CN213137364U - Wafer cutting cooling water circulation equipment - Google Patents
Wafer cutting cooling water circulation equipment Download PDFInfo
- Publication number
- CN213137364U CN213137364U CN202021652767.XU CN202021652767U CN213137364U CN 213137364 U CN213137364 U CN 213137364U CN 202021652767 U CN202021652767 U CN 202021652767U CN 213137364 U CN213137364 U CN 213137364U
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- Prior art keywords
- pipeline
- water
- wafer cutting
- temperature sensor
- evaporator
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- Expired - Fee Related
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- 239000000498 cooling water Substances 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 107
- 230000001105 regulatory effect Effects 0.000 claims abstract description 10
- 239000007788 liquid Substances 0.000 claims description 15
- 238000002360 preparation method Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 10
- 238000005057 refrigeration Methods 0.000 description 4
- 239000008400 supply water Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
The utility model discloses a wafer cutting cooling water circulation device, which comprises an evaporator water tank, a first pipeline, a second pipeline and a third pipeline, wherein the evaporator water tank is respectively communicated with the first pipeline, the second pipeline and the third pipeline; water is input from the first pipeline and enters the second pipeline after passing through the water tank of the evaporator; the second pipeline is communicated with the third pipeline in a circulating mode after passing through the main shaft of the wafer cutting machine, so that circulating cooling water for the main shaft of the wafer cutting machine is formed; the second pipeline is provided with an electric regulating valve and a water supply temperature sensor, the third pipeline is provided with a water return temperature sensor, and the electric regulating valve, the water supply temperature sensor and the water return temperature sensor are all electrically connected to a main controller. The utility model discloses can the temperature variation of accurate control wafer cutting machine main shaft about 1 ℃, guarantee cutting accuracy.
Description
Technical Field
The utility model relates to the field of mechanical equipment, concretely relates to wafer cutting cooling water circulating equipment.
Background
In the semiconductor packaging industry, wafer cutting is an important process, at present, most of domestic wafer cutting adopts a mechanical cutting mode, a single electronic circuit in a wafer is very tiny, so that the cutting precision of equipment is required to be very high, a large amount of heat is generated by cutting equipment during cutting, the influence on the cutting quality is large, and the cooling of the cutting equipment and the keeping of the cutting temperature are particularly important.
The wafer cutting cooling water circulation equipment is a machine which can achieve the refrigeration effect through vapor compression or absorption circulation, and is widely applied to refrigeration of industrial equipment.
Some cooling devices available on the market, mainly for users in the non-semiconductor industry, cannot meet the requirements of cutting devices.
The existing higher-grade cooling equipment has higher price, larger volume and overlarge output power, and the designed linkage port is not matched with the semiconductor cutting equipment.
The existing wafer cutting cooling water circulation equipment has the condition that the temperature change control precision of a cooling water cooling wafer cutting machine main shaft is not high.
SUMMERY OF THE UTILITY MODEL
In view of this, in order to solve the above technical problem, an object of the present invention is to provide a wafer cutting cooling water circulation device, which can control the temperature variation of the main shaft of the wafer cutting machine within a very small range, and ensure the precision requirement.
The adopted technical scheme is as follows:
a wafer cutting cooling water circulation apparatus, comprising:
the evaporator water tank is respectively communicated with a first pipeline, a second pipeline and a third pipeline; water is input from the first pipeline and enters the second pipeline after passing through the water tank of the evaporator;
the second pipeline is communicated with the third pipeline in a circulating mode after passing through the main shaft of the wafer cutting machine, so that circulating cooling water for the main shaft of the wafer cutting machine is formed;
the second pipeline is provided with an electric regulating valve and a water supply temperature sensor, the third pipeline is provided with a water return temperature sensor, and the electric regulating valve, the water supply temperature sensor and the water return temperature sensor are all electrically connected to a main controller.
Furthermore, a liquid level switch is arranged on the evaporator water tank, a water inlet electromagnetic valve is arranged on the first pipeline, and the liquid level switch and the water inlet electromagnetic valve are electrically connected to the main controller.
Further, a water supply flow meter is arranged on the second pipeline; and a water return flowmeter is arranged on the third pipeline, and the water supply flowmeter and the water return flowmeter are both electrically connected to the main controller.
Further, a cartridge filter is mounted on the second pipeline.
Further, the evaporator water tank is fixed on a movable trolley.
Furthermore, a centrifugal water pump is mounted on the second pipeline and electrically connected with the main controller.
The beneficial effects of the utility model reside in that:
because the second pipeline is provided with the electric control valve and the water supply temperature sensor, the third pipeline is provided with the water return temperature sensor, and the electric control valve, the water supply temperature sensor and the water return temperature sensor are all electrically connected to a main controller. Therefore, the main controller can judge the opening size of the electric regulating valve through monitoring the water temperature by the water supply temperature sensor and the water return temperature sensor, so that the temperature change of the main shaft of the wafer cutting machine can be accurately controlled to be about +/-1 ℃, and the cutting precision is ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic structural view of a wafer cutting cooling water circulation apparatus.
