CN213122771U - Baking varnish lower shell for notebook computer - Google Patents
Baking varnish lower shell for notebook computer Download PDFInfo
- Publication number
- CN213122771U CN213122771U CN202022353080.2U CN202022353080U CN213122771U CN 213122771 U CN213122771 U CN 213122771U CN 202022353080 U CN202022353080 U CN 202022353080U CN 213122771 U CN213122771 U CN 213122771U
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- CN
- China
- Prior art keywords
- bottom plate
- heat dissipation
- notebook computer
- shell
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000002966 varnish Substances 0.000 title claims description 12
- 230000017525 heat dissipation Effects 0.000 claims abstract description 34
- 230000008878 coupling Effects 0.000 claims abstract description 10
- 238000010168 coupling process Methods 0.000 claims abstract description 10
- 238000005859 coupling reaction Methods 0.000 claims abstract description 10
- 238000009434 installation Methods 0.000 claims abstract description 6
- 238000007731 hot pressing Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
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Abstract
The utility model discloses a casing under baking finish for notebook computer relates to hot pressing buffer material production technical field, the utility model relates to a casing under baking finish for notebook computer, including shell, installation component, radiator unit, jack and coupling assembling, the shell includes bottom plate and base, and the bottom plate is middle sunken cuboid platelike structure, and the bottom plate upper surface is equipped with a plurality of screw thread through-holes, and wherein, the screw thread through-hole has nine, and the screw thread through-hole mainly connects the various accessories that will install on the bottom plate, and a plurality of base upper surfaces all are connected with bottom plate lower surface, and wherein, the base has two, mainly for raising the bottom plate. The utility model discloses in, through the utility model discloses in, increase the high temperature suggestion piece and indicate that the user probably sends the position of high temperature and increased the security of using, radiator unit has increased the heat dissipation of computer, has raised the bottom plate height through the base for it is more comfortable to type, increases coupling assembling and has increased the agility of loading and unloading.
Description
Technical Field
The utility model relates to a casing field under for the notebook computer, in particular to casing under baking finish for the notebook computer.
Background
With the continuous development of computer technology, a notebook computer becomes one of the necessary tools for young people, and when a consumer chooses the same type of notebook computer, besides the functional consideration, the appearance of the notebook computer also accounts for a considerable influence ratio, and the notebook computer is also called a portable computer, which has the biggest characteristic of small and exquisite body and is a small and portable personal computer compared with a PC (personal computer), also called a portable computer, a palm computer or a laptop computer, but the notebook computer is a small and portable personal computer, but the structure of the lower shell of the traditional notebook computer is simpler, the installation and the disassembly are not convenient enough, the heat dissipation capability is weak, and the anti-falling capability is poor, so that the notebook computer cannot meet the requirements of people.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a casing under baking finish for notebook computer can effectively solve the installation inconvenient among the background art, and the heat-sinking capability is too weak and anti the relatively poor problem of ability that falls.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a casing under baking finish for notebook computer, includes shell, installation component, radiator unit, jack and coupling assembling, its characterized in that: the shell comprises a bottom plate and bases, the bottom plate is of a cuboid plate-shaped structure with a concave middle part, a plurality of threaded through holes are arranged on the upper surface of the bottom plate, nine threaded through holes are formed in the bottom plate, the threaded through holes are mainly connected with various accessories to be installed on the bottom plate, the upper surfaces of the bases are all connected with the lower surface of the bottom plate, two bases are arranged and mainly used for lifting the bottom plate, the installation assembly comprises fan positions, the lower surfaces of the two fan positions are welded with the upper surface of the bottom plate, the heat dissipation assembly comprises heat dissipation holes, the heat dissipation holes are arranged in the middle of the bottom plate, each jack comprises a DC charging port, a type c port and a network interface, the DC charging port is arranged on one surface of the bottom plate, the type c port is arranged on one surface of the bottom plate, the network interface is arranged on one surface of, the four clamping grooves are mainly used for connecting the notebook computer keyboard with the lower shell bottom plate.
