CN213184953U - Cooling device of picosecond laser - Google Patents
Cooling device of picosecond laser Download PDFInfo
- Publication number
- CN213184953U CN213184953U CN202022565120.XU CN202022565120U CN213184953U CN 213184953 U CN213184953 U CN 213184953U CN 202022565120 U CN202022565120 U CN 202022565120U CN 213184953 U CN213184953 U CN 213184953U
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- Prior art keywords
- picosecond laser
- base
- heat exchanger
- connecting pipe
- mounting groove
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- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 8
- 238000012856 packing Methods 0.000 claims abstract 2
- 238000009413 insulation Methods 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 11
- 239000003507 refrigerant Substances 0.000 claims description 9
- 229920000742 Cotton Polymers 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012984 biological imaging Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a picosecond laser technical field just discloses a heat sink of picosecond laser instrument, the on-line screen storage device comprises a base, the top fixed mounting of base has the picosecond laser instrument body, the venthole has been seted up in the front of picosecond laser instrument body, the equal fixed mounting in the left and right sides of base has supporting mechanism, the mounting groove has been seted up at the back of base, the inside fixed mounting of mounting groove has the baffle, the back of base is seted up and is located mounting groove top and one end and extends to the inside spread groove of baffle, the inside packing of spread groove has the insulating layer, the positive fixed mounting of baffle has indoor heat exchanger, indoor heat exchanger's right side intercommunication has the first connecting pipe that one end runs through the. This heat sink of picosecond laser instrument possesses advantages such as the cooling effect is good, has solved traditional picosecond laser instrument most and has all utilized inside fan to dispel the heat the cooling, leads to the poor problem of cooling effect.
Description
Technical Field
The utility model relates to a picosecond laser technical field specifically is a heat sink of picosecond laser.
Background
The picosecond laser is a laser with picosecond pulse width, has the characteristics of picosecond-level ultrashort pulse width, adjustable repetition frequency, high pulse energy and the like, has increasingly wide application in the fields of biomedicine, optical parametric oscillation, biological microscopic imaging and the like, and gradually becomes an increasingly important tool in a modern biological imaging and analyzing system.
The picosecond laser can produce higher temperature inside when using, if not timely cooling, can cause the influence to the life of inside electronic components, and traditional picosecond laser most all utilizes inside fan to dispel the heat the cooling, leads to the cooling effect poor, so proposes the heat sink of a picosecond laser and solves the problem that the aforesaid was put forward.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The utility model provides a not enough to prior art, the utility model provides a heat sink of picosecond laser instrument possesses advantages such as cooling effect is good, has solved traditional picosecond laser instrument most and has all utilized inside fan to dispel the heat the cooling, leads to the poor problem of cooling effect.
(II) technical scheme
For realizing the effectual purpose of above-mentioned cooling, the utility model provides a following technical scheme: a cooling device of a picosecond laser comprises a base, wherein a picosecond laser body is fixedly installed at the top of the base, an air outlet hole is formed in the front of the picosecond laser body, supporting mechanisms are fixedly installed on the left side and the right side of the base, an installation groove is formed in the back of the base, a partition plate is fixedly installed inside the installation groove, a connection groove which is located above the installation groove and one end of which extends into the partition plate is formed in the back of the base, a heat insulation layer is filled inside the connection groove, an indoor heat exchanger is fixedly installed on the front of the partition plate, a first connection pipe with one end penetrating through the partition plate is communicated with the right side of the indoor heat exchanger, a compressor fixedly connected with the bottom wall of an inner cavity of the installation groove is communicated with one end of the first connection pipe away from the indoor heat exchanger, a second connection pipe is communicated with the back of the compressor, the back intercommunication of switching-over valve has the third connecting pipe, the one end intercommunication that the switching-over valve was kept away from to the third connecting pipe has the outdoor heat exchanger with mounting groove inner chamber roof fixed connection, the front intercommunication of outdoor heat exchanger has one end to run through the baffle and extend to the fourth connecting pipe with indoor heat exchanger intercommunication, the inner chamber roof of mounting groove is seted up and is located inside the base and a plurality of heat transfer holes that communicate with the picosecond laser instrument body, controls two the equal fixed mounting in inside in heat transfer hole has axial fan.
Preferably, the number of the air outlet holes is multiple, and the dust screen is fixedly connected inside the air outlet holes.
Preferably, the supporting mechanism comprises a connecting plate, a threaded rod and a cushion block, the connecting plate is fixedly mounted on the left side and the right side of the base, one end of the threaded rod extends to the lower portion of the connecting plate is connected to the top of the connecting plate in a threaded mode, and the cushion block is fixedly mounted at the bottom of the threaded rod.
Preferably, the baffle is T-shaped, and the first connecting pipe and the fourth connecting pipe both penetrate through the heat insulation layer.
