CN213124495U - Current collecting device - Google Patents

Current collecting device Download PDF

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CN213124495U
CN213124495U CN202021851663.1U CN202021851663U CN213124495U CN 213124495 U CN213124495 U CN 213124495U CN 202021851663 U CN202021851663 U CN 202021851663U CN 213124495 U CN213124495 U CN 213124495U
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heat
adhesive layer
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臧世伟
刘文卿
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Chongqing Jinmei New Material Technology Co Ltd
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Chongqing Jinmei New Material Technology Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
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    • Y02E60/10Energy storage using batteries

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Abstract

The utility model relates to a lithium cell technical field, concretely relates to electric current collects device, it includes base film, graphite alkene layer, epoxy heat-conducting adhesive layer, thin layer and metal level, graphite alkene layer locates two upper and lower surfaces of base film, graphite alkene layer surface is located to epoxy heat-conducting adhesive layer, epoxy heat-conducting adhesive layer surface is located to the thin layer, thin layer surface is located to the metal level. The utility model discloses a device is compiled to electric current has high heat conductivility, and when being applied to in the battery, the difficult condition that appears burning or explosion.

Description

Current collecting device
Technical Field
The utility model relates to a lithium cell technical field, concretely relates to electric current collects device.
Background
The current collecting device, as the name implies, is a structure or a part for collecting current, and is widely used in various electronic devices because of its strong current collecting capability. Especially in lithium ion batteries.
In order to better collect the current, therefore, there is a certain requirement for the conductivity of the current collecting device, in nature, the conductivity of the metal is gradually decreased according to the silver, copper, gold, aluminum, tungsten, nickel and iron, because silver is more noble and rare, the current collecting device is generally made of metal copper and aluminum in practice, however, although the current collecting device is made of copper foil or aluminum foil made of pure metal copper or aluminum, which has the advantages, the mass is relatively high, so that the active material coated on the unit volume is relatively less, and the energy density is low, therefore, people gradually turn to use a lighter copper-plated or aluminum-plated film to replace the traditional copper foil and aluminum foil, and the current collecting capability of the current collecting device is greatly improved by adopting the way, when the current collecting device is used in a lithium ion battery, the energy density of the lithium ion battery is improved, but, compared with the traditional copper foil or aluminum foil, the heat conducting performance of the current collecting device obtained in the mode is reduced, and particularly when the internal temperature of the lithium ion battery is increased due to the improper use of overcharging and the like, the heat of the current collecting device obtained in the mode cannot be rapidly transmitted out, so that the lithium ion battery is easily burnt and even explodes.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a current collection device, which has high heat-conducting property and is not easy to burn or explode when being applied to a battery.
The utility model provides a technical scheme that its technical problem adopted is:
the utility model provides a current collects device, its includes base film, graphite alkene layer, epoxy heat-conducting adhesive layer, thin film layer and metal level, graphite alkene layer locates two upper and lower surfaces of base film, graphite alkene layer surface is located to epoxy heat-conducting adhesive layer, epoxy heat-conducting adhesive layer surface is located to the thin film layer, thin film layer surface is located to the metal level.
The utility model discloses a surface sets up the graphite alkene layer that has good heat conductivility and conductivity respectively about the base film, sets up the epoxy heat-conducting glue film that has high stretch-proofing performance and heat conductivility on graphite alkene layer surface again, sets up thin layer and metal level on epoxy heat-conducting glue film surface at last, makes the utility model discloses a current collects device heat conductivity and stretch-proofing performance better, not only is difficult for breaking, and because heat conductivility is better for the battery obtains faster transmission and distributes away owing to the battery produced heat that generates heat unusually that reasons such as overcharging lead to, thereby prevents occurence of failure such as battery explosion.
Wherein, the basal membrane is a PI membrane or a PET membrane.
Wherein the thickness of the base film layer is 1-1.5 μm.
Wherein the thickness of the graphene layer is 0.2-0.3 μm.
The epoxy resin heat-conducting adhesive layer comprises an epoxy resin adhesive layer and silicon dioxide heat-conducting particles, silicon carbide heat-conducting particles and aluminum nitride heat-conducting particles which are arranged in the epoxy resin adhesive layer.
Because silica heat conduction particle, carborundum heat conduction particle and aluminium nitride heat conduction particle all have good heat conductivility, set up it with the epoxy adhesive layer that has high stretch-proofing performance, have heat conductivility and high tensile strength when can improve epoxy adhesive layer, be favorable to improving the heat conductivity of electric current collection device.
Wherein the thickness of the epoxy resin heat-conducting adhesive layer is 0.3-0.5 μm.
The film layer is a PE film, a PP film or a PET film, the stretch resistance of the film layer is better, and the current collector is more difficult to break.
Wherein the thickness of the thin film layer is 1-1.5 μm.
Wherein the metal layer is a copper layer or an aluminum layer. The copper layer and the aluminum layer have good electrical conductivity and thermal conductivity and are cheap, so that the production cost of the current collecting device is reduced, and the electrical conductivity and the thermal conductivity of the current collecting device are improved.
Wherein the thickness of the metal layer is 0.5-0.7 μm.
The utility model has the advantages that:
the utility model discloses a surface sets up the graphite alkene layer that has good heat conductivility and conductivity respectively about the base film, sets up the epoxy heat-conducting glue film that has high stretch-proofing performance and heat conductivility on graphite alkene layer surface again, sets up thin layer and metal level on epoxy heat-conducting glue film surface at last, makes the utility model discloses a current collects device heat conductivity and stretch-proofing performance better, not only is difficult for breaking, and because heat conductivility is better for the battery obtains faster transmission and distributes away owing to the battery produced heat that generates heat unusually that reasons such as overcharging lead to, thereby prevents occurence of failure such as battery explosion.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a side view of the present invention.
