CN213137364U - Wafer cutting cooling water circulation equipment - Google Patents
Wafer cutting cooling water circulation equipment Download PDFInfo
- Publication number
- CN213137364U CN213137364U CN202021652767.XU CN202021652767U CN213137364U CN 213137364 U CN213137364 U CN 213137364U CN 202021652767 U CN202021652767 U CN 202021652767U CN 213137364 U CN213137364 U CN 213137364U
- Authority
- CN
- China
- Prior art keywords
- pipeline
- water
- wafer cutting
- temperature sensor
- evaporator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000498 cooling water Substances 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 107
- 230000001105 regulatory effect Effects 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims description 15
- 238000002360 preparation method Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 4
- 239000008400 supply water Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021652767.XU CN213137364U (en) | 2020-08-10 | 2020-08-10 | Wafer cutting cooling water circulation equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021652767.XU CN213137364U (en) | 2020-08-10 | 2020-08-10 | Wafer cutting cooling water circulation equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN213137364U true CN213137364U (en) | 2021-05-07 |
Family
ID=75737016
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202021652767.XU Expired - Fee Related CN213137364U (en) | 2020-08-10 | 2020-08-10 | Wafer cutting cooling water circulation equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN213137364U (en) |
-
2020
- 2020-08-10 CN CN202021652767.XU patent/CN213137364U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Wafer cutting cooling water circulating equipment Effective date of registration: 20220624 Granted publication date: 20210507 Pledgee: Weihai Branch of Shanghai Pudong Development Bank Co.,Ltd. Pledgor: WEIHAI SICICS MICROELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980008925 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230830 Granted publication date: 20210507 Pledgee: Weihai Branch of Shanghai Pudong Development Bank Co.,Ltd. Pledgor: WEIHAI SICICS MICROELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980008925 |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210507 |