CN213093215U - Silicon wafer feeding device, silicon wafer feeding device and silicon wafer overturning and conveying system - Google Patents

Abstract

The utility model discloses a silicon chip loading attachment, silicon chip unloader and silicon chip upset conveying system belongs to solar energy silicon chip production field. The utility model discloses a silicon chip feeding device, the stacking mechanism of which comprises an input track, and a flower basket is arranged in the stacking mechanism; after the silicon chip is carried to the input track along the first direction by material loading conveying track, a plurality of silicon chip standing grooves of basket of flowers can correspond with the input track position in the third direction in proper order to stack the silicon chip in the basket of flowers, thereby conveniently overturn the silicon chip in batches. The utility model discloses a silicon wafer blanking device, wherein a drawing and placing mechanism comprises an output track, and a flower basket is arranged in the drawing and placing mechanism; a plurality of silicon chip standing grooves of basket of flowers can correspond with output track position in the third direction in proper order for the silicon chip is carried to the material conveying track on along the first direction by the output track, thereby conveniently takes out the silicon chip in the basket of flowers after accomplishing the upset in proper order, and continues to carry to low reaches process, has improved the upset and the transport efficiency of silicon chip.

Description

Silicon wafer feeding device, silicon wafer feeding device and silicon wafer overturning and conveying system

Technical Field

The utility model relates to a solar energy production technical field, more specifically say, relate to a silicon chip loading attachment, silicon chip unloader and silicon chip upset conveying system.

Background

In the processing production of solar cells, with the continuous improvement of silicon wafer processing technology, the double-sided processing technology of silicon wafers is more and more mature. At present, part of the processes are to gradually process each single side of the double sides of the silicon wafer, so that the silicon wafer with the single side processed needs to be processed again after being turned over. Meanwhile, the silicon wafers cannot be directly contacted, so that the silicon wafers need to be manually turned over one by using the sucking disc, the processing procedure consumes time and labor, and the turning efficiency is low.

In the related art, in order to solve the above problems, a method of automatically turning a silicon wafer by using a turning mechanism is often adopted; for example, chinese patent document No. 201820873204X discloses a silicon wafer turnover device and a silicon wafer turnover conveying system, wherein the turnover mechanism includes a feeding assembly, a turnover assembly, and a discharging assembly, which are sequentially disposed. The feeding assembly is used for conveying a silicon wafer to be overturned, and the first surface of the silicon wafer to be overturned faces upwards; the overturning assembly is used for overturning the surface of the silicon wafer to be overturned conveyed by the feeding assembly, so that a second surface of the silicon wafer, which is opposite to the first surface, faces upwards; and the discharging assembly is used for conveying the silicon wafer after the surface is turned over.

However, it should be understood that the object naturally has a centrifugal force when rotating, and in order to prevent the silicon wafer from coming off the turnover mechanism, the silicon wafer needs to be fixed or limited, and at this time, the surface of the silicon wafer is easily damaged; in addition, in order to prevent the silicon wafer from separating out in the overturning process, the overturning speed is generally slow, so that the silicon wafer in the front-stage process of the overturning mechanism is overstocked, and the conveying efficiency of a silicon wafer production line is reduced.

SUMMERY OF THE UTILITY MODEL

1. Technical problem to be solved by the utility model

The utility model aims to overcome the less than enough of efficiency when the silicon chip overturns and carries among the prior art, provide a silicon chip loading attachment and silicon chip unloader, aim at utilizing and stack the mechanism and stack the silicon chip and overturn in the basket of flowers again, take out the silicon chip in proper order through taking out the device of putting after the upset is accomplished to realize overturning of silicon chip in batches.

The utility model discloses a silicon chip upset conveying system stacks the silicon chip and criticizes in the basket of flowers and overturns, has improved the upset and the conveying efficiency of silicon chip.

2. Technical scheme

In order to achieve the above purpose, the utility model provides a technical scheme does:

the utility model discloses a silicon wafer feeding device, which comprises a feeding conveying track and a stacking mechanism, wherein the stacking mechanism comprises an input track and a first lifting piece, and a flower basket is arranged in the stacking mechanism; after the silicon wafers are conveyed to the input rail along the first direction by the feeding conveying rail, the first lifting piece drives the flower basket to move along the third direction, so that the silicon wafer placing grooves of the flower basket sequentially correspond to the input rail in the third direction.