Preferably, the shell still includes high temperature suggestion piece, and is a plurality of high temperature suggestion piece lower surface all is connected with the bottom plate, and wherein, high temperature suggestion piece has four, and main suggestion user probably sends the position of high temperature, and the setting up of high temperature suggestion piece has increased the security of using, and the bottom plate height has been raised to the base for it is more comfortable to type.
Preferably, the mounting assembly further comprises a power supply position, and the lower surface of the power supply position is connected with the upper surface of the bottom plate.
Preferably, the heat dissipation assembly further comprises a heat dissipation bin, one surface of the heat dissipation bin is welded with one surface of the base plate, a plurality of heat dissipation through holes are formed in one surface of the heat dissipation bin, and the heat dissipation assembly increases heat dissipation of a computer and is beneficial to releasing performance of the computer.
Preferably, the jacks further comprise USB ports, the two USB ports are arranged on the surface of the bottom plate, and the abundant jacks increase the expansibility of the notebook computer.
Preferably, coupling assembling still includes the pivot groove, and is a plurality of the pivot groove all sets up in a bottom plate surface, a pivot inslot portion surface is equipped with rotatory hole, and wherein, the pivot groove has two, and mainly used bottom plate and notebook computer screen surface are connected, and coupling assembling has increased the agility of loading and unloading.
Compared with the prior art, the utility model discloses following beneficial effect has:
1. the utility model discloses in, indicate the position that the user probably sent the high temperature through increasing high temperature suggestion piece and increased the security of using.
2. The utility model discloses in, the heat dissipation of computer has been increased through radiator unit.
3. The utility model discloses in, raise the bottom plate height through the base for it is more comfortable to type.
4. The utility model discloses in, through increasing coupling assembling the agility that has increased loading and unloading.
Drawings
Fig. 1 is a schematic view of a bottom structure of a baking varnish lower case for a notebook computer according to the present invention;
fig. 2 is a schematic view of the bottom structure of the baking varnish lower case for the notebook computer of the present invention;
fig. 3 is a schematic top view of the lower case of the baking varnish for the notebook computer according to the present invention;
fig. 4 is a left structural schematic diagram of the lower case of the baking varnish for the notebook computer.
In the figure: 100. a housing; 101. a base plate; 102. a high temperature prompt block; 103. a base; 200. mounting the component; 201. a fan position; 202. a power supply position; 300. a heat dissipating component; 301. heat dissipation holes; 302. a heat dissipation bin; 400. a jack; 401. a DC charging port; 402. type c port; 403. a network interface; 404. a USB port; 500. a connecting assembly; 501. a rotating shaft groove; 502. a clamping groove.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The first embodiment is as follows:
referring to fig. 1-4, the present invention relates to a lower baking finish casing for a notebook computer, which comprises a casing 100, a mounting assembly 200, a heat dissipation assembly 300, a jack 400 and a connecting assembly 500, and is characterized in that: the shell 100 comprises a bottom plate 101 and a base 103, the bottom plate 101 is a middle sunken cuboid plate-shaped structure, the upper surface of the bottom plate 101 is provided with a plurality of threaded through holes, the upper surfaces of the base 103 are all connected with the lower surface of the bottom plate 101, the mounting assembly 200 comprises a fan position 201, the lower surfaces of the fan position 201 are all welded with the upper surface of the bottom plate 101, the heat dissipation assembly 300 comprises a heat dissipation hole 301, the heat dissipation hole 301 is arranged in the middle of the bottom plate 101, the jack 400 comprises a DC charging port 401, a type c port 402 and a network interface 403, the DC charging port 401 is arranged on one surface of the bottom plate 101, the type c port 402 is arranged on one surface of the bottom plate 101, the network interface 403 is arranged on one surface of the shell 100.
Further, the shell 100 further comprises a high-temperature prompt block 102, the lower surfaces of the high-temperature prompt blocks 102 are connected with the bottom plate 101, the high-temperature prompt block 102 is arranged to increase use safety, and the base 103 is raised by the height of the bottom plate 101, so that typing is more comfortable.
Further, the mounting assembly 200 further includes a power supply site 202, and a lower surface of the power supply site 202 is connected to an upper surface of the base plate 101.
