CN213198805U - Semiconductor refrigeration piece radiator suitable for 3D printer throat is radiating - Google Patents
Semiconductor refrigeration piece radiator suitable for 3D printer throat is radiating Download PDFInfo
- Publication number
- CN213198805U CN213198805U CN202021977835.XU CN202021977835U CN213198805U CN 213198805 U CN213198805 U CN 213198805U CN 202021977835 U CN202021977835 U CN 202021977835U CN 213198805 U CN213198805 U CN 213198805U
- Authority
- CN
- China
- Prior art keywords
- semiconductor refrigeration
- radiator
- choke
- refrigeration piece
- extrusion mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
Abstract
The utility model discloses a semiconductor refrigeration piece radiator suitable for 3D printer choke heat dissipation, including extrusion mechanism, the bottom of extrusion mechanism is connected with no indisputable fluorine dragon formula choke, the bottom of no indisputable fluorine dragon formula choke is connected with heating block shower nozzle external member, the utility model discloses in use the principle of semiconductor refrigeration piece; by utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that the aim of refrigeration can be fulfilled; the advantage of semiconductor refrigeration piece radiator is that thermal inertia is very little, and the circular telegram can reach the maximum temperature difference fast less than 1 minute, hugs closely the radiator of installation choke with the cold junction of semiconductor refrigeration piece radiator, and the hot junction uses the fan heat dissipation, can realize the quick heat dissipation of choke for no teflon tubular choke when printing low temperature consumptive materials such as PLA, TPU, also guarantee that the consumptive material smoothly extrudes and is not stained with glutinous pipe wall.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation of 3D printer choke, concretely relates to semiconductor refrigeration piece radiator suitable for 3D printer choke is radiating.
Background
The throat of the FDM 3D printer is used for guiding consumables to enter a heating block and is connected with a nozzle, and the upper half section of the throat is usually connected with a radiator to isolate heat conduction; there are three main types of throats: the first one is a complete penetration type, and is used for directly inserting a far-end Teflon feeding pipe into a throat from the outside, penetrating the whole throat to the bottom and touching a nozzle; and the second method comprises the following steps: the feeding pipe is a non-complete penetration type, the far-end Teflon feeding pipe is connected to the upper end of the throat pipe, and the other section of Teflon pipe is used at the lower end of the throat pipe; and the third is that: the throat tube is a Teflon-free tubular throat tube, and is suitable for printing high-temperature consumables such as ABS, PETG and HIPS; in the printing process, the consumable is extruded into the throat pipe by the extruding mechanism or is pumped back from the throat pipe, the upper end of the throat pipe is provided with a radiator, and the lower end of the throat pipe is connected with the heating block and the nozzle; the throat pipe is made of metal materials, and the temperature of the inner wall of the throat pipe can be directly increased when the throat pipe is connected with the heating block, so that a radiator is required to be additionally arranged at the upper end of the throat pipe to isolate heat conduction. The heat dissipation mode of present choke all utilizes an aluminium system radiating block, and plus radiator fan dispels the heat to the choke, and this kind of heat dissipation mode has just led to present when printing low temperature consumptive material like PLA, TPU, can only use the first or the second to take the choke of teflon pipe, if uses the third kind not to take the choke of teflon pipe, will be owing to the heat dissipation is not enough, causes the consumptive material inflation in the choke, blocks up the choke, can't continue to print. So when your printer uses the throat of first or second kind, just can not print high temperature consumptive material such as ABS, PETG and HIPS for a long time, can cause the ageing of the teflon pipe in the throat. Therefore, if the low-temperature consumable material of the printer is replaced by the high-temperature consumable material, the non-Teflon tubular throat pipe needs to be replaced; when low-temperature consumables need to be printed, the throat pipe with the Teflon pipe needs to be replaced, which is very inconvenient.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor refrigeration piece radiator suitable for 3D printer choke is radiating to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor refrigeration piece radiator suitable for 3D printer choke is radiating, includes extrusion mechanism, extrusion mechanism's bottom is connected with no indisputable fluorine dragon formula choke, the bottom of no indisputable fluorine dragon formula choke is connected with heating block shower nozzle external member, the fixed cooling cap that is provided with in one side of extrusion mechanism, the fixed hot junction radiator fan that is provided with in cooling cap one side, be provided with the semiconductor refrigeration piece between cooling cap and the hot junction radiator fan, the inboard of semiconductor refrigeration piece embedding cooling cap.
