CN213136829U

CN213136829U - Production of semiconductor ceramic capacitor chip is with cutting equipment

Info

Publication number: CN213136829U
Application number: CN202021334609.XU
Authority: CN
Inventors: 叶华
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2021-05-07
Anticipated expiration: 2030-07-09

Abstract

The utility model discloses a semiconductor ceramic capacitor chip production is with cutting equipment, the on-line screen storage device comprises a base, the top fixed mounting of base has the roof, the top of base is rotated and is installed and place the board, and places the bottom that the board is located the roof, fixed mounting has and places the brace table of board mutually supporting on the roof of base, and the brace table is located the one end of placing the board, fixed mounting has the hydraulic press on the roof of roof, the output fixed mounting of hydraulic press has the piston rod, and the bottom of piston rod runs through the roof and extends to the downside of roof, the bottom fixed mounting of piston rod has the mounting panel. The utility model discloses can drive the one end tilt up of placing the board after well bisecting with when dividing cutter rebound, cut good chip this moment and can along the roof landing of placing the board slope to the material case that connects of placing board one end in, simple structure and chip are difficult for dropping to the base from placing the board, reasonable in design, practical function is good.

Description

Production of semiconductor ceramic capacitor chip is with cutting equipment

Technical Field

The utility model relates to a chip processing technology field especially relates to a semiconductor ceramic capacitor chip production is with cutting equipment.

Background

The chip is called as an integrated circuit, a circuit (mainly comprising semiconductor equipment and also comprising a passive component and the like) is miniaturized in electronics and is often manufactured on the surface of a semiconductor wafer, a semiconductor ceramic capacitor chip is one type of the chip, a cutting device is required in the production process of the chip, the chips cut by the existing cutting device need to be manually collected one by one, the labor intensity is high, the collection efficiency is low, and the labor cost is high, so that the improvement is required.

Through the retrieval, chinese patent No. CN210722962U discloses a device is cut with production of semiconductor ceramic capacitor chip, the on-line screen storage device comprises a base, the rear side fixedly connected with L shape support frame at base top, the top of L shape support frame inner chamber is provided with cuts the mechanism body, the left side at base top is provided with the placement machine and constructs, the inside cavity that has seted up of base, the left side fixedly connected with motor of cavity inner chamber, the output shaft transmission of motor is connected with the threaded rod, the one end that the motor was kept away from to the threaded rod passes through bearing and base swing joint, the surperficial threaded connection of threaded rod has the thread bush.

The existing slitting device for producing the semiconductor ceramic capacitor chip has the following defects: use motor drive to promote the brush horizontal direction and remove and collect placing the bench chip of cutting, not only the structure is complicated, and the chip drops to the base on from the both sides of placing the platform easily when collecting moreover, and practical function is relatively poor, because the top of placing the platform does not have the fixing device who mutually supports with the chip, and the chip takes place offset easily and leads to the chip to cut the effect relatively poor when consequently cutting.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the unreasonable problem of device design is cut with cutting in the production of semiconductor ceramic capacitor chip among the prior art, and the production of semiconductor ceramic capacitor chip that provides is with cutting equipment.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a slitting device for semiconductor ceramic capacitor chip production comprises a base, wherein a top plate is fixedly mounted at the top end of the base, a placing plate is rotatably mounted at the top end of the base and is positioned at the bottom end of the top plate, a supporting table matched with the placing plate is fixedly mounted on the top wall of the base and is positioned at one end of the placing plate, a hydraulic machine is fixedly mounted on the top wall of the top plate, a piston rod is fixedly mounted at the output end of the hydraulic machine, the bottom end of the piston rod penetrates through the top plate and extends to the lower side of the top plate, a mounting plate is fixedly mounted at the bottom end of the piston rod, chips are uniformly placed on the top wall of the placing plate close to one end of the supporting table, a material receiving box is placed at one end of the base and the placing plate, a plurality of slitting knives matched with the chips are uniformly mounted on the bottom wall of, the one end fixed mounting that the mounting panel is close to a supporting bench has the dead lever, the bottom activity of dead lever is inserted and is equipped with the second movable rod, and the bottom of second movable rod rotates and installs the one end of placing the board.

Preferably, fixing device includes the profile modeling clamp plate of mutually supporting with the chip, set up a plurality ofly on the profile modeling clamp plate and divide the cutter through-hole of mutually supporting, the activity is inserted on the diapire of mounting panel and is equipped with a plurality of first movable rods, and the equal fixed mounting in bottom of first movable rod is on the roof of profile modeling clamp plate, every all around being equipped with the spring on the lateral wall of first movable rod, and the both ends difference fixed mounting of spring is on mounting panel and profile modeling clamp plate.

