CN213244466U

CN213244466U - Circuit board with long service life

Info

Publication number: CN213244466U
Application number: CN202022312423.0U
Authority: CN
Inventors: 林裕圳
Original assignee: Meizhou Zhengneng Circuit Technology Co ltd
Current assignee: Meizhou Zhengneng Circuit Technology Co ltd
Priority date: 2020-10-16
Filing date: 2020-10-16
Publication date: 2021-05-18
Anticipated expiration: 2030-10-16

Abstract

The utility model discloses a long service life's circuit board, including the circuit board body, the circuit board body includes first functional layer, strengthening layer, basic unit and insulating layer, the strengthening layer includes polyether ketone layer, foamed plastic layer and melamine resin glue film. The utility model discloses a setting of first functional layer, it is insulating to have, it is adiabatic, corrosion-resistant, do not burn, high temperature resistant, performance such as high strength, setting through the polyether ketone layer, polyaryletherketone who comprises difluorobenzophenone and hydroquinone, tensile strength and tensile modulus are comparatively excellent, can make reinforcing material or combined material with glass fiber or carbon fiber, be applied to high temperature resistant structural material, special type coating, wear-resisting material and electrical insulation material, it receives the damage very easily to have solved current circuit board, meet slight collision and can cause the circuit board to appear the damage and lead to the unable normal use of circuit board, influence normal work operation's problem.

Description

Circuit board with long service life

Technical Field

The utility model relates to a circuit board technical field specifically is a long service life's circuit board.

Background

The circuit board generally refers to a circuit board, and the name of the circuit board is as follows: ceramic circuit board, alumina ceramic circuit board, aluminium nitride ceramic circuit board, PCB board, aluminium base board, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed circuit board etc. current circuit board receives the damage very easily, meets slight collision and can cause the circuit board to appear the damage and lead to the unable normal use of circuit board, influences normal work operation, for this reason we provide a long service life's circuit board.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a long service life's circuit board possesses long service life's advantage, has solved current circuit board and has received the damage very easily, meets slight collision and can cause the circuit board to appear the damage and lead to the unable normal use of circuit board, influences the problem of normal work operation.

In order to achieve the above object, the utility model provides a following technical scheme: the circuit board comprises a circuit board body, wherein the circuit board body comprises a first functional layer, a strengthening layer, a base layer and an insulating layer, and the strengthening layer comprises a polyether ketone layer, a foam plastic layer and a melamine resin adhesive layer.

Preferably, the polyether ketone layer is located the top of foamed plastic layer and fixedly connected through the welding mode, the top of melamine resin glue film is fixedly connected in the bottom of foamed plastic layer, the thickness of polyether ketone layer is greater than the thickness of foamed plastic layer, the thickness of melamine resin glue film is greater than the thickness of foamed plastic layer.

Preferably, the thickness of the first functional layer is greater than that of the base layer, the thickness of the insulating layer is greater than that of the first functional layer, and the thickness of the reinforcing layer is greater than that of the base layer.

Preferably, the first functional layer is made of glass cloth, and the bottom of the first functional layer is fixedly connected to the top of the reinforcing layer.

Preferably, the insulating layer is made of a polytetrafluoroethylene copper-clad foil plate, and the top of the insulating layer is fixedly connected to the bottom of the base layer.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a setting of first functional layer, it is insulating, thermal insulation, corrosion-resistant, do not burn, high temperature resistant, performance such as high strength, through the setting on polyether ketone layer, polyaryletherketone who comprises difluorobenzophenone and hydroquinone, tensile strength and tensile modulus are comparatively excellent, can make reinforcing material or combined material with glass fiber or carbon fiber, be applied to high temperature resistant structure material, special type coating, wear-resistant material and electrical insulation material, through the setting of foam plastic layer, have the characteristics such as matter is light, thermal-insulated, inhale sound, shock attenuation, and dielectric property is superior to base resin, it is wide to use, through the setting on melamine resin glue film, great chemical activity has, very high adhesive strength, water-fast ability experiences boiling water more than three hours, the thermal stability is high, the low temperature curing ability is stronger, the wearability is good, the solidification is fast, do not need characteristics such as reinforcer, the heat-conducting insulating layer is formed by special polymers filled with special ceramics, has small thermal resistance, excellent viscoelastic performance and thermal aging resistance, can bear mechanical and thermal stress, has excellent electrical property, heat resistance and mechanical strength by the arrangement of the insulating layer, and solves the problems that the existing circuit board is easy to damage, the circuit board can not be normally used and the normal working operation is influenced due to the fact that the circuit board is damaged when slight collision occurs.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a sectional view of the structure of the present invention;

fig. 3 is a sectional view of the structure reinforcing layer of the present invention.

In the figure: 1. a circuit board body; 2. a first functional layer; 3. a strengthening layer; 31. a polyetherketone layer; 32. a foam plastic layer; 33. a melamine resin adhesive layer; 4. a base layer; 5. an insulating layer.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses a circuit board body 1, first functional layer 2, strengthening layer 3, polyether ketone layer 31, foamed plastic layer 32, melamine resin glue film 33, basic unit 4 and 5 parts of insulating layer are the parts that general standard spare or technical staff in the field know, and its structure and principle all are that this technical staff all can learn through the technical manual or learn through conventional experimental method.

Referring to fig. 1-3, a circuit board with a long service life includes a circuit board body 1, the circuit board body 1 includes a first functional layer 2, a reinforcement layer 3, a base layer 4 and an insulating layer 5, the reinforcement layer 3 includes a polyetherketone layer 31, a foam layer 32 and a melamine resin adhesive layer 33.

The polyether ketone layer 31 is positioned at the top of the foamed plastic layer 32 and fixedly connected through a welding mode, the top of the melamine resin glue layer 33 is fixedly connected at the bottom of the foamed plastic layer 32, the thickness of the polyether ketone layer 31 is larger than that of the foamed plastic layer 32, the thickness of the melamine resin glue layer 33 is larger than that of the foamed plastic layer 32, through the arrangement of the polyether ketone layer 31, the polyaryletherketone consisting of difluorobenzophenone and hydroquinone has more excellent tensile strength and tensile modulus, can be made into a reinforcing material or a composite material with glass fiber or carbon fiber, is applied to high temperature resistant structural materials, special coatings, wear-resistant materials and electrical insulating materials, has the characteristics of light weight, heat insulation, sound absorption, shock absorption and the like through the arrangement of the foamed plastic layer 32, has better dielectric property than that of matrix resin, has wide application range, and has larger chemical activity through the arrangement of the melamine resin glue layer 33, high adhesion strength, high water resistance, high boiling water duration of more than three hours, high thermal stability, strong low-temperature curing capability, good wear resistance, fast curing, no need of a curing agent and the like.

The thickness of the first functional layer 2 is larger than that of the base layer 4, the thickness of the insulating layer 5 is larger than that of the first functional layer 2, the thickness of the reinforcing layer 3 is larger than that of the base layer 4, the base layer 4 is formed by a circuit layer, a heat conduction insulating layer and a metal base layer, the heat conduction insulating layer is formed by special polymers filled with special ceramics, the heat resistance is small, the viscoelasticity is excellent, the heat aging resistance is realized, the mechanical stress and the thermal stress can be borne, and the electric performance, the heat resistance and the mechanical strength are excellent through the arrangement of the insulating layer 5.

The material of first functional layer 2 is glass cloth, and the bottom fixed connection of first functional layer 2 has insulating, thermal insulation, corrosion-resistant, incombustible, high temperature resistant, performance such as high strength in the top of strengthening layer 3 through the setting of first functional layer 2.

Insulating layer 5's material is polytetrafluoroethylene copper clad foil board, and insulating layer 5's top fixed connection has excellent electrical property, heat resistance and mechanical strength through insulating layer 5's setting in the bottom of basic unit 4.

When in use, the first functional layer 2 is arranged, has the properties of insulation, heat insulation, corrosion resistance, no combustion, high temperature resistance, high strength and the like, the polyaryletherketone consisting of difluorobenzophenone and hydroquinone is arranged through the polyetherketone layer 31, has excellent tensile strength and tensile modulus, can be made into a reinforced material or a composite material with glass fiber or carbon fiber, is applied to a high temperature resistant structural material, a special coating, an abrasion resistant material and an electric insulating material, has the characteristics of light weight, heat insulation, sound absorption, shock absorption and the like through the arrangement of the foamed plastic layer 32, has dielectric property superior to that of a matrix resin, has wide application range, has larger chemical activity, higher bonding strength and water resistance when being subjected to boiling water for more than three hours, has high thermal stability, stronger low-temperature curing capability, good abrasion resistance and quick curing, the heat-conducting insulating layer is made of special polymers filled with special ceramics, has low thermal resistance and excellent viscoelastic performance, has the capability of resisting thermal aging, can bear mechanical and thermal stress, has excellent electrical property, heat resistance and mechanical strength by the arrangement of the insulating layer 5, and solves the problems that the existing circuit board is easy to damage, and the circuit board can not be normally used and the normal working operation is influenced due to the fact that the circuit board is damaged when slight collision occurs.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a circuit board of long service life, includes circuit board body (1), its characterized in that: the circuit board body (1) comprises a first functional layer (2), a strengthening layer (3), a base layer (4) and an insulating layer (5), wherein the strengthening layer (3) comprises a polyether ketone layer (31), a foam plastic layer (32) and a melamine resin glue layer (33).

2. A long-life wiring board according to claim 1, wherein: the polyether ketone layer (31) is located the top of foamed plastic layer (32) and passes through welding mode fixed connection, the top fixed connection of melamine resin glue film (33) is in the bottom of foamed plastic layer (32), the thickness of polyether ketone layer (31) is greater than the thickness of foamed plastic layer (32), the thickness of melamine resin glue film (33) is greater than the thickness of foamed plastic layer (32).

3. A long-life wiring board according to claim 1, wherein: the thickness of the first functional layer (2) is larger than that of the base layer (4), the thickness of the insulating layer (5) is larger than that of the first functional layer (2), and the thickness of the strengthening layer (3) is larger than that of the base layer (4).

4. A long-life wiring board according to claim 1, wherein: the material of the first functional layer (2) is glass cloth, and the bottom of the first functional layer (2) is fixedly connected to the top of the reinforced layer (3).

5. A long-life wiring board according to claim 1, wherein: the material of insulating layer (5) is polytetrafluoroethylene copper clad foil board, the top fixed connection of insulating layer (5) is in the bottom of basic unit (4).