Preferably, the heat insulation layer is made of heat insulation cotton, the heat insulation layer is L-shaped, and a refrigerant is arranged in the indoor heat exchanger.
Preferably, the bottom of the reversing valve is fixedly provided with a supporting rod, and the reversing valve is fixedly connected with the bottom wall of the inner cavity of the mounting groove through the supporting rod.
(III) advantageous effects
Compared with the prior art, the utility model provides a heat sink of picosecond laser possesses following beneficial effect:
the cooling device of the picosecond laser comprises a picosecond laser body, wherein when the picosecond laser body starts to work and generates heat inside, axial flow fans on the left side and the right side transmit heated gas inside the picosecond laser body into a mounting groove, a refrigerant inside an indoor heat exchanger absorbs the heat inside hot gas after contacting with the hot gas and converts the heat into a gas state from a liquid state, the heat of the hot gas is absorbed by the refrigerant and converted into cold air, the cold air is input into the picosecond laser body from a heat exchange hole in the middle and is finally discharged from an air outlet hole, so that the inside of the picosecond laser body is rapidly cooled, the purpose of good cooling effect is achieved, meanwhile, the refrigerant converted into the gas state sequentially passes through a compressor, a reversing valve and an outdoor heat exchanger and then is converted into the liquid state from the gas state again and is input into the indoor heat exchanger, and, and the insulating layer can be isolated with the heat that outdoor heat exchanger distributed out, prevents to cause the influence to the cooling of picosecond laser instrument body.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a right sectional view of the partition plate of the present invention;
fig. 3 is a back view of the thermal insulation layer of the present invention.
In the figure: 1. a base; 2. a picosecond laser body; 3. an air outlet; 4. a support mechanism; 5. mounting grooves; 6. a partition plate; 7. connecting grooves; 8. a thermal insulation layer; 9. an indoor heat exchanger; 10. a first connecting pipe; 11. a compressor; 12. a second connecting pipe; 13. a diverter valve; 14. a third connecting pipe; 15. an outdoor heat exchanger; 16. a fourth connecting pipe; 17. heat exchange holes; 18. an axial flow fan.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, a cooling device for picosecond laser comprises a base 1, a picosecond laser body 2 is fixedly mounted on the top of the base 1, air outlet holes 3 are formed in the front surface of the picosecond laser body 2, a plurality of air outlet holes 3 are formed, a dust screen is fixedly connected inside the air outlet holes 3, supporting mechanisms 4 are fixedly mounted on the left side and the right side of the base 1, each supporting mechanism 4 comprises a connecting plate, a threaded rod and a cushion block, the connecting plates are fixedly mounted on the left side and the right side of the base 1, one end of the top of each connecting plate is in threaded connection with a threaded rod extending to the lower side of the corresponding connecting plate, the cushion blocks are fixedly mounted at the bottoms of the threaded rods, a mounting groove 5 is formed in the back surface of the base 1, a partition plate 6 is fixedly mounted inside the mounting groove 5, the partition plate 6 is in a T shape, a first connecting pipe 10 and a fourth connecting, the inside of the connecting groove 7 is filled with a heat insulating layer 8, the heat insulating layer 8 is made of heat insulating cotton, the heat insulating layer 8 is in an L shape, the inside of the indoor heat exchanger 9 is provided with a refrigerant, the front surface of the partition plate 6 is fixedly provided with the indoor heat exchanger 9, the right side of the indoor heat exchanger 9 is communicated with a first connecting pipe 10 with one end penetrating through the partition plate 6, one end of the first connecting pipe 10 far away from the indoor heat exchanger 9 is communicated with a compressor 11 fixedly connected with the inner cavity bottom wall of the mounting groove 5, the back surface of the compressor 11 is communicated with a second connecting pipe 12, one end of the second connecting pipe 12 far away from the compressor 11 is communicated with a reversing valve 13 fixedly connected with the inner cavity bottom wall of the mounting groove 5, the bottom of the reversing valve 13 is fixedly provided with a supporting rod, the reversing valve 13 is fixedly connected with the inner cavity bottom wall of the mounting groove 5 through the supporting rod, the, the front intercommunication of outdoor heat exchanger 15 has one end to run through baffle 6 and extend to the fourth connecting pipe 16 with indoor heat exchanger 9 intercommunication, and a plurality of heat transfer holes 17 that are located base 1 inside and communicate with picosecond laser instrument body 2 are seted up to the inner chamber roof of mounting groove 5, and the equal fixed mounting in inside of controlling two heat transfer holes 17 has axial fan 18.