Further, the heat dissipation assembly 300 further includes a heat dissipation bin 302, one surface of the heat dissipation bin 302 is welded with one surface of the bottom plate 101, a plurality of heat dissipation through holes are formed in one surface of the heat dissipation bin 302, and the heat dissipation assembly 300 increases heat dissipation of the computer and is beneficial to releasing performance of the computer.
Furthermore, the jack 400 further includes USB ports 404, and both USB ports 404 are disposed on a surface of the bottom plate 101, so that the abundant jacks 400 increase the expandability of the notebook computer.
Further, coupling assembling 500 still includes pivot groove 501, and a plurality of pivot grooves 501 all set up in bottom plate 101 a surface, and a pivot groove 501 inside surface is equipped with rotatory hole, and coupling assembling 500 has increased the agility of loading and unloading.
Example two:
referring to fig. 1-4, the present invention relates to a baking varnish lower case for a notebook computer, which comprises a battery disposed in a power supply position 202, a fan disposed in the fan position 201, a main board, a chip memory disposed on the upper surface of a bottom plate 101 and connected via a connecting thread, a keyboard disposed on a case 100 via a slot 502, and a screen disposed on the case 100 via a rotation shaft 501.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a casing under baking finish for notebook computer, includes shell (100), installation component (200), radiator unit (300), jack (400) and coupling assembling (500), its characterized in that: the shell (100) comprises a bottom plate (101) and a base (103), the bottom plate (101) is of a cuboid plate-shaped structure with a concave middle part, the upper surface of the bottom plate (101) is provided with a plurality of threaded through holes, the upper surfaces of the base (103) are connected with the lower surface of the bottom plate (101), the mounting assembly (200) comprises fan positions (201), the lower surfaces of the two fan positions (201) are welded with the upper surface of the bottom plate (101), the heat dissipation assembly (300) comprises heat dissipation holes (301), the heat dissipation holes (301) are arranged in the middle of the bottom plate (101), each jack (400) comprises a DC charging port (401), a type c port (402) and a network interface (403), the DC charging port (401) is arranged on one surface of the bottom plate (101), the type c port (402) is arranged on one surface of the bottom plate (101), the network interface (403) is arranged on one surface of the shell (100), the connecting assembly (500) comprises clamping grooves (502), and the clamping grooves (502) are arranged on one surface of the bottom plate (101).
2. The baked varnish lower shell for the notebook computer as recited in claim 1, wherein: the shell (100) further comprises high-temperature prompt blocks (102), and the lower surfaces of the high-temperature prompt blocks (102) are connected with the bottom plate (101).
3. The baked varnish lower shell for the notebook computer as recited in claim 1, wherein: the mounting assembly (200) further comprises a power supply position (202), and the lower surface of the power supply position (202) is connected with the upper surface of the bottom plate (101).
4. The baked varnish lower shell for the notebook computer as recited in claim 1, wherein: the heat dissipation assembly (300) further comprises a heat dissipation bin (302), one surface of the heat dissipation bin (302) is welded with one surface of the base plate (101), and a plurality of heat dissipation through holes are formed in one surface of the heat dissipation bin (302).
5. The baked varnish lower shell for the notebook computer as recited in claim 1, wherein: the jack (400) further comprises two USB ports (404), and the two USB ports (404) are arranged on one surface of the bottom plate (101).
6. The baked varnish lower shell for the notebook computer as recited in claim 1, wherein: coupling assembling (500) still include pivot groove (501), and is a plurality of pivot groove (501) all set up in bottom plate (101) a surface, an inside surface in pivot groove (501) is equipped with rotatory hole.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022353080.2U CN213122771U (en) | 2020-10-21 | 2020-10-21 | Baking varnish lower shell for notebook computer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202022353080.2U CN213122771U (en) | 2020-10-21 | 2020-10-21 | Baking varnish lower shell for notebook computer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN213122771U true CN213122771U (en) | 2021-05-04 |
Family
ID=75666778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202022353080.2U Expired - Fee Related CN213122771U (en) | 2020-10-21 | 2020-10-21 | Baking varnish lower shell for notebook computer |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN213122771U (en) |
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2020
- 2020-10-21 CN CN202022353080.2U patent/CN213122771U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210504 |