CN213126611U - High-temperature gas seepage pyrolysis circuit board - Google Patents

High-temperature gas seepage pyrolysis circuit board Download PDF

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Publication number
CN213126611U
CN213126611U CN202022115705.1U CN202022115705U CN213126611U CN 213126611 U CN213126611 U CN 213126611U CN 202022115705 U CN202022115705 U CN 202022115705U CN 213126611 U CN213126611 U CN 213126611U
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China
Prior art keywords
circuit board
fixedly connected
wall
protective sleeve
right surface
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CN202022115705.1U
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Chinese (zh)
Inventor
范腾
夏友印
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Shenzhen Tengwei Lighting Accessories Co ltd
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Shenzhen Tengwei Lighting Accessories Co ltd
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Abstract

The utility model relates to the technical field of circuit boards, and discloses a high-temperature gas seepage pyrolysis circuit board, which comprises a circuit board structure, a protective sleeve structure and a protective structure, wherein the circuit board structure comprises a circuit board, the right surface of the circuit board is fixedly connected with a switch, the front end of the right surface of the circuit board is fixedly connected with a first buffer cotton, the rear end of the right surface of the circuit board is fixedly connected with a second buffer cotton, the lower end of the right surface of the circuit board is provided with a strip-shaped groove, the left surface of the inner wall of the strip-shaped groove is fixedly connected with the protective sleeve structure, the protective sleeve structure comprises a protective sleeve, the right surface of the protective sleeve is flush with the right surface of the circuit board, when in use, an electric wire with a rubber sleeve is inserted into an insert column, the rubber sleeve can extrude an elastic plate in the inserting process, the rear end of the elastic plate, the service life of the device is longer.

