CN213227879U - Hard alloy and diamond composite structure - Google Patents
Hard alloy and diamond composite structure Download PDFInfo
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- CN213227879U CN213227879U CN202022017713.2U CN202022017713U CN213227879U CN 213227879 U CN213227879 U CN 213227879U CN 202022017713 U CN202022017713 U CN 202022017713U CN 213227879 U CN213227879 U CN 213227879U
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Abstract
The utility model discloses a carbide and diamond composite construction, it includes: diamond micropowder layer and carbide basic unit, carbide basic unit from the bottom up superposes in proper order, diamond micropowder layer sets up between adjacent two-layer carbide basic unit, diamond micropowder layer goes up the annular array and is provided with several rings of through-holes, it has the binder to fill respectively in the through-hole, binder bottom and top contact with adjacent two-layer carbide basic unit respectively. Carbide and diamond composite construction, designed the through-hole on the diamond micropowder layer very much, carry out the packing of through-hole through the binder to two-layer carbide basic unit about connecting forms three-dimensional carbide basic unit framework behind the sintering solidification shaping, promoted the structural stability of diamond micropowder layer and carbide basic unit greatly, reduce the delaminating problem in the use.
Description
Technical Field
The utility model relates to a combined material produces technical field, especially relates to a carbide and diamond composite construction.
Background
At present, with the development of the technology of the domestic and foreign industries, diamond composite sheet materials are mostly formed by sintering diamond micro powder and hard alloy under the condition of ultrahigh pressure and high temperature, and the diamond composite sheet materials are used as ideal materials for manufacturing drilling bits and other wear-resistant tools and have the excellent characteristics of high hardness, high wear resistance and thermal conductivity of diamond, strength and impact toughness of hard alloy and the like.
In fact, due to the problems of material difference and process level limitation, the existing diamond compact materials used in the fields of drilling and production and other high-end drilling processing are easy to have an integral delamination phenomenon, the service life of a drill bit is influenced, the difficulty and the period of drilling and production are increased, and improvement is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a carbide and diamond composite construction promotes structural stability, reduces the delaminating problem.
To achieve the purpose, the utility model adopts the following technical proposal:
a cemented carbide and diamond composite structure comprising: diamond micropowder layer and carbide basic unit, carbide basic unit from the bottom up superposes in proper order, diamond micropowder layer sets up between adjacent two-layer carbide basic unit, diamond micropowder layer goes up the annular array and is provided with several rings of through-holes, it has the binder to fill respectively in the through-hole, binder bottom and top contact with adjacent two-layer carbide basic unit respectively.
The diamond micropowder layer and the hard alloy base layer are respectively of a disc-shaped structure.
And central holes are concentrically arranged in the middle of the diamond micropowder layer and the hard alloy base layer.
Wherein the thickness of the diamond micropowder layer is less than that of the hard alloy base layer.
The binder is made of hard alloy powder which is the same as the hard alloy base layer.
Wherein, the through holes are distributed on the diamond micropowder layer in two circles and annular arrays.
And the diamond micropowder layer, the hard alloy base layer and the binder are sintered, cured and molded.
The utility model has the advantages that: a through hole is designed on a diamond micro powder layer, the through hole is filled through a binder and is connected with an upper hard alloy base layer and a lower hard alloy base layer, a three-dimensional hard alloy base layer framework is formed after sintering, curing and forming, the structural stability of the diamond micro powder layer and the hard alloy base layer is greatly improved, the delamination problem in the using process is reduced, the durability of related products is better, and the application range is wide.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a top view of the diamond micropowder layer of fig. 1.
Detailed Description
The technical solution of the present invention is further explained by the specific embodiment with reference to fig. 1 to fig. 2.
The cemented carbide and diamond composite structure shown in fig. 1 comprises: the composite material comprises a diamond micropowder layer 2 and a hard alloy base layer 1, wherein the hard alloy base layer 1 is sequentially overlapped from bottom to top, in the embodiment, the hard alloy base layer 1 can adopt W-C-Co as a basic raw material, and molybdenum carbide and Ru are added to respectively regulate and control the lattice constants of a WC-based hard phase and a Co-based binding phase, so that the comprehensive performance, particularly the impact toughness, is improved.