Preferably, even fixed mounting has the female pole of a plurality of telescopic links on the roof of roof, every the equal activity of the bottom of the female pole of telescopic link is inserted and is equipped with the sub-pole of telescopic link, and the bottom of the sub-pole of telescopic link all runs through roof and fixed mounting on the roof of mounting panel.

Preferably, the top end of the second movable rod is inserted into the bottom wall of the fixed rod, a movable groove matched with the second movable rod is formed in the bottom wall of the fixed rod, a limiting block is fixedly mounted at the top end of the second movable rod, and a limiting groove matched with the limiting block is formed in the inner side wall of the movable groove.

Preferably, the top walls of the two sides of the placing plate are fixedly provided with baffle plates matched with the chips.

Compared with the prior art, the utility model discloses there is following beneficial effect:

1. after cutting, the mounting plate and the cutting knife move upwards to drive one end of the placing plate to incline upwards, and the cut chips slide into a material receiving box at one end of the placing plate along the inclined top wall of the placing plate, so that the structure is simple, the chips are not easy to fall onto a base from the placing plate, the design is reasonable, and the practical effect is good;

2. the bottom movable mounting of mounting panel has the fixing device who mutually supports with the chip, and the profile modeling clamp plate can compress tightly the chip earlier when dividing the cutter to the chip cuts to chip emergence offset when can preventing to cut has improved the effect of cutting of chip.

Drawings

Fig. 1 is a front structural cross-sectional view of a slitting apparatus for producing semiconductor ceramic capacitor chips according to the present invention;

fig. 2 is a schematic front structural view of a partial structure of a slitting apparatus for producing semiconductor ceramic capacitor chips according to the present invention;

fig. 3 is the utility model provides a production of semiconductor ceramic capacitor chip is with enlargeing of cutting equipment's a part structure.

In the figure: 1 base, 2 roof, 3 place board, 4 brace tables, 5 hydraulic presses, 6 piston rods, 7 mounting panels, 8 minute cutters, 9 profile modeling clamp plates, 10 first movable rods, 11 springs, 12 telescopic link female poles, 13 telescopic link sub-poles, 14 dead levers, 15 second movable rods, 16 stopper, 17 spacing grooves, 18 baffles.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, a slitting device for semiconductor ceramic capacitor chip production comprises a base 1, a top plate 2 is fixedly installed at the top end of the base 1, a placing plate 3 is rotatably installed at the top end of the base 1, the placing plate 3 is located at the bottom end of the top plate 2, a supporting table 4 matched with the placing plate 3 is fixedly installed on the top wall of the base 1, the supporting table 4 is located at one end of the placing plate 3, a hydraulic press 5 is fixedly installed on the top wall of the top plate 2, a piston rod 6 is fixedly installed at the output end of the hydraulic press 5, the bottom end of the piston rod 6 penetrates through the top plate 2 and extends to the lower side of the top plate 2, an installation plate 7 is fixedly installed at the bottom end of the piston rod 6, chips are uniformly placed on the top wall of the placing plate 3 close to one end of the supporting table 4, a material receiving box is placed at one, the bottom movable mounting of mounting panel 7 has the fixing device who mutually supports with the chip, fixing device includes the profile modeling clamp plate 9 of mutually supporting with the chip, set up a plurality ofly on the profile modeling clamp plate 9 and divide cutter 8 through-hole of mutually supporting, the activity is inserted on the diapire of mounting panel 7 and is equipped with a plurality of first movable rods 10, and the equal fixed mounting in bottom of first movable rod 10 is on the roof of profile modeling clamp plate 9, all around being equipped with spring 11 on every first movable rod 10's the lateral wall, and spring 11's both ends difference fixed mounting is on mounting panel 7 and profile modeling clamp plate 9, hydraulic press 5 drive piston rod 6 can drive mounting panel 7 and branch cutter 8 reciprocate, profile modeling clamp plate 9 can compress tightly the chip earlier when dividing cutter 8 to cutting the chip downwards, thereby can prevent that the chip from taking place the offset when cutting, the effect of cutting of chip has been.

Even fixed mounting has the female pole 12 of a plurality of telescopic links on the roof of roof 2, and the equal activity of the bottom of the female pole 12 of every telescopic link is inserted and is equipped with the sub-pole 13 of telescopic link, and the bottom of the sub-pole 13 of telescopic link all runs through roof 2 and fixed mounting on the roof of mounting panel 7, has both promoted the stability of mounting panel 7 installation, can prevent again that mounting panel 7 from reciprocating the time emergence skew.

