CN213093196U - Transient suppression high-side overvoltage protection IC - Google Patents
Transient suppression high-side overvoltage protection IC Download PDFInfo
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- CN213093196U CN213093196U CN202021966366.1U CN202021966366U CN213093196U CN 213093196 U CN213093196 U CN 213093196U CN 202021966366 U CN202021966366 U CN 202021966366U CN 213093196 U CN213093196 U CN 213093196U
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- limiting plate
- transient suppression
- overvoltage protection
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Abstract
The utility model relates to a transient suppression high side overvoltage protection IC, which comprises a shell, wherein the top of the shell is provided with a shell cover, the interior of the shell is provided with a transient suppression diode placing groove and an IC chip placing groove, the two sides of the shell are symmetrically provided with connecting grooves, the bottom of the shell is provided with a mounting groove, a limiting plate and a heat conducting plate are arranged in the mounting groove, the limiting plate is arranged at the bottom of the mounting groove, the limiting plate is fixedly connected with the shell, the two ends of the heat conducting plate are arranged between the limiting plate and the shell, the bottom of the heat conducting plate is equidistantly provided with radiating fins, the radiating fins are arranged between the limiting plate and the limiting plate, the front side of the heat conducting plate is provided with a connecting plate, the structure of the utility model is simple, the design is reasonable, the heat conducting, thereby being favorable for maintenance and cleaning and having strong practicability.
Description
Technical Field
The utility model relates to a high side overvoltage protection IC of transient state suppression belongs to IC chip technical field.
Background
To transient suppression high side overvoltage protection IC, transient suppression diode and the IC chip that wherein installation set up can produce a large amount of heats when moving, if do not discharge the heat, the heat of piling up gradually can lead to the fact the damage to transient suppression diode and IC chip, when influencing its normal operating, reduces life, for this reason, provides a transient suppression high side overvoltage protection IC.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a transient state restraines high side overvoltage protection IC to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a high side overvoltage protection IC of transient suppression, includes the casing, the casing top is provided with the cap, inside transient suppression diode standing groove and the IC chip standing groove of being provided with of casing, the spread groove has been seted up to casing bilateral symmetry, the mounting groove has been seted up to the casing bottom, be provided with restriction board and heat-conducting plate in the mounting groove, just the restriction board sets up in the mounting groove bottom, restriction board and casing fixed connection, the heat-conducting plate both ends set up between restriction board and casing, heat-conducting plate bottom equidistance is provided with the fin, just the fin sets up between restriction board and restriction board, the heat-conducting plate front side is provided with the connecting plate, just the connecting plate both ends all are provided with between restriction.
Furthermore, the bottom of the connecting plate is provided with first threaded holes, and the first threaded holes are symmetrically arranged on two sides of the connecting plate.
Furthermore, a first bolt is arranged at the bottom of the limiting plate, and the bolt tail of the first bolt penetrates through the limiting plate and is in threaded connection with the first threaded hole.
Furthermore, second threaded holes are formed in four corners of the top of the shell.
Furthermore, second bolts are arranged at four corners of the top of the shell cover, and bolt tails of the second bolts penetrate through the shell cover and are in threaded connection with second threaded holes.
Furthermore, an auxiliary groove is formed in the middle of the bottom of the connecting plate.
The utility model has the advantages that:
1. the heat conducting plate and the radiating fins are used for radiating elements in the shell, and the heat conducting plate and the radiating fins are convenient to mount and dismount, so that maintenance and cleaning are facilitated.
2. Through setting up the restriction board, can restrict the heat-conducting plate, make the better laminating restriction of heat-conducting plate in the casing bottom to cooperate first screw hole and first bolt, fix between connecting plate and the restriction board, thereby prevent that the heat-conducting plate from breaking away from the casing, through setting up connecting plate and supplementary groove, conveniently take the heat-conducting plate out, the practicality is strong.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
Fig. 1 is a schematic diagram of an internal structure of a transient suppression high-side overvoltage protection IC of the present invention;
fig. 2 is a top view of a housing of a transient suppression high side overvoltage protection IC of the present invention;
fig. 3 is a schematic diagram of an overall structure of a transient suppression high-side overvoltage protection IC according to the present invention;
fig. 4 is a schematic bottom view of a housing of a transient suppression high side overvoltage protection IC of the present invention;
FIG. 5 is a schematic diagram of a thermal plate connection for a transient suppression high side overvoltage protection IC of the present invention;
reference numbers in the figures: 1. a housing; 2. a shell cover; 3. a transient suppression diode placement groove; 4. an IC chip placement groove; 5. connecting grooves; 6. mounting grooves; 7. a limiting plate; 8. a heat conducting plate; 9. a heat sink; 10. a connecting plate; 11. a first threaded hole; 12. a first bolt; 13. a second threaded hole; 14. a second bolt; 15. an auxiliary groove.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: a transient suppression high side overvoltage protection IC comprises a shell 1, a shell cover 2 is arranged on the top of the shell 1, the inside of the case 1 is provided with a transient suppression diode placing groove 3 and an IC chip placing groove 4, the shell 1 is symmetrically provided with connecting grooves 5 at two sides, the bottom of the shell 1 is provided with an installation groove 6, a limiting plate 7 and a heat conducting plate 8 are arranged in the installation groove 6, the limiting plate 7 is arranged at the bottom of the mounting groove 6, the limiting plate 7 is fixedly connected with the shell 1, the two ends of the heat conducting plate 8 are arranged between the limiting plate 7 and the shell 1, the bottom of the heat conducting plate 8 is equidistantly provided with radiating fins 9, the radiating fins 9 are arranged between the limiting plates 7 and 7, the heat conducting plate 8 is provided with a connecting plate 10 at the front side, and both ends of the connecting plate 10 are provided with a space between the limiting plate 7 and the shell 1, and the middle of the bottom of the connecting plate 10 is provided with an auxiliary groove 15.