Furthermore, the feeding conveying track comprises two feeding conveying belts arranged in parallel, a plurality of first positioning pieces and second positioning pieces are arranged on the feeding conveying belts at intervals, and silicon wafer placing positions are formed between the adjacent first positioning pieces and the second positioning pieces.

Furthermore, the first positioning piece comprises a connecting part, an inclined plane is arranged on the connecting part, and a positioning bulge is arranged on the inclined plane; the second positioning piece and the first positioning piece are identical in structure, and the first positioning piece and the second positioning piece are arranged in a mirror image mode.

Furthermore, a feeding port is formed at one end, close to the stacking mechanism, of the feeding conveying rail, and one end, close to the feeding conveying rail, of the input rail of the stacking mechanism extends into the feeding port.

Furthermore, the positioning protrusion is in a circular truncated cone structure or a step structure.

Furthermore, the included angle formed between the inclined plane and the first direction ranges from 3 degrees to 10 degrees.

Furthermore, a feeding port is formed at one end of the feeding conveying track close to the stacking mechanism, and an input track of the stacking mechanism extends into a position between the two feeding conveyor belts and is located at the feeding port.

Further, still include material loading detection mechanism, material loading detection mechanism includes the portal frame to and set up the detector on the portal frame, the portal frame depends on material loading conveying track sets up, the detector is used for gathering silicon chip information on the material loading conveying track.

The utility model discloses a silicon chip upset conveying system, including turning device to and foretell loading attachment, loading attachment is arranged in stacking the silicon chip and sets up in the basket of flowers, turning device is used for realizing the upset of basket of flowers.

The utility model discloses a silicon wafer blanking device, which comprises a blanking conveying track and a drawing and placing mechanism, wherein the drawing and placing mechanism comprises an output track and a second lifting piece, and a flower basket is arranged in the drawing and placing mechanism; the second lifting piece drives the flower basket to move along the third direction, so that the silicon wafer placing grooves of the flower basket correspond to the output rail in the third direction in sequence, and the silicon wafers are conveyed to the feeding conveying rail along the first direction by the output rail.

The utility model discloses a silicon chip upset conveying system, including turning device to and foretell unloader, turning device has the basket of flowers upset back of silicon chip with the device, unloader is used for taking out the silicon chip of stacking in the basket of flowers in proper order.

3. Advantageous effects

Adopt the technical scheme provided by the utility model, compare with prior art, have following beneficial effect:

(1) the utility model discloses a silicon wafer feeding device, which comprises a feeding and conveying track and a stacking mechanism, wherein the stacking mechanism comprises an input track and a first lifting piece, and a flower basket is arranged in the stacking mechanism; after the silicon chip is carried to the input track along the first direction by material loading delivery track, first lifting member ordered about the basket of flowers and removed along the third direction to a plurality of silicon chip standing grooves that make the basket of flowers correspond with input track position in the third direction in proper order, thereby stack the silicon chip at the basket of flowers, thereby conveniently overturn the silicon chip in batches, improved the upset and the conveying efficiency of silicon chip.

(2) The utility model discloses in, the location arch has the function of tentatively fixing a position the silicon chip, forms between first setting element and the second setting element to the silicon chip places the position and can further fix a position the silicon chip to the convenience is in carrying the silicon chip and stack in the basket of flowers.

(3) The utility model discloses a silicon wafer blanking device, which comprises a blanking conveying track and a drawing and placing mechanism, wherein the drawing and placing mechanism comprises an output track and a second lifting piece, and a flower basket is arranged in the drawing and placing mechanism; the second lifting piece orders about the basket of flowers and removes along the third direction to make a plurality of silicon chip standing grooves of basket of flowers correspond with output track position in the third direction in proper order, make the silicon chip be carried to the material conveying track along the first direction by the output track on, thereby conveniently will accomplish the silicon chip in the basket of flowers after the upset and take out in proper order, and continue to carry to low reaches process, improved the upset and the transport efficiency of silicon chip.

(4) The utility model discloses a silicon chip upset conveying system utilizes and stacks the mechanism and/or take out and put the batch upset that the mechanism realized the silicon chip, has improved the upset efficiency of silicon chip, and then has improved the whole efficiency of silicon chip production.