Description of reference numerals:
10. a base film; 20. a graphene layer; 30. an epoxy resin heat-conducting adhesive layer; 40. a thin film layer; 50. a metal layer.
Detailed Description
The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. The utility model discloses each technical feature in the creation can the interactive combination under the prerequisite that does not contradict conflict each other.
Example 1
The utility model provides a device is compiled to electric current, as shown in fig. 1, it includes base film 10, graphite alkene layer 20, epoxy heat-conducting adhesive layer 30, thin layer 40 and metal level 50, graphite alkene layer 20 locates two upper and lower surfaces of base film 10, graphite alkene layer 20 surface is located to epoxy heat-conducting adhesive layer 30, epoxy heat-conducting adhesive layer 30 surface is located to thin layer 40, thin layer 40 surface is located to metal level 50.
Wherein the base film 10 is a PET film having a thickness of 1.2 μm.
Wherein the thickness of the graphene layer 20 is 0.25 μm.
The epoxy resin heat-conducting adhesive layer 30 includes an epoxy resin adhesive layer, and silica heat-conducting particles, silicon carbide heat-conducting particles, and aluminum nitride heat-conducting particles disposed in the epoxy resin adhesive layer.
Wherein, the thickness of the epoxy resin heat-conducting adhesive layer 30 is 0.4 μm.
Wherein the film layer 40 is a PP film having a thickness of 1.25 μm.
Wherein the metal layer 50 is a copper layer having a thickness of 0.6 μm.
Example 2
The utility model provides a current collects device, its includes base film, graphite alkene layer, epoxy heat-conducting adhesive layer, thin film layer and metal level, graphite alkene layer locates two upper and lower surfaces of base film, graphite alkene layer surface is located to epoxy heat-conducting adhesive layer, epoxy heat-conducting adhesive layer surface is located to the thin film layer, thin film layer surface is located to the metal level.
Wherein the base film is a PI film having a thickness of 1 μm.
Wherein the thickness of the graphene layer is 0.2 μm.
The epoxy resin heat-conducting adhesive layer comprises an epoxy resin adhesive layer and silicon dioxide heat-conducting particles, silicon carbide heat-conducting particles and aluminum nitride heat-conducting particles which are arranged in the epoxy resin adhesive layer.
Wherein the thickness of the epoxy resin heat-conducting adhesive layer is 0.3 mu m.
Wherein the thin film layer is a PE thin film with the thickness of 1 μm.
Wherein the metal layer is a copper layer having a thickness of 0.5 μm.
Example 3
The utility model provides a current collects device, its includes base film, graphite alkene layer, epoxy heat-conducting adhesive layer, thin film layer and metal level, graphite alkene layer locates two upper and lower surfaces of base film, graphite alkene layer surface is located to epoxy heat-conducting adhesive layer, epoxy heat-conducting adhesive layer surface is located to the thin film layer, thin film layer surface is located to the metal level.
Wherein the base film is a PET film having a thickness of 1.5 μm.
Wherein the thickness of the graphene layer is 0.3 μm.
The epoxy resin heat-conducting adhesive layer comprises an epoxy resin adhesive layer and silicon dioxide heat-conducting particles, silicon carbide heat-conducting particles and aluminum nitride heat-conducting particles which are arranged in the epoxy resin adhesive layer.
Wherein the thickness of the epoxy resin heat-conducting adhesive layer is 0.5 mu m.
Wherein the film layer is a PET film with a thickness of 1.5 μm.
Wherein the metal layer is a copper layer having a thickness of 0.7 μm.
Performance testing
Preparation of test samples:
(1) taking the current collection device of embodiments 1 to 3 of the present invention, and cutting the current collection device of each embodiment into 2 specimens with a length of 20cm and a width of 5cm, two specimens made by the current collection device of embodiment 1 are labeled as specimen 1 and specimen 2, two specimens made by the current collection device of embodiment 2 are labeled as specimen 3 and specimen 4, and two specimens made by the current collection device of embodiment 3 are labeled as specimen 5 and specimen 6;
(2) respectively taking a PET film substrate with the thickness of 1.2 mu m, a PP film substrate with the thickness of 1 mu m and a PET film substrate with the thickness of 1.5 mu m, coating films by magnetron sputtering, then coating films by water plating to finally form a current collecting device with the thickness of 6.2 mu m and taking the PET film as a base film, a current collecting device with the thickness of 5 mu m and taking the PP film as a base film and a current collecting device with the thickness of 7.5 mu m and taking the PET film as a base film, respectively cutting the current collecting device with the thicknesses of 5 mu m, 6.2 mu m and 7.5 mu m into two reference products with the lengths of 20cm and the widths of 5cm, specifically, respectively marking two reference products cut by the current collecting device with the thickness of 6.2 mu m of the PET film as a reference product 1 and a reference product 2, respectively marking two reference products cut by the current collecting device with the thickness of 5 mu m of the PP film as a reference product 3 and a reference product 4, respectively marking two reference products cut by the current collecting device with the thickness of 7.5 mu m of the PET film as a reference product 5 and respectively Reference 6.
And (3) testing:
the tensile strength test and the heat conductivity test are respectively carried out on the experimental products 1 to 6 and the comparison products 1 to 6.
The test method comprises the following steps:
and (3) testing tensile strength: and fixing the cut samples to the clamps at the upper end and the lower end of the tensile strength measuring instrument. The tensile strength was measured at a rate of 100 mm/min. The tensile strength was measured in kgf/cm and the tensile strength was measured by applying force in the upper and lower directions2. The test results are shown in table 1.
Testing the heat conduction performance: a TC3000S single-sided thermal conductivity meter is adopted to carry out thermal conductivity tests, and the data obtained by the tests are shown in Table 1.
TABLE 1
Figure BDA0002655562740000061
Figure BDA0002655562740000071
As can be seen from the table, the utility model discloses a device is compiled to electric current no matter in tensile strength or thermal conductivity aspect, all collects the device better than traditional electric current.
While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims (10)