Fig. 2 is a schematic structural diagram of a main controller.
In the figure, 1 — a refrigeration compressor; 2-a condenser; 3-a heat dissipation fan; 4-drying the filter; 5-a thermostatic expansion valve; 6-evaporator water tank; 7-a liquid level switch; 8-water inlet electromagnetic valve; 9-water supply ball valve; 10-a water supply flow meter; 11-centrifugal water pump; 12-an electric regulating valve; 13-a cartridge filter; 14-supply water temperature sensor; 15-a wafer cutting motor spindle; 16-backwater temperature sensor; 17-a water return ball valve; 18-backwater flow meter; 19-a master controller; 20-a first conduit; 21-a second conduit; 22-a third conduit; 23-circulation line.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only preferred embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1, a wafer cutting cooling water circulation device comprises a cooling unit, an evaporator water tank 6 and a wafer cutting machine spindle.
And the cooling unit is used for circularly cooling water in the evaporator water tank 6 and comprises a circulating cooling pipeline, a refrigeration compressor 1, a condenser 2, a drying filter 4 and a thermal expansion valve 5 are sequentially installed on the circulating cooling pipeline in series, and a heat radiation fan 3 is arranged near the condenser 2. The circulating cooling pipe inside the evaporator water tank 6 is a refrigerator evaporator.
The evaporator water tank 6 is communicated with a first pipeline 20, a second pipeline 21 and a third pipeline 22 respectively; pure water is fed through a first pipe 20 and through the evaporator water tank 6, cooled by the chiller unit, and then fed into a second pipe 21.
And the second pipeline 21 is circularly communicated with the third pipeline 22 after passing through the main shaft of the wafer cutting machine, so that circulating cooling water for the main shaft of the wafer cutting machine is formed.
The cooling water circulation device for wafer cutting in the market at present comprises the cooling unit, the evaporator water tank 6 and the main shaft of the wafer cutting machine, which have the technical means, so that the detailed description is omitted in the present embodiment, and the present embodiment is improved on the basis of the above technical means, so as to improve and realize the service performance of the wafer cutting machine.
First embodiment of the improvement:
referring to fig. 1 and 2, the electric control valve 12 and the supply water temperature sensor 14 are installed in the second pipe 21, the return water temperature sensor 16 is installed in the third pipe 22, and the electric control valve 12, the supply water temperature sensor 14 and the return water temperature sensor 16 are electrically connected to a main controller 19.
Therefore, the main controller 19 can judge the opening size of the electric regulating valve 12 through monitoring the water temperature by the water supply temperature sensor 14 and the water return temperature sensor 16, so that the temperature change of the main shaft of the wafer cutting machine can be accurately controlled to be about +/-1 ℃, and the cutting precision is ensured.
The main controller 19 is generally a PLC controller, and is powered by a unified power supply unit.
Second embodiment of the improvement:
the evaporator water tank 6 is provided with a liquid level switch 7, the first pipeline 20 is provided with a water inlet electromagnetic valve 8, and the liquid level switch 7 and the water inlet electromagnetic valve 8 are both electrically connected on a main controller 19.
Thus, the main controller 19 controls the water inlet solenoid valve 8 to feed water through the liquid level switch 7, and prevents insufficient water level of the evaporator water tank 6 caused by water leakage of the water tank or water leakage of the second pipeline 21, which results in insufficient water supply.
Specifically, the main controller 19 judges whether the liquid level of the water in the evaporator water tank 6 reaches a set value through the liquid level switch 7, and when the liquid level is lower than a set liquid level value, the liquid level switch 7 is conducted, and the water inlet electromagnetic valve 8 is opened; when the water level value is higher than the set level value, the liquid level switch 7 is switched off, and the water inlet electromagnetic valve 8 is closed.
Third embodiment of the improvement:
a water supply flow meter 10 is installed on the second pipe 21; a water return flow meter 18 is arranged on the third pipeline 22, and the water supply flow meter 10 and the water return flow meter 18 are both electrically connected on the main controller 19.
In this way, the water supply flowmeter 10 and the water return flowmeter 18 detect the water flow in the second pipe 21 and the third pipe 22 together, and determine whether water leakage, water shortage, and the like occur, thereby preventing the water temperature change from being large, and protecting the main shaft of the wafer cutting machine.
Modified fourth embodiment:
a cartridge filter 13 is mounted on second duct 21.
Therefore, water filtered by the security filter 13 passes through the main shaft of the wafer cutting machine, so that the situation that fine particles in a pipeline block tiny gaps in the main shaft of the wafer cutting machine to cause resistance increase and influence on cutting precision can be prevented; and also prevents the second pipe 21 from being clogged with minute foreign substances.