In summary, according to the cooling device for the picosecond laser, when the picosecond laser body 2 starts to work and generates heat inside, the axial fans 18 on the left and right sides transmit the heated gas inside the picosecond laser body 2 into the mounting groove 5, the refrigerant inside the indoor heat exchanger 9 absorbs the heat inside the hot gas after contacting the hot gas and converts the heat into gas state from liquid state, the heat of the hot gas is absorbed by the refrigerant and then converted into cold gas, the cold gas is input into the picosecond laser body 2 from the heat exchange hole 17 in the middle, and finally the cold gas is discharged from the air outlet hole 3, so that the inside of the picosecond laser body 2 is rapidly cooled, the purpose of good cooling effect is achieved, meanwhile, the refrigerant converted into gas state sequentially passes through the compressor 11, the reversing valve 13 and the outdoor heat exchanger 15 and then is converted into liquid state again and input into the indoor heat exchanger 9, so that the indoor heat exchanger 9 can cool the picosecond laser, and insulating layer 8 can be isolated with the heat that outdoor heat exchanger 15 distributed out, prevents to cause the influence to the cooling of picosecond laser instrument body 2, has solved traditional picosecond laser instrument most and has all utilized inside fan to dispel the heat the cooling, leads to the poor problem of cooling effect.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a heat sink of picosecond laser instrument, includes base (1), its characterized in that: the utility model discloses a picosecond laser instrument, including base (1), gas outlet (3) have been seted up in the front of picosecond laser instrument body (2), the equal fixed mounting in the left and right sides of base (1) has supporting mechanism (4), mounting groove (5) have been seted up at the back of base (1), the inside fixed mounting of mounting groove (5) has baffle (6), the back of base (1) is seted up and is located mounting groove (5) top and one end extends to inside spread groove (7) of baffle (6), the inside packing of spread groove (7) has insulating layer (8), the positive fixed mounting of baffle (6) has indoor heat exchanger (9), the right side intercommunication of indoor heat exchanger (9) has first connecting pipe (10) that one end runs through baffle (6), the one end intercommunication that indoor heat exchanger (9) were kept away from in first connecting pipe (10) has the compressor(s) with mounting groove (5) inner chamber diapire fixed connection (5), diapire fixed connection 11) The back of the compressor (11) is communicated with a second connecting pipe (12), one end of the second connecting pipe (12) far away from the compressor (11) is communicated with a reversing valve (13) fixedly connected with the bottom wall of the inner cavity of the mounting groove (5), the back of the reversing valve (13) is communicated with a third connecting pipe (14), one end of the third connecting pipe (14) far away from the reversing valve (13) is communicated with an outdoor heat exchanger (15) fixedly connected with the top wall of the inner cavity of the mounting groove (5), the front surface of the outdoor heat exchanger (15) is communicated with a fourth connecting pipe (16) of which one end penetrates through the clapboard (6) and extends to be communicated with the indoor heat exchanger (9), the inner cavity roof of mounting groove (5) is seted up and is located base (1) inside and a plurality of heat transfer holes (17) with picosecond laser body (2) intercommunication, controls two the equal fixed mounting in inside of heat transfer hole (17) has axial fan (18).
2. The cooling device for picosecond laser according to claim 1, wherein: the number of the air outlet holes (3) is multiple, and the dust screen is fixedly connected inside the air outlet holes (3).
3. The cooling device for picosecond laser according to claim 1, wherein: the supporting mechanism (4) comprises a connecting plate, a threaded rod and a cushion block, the connecting plate is fixedly mounted on the left side and the right side of the base (1), one end of the top of the connecting plate is connected with the threaded rod, the threaded rod extends to the lower portion of the connecting plate, and the cushion block is fixedly mounted at the bottom of the threaded rod.
4. The cooling device for picosecond laser according to claim 1, wherein: the partition plate (6) is T-shaped, and the first connecting pipe (10) and the fourth connecting pipe (16) penetrate through the heat insulation layer (8).
5. The cooling device for picosecond laser according to claim 1, wherein: the heat insulation layer (8) is made of heat insulation cotton, the heat insulation layer (8) is L-shaped, and a refrigerant is arranged in the indoor heat exchanger (9).
6. The cooling device for picosecond laser according to claim 1, wherein: the bottom fixed mounting of switching-over valve (13) has the bracing piece, switching-over valve (13) are through bracing piece and the inner chamber diapire fixed connection of mounting groove (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022565120.XU CN213184953U (en) | 2020-11-09 | 2020-11-09 | Cooling device of picosecond laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022565120.XU CN213184953U (en) | 2020-11-09 | 2020-11-09 | Cooling device of picosecond laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213184953U true CN213184953U (en) | 2021-05-11 |
Family
ID=75781106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022565120.XU Expired - Fee Related CN213184953U (en) | 2020-11-09 | 2020-11-09 | Cooling device of picosecond laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213184953U (en) |
-
2020
- 2020-11-09 CN CN202022565120.XU patent/CN213184953U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210511 |