Description

High-temperature gas seepage pyrolysis circuit board
Technical Field
The utility model relates to a circuit board technical field specifically is high-temperature gas seepage flow pyrolysis circuit board.
Background
The circuit board has the name: the circuit board makes the circuit miniaturized, visualized, plays important role to the batch production of fixed circuit and the optimization of electrical apparatus overall arrangement. The FPC board is also called a flexible circuit board, and is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and has the characteristics of high wiring density, light weight, thin thickness and good bending property. The birth and development of FPC and PCB have promoted a new product of soft and hard combined board. Therefore, the flexible-rigid combined board, namely the flexible circuit board and the rigid circuit board, are combined together according to the relevant process requirements through processes such as pressing and the like to form the circuit board with the FPC characteristic and the PCB characteristic, the circuit board is the most active industry in the modern electronic component industry, the industry growth speed of the circuit board is generally higher than that of the electronic component industry by about 3 percent, along with the high-speed development of the electronic technology, the requirements on electronic products are higher and higher, the functions are more and more, the integration level of chips is higher and higher, and the design requirements on the circuit board are higher and higher correspondingly, and the circuit board is a product of the electronic technology developing towards high speed, multiple functions, large capacity and small volume.
When the existing circuit board is used, the electric wire with the rubber sleeve is required to be inserted into the circuit board, the electric wire can be frequently inserted and pulled out, elements at a socket are easily broken, long time is required for replacement, labor force is wasted, and working efficiency is influenced.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
The not enough to prior art, the utility model provides a high temperature gas seepage flow pyrolysis circuit board possesses the protectiveness height, and advantages such as long service life have solved the problem of proposing in the above-mentioned background art.
(II) technical scheme
In order to achieve the above object, the utility model provides a following technical scheme: the high-temperature gas seepage pyrolysis circuit board comprises a circuit board structure, a protective sleeve structure and a protective structure, wherein the circuit board structure comprises a circuit board, the right surface of the circuit board is fixedly connected with a switch, the front end of the right surface of the circuit board is fixedly connected with a first buffer cotton, the rear end of the right surface of the circuit board is fixedly connected with a second buffer cotton, and the lower end of the right surface of the circuit board is provided with a strip-shaped groove;
the left surface of the inner wall of the strip-shaped groove is fixedly connected with the protective sleeve structure.
The protective sleeve structure comprises a protective sleeve, the protective sleeve is fixedly connected to the left surface of the inner wall of the strip-shaped groove, a square groove is formed in the right surface of the protective sleeve, the inner wall of the square groove is fixedly connected with a rubber pad, the left surface of the inner wall of the square groove is fixedly connected with an insert column, and a clamping groove is formed in the front surface of the inner wall of the square groove;
the front surface of the inner wall of the clamping groove is fixedly connected with the protection structure.
The protection architecture includes the elastic plate, elastic plate fixed connection is on draw-in groove inner wall front surface, elastic plate left surface front end fixedly connected with fixed plate, fixed plate rear surface fixedly connected with spring.
Preferably, the rear surface of the inner wall of the square groove is symmetrically provided with a structure the same as the front surface of the inner wall of the square groove.
Preferably, an arc-shaped groove is formed in the left surface of the elastic plate, and one end, far away from the fixed plate, of the spring is fixedly connected to the rear surface of the inner wall of the arc-shaped groove.
Preferably, the right surface of the protective sleeve is flush with the right surface of the circuit board.
(III) advantageous effects
Compared with the prior art, the utility model provides a high temperature gas seepage flow pyrolysis circuit board possesses following beneficial effect:
1. when the circuit board is used, when the circuit board needs to be used, an electric wire with a rubber sleeve is inserted into the plug column, the rubber sleeve is attached to the inner wall of the rubber pad in the process and is buffered for the first time, and the rubber sleeve is limited in the process and can only be inserted in the vertical direction, so that the device cannot shake the plug column to damage the plug column in use, the rubber sleeve can extrude the elastic plate in the process of inward insertion, the elastic plate is stressed by a force from right to left, the elastic plate is deformed under the action of the force, the rear end of the elastic plate moves leftwards to compress the spring to deform leftwards, after the circuit board is used, the electric wire is pulled out, the spring resets to push the elastic plate rightwards, the two elastic plates block the square groove, the plug column is protected, and the device has higher protection performance on internal elements, the service life of the device is longer.
2. When the circuit board is used, when the circuit board needs to be used, an electric wire with a rubber sleeve is inserted into the plug column, the rubber sleeve is attached to the inner wall of the rubber pad in the process and is buffered for the first time, and the rubber sleeve is limited in the process and can only be inserted in the vertical direction, so that the device cannot shake the plug column to damage the plug column in use, the rubber sleeve can extrude the elastic plate in the process of inward insertion, the elastic plate is subjected to a force from right to left, the elastic plate is deformed under the action of the force, the rear end of the elastic plate moves leftwards to compress the spring to deform leftwards, after the circuit board is used, the electric wire is pulled out, the spring resets to push the elastic plate rightwards, the two elastic plates block the square groove, the plug column is protected, and the structure of the device is simpler, and the circuit elements are not exposed to the outside when the circuit is used, so that the circuit is safer for users.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of the connection structure of the protective sheath of the present invention;
fig. 3 is a schematic view of the connection structure of the elastic plate of the present invention.
In the figure: 1 circuit board structure, 101 circuit board, 102 switch, 103 buffer cotton I, 104 buffer cotton II, 105 strip-shaped groove, 2 protective sleeve structure, 201 protective sleeve, 202 square groove, 203 rubber pad, 204 inserted column, 205 clamping groove, 3 protective structure, 301 elastic plate, 302 fixed plate and 303 spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, the high-temperature gas seepage pyrolysis circuit board comprises a circuit board structure 1, a protective sleeve structure 2 and a protective structure 3, wherein the circuit board structure 1 comprises a circuit board 101, a switch 102 is fixedly connected to the right surface of the circuit board 101, a first buffer cotton 103 is fixedly connected to the front end of the right surface of the circuit board 101, a second buffer cotton 104 is fixedly connected to the rear end of the right surface of the circuit board 101, and a strip-shaped groove 105 is formed in the lower end of the right surface of the circuit board 101;