Preferably, a heating block is arranged on the heating block spray head external member.
Preferably, the bottom of the extrusion mechanism is provided with a mounting hole, and the size of the mounting hole is matched with the top end of the iron-free fluorine dragon type throat pipe.
Preferably, the iron-free fluorine dragon type throat pipe is fixedly connected with the heating block spray head suite through threaded screwing.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model uses the principle of semiconductor refrigeration piece; by utilizing the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that the aim of refrigeration can be fulfilled; the advantage of semiconductor refrigeration piece radiator is that thermal inertia is very little, and the circular telegram can reach the maximum temperature difference fast less than 1 minute, hugs closely the radiator of installation choke with the cold junction of semiconductor refrigeration piece radiator, and the hot junction uses the fan heat dissipation, can realize the quick heat dissipation of choke for no teflon tubular choke when printing low temperature consumptive materials such as PLA, TPU, also guarantee that the consumptive material smoothly extrudes and is not stained with glutinous pipe wall.
Drawings
FIG. 1 is a front sectional view of the present invention;
fig. 2 is a schematic diagram of the explosion structure of the present invention;
in the figure: 1. a heating block spray head kit; 2. a non-iron fluorine dragon type throat pipe; 3. a heat dissipation cover; 4. a semiconductor refrigeration sheet; 5. a hot-end heat dissipation fan; 6. an extrusion mechanism.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
Referring to fig. 1 to 2, the present invention provides a technical solution: the utility model provides a semiconductor refrigeration piece radiator suitable for 3D printer choke is radiating, including extrusion mechanism 6, extrusion mechanism 6's bottom is connected with no indisputable fluorine dragon formula choke 2, the bottom of no indisputable fluorine dragon formula choke 2 is connected with heating block shower nozzle external member 1, one side of extrusion mechanism 6 is fixed to be provided with cooling cap 3, 3 one side of cooling cap is fixed to be provided with hot junction radiator fan 5, be provided with semiconductor refrigeration piece 4 between cooling cap 3 and the hot junction radiator fan 5, the inboard of semiconductor refrigeration piece 4 embedding cooling cap 3.
In this embodiment, preferably, the heating block is disposed on the heating block nozzle set 1, so as to facilitate heating.
In this embodiment, preferably, the bottom of the extruding mechanism 6 is provided with a mounting hole, and the size of the mounting hole matches with the top end of the ironless fluorine dragon type throat 2, so as to facilitate mounting and dismounting.
In this embodiment, preferably, the iron-free fluorine dragon type throat 2 and the heating block nozzle suite 1 are fixedly connected by screwing through threads, so as to ensure firm installation and realize disassembly.
The utility model discloses a theory of operation and use flow: the consumables enter the iron-free fluorine dragon type throat pipe 2 through the extrusion mechanism 6 and then flow to the heating block spray head suite 1; the iron-free fluorine dragon type throat pipe 2 is arranged on the heat dissipation cover 3, the cold end of the semiconductor refrigeration sheet 4 is tightly attached to the heat dissipation cover 3, the iron-free fluorine dragon type throat pipe 2 can be quickly cooled, and the heat dissipation efficiency can be greatly improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a semiconductor refrigeration piece radiator suitable for 3D printer throat is radiating, includes extrusion mechanism (6), its characterized in that: the bottom of extrusion mechanism (6) is connected with no indisputable fluorine dragon formula choke (2), the bottom of no indisputable fluorine dragon formula choke (2) is connected with heating block shower nozzle external member (1), one side of extrusion mechanism (6) is fixed and is provided with radiator cap (3), radiator cap (3) one side is fixed and is provided with hot junction radiator fan (5), be provided with semiconductor refrigeration piece (4) between radiator cap (3) and hot junction radiator fan (5), the inboard of semiconductor refrigeration piece (4) embedding radiator cap (3).