The diamond micropowder layer 2 is arranged between the two adjacent hard alloy base layers 1, and the hardness and the wear resistance of the whole body are improved through the diamond micropowder layer 2. In this embodiment, the diamond micropowder layer 2 and the cemented carbide substrate 1 are respectively in a disc-shaped structure, and the thickness of the diamond micropowder layer 2 is smaller than that of the cemented carbide substrate 1, so that the cost is reduced.
In this embodiment, as shown in fig. 1, the central holes 3 are concentrically arranged in the middle of the diamond micropowder layer 2 and the cemented carbide substrate 1, and the central holes 3 not only can reduce the self weight and the cost, but also can facilitate the subsequent processing, installation and use.
In order to improve the stability of the composite structure of the diamond micropowder layer 2 and the hard alloy base layer 1, a plurality of circles of through holes 5 are arranged on the diamond micropowder layer 2 in an annular array mode, binders 4 are filled in the through holes 5 respectively, the bottoms and the tops of the binders 4 are in contact with the two adjacent hard alloy base layers respectively, and the connection of the upper hard alloy base layer and the lower hard alloy base layer is enhanced.
In this embodiment, the through holes 5 are distributed on the diamond micropowder layer 2 in two circles in an annular array manner, so that the binder 4 is uniformly distributed, the connection strength of the upper and lower hard alloy base layers is greatly improved, and a three-dimensional hard alloy base layer framework is formed after sintering, curing and forming.
In this embodiment, the binder 4 is made of hard alloy powder of the same material as the hard alloy base layer 1, the bonding strength is high, the diamond micropowder layer 2, the hard alloy base layer 1 and the binder 4 are sintered, cured and molded, and sintered under the condition of ultrahigh pressure and high temperature to form a composite sheet material, and the application range is wide.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (7)
1. A cemented carbide and diamond composite structure comprising: diamond micropowder layer and carbide basic unit, carbide basic unit from the bottom up superposes in proper order, diamond micropowder layer sets up between adjacent two-layer carbide basic unit, diamond micropowder layer goes up the annular array and is provided with several rings of through-holes, it has the binder to fill respectively in the through-hole, binder bottom and top contact with adjacent two-layer carbide basic unit respectively.
2. The composite cemented carbide and diamond structure of claim 1, wherein the micro-powder layer and the base cemented carbide layer are each in the form of a disc.
3. The composite structure of cemented carbide and diamond as claimed in claim 2, wherein the micro-powder layer of diamond and the middle part of the cemented carbide substrate are concentrically provided with a central hole.
4. The cemented carbide and diamond composite structure of claim 2, wherein the diamond micropowder layer is less thick than the cemented carbide substrate layer.
5. The composite cemented carbide and diamond structure of claim 1, wherein the binder is cemented carbide powder of the same material as the cemented carbide substrate.
6. The cemented carbide and diamond composite structure of claim 1, wherein the through holes are distributed in two annular arrays on the diamond micropowder layer.
7. The composite structure of cemented carbide and diamond as claimed in claim 1, wherein the micro-powder layer of diamond, the cemented carbide substrate layer and the binder are sintered, cured and formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022017713.2U CN213227879U (en) | 2020-09-16 | 2020-09-16 | Hard alloy and diamond composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022017713.2U CN213227879U (en) | 2020-09-16 | 2020-09-16 | Hard alloy and diamond composite structure |
Publications (1)
| Publication Number | Publication Date |
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| CN213227879U true CN213227879U (en) | 2021-05-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022017713.2U Active CN213227879U (en) | 2020-09-16 | 2020-09-16 | Hard alloy and diamond composite structure |
Country Status (1)
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| CN (1) | CN213227879U (en) |
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2020
- 2020-09-16 CN CN202022017713.2U patent/CN213227879U/en active Active
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