Fifth embodiment of the improvement:
the evaporator water tank 6 is fixed to a movable carriage.
Therefore, the evaporator water tank 6 is convenient to move, can move on the field and improves the application field range of the evaporator water tank.
Modified sixth embodiment:
the centrifugal water pump 11 is installed on the second pipeline 21, and the centrifugal water pump 11 is electrically connected with the main controller 19.
In this way, under the control of the main controller 19, the centrifugal water pump 11 can cooperate with the electric control valve 12 on the second pipeline 21, and the temperature of the water flowing into the main shaft of the wafer cutting machine can be more accurately adjusted by the temperature judgment of the water supply temperature sensor 14 and the water return temperature sensor 16.
For the convenience of control, a water supply ball valve 9 is generally arranged on the second pipeline 21, and a water return ball valve 17 is arranged on the third pipeline 22.
The second to sixth modified embodiments may be combined with the first modified embodiment. Various modified embodiments may also be combined in other ways as appropriate to form further embodiments, including but not limited to all combinations.
It should be noted that, fig. 2 shows 1, 3, 7, 8, 10, 11, 12, 14, 15, 16, 18, which indicates the components or elements corresponding to the reference numerals "1, 3, 7, 8, 10, 11, 12, 14, 15, 16, 18", for example, 1-refrigerant compressor; 3-a heat dissipation fan; 7-a liquid level switch; 8-water inlet electromagnetic valve; 10-a water supply flow meter; 11-centrifugal water pump; 12-an electric regulating valve; 14-supply water temperature sensor; 15-a wafer cutting motor spindle; 16-backwater temperature sensor; the 18-backwater flow meters can be electrically connected with the main controller, so that the main controller can be comprehensively or integrally controlled. And not to indicate that the master controller is given various numbers.
The above detailed description is only for the purpose of illustrating the practical embodiments of the present invention, and they are not intended to limit the scope of the present invention, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A wafer cutting cooling water circulation apparatus, comprising:
the evaporator water tank is respectively communicated with a first pipeline, a second pipeline and a third pipeline; water is input from the first pipeline and enters the second pipeline after passing through the water tank of the evaporator;
the second pipeline is communicated with the third pipeline in a circulating mode after passing through the main shaft of the wafer cutting machine, so that circulating cooling water for the main shaft of the wafer cutting machine is formed;
it is characterized in that the preparation method is characterized in that,
the second pipeline is provided with an electric regulating valve and a water supply temperature sensor, the third pipeline is provided with a water return temperature sensor, and the electric regulating valve, the water supply temperature sensor and the water return temperature sensor are all electrically connected to a main controller.
2. The wafer cutting cooling water circulation device as claimed in claim 1, wherein a liquid level switch is installed on the evaporator water tank, a water inlet solenoid valve is installed on the first pipeline, and both the liquid level switch and the water inlet solenoid valve are electrically connected to the main controller.
3. The wafer cutting cooling water circulation apparatus according to claim 1, wherein a water supply flow meter is installed on the second pipe; and a water return flowmeter is arranged on the third pipeline, and the water supply flowmeter and the water return flowmeter are both electrically connected to the main controller.
4. The wafer cutting cooling water circulation apparatus as claimed in claim 1, wherein a cartridge filter is installed on the second pipe.
5. The wafer cutting cooling water circulation apparatus as claimed in claim 1, wherein the evaporator water tank is fixed to a movable carriage.
6. The wafer cutting cooling water circulation device as claimed in claim 1, wherein a centrifugal water pump is mounted on the second pipe, and the centrifugal water pump is electrically connected with the main controller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021652767.XU CN213137364U (en) | 2020-08-10 | 2020-08-10 | Wafer cutting cooling water circulation equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021652767.XU CN213137364U (en) | 2020-08-10 | 2020-08-10 | Wafer cutting cooling water circulation equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213137364U true CN213137364U (en) | 2021-05-07 |
Family
ID=75737016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021652767.XU Expired - Fee Related CN213137364U (en) | 2020-08-10 | 2020-08-10 | Wafer cutting cooling water circulation equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213137364U (en) |
-
2020
- 2020-08-10 CN CN202021652767.XU patent/CN213137364U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Wafer cutting cooling water circulating equipment Effective date of registration: 20220624 Granted publication date: 20210507 Pledgee: Weihai Branch of Shanghai Pudong Development Bank Co.,Ltd. Pledgor: WEIHAI SICICS MICROELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980008925 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230830 Granted publication date: 20210507 Pledgee: Weihai Branch of Shanghai Pudong Development Bank Co.,Ltd. Pledgor: WEIHAI SICICS MICROELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980008925 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210507 |