2. The semiconductor refrigeration fin radiator applicable to radiating heat of a 3D printer throat pipe according to claim 1, is characterized in that: and a heating block is arranged on the heating block spray head external member (1).
3. The semiconductor refrigeration fin radiator applicable to radiating heat of a 3D printer throat pipe according to claim 1, is characterized in that: the bottom of the extrusion mechanism (6) is provided with a mounting hole, and the size of the mounting hole is matched with the top end of the iron-free fluorine dragon type throat pipe (2).
4. The semiconductor refrigeration fin radiator applicable to radiating heat of a 3D printer throat pipe according to claim 1, is characterized in that: the iron-free fluorine dragon type throat pipe (2) is fixedly connected with the heating block spray head suite (1) in a screwing mode through threads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021977835.XU CN213198805U (en) | 2020-09-11 | 2020-09-11 | Semiconductor refrigeration piece radiator suitable for 3D printer throat is radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021977835.XU CN213198805U (en) | 2020-09-11 | 2020-09-11 | Semiconductor refrigeration piece radiator suitable for 3D printer throat is radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213198805U true CN213198805U (en) | 2021-05-14 |
Family
ID=75819789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021977835.XU Active CN213198805U (en) | 2020-09-11 | 2020-09-11 | Semiconductor refrigeration piece radiator suitable for 3D printer throat is radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213198805U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116277949A (en) * | 2023-03-03 | 2023-06-23 | 南京航空航天大学 | High energy utilization efficiency print head for additive manufacturing in space environment |
-
2020
- 2020-09-11 CN CN202021977835.XU patent/CN213198805U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116277949A (en) * | 2023-03-03 | 2023-06-23 | 南京航空航天大学 | High energy utilization efficiency print head for additive manufacturing in space environment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103838334A (en) | Heat dissipation base of notebook computer | |
| CN213198805U (en) | Semiconductor refrigeration piece radiator suitable for 3D printer throat is radiating | |
| CN105101752A (en) | Charger heat dissipation device | |
| CN205670900U (en) | A kind of charger cooling system | |
| CN108615713A (en) | Tandem type thermo-electric generation drives the coupled thermomechanics radiator of cooling fluid | |
| CN208768363U (en) | A kind of rain-proof power supply convenient for safeguarding | |
| CN211222070U (en) | FFF printer water-cooling shower nozzle | |
| CN208143359U (en) | Explosion-proof air-conditioner camera protecting cover | |
| CN209088026U (en) | A kind of battery assembling structure | |
| CN107364128A (en) | A kind of medical 3D printer printhead cooling device | |
| CN210733294U (en) | 3D printing nozzle structure | |
| CN219564145U (en) | 3D printer nozzle with stable heating and heat dissipation | |
| CN114851555B (en) | Semiconductor heat dissipation device | |
| CN214959313U (en) | Plasma power supply rectification module structure | |
| CN218084194U (en) | Novel structure of high-temperature printing head | |
| CN217862408U (en) | High-temperature waste gas exchange device of film casting machine | |
| CN215359896U (en) | Ceramic plate heating rod extruder | |
| CN218749339U (en) | 3d print head | |
| CN218430000U (en) | 3D printing equipment | |
| CN218821863U (en) | Heat dissipation copper pipe convenient to installation is dismantled | |
| CN215321447U (en) | Cooling device of printing machine feda wind cabinet | |
| CN218286734U (en) | Cooling structure of 3D printing wire extrusion device | |
| CN111565549B (en) | Heat dissipation assembly, backlight source assembly and display device | |
| CN209062393U (en) | A kind of contravariant arc welding machine of novel internal structure | |
| CN216683359U (en) | Shower nozzle heat abstractor of 3D printer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |