (7) mounting a seat.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides an embodiment: a high-temperature-resistant multilayer printed circuit board comprises a first circuit board 1, a second circuit board 2 and a third circuit board 3, wherein the second circuit board 2 is arranged at the top end of the first circuit board 1, the third circuit board 3 is arranged at the top end of the second circuit board 2, cooling structures 4 are arranged at the bottom ends of the first circuit board 1, the second circuit board 2 and the third circuit board 3, each cooling structure 4 comprises a heat absorbing plate 401, heat dissipation holes 402, a fixing groove 403 and a fixing block 404, the fixing groove 403 is arranged on one side of a sliding block 503, the fixing block 404 is arranged inside the fixing groove 403, the heat absorbing plate 401 is fixed on one side of the fixing block 404, the heat absorbing plate 401 is internally provided with heat dissipation holes 402, the heat dissipation holes 402 are arranged in twelve groups, and the twelve groups of heat dissipation holes 402;

specifically, as shown in fig. 1, when the mechanism is used, a worker firstly takes out the heat absorbing plate 401, then aligns the fixing block 404 on the heat absorbing plate 401 with the fixing groove 403 on the sliding block 503, and then places the fixing block 404 into the fixing groove 403 to complete the installation of the heat absorbing plate 401, because the heat dissipating holes 402 are uniformly arranged in the heat absorbing plate 401, the heat absorbed by the heat absorbing plate 401 can be quickly exhausted from the heat dissipating holes 402, so that the first circuit board 1, the second circuit board 2 and the third circuit board 3 are cooled, and the service life of the circuit board is greatly prolonged;

the corners of the top ends and the bottom ends of the first circuit board 1, the second circuit board 2 and the third circuit board 3 are respectively provided with a dismounting structure 5, each dismounting structure 5 comprises a clamping block 501, a clamping groove 502, a sliding block 503 and a sliding groove 504, each sliding groove 504 is fixed with the top ends of the first circuit board 1, the second circuit board 2 and the third circuit board 3, one end inside each sliding groove 504 is fixed with the clamping groove 502, each sliding block 503 is arranged inside each sliding groove 504, one end of each sliding block 503 is fixed with the clamping block 501, the cross section of each sliding groove 504 is larger than that of each sliding block 503, a sliding structure is formed between each sliding groove 504 and each sliding block 503, the sliding grooves 504 are provided with two groups, and the two groups;

specifically, as shown in fig. 1, fig. 2 and fig. 3, when the mechanism is used, when the third circuit board 3 needs to be assembled, a worker takes the third circuit board 3, aligns the sliding block 503 with the sliding groove 504, pushes the sliding block 503 into the sliding groove 504, stops pushing when the clamping block 501 and the clamping groove 502 are clamped with each other, completes the assembly of the third circuit board 3 at this time, when the third circuit board 3 needs to be disassembled, the worker holds the circuit board, then lifts up, separates the clamping block 501 from the clamping groove 502, slides out the sliding block 503 from the inside of the sliding groove 504 at this time, completes the disassembly of the third circuit board 3, realizes the convenience in the assembly and disassembly of the third circuit board 3, and greatly increases the convenience in the use of the multilayer printed circuit board;

the top end of the third circuit board 3 is provided with a dustproof structure 6, the dustproof structure 6 comprises a dustproof net 601, a spring 602, a connecting shaft 603, a movable block 604 and a mounting seat 605, the mounting seat 605 is fixed at the edge of the top end of the third circuit board 3, the spring 602 is fixed on two sides of the inside of the mounting seat 605, the movable block 604 is fixed on one side of the spring 602, the dustproof net 601 is arranged at the top end of the third circuit board 3, and the connecting shafts 603 are fixed at four corners of the bottom end of the dustproof net 601;

specifically, as shown in fig. 1 and 4, when using the mechanism, a worker first takes out the dust screen 601, aligns the connecting shaft 603 with the movable block 604, places the connecting shaft 603 inside the movable block 604, and then the spring 602 is acted by elastic force to drive the movable block 604 to retract backwards, when a groove on the connecting shaft 603 is just in front of the movable block 604, the spring 602 is acted by elastic force again to drive the movable block 604 to extend forwards and engage with the connecting shaft 603, so as to complete the installation of the dust screen 601, and at the same time, the dust screen 601 is used to prevent dust from falling onto the surface of the third circuit board 3, after using for a while, the worker holds the dust screen 601 to lift upwards, and at the same time, the spring 602 is acted by elastic force to drive the movable block 604 to retract backwards, so as to detach the dust screen 601, and replace the new dust screen 601, thereby achieving a certain dust-proof effect on the third circuit board 3, the utility of the third circuit board 3 in use is greatly increased.

The working principle is as follows: when the dustproof screen is used, firstly, a worker takes the circuit board to a proper position, takes the heat absorption plate 401 out, aligns the fixed block 404 with the fixed groove 403, places the fixed block 404 into the fixed groove 403 to complete installation of the heat absorption plate 401, takes the dustproof screen 601 out, aligns the connecting shaft 603 with the movable block 604, places the connecting shaft 603 into the movable block 604, enables the spring 602 to be under the action of elasticity to drive the movable block 604 to contract backwards, and enables the spring 602 to be under the action of elasticity again to drive the movable block 604 to extend forwards and be clamped with the connecting shaft 603 when a groove in the connecting shaft 603 is just in front of the movable block 604, so that installation of the dustproof screen 601 is completed;

then, when the third circuit board 3 needs to be assembled, a worker firstly takes the third circuit board 3, then aligns the sliding block 503 with the sliding groove 504, then pushes the sliding block 503 into the sliding groove 504, stops pushing when the clamping block 501 and the clamping groove 502 are clamped with each other, completes the assembly of the third circuit board 3 at this moment, repeats the steps, completes the assembly of the circuit board according to the actual situation, at this moment, the circuit board can work, the heat generated by the work is absorbed into the heat absorption plate 401, is discharged through the heat dissipation holes 402, and cools the circuit board;

finally, after a lot of dust deposited on the dust screen 601 is used for a period of time, a worker holds the dust screen 601 to lift the dust screen 601 upwards with force, at the moment, the spring 602 is under the action of elasticity to drive the movable block 604 to contract backwards, the dust screen 601 can be detached to replace the new dust screen 601, when the third circuit board 3 needs to be detached, the worker holds the circuit board and then lifts the circuit board upwards, at the moment, the fixture block 501 is separated from the clamping groove 502, at the moment, the sliding block 503 slides out from the inside of the sliding groove 504, the detachment of the third circuit board 3 can be completed, and finally, the work of the multilayer printed circuit board is completed.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. A high temperature resistant multilayer printed circuit board comprising a first circuit board (1), a second circuit board (2) and a third circuit board (3), characterized in that: the top end of the first circuit board (1) is provided with a second circuit board (2), the top end of the second circuit board (2) is provided with a third circuit board (3), the bottoms of the first circuit board (1), the second circuit board (2) and the third circuit board (3) are respectively provided with a cooling structure (4), the corners of the top ends and the bottoms of the first circuit board (1), the second circuit board (2) and the third circuit board (3) are respectively provided with a dismounting structure (5), each dismounting structure (5) comprises a clamping block (501), a clamping groove (502), a sliding block (503) and a sliding groove (504), the sliding grooves (504) are respectively fixed with the top ends of the first circuit board (1), the second circuit board (2) and the third circuit board (3), one end inside the sliding groove (504) is fixed with the clamping groove (502), the sliding block (503) is arranged inside the sliding groove (504), one end of the sliding block (503) is fixed with a clamping block (501), and the top end of the third circuit board (3) is provided with a dustproof structure (6).

2. The high temperature resistant multilayer printed circuit board of claim 1, wherein: the cross section of the sliding groove (504) is larger than that of the sliding block (503), and a sliding structure is formed between the sliding groove (504) and the sliding block (503).

3. The high temperature resistant multilayer printed circuit board of claim 1, wherein: the sliding grooves (504) are arranged in two groups, and the two groups of sliding grooves (504) are symmetrically distributed around the central axis of the third circuit board (3).

4. The high temperature resistant multilayer printed circuit board of claim 1, wherein: the cooling structure (4) comprises a heat absorbing plate (401), heat dissipation holes (402), a fixing groove (403) and a fixing block (404), wherein the fixing groove (403) is formed in one side of a sliding block (503), the fixing block (404) is arranged inside the fixing groove (403), the heat absorbing plate (401) is fixed on one side of the fixing block (404), and the heat dissipation holes (402) are formed inside the heat absorbing plate (401).

5. The high temperature resistant multilayer printed circuit board of claim 4, wherein: twelve groups of heat dissipation holes (402) are arranged, and the twelve groups of heat dissipation holes (402) are distributed in the heat absorption plate (401) at equal intervals.

6. The high temperature resistant multilayer printed circuit board of claim 1, wherein: dustproof construction (6) include dust screen (601), spring (602), connecting axle (603), movable block (604) and mount pad (605), mount pad (605) are fixed in the edge on third circuit board (3) top, the inside both sides of mount pad (605) all are fixed with spring (602), one side of spring (602) all is fixed with movable block (604), dust screen (601) set up in the top of third circuit board (3), four corners of dust screen (601) bottom all are fixed with connecting axle (603).