Drawings

Fig. 1 is a schematic structural view of the turnover conveying system of the present invention;

fig. 2 is a schematic structural view of a feeding conveying track in the utility model;

FIG. 3 is a schematic structural view of a silicon wafer placement site in the present invention;

fig. 4 is a schematic structural view of the first positioning member of the present invention;

FIG. 5 is a schematic view of the structure of the turnover mechanism of the present invention;

fig. 6 is a schematic structural view of the fixing arm of the present invention;

FIG. 7 is a schematic structural view of the flower basket of the present invention;

FIG. 8 is a schematic structural view of the flower basket guard arm of the present invention;

fig. 9 is a schematic view of the turning process of the middle turning mechanism of the present invention.

The reference numerals in the schematic drawings illustrate: 100. a feeding device; 110. a feeding conveying track; 120. placing a silicon wafer; 121. a first positioning member; 1211. positioning the projection; 1212. a connecting portion; 1213. a bevel; 122. a second positioning member; 130. a feeding port; 140. a feeding detection mechanism; 150. a stacking mechanism;

200. a turning device; 210. a first buffer track; 220. a second buffer track; 230. a turnover mechanism; 231. turning over the driving piece; 232. a shaft seat; 233. a turning shaft; 234. an installation part; 235. a fixed arm; 236. a flower basket protecting arm; 2361. a compression plate; 2362. jacking a driving piece; 240. a first transfer track; 241. a first transfer belt; 250. a second transfer track; 251. a second transfer belt;

300. a blanking device; 310. blanking and conveying the track; 320. a pumping mechanism;

400. a flower basket; 401. an upper frame body; 402. a lower frame body; 403. a connecting plate; 404. connecting columns;

500. and (3) a silicon wafer.

Detailed Description

For a further understanding of the present invention, reference will be made to the following detailed description taken in conjunction with the accompanying drawings and examples.

The structure, ratio, size and the like shown in the drawings of the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention does not have the substantial significance in the technology, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy which can be produced by the present invention and the achievable purpose. In addition, the terms "upper", "lower", "left", "right" and "middle" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.

In the related art, in order to prevent the silicon wafer from being released from the turnover mechanism in the turnover process, the turnover speed of the silicon wafer is generally not fast, and the overall production rate of the production line is determined by the speed of the slowest process. Therefore, when the turnover speed of the silicon wafer turnover mechanism is not fast, the production speed of the whole silicon wafer production line is reduced.

In order to solve the above problem, the present embodiment provides a silicon wafer turnover conveying system. Fig. 1 shows the structure of the inverting conveyance system of the present embodiment. Specifically, the silicon wafer overturning and conveying system comprises a feeding device 100, an overturning device 200 and a discharging device 300 which are arranged along a first direction. The feeding device 100 is used for conveying the silicon wafers 500 to the turnover device 200, the turnover device 200 is used for overturning the silicon wafers 500, and the discharging device 300 is used for continuously conveying the silicon wafers overturned by the turnover device 200 to a downstream process.

It should be noted that the first direction referred to in this embodiment may be a silicon wafer transmission direction, such as the x direction identified in the drawings; the second direction may be a direction of a flip axis of the flipping mechanism, such as the y-direction identified in the figures; the third direction may be a direction perpendicular to the first direction and perpendicular to the second direction, such as the z-direction identified in the figures.

In the following, the following description is given,

the loading device 100 includes a loading conveyor rail 110 and a stacking mechanism 150. The feeding and conveying rail 110 is disposed along a first direction, and is used for conveying the silicon wafer 500 in the first direction, specifically, conveying the silicon wafer 500 from an upstream process to the stacking mechanism 150. The stacking mechanism 150 is used to stack a plurality of silicon wafers 500 in the basket 400 and then transfer the silicon wafers 500 loaded into the turnover device.

Fig. 2 shows the structure of the loading conveyor rail 110. Specifically, the feeding conveying track 110 is composed of two feeding conveyor belts arranged in parallel. A plurality of silicon wafer placing locations 120 are formed between the two feeding conveyors, and the silicon wafer 500 can be positioned and supported in the silicon wafer placing locations 120.

Fig. 3 shows the structure of the silicon wafer placement bit 120. Specifically, the silicon wafer placing position 120 is composed of two first positioning members 121 and two second positioning members 122 on two feeding conveyors. Wherein, be provided with a plurality of first setting element 121 and a plurality of second setting element 122 on the material loading conveyer belt, first setting element 121 and second setting element 122 interval set up.