1. A current sinking apparatus, comprising: including base film, graphite alkene layer, epoxy heat-conducting adhesive layer, thin film layer and metal level, two upper and lower surfaces of base film are located to graphite alkene layer, graphite alkene layer surface is located to epoxy heat-conducting adhesive layer, epoxy heat-conducting adhesive layer surface is located to the thin film layer, thin film layer surface is located to the metal level.
2. A current sinking apparatus according to claim 1, wherein: the base film is a PI film or a PET film.
3. A current sinking apparatus according to claim 1, wherein: the thickness of the base film layer is 1-1.5 μm.
4. A current sinking apparatus according to claim 1, wherein: the thickness of the graphene layer is 0.2-0.3 μm.
5. A current sinking apparatus according to claim 1, wherein: the epoxy resin heat-conducting adhesive layer comprises an epoxy resin adhesive layer and silicon dioxide heat-conducting particles, silicon carbide heat-conducting particles and aluminum nitride heat-conducting particles which are arranged in the epoxy resin adhesive layer.
6. A current sinking apparatus according to claim 1, wherein: the thickness of the epoxy resin heat-conducting adhesive layer is 0.3-0.5 mu m.
7. A current sinking apparatus according to claim 1, wherein: the film layer is a PE film, a PP film or a PET film.
8. A current sinking apparatus according to claim 1, wherein: the thickness of the thin film layer is 1-1.5 μm.
9. A current sinking apparatus according to claim 1, wherein: the metal layer is a copper layer or an aluminum layer.
10. A current sinking apparatus according to claim 1, wherein: the thickness of the metal layer is 0.5-0.7 um.
CN202021851663.1U 2020-08-28 2020-08-28 Current collecting device Active CN213124495U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
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Country Status (1)

Country Link
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