Mounting panel 7 is close to the one end fixed mounting of brace table 4 has dead lever 14, the bottom activity of dead lever 14 is inserted and is equipped with second movable rod 15, and the bottom of second movable rod 15 is rotated and is installed in the one end of placing board 3, after cutting mounting panel 7 can drive the one end tilt up of placing board 3 with when dividing cutter 8 to move up, the top wall landing that the board 3 slopes can be along placing to the workbin that connects of placing board 3 one end to this moment to cut good chip, simple structure and chip are difficult for dropping to base 1 from placing board 3.

The top of second movable rod 15 is inserted and is established on the diapire of dead lever 14, has seted up on the diapire of dead lever 14 and has mutually supported the activity groove with second movable rod 15, and the top fixed mounting of second movable rod 15 has stopper 16, has seted up on the inside wall in activity groove with stopper 16 spacing groove 17 of mutually supporting, can prevent that second movable rod 15 from breaking away from dead lever 14.

All fixed mounting has the baffle 18 of mutually supporting with the chip on placing the roof of board 3 both sides, can prevent that the chip from droing from placing the both sides of board 3.

The utility model discloses in, hydraulic press 5 actuating piston rod 6 can drive mounting panel 7 and divide cutter 8 to reciprocate, profile modeling clamp plate 9 can compress tightly the chip earlier when dividing cutter 8 to cut the chip downwards, thereby can prevent that the chip from taking place the offset when cutting, can drive the one end tilt up of placing board 3 when cutting mounting panel 7 and branch cutter 8 rebound after the end, the chip of cutting this moment can be along placing the roof landing of board 3 slope to the workbin that connects of placing board 3 one end in, simple structure and chip are difficult for dropping to base 1 from placing board 3.

Further, unless otherwise specifically stated or limited, the above-described fixed connection is to be understood in a broad sense, and may be, for example, welded, glued, or integrally formed as is conventional in the art.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a production of semiconductor ceramic capacitor chip is with cutting equipment, includes base (1), its characterized in that: the top end of the base (1) is fixedly provided with a top plate (2), the top end of the base (1) is rotatably provided with a placing plate (3), the placing plate (3) is positioned at the bottom end of the top plate (2), the top wall of the base (1) is fixedly provided with a supporting table (4) which is matched with the placing plate (3), the supporting table (4) is positioned at one end of the placing plate (3), the top wall of the top plate (2) is fixedly provided with a hydraulic machine (5), the output end of the hydraulic machine (5) is fixedly provided with a piston rod (6), the bottom end of the piston rod (6) penetrates through the top plate (2) and extends to the lower side of the top plate (2), the bottom end of the piston rod (6) is fixedly provided with a mounting plate (7), the top wall of the placing plate (3) close to one end of the supporting table (4) is uniformly provided with chips, one ends of the, evenly install a plurality ofly on the diapire of mounting panel (7) and chip branch cutter (8) of mutually supporting, the bottom movable mounting of mounting panel (7) has the fixing device who mutually supports with the chip, the one end fixed mounting that mounting panel (7) are close to brace table (4) has dead lever (14), the bottom activity of dead lever (14) is inserted and is equipped with second movable rod (15), and the bottom of second movable rod (15) rotates and install the one end of placing board (3).

2. The slitting equipment for producing the semiconductor ceramic capacitor chip as claimed in claim 1, wherein: fixing device includes profile modeling clamp plate (9) of mutually supporting with the chip, set up a plurality ofly on profile modeling clamp plate (9) and divide cutter (8) through-hole of mutually supporting, the activity is inserted on the diapire of mounting panel (7) and is equipped with a plurality of first movable rods (10), and the equal fixed mounting in bottom of first movable rod (10) is on the roof of profile modeling clamp plate (9), every all around being equipped with spring (11) on the lateral wall of first movable rod (10), and the both ends difference fixed mounting of spring (11) is on mounting panel (7) and profile modeling clamp plate (9).

3. The slitting equipment for producing the semiconductor ceramic capacitor chip as claimed in claim 1, wherein: the roof of roof (2) is gone up even fixed mounting has female pole (12) of a plurality of telescopic links, every the bottom of the female pole (12) of telescopic link is all movable to be inserted and is equipped with the sub-pole (13) of telescopic link, and the bottom of the sub-pole (13) of telescopic link all runs through roof (2) and fixed mounting on the roof of mounting panel (7).

4. The slitting equipment for producing the semiconductor ceramic capacitor chip as claimed in claim 1, wherein: the top of second movable rod (15) is inserted and is established on the diapire of dead lever (14), seted up on the diapire of dead lever (14) and mutually supported movable groove with second movable rod (15), the top fixed mounting of second movable rod (15) has stopper (16), set up on the inside wall in movable groove and mutually supported spacing groove (17) with stopper (16).

5. The slitting equipment for producing the semiconductor ceramic capacitor chip as claimed in claim 1, wherein: and the top walls at the two sides of the placing plate (3) are fixedly provided with baffle plates (18) matched with the chips.