Fig. 4 shows the structure of the first positioning member 121. The first positioning member 121 includes a positioning protrusion 1211, a connecting portion 1212, and a slant surface 1213. Wherein, set up on the material loading conveyer belt between the connecting portion 1212, inclined plane 1213 sets up on connecting portion 1212, and location arch 1211 sets up on the inclined plane.

Furthermore, the included angle α formed by the inclined surface 1213 and the first direction may be 3 to 10 °, so that the silicon wafer 500 can be located near the center position in the silicon wafer placement position when the silicon wafer is located in the silicon wafer placement position. In addition, when the silicon wafer 500 is located in the silicon wafer placing position, the distance L from the positioning projection 1211 facing the edge of the first positioning member 121 may be 0 to 3 mm.

The second positioning element 122 may have the same structure as the first positioning element 121, and the second positioning element 122 and the first positioning element 121 are arranged in a mirror image. In the same silicon wafer placing position 120, the first positioning element 121 and the second positioning element 122 located on the same feeding conveyor belt are arranged oppositely, specifically, the inclined surface 1213 of the first positioning element 121 is arranged towards the second positioning element 122, and the inclined surface of the second positioning element 122 is arranged towards the first positioning element 121, so that the silicon wafer 500 can be just clamped between the first positioning element 121 and the second positioning element 122, and the positioning of the silicon wafer 500 is realized. In addition, due to the inclined surfaces 1213 of the first positioning members 121 and the inclined surfaces of the second positioning members 122, the silicon wafer placing site 120 can place silicon wafers 500 of different sizes.

In addition, as a further optimization, the positioning projection 1211 has a function of preliminarily positioning the silicon wafer 500. Specifically, the positioning protrusion 1211 may have a circular truncated cone structure or a step structure, that is, the size of the positioning protrusion 1211 gradually changes along the third direction, so that the silicon wafer 500 tends to move toward the center of the silicon wafer placement site 120, thereby achieving the positioning effect.

The stacking mechanism 150 includes an input rail and a first lifting member, the input rail is disposed along a first direction and is used for conveying the silicon wafer 500 from the feeding conveying rail 110 to the basket 400; the first lifting member is used for driving the flower basket 400 to move along the third direction, so that the silicon wafer placing grooves in the flower basket 400 correspond to the input rail positions in the third direction respectively, and the first lifting member may be one of an air cylinder, a hydraulic cylinder and a motor.

That is, in an initial state, the uppermost silicon wafer placement groove of the basket 400 corresponds to the input rail in the third direction, the input rail conveys the silicon wafers 500 from the feeding conveying rail 110 to the uppermost silicon wafer placement groove of the basket 400 along the first direction, then the first lifting member drives the basket 400 to move upward along the third direction, so that the next silicon wafer placement groove of the basket 400 corresponds to the input rail in the third direction, and the input rail conveys the silicon wafers 500 from the feeding conveying rail 110 to the next silicon wafer placement groove of the basket 400 along the first direction, so as to reciprocate, and thus stacking of the silicon wafers 500 is completed.

Of course, in order to achieve smooth transfer of the silicon wafer 500 from the loading conveyor rail 110 to the flower basket 400, the loading conveyor rail 110 may be formed with a loading port 130 at an end adjacent to the stacking mechanism 150, and the input rail of the stacking mechanism 150 extends between the two loading conveyors and is located at the loading port 130, so that the silicon wafer 500 can be supported on the input rail and transferred to the flower basket 400 by the input rail without completely separating from the loading conveyor rail 110.

In addition, a feeding detection mechanism 140 may be further disposed in the feeding device 100, and the feeding detection mechanism 140 may include a gantry, and a detector disposed on the gantry, and the detector may be configured to detect whether the silicon wafer 500 exists on the silicon wafer placing position 120. Specifically, when the silicon wafer 500 exists on the silicon wafer placing position 120, the first lifting member drives the flower basket 400 to move after the silicon wafer 500 is conveyed into the flower basket 400 by the input rail; when no silicon wafer 500 exists on the silicon wafer placing position 120, the first lifting piece cannot drive the flower basket 400 to move, so that the flower basket 400 is prevented from being unloaded, and the overall conveying efficiency of the turnover conveying system is improved.