the left surface of the inner wall of the strip-shaped groove 105 is fixedly connected with the protective sleeve structure 2.
The protective sleeve structure 2 comprises a protective sleeve 201, the right surface of the protective sleeve 201 is flush with the right surface of the circuit board 101, the protective sleeve 201 is fixedly connected to the left surface of the inner wall of the strip-shaped groove 105, the right surface of the protective sleeve 201 is provided with a square groove 202, the rear surface of the inner wall of the square groove 202 is symmetrically provided with a structure the same as the front surface of the inner wall of the square groove 202, the inner wall of the square groove 202 is fixedly connected with a rubber pad 203, the left surface of the inner wall of the square groove 202 is fixedly connected with an insert;
the front surface of the inner wall of the slot 205 is fixedly connected with the protection structure 3.
The protection structure 3 comprises an elastic plate 301, the elastic plate 301 is fixedly connected to the front surface of the inner wall of the clamping groove 205, the front end of the left surface of the elastic plate 301 is fixedly connected with a fixing plate 302, the rear surface of the fixing plate 302 is fixedly connected with a spring 303, the left surface of the elastic plate 301 is provided with an arc-shaped groove, one end of the spring 303 far away from the fixing plate 302 is fixedly connected to the rear surface of the inner wall of the arc-shaped groove, when the circuit board 101 is used, an electric wire with a rubber sleeve is inserted into the plug post 204, the rubber sleeve is attached to the inner wall of the rubber pad 203 in the process of buffering for the first time, and the rubber sleeve is limited in the process so that the rubber sleeve can be inserted only in the vertical direction, the device can not shake the plug post 204 during use to damage the plug post 204, the rubber sleeve can extrude the elastic plate 301 in the inward inserting process, at the moment, the elastic, make elastic plate 301 take place deformation under this effect of force, elastic plate 301 rear end removes compression spring 303 leftwards and takes place deformation, and after using circuit board 101 to accomplish, extracts the electric wire, and spring 303 resets and promotes elastic plate 301 rightwards this moment, and two elastic plates 301 block up square groove 202, play the effect of protection to inserting post 204 for the device is higher to the protectiveness of inner member, makes it longer to be used for.
When the device is used, when the circuit board 101 needs to be used, an electric wire with a rubber sleeve is inserted into the plug column 204, the rubber sleeve is attached to the inner wall of the rubber pad 203 in the process and is buffered for the first time, and the rubber sleeve is limited in the process and can only be inserted in the vertical direction, so that the device cannot shake the plug column 204 to damage the plug column 204 in the use process, the rubber sleeve extrudes the elastic plate 301 in the inward insertion process, the elastic plate 301 is subjected to a force from right to left, the elastic plate 301 deforms under the action of the force, the rear end of the elastic plate 301 moves leftwards to compress the spring 303 to deform leftwards, after the circuit board 101 is used, the electric wire is pulled out, the spring 303 resets to push the elastic plate 301 rightwards, the two elastic plates 301 block the square groove 202, the plug column 204 is protected, and the device has higher protection effect on internal elements, the service life of the device is longer.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. High-temperature gas seepage pyrolysis circuit board, including circuit board structure (1), protective sheath structure (2) and protective sheath structure (3), circuit board structure (1) is including circuit board (101), its characterized in that: a switch (102) is fixedly connected to the right surface of the circuit board (101), a first buffer cotton (103) is fixedly connected to the front end of the right surface of the circuit board (101), a second buffer cotton (104) is fixedly connected to the rear end of the right surface of the circuit board (101), and a strip-shaped groove (105) is formed in the lower end of the right surface of the circuit board (101);
the left surface of the inner wall of the strip-shaped groove (105) is fixedly connected with the protective sleeve structure (2).
2. The high temperature gas infiltration pyrolysis circuit board of claim 1, characterized by: the protective sleeve structure (2) comprises a protective sleeve (201), the protective sleeve (201) is fixedly connected to the left surface of the inner wall of the strip-shaped groove (105), a square groove (202) is formed in the right surface of the protective sleeve (201), a rubber pad (203) is fixedly connected to the inner wall of the square groove (202), an insert column (204) is fixedly connected to the left surface of the inner wall of the square groove (202), and a clamping groove (205) is formed in the front surface of the inner wall of the square groove (202);
the front surface of the inner wall of the clamping groove (205) is fixedly connected with the protection structure (3).
3. The high temperature gas infiltration pyrolysis circuit board of claim 2, characterized by: protection architecture (3) include elastic plate (301), elastic plate (301) fixed connection is on draw-in groove (205) inner wall front surface, elastic plate (301) left surface front end fixedly connected with fixed plate (302), fixed plate (302) rear surface fixedly connected with spring (303).
4. The high temperature gas infiltration pyrolysis circuit board of claim 2, characterized by: the rear surface of the inner wall of the square groove (202) is symmetrically provided with a structure the same as the front surface of the inner wall of the square groove (202).
5. The high temperature gas infiltration pyrolysis circuit board of claim 3, characterized by: the left surface of the elastic plate (301) is provided with an arc-shaped groove, and one end, far away from the fixed plate (302), of the spring (303) is fixedly connected to the rear surface of the inner wall of the arc-shaped groove.
6. The high temperature gas infiltration pyrolysis circuit board of claim 2, characterized by: the right surface of the protective sleeve (201) is flush with the right surface of the circuit board (101).
CN202022115705.1U 2020-09-24 2020-09-24 High-temperature gas seepage pyrolysis circuit board Active CN213126611U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022115705.1U CN213126611U (en) 2020-09-24 2020-09-24 High-temperature gas seepage pyrolysis circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022115705.1U CN213126611U (en) 2020-09-24 2020-09-24 High-temperature gas seepage pyrolysis circuit board

Publications (1)

Publication Number Publication Date
CN213126611U true CN213126611U (en) 2021-05-04

Family

ID=75664672

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022115705.1U Active CN213126611U (en) 2020-09-24 2020-09-24 High-temperature gas seepage pyrolysis circuit board

Country Status (1)

Country Link
CN (1) CN213126611U (en)

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