In the following, the following description is given,

the discharging device 300 includes a drawing mechanism 320 and a discharging conveying rail 310. The blanking device 300 is used for sequentially drawing out the silicon wafers 500 in the flower basket 400 and placing the silicon wafers on the blanking conveying rail 310, and the blanking conveying rail 310 is used for conveying the silicon wafers 500 to a downstream process.

It should be noted that the structure of the blanking device 300 can be identical to the loading device 100, and the arrangement between the blanking device 300 and the loading device 100 is a mirror image. Specifically, the drawing and discharging mechanism 320 includes an output rail and a second lifting member for driving the flower basket 400 to move in the third direction. The construction of the withdrawal mechanism 320 may be identical to that of the stacking mechanism 150, but the withdrawal mechanism 320 acts in a reverse manner to that of the stacking mechanism 150.

That is, in the initial state, the silicon wafer placing groove at the bottom of the basket 400 corresponds to the output rail in the third direction, the output rail conveys the silicon wafers 500 from the silicon wafer placing groove at the bottom of the basket 400 to the blanking conveying rail 310 along the first direction, then the second lifting member drives the basket 400 to move downward along the third direction, so that the next silicon wafer placing groove of the basket 400 corresponds to the input rail in the third direction, and the output rail conveys the silicon wafers 500 from the next silicon wafer placing groove of the basket 400 to the blanking conveying rail 310 along the first direction, so as to reciprocate, and the drawing and placing of all the silicon wafers 500 in the basket 400 is completed.

Therefore, the structure of the blanking device 300 is not described in detail in this embodiment.

In the following, the following description is given,

the flipping mechanism 200 includes a first buffer rail 210, a second buffer rail 220, and a flipping mechanism 230, and the first buffer rail 210, the second buffer rail 220, and the flipping mechanism 230 are disposed along a first direction. The first buffer rail 210 is located between the stacking mechanism 150 and the turnover mechanism 230, and the first buffer rail 210 is used for conveying the baskets 400 in the stacking mechanism 150 to the turnover mechanism 230 and providing temporary storage positions for the baskets 400; the second buffer rail 220 is located between the turnover mechanism 230 and the drawing and discharging mechanism 320, and the second buffer rail 220 is used for conveying the flower basket 400 turned by the turnover mechanism 230 to the drawing and discharging mechanism.

Fig. 5 shows the structure of the turnover mechanism 230. Specifically, the turnover mechanism 230 includes a turnover shaft 233, an axis of the turnover shaft 233 is disposed along the second direction, two ends of the turnover shaft 233 are respectively disposed on two shaft seats 232, specifically, a bearing may be disposed on the shaft seat 232, and the turnover shaft 233 is connected to the shaft seats 232 through the bearing. The turning shaft 233 is driven to rotate by a turning drive 231, and the turning drive 231 may be a motor.

Referring to fig. 5 and 6, the turning shaft 233 is provided with a mounting portion 234, two fixing arms 235 are connected to the mounting portion 234, the two fixing arms 235 are disposed opposite to each other, and a clamping position is formed between the two fixing arms 235. Referring to fig. 7, the flower basket 400 may be provided with a fixing groove to be form-fitted to the fixing arm 235. When the silicon wafer 500 is turned, the fixing arms 235 can be inserted into the fixing grooves, and the flower basket 400 is clamped by the two fixing arms 235, so that the flower basket 400 is prevented from being pulled out of the fixing arms 235 when the silicon wafer 500 is turned.

The flower basket 400 specifically includes an upper frame 401 and a lower frame 402, and two connecting plates 403 are connected between the upper frame 401 and the lower frame 402. The connecting plates 403 are provided with a plurality of silicon wafer placing grooves, and silicon wafer placing positions are formed between the silicon wafer placing grooves at corresponding positions on the two connecting plates 403, specifically, when the silicon wafer 500 is placed, one edge of the silicon wafer 500 can be placed in the silicon wafer placing groove on one connecting plate 403 of the two connecting plates 403, and the other edge of the silicon wafer 500 can be prevented from being placed in the silicon wafer placing groove on the other connecting plate 403 of the two connecting plates 403.

The edges of the upper frame 401 and the lower frame 402 may protrude from the outer side of the connecting plate 403, so that fixing grooves with a concave structure are formed among the upper frame 401, the lower frame 402 and the connecting plate 403, and thus the upper frame 401 and the lower frame 402 serve as stress members in the front half and the rear half, respectively, when the flower basket 400 is turned over.

Both the upper frame 401 and the lower frame 402 of the flower basket 400 may have a concave structure, that is, both the upper frame 401 and the lower frame 402 may have an opening for the silicon wafer 500 to enter the flower basket 400. In order to improve the overall structural strength of the flower basket 400, a plurality of connecting columns 404 may be connected between the upper frame 401 and the lower frame 402.

In addition, in order to improve the fixing effect of the turnover mechanism 230 on the flower basket 400 during the turnover process, a flower basket protecting arm 236 may be disposed on the mounting portion 234. Specifically, referring to fig. 8, the flower basket protecting arm 236 includes a pressing plate 2361 and a lifting driving member 2362, the pressing plate 2361 is disposed toward the flower basket 400, and the lifting driving member 2362 is configured to drive the pressing plate 2361 to move along a third direction, so as to drive the pressing plate 2361 to be pressed against the lower frame 402 of the flower basket 400, so as to press the lower frame 402 against the fixing arm 235, or drive the pressing plate 2361 to be pressed against the upper frame 401 of the flower basket 400, so as to press the upper frame 401 against the fixing arm 235, and further to fix the flower basket 400.

In the following, the following description is given,

in order to realize stable conveyance of the flower basket between the first buffer rail 210 and the second buffer rail 220 and the turnover mechanism 230, a first transfer rail 240 may be provided between the first buffer rail 210 and the turnover mechanism 230, and a second transfer rail 250 may be provided between the second buffer rail 220 and the turnover mechanism 230.

Specifically, the first transfer rail 240 is formed of two first transfer belts 241 arranged in parallel, and the second transfer rail 250 is formed of two second transfer belts 251 arranged in parallel.

When the plate surface of the mounting portion 234 is perpendicular to the first direction, the fixing arm 235 at least partially overlaps the first transfer rail 240 in the first direction or at least partially overlaps the second transfer rail 250 in the first direction. That is, when the fixed arm 235 at least partially overlaps the first transfer track 240 in the first direction, the first transfer track 240 may transport the flower basket 400 from the first buffer track into the turnover mechanism 230; when the fixing arm 235 at least partially overlaps the second transfer rail 250 in the first direction, the second transfer rail 250 may transfer the baskets 400 in the turnover mechanism 230 onto the second buffer rail 220.

In addition, the positions of the first transfer rail 240 and the second transfer rail 250 in the third direction may be the same, that is, after the first transfer rail 240 conveys the flower basket 400 from the first buffer rail 210 to the turnover mechanism 230, after the turnover mechanism 230 turns over by 180 °, the flower basket 400 and the second transfer rail 250 are at the same position in the third direction, thereby ensuring that the flower basket 400 is always arranged in parallel to the first direction, that is, horizontally arranged before and after the turnover mechanism 230 turns over.

In the following, the following description is given,

the method for turning over and conveying the silicon wafer 500 by using the silicon wafer turning and conveying system of the embodiment specifically comprises the following steps:

step 1, after the silicon wafers 500 are conveyed to the stacking mechanism 150 along the first direction by the feeding conveying rail 110, the stacking mechanism 150 stacks the silicon wafers 500 in the basket 400.

Step 2, after the first buffer rail 210 conveys the flower basket 400 loaded with the silicon wafers 500 from the stacking mechanism 150 to the turnover mechanism 230, the turnover mechanism 230 turns over the flower basket 400 loaded with the silicon wafers 500 and places the flower basket on the second buffer rail 220.

Referring to fig. 9, when the first transfer rail 240 is disposed between the first buffer rail 210 and the turning mechanism 230, and the second transfer rail 250 is disposed between the second buffer rail 220 and the turning mechanism 230, the specific turning process of the flower basket 400 is as follows: referring to the state a, the flower basket 400 is transferred to the turnover mechanism 230 by the first transfer rail 240, and the fixing arm 235 is inserted into the fixing groove; thereafter, referring to the state b, the flower basket 400 is driven by the tilting mechanism 230 to be tilted toward the second transfer rail 250, and during the period, the flower basket 400 abuts against the mounting portion 234 or the basket guard arm 236 under the action of the gravity of the flower basket 400 itself, so that the flower basket 400 is not separated from the tilting mechanism 230; finally, referring to the state c, after the turnover mechanism 230 turns over 180 °, the second transfer rail 250 conveys the flower basket 400 out of the turnover mechanism 230, and the turnover of the flower basket 400 is completed.

Step 3, after the second buffer rail 220 conveys the flower basket 400 loaded with the silicon wafers 500 into the drawing and placing mechanism 320, the drawing and placing mechanism 320 draws the silicon wafers 500 in the flower basket 400 loaded with the silicon wafers 500 in sequence and places the silicon wafers 500 on the blanking conveying rail 310.

And 4, conveying the silicon wafer 500 to a downstream process by the blanking conveying rail 310.

The present invention and its embodiments have been described above schematically, and the description is not limited thereto, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching of the present invention, without departing from the inventive spirit of the present invention, the person skilled in the art should also design the similar structural modes and embodiments without creativity to the technical solution, and all shall fall within the protection scope of the present invention.

Claims (11)

1. A silicon wafer loading attachment which characterized in that: the automatic flower basket stacking device comprises a feeding conveying track and a stacking mechanism, wherein the stacking mechanism comprises an input track and a first lifting piece, and a flower basket is arranged in the stacking mechanism; after the silicon wafers are conveyed to the input rail along the first direction by the feeding conveying rail, the first lifting piece drives the flower basket to move along the third direction, so that the silicon wafer placing grooves of the flower basket sequentially correspond to the input rail in the third direction.

2. The silicon wafer loading apparatus according to claim 1, wherein: the feeding conveying track comprises two feeding conveying belts arranged in parallel, a plurality of first positioning pieces and second positioning pieces are arranged on the feeding conveying belts at intervals, and silicon wafer placing positions are formed between the adjacent first positioning pieces and the second positioning pieces.

3. The silicon wafer loading apparatus according to claim 2, wherein: the first positioning piece comprises a connecting part, an inclined plane is arranged on the connecting part, and a positioning bulge is arranged on the inclined plane; the second positioning piece and the first positioning piece are identical in structure, and the first positioning piece and the second positioning piece are arranged in a mirror image mode.

4. The silicon wafer loading apparatus according to claim 3, wherein: and a feeding port is formed at one end of the feeding conveying track close to the stacking mechanism, and one end of the input track of the stacking mechanism close to the feeding conveying track extends into the feeding port.

5. The silicon wafer loading apparatus according to claim 3, wherein: the positioning bulge is in a round table structure or a ladder platform structure.

6. The silicon wafer loading apparatus according to claim 3, wherein: the included angle formed by the inclined plane and the first direction is 3-10 degrees.

7. The silicon wafer loading apparatus according to claim 2, wherein: and a feeding port is formed at one end of the feeding conveying track close to the stacking mechanism, and an input track of the stacking mechanism extends into a position between the two feeding conveying belts and is positioned at the feeding port.

8. The silicon wafer loading apparatus according to claim 1, wherein: the silicon wafer loading device is characterized by further comprising a loading detection mechanism, wherein the loading detection mechanism comprises a portal frame and a detector arranged on the portal frame, the portal frame is attached to the loading conveying track, and the detector is used for collecting silicon wafer information on the loading conveying track.

9. The utility model provides a silicon chip upset conveying system which characterized in that: the silicon wafer overturning device comprises an overturning device and the feeding device as claimed in any one of claims 1-8, wherein the feeding device is used for stacking silicon wafers in a flower basket, and the overturning device is used for realizing overturning of the flower basket.

10. The utility model provides a silicon chip unloader which characterized in that: the discharging device comprises a discharging conveying track and a drawing and releasing mechanism, wherein the drawing and releasing mechanism comprises an output track and a second lifting piece, and a flower basket is arranged in the drawing and releasing mechanism; the second lifting piece drives the flower basket to move along the third direction, so that the silicon wafer placing grooves of the flower basket correspond to the output rail in the third direction in sequence, and the silicon wafers are conveyed to the feeding conveying rail along the first direction by the output rail.

11. The utility model provides a silicon chip upset conveying system which characterized in that: the silicon wafer discharging device comprises a turnover device and the discharging device as claimed in claim 10, wherein after the turnover device turns over a flower basket provided with silicon wafers, the discharging device is used for sequentially taking out the silicon wafers stacked in the flower basket.

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