Specifically, as shown in fig. 1 and 5, the bottom of the connecting plate 10 is provided with first threaded holes 11, the first threaded holes 11 are symmetrically arranged on two sides of the connecting plate 10, the bottom of the limiting plate 7 is provided with first bolts 12, and the bolt tails of the first bolts 12 penetrate through the limiting plate 7 and are in threaded connection with the first threaded holes 11, so that the connecting plate 10 and the limiting plate 7 are fixed, and the heat conducting plate 8 is prevented from being separated from the casing 1.
Specifically, as shown in fig. 2 and 3, second threaded holes 13 are formed in four corners of the top of the housing 1, second bolts 14 are arranged in four corners of the top of the housing cover 2, and bolt tails of the second bolts 14 penetrate through the housing cover 2 and are in threaded connection with the second threaded holes 13, so that the housing cover 2 and the housing 1 are fixed.
The utility model discloses the theory of operation: use second bolt 14 and second screw hole 13, fix between cap 2 and casing 1, through connecting plate 10 and auxiliary tank 15, install heat-conducting plate 8 between limiting plate 7 and casing 1, and use first bolt 12 and first screw hole 11, fix between connecting plate 10 and the limiting plate 7, thereby better with the fixed restriction of heat-conducting plate 8 between limiting plate 7 and casing 1, heat-conducting plate 8 is derived the heat that transient suppression diode and IC chip produced in with casing 1, and disperse through fin 9, thereby reach radiating effect, and conveniently install heat-conducting plate 8 and fin 9 and dismantle, thereby be favorable to the maintenance clearance, moreover, the steam generator is simple in structure, and convenient for operation, therefore, the clothes hanger is strong in practicability.
The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.
Claims (6)
1. A transient suppression high side overvoltage protection IC comprising a housing (1), characterized in that: the shell is characterized in that a shell cover (2) is arranged at the top of the shell (1), a transient suppression diode placing groove (3) and an IC chip placing groove (4) are arranged in the shell (1), connecting grooves (5) are symmetrically formed in two sides of the shell (1), a mounting groove (6) is formed in the bottom of the shell (1), a limiting plate (7) and a heat-conducting plate (8) are arranged in the mounting groove (6), the limiting plate (7) is arranged at the bottom of the mounting groove (6), the limiting plate (7) is fixedly connected with the shell (1), two ends of the heat-conducting plate (8) are arranged between the limiting plate (7) and the shell (1), radiating fins (9) are equidistantly arranged at the bottom of the heat-conducting plate (8), the radiating fins (9) are arranged between the limiting plate (7) and the limiting plate (7), and a connecting plate (10), and both ends of the connecting plate (10) are provided with limiting plates (7) between the shell (1).
2. The transient suppression high side overvoltage protection IC of claim 1, wherein: the bottom of the connecting plate (10) is provided with first threaded holes (11), and the first threaded holes (11) are symmetrically arranged on two sides of the connecting plate (10).
3. A transient suppression high side overvoltage protection IC in accordance with claim 2 wherein: the bottom of the limiting plate (7) is provided with a first bolt (12), and the bolt tail of the first bolt (12) penetrates through the limiting plate (7) and is in threaded connection with the first threaded hole (11).
4. The transient suppression high side overvoltage protection IC of claim 1, wherein: and four corners of the top of the shell (1) are provided with second threaded holes (13).
5. The transient suppression high side overvoltage protection IC of claim 4, wherein: and the four corners of the top of the shell cover (2) are provided with second bolts (14), and the bolt tails of the second bolts (14) penetrate through the shell cover (2) and are in threaded connection with second threaded holes (13).
6. The transient suppression high side overvoltage protection IC of claim 1, wherein: an auxiliary groove (15) is formed in the middle of the bottom of the connecting plate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021966366.1U CN213093196U (en) | 2020-09-10 | 2020-09-10 | Transient suppression high-side overvoltage protection IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021966366.1U CN213093196U (en) | 2020-09-10 | 2020-09-10 | Transient suppression high-side overvoltage protection IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213093196U true CN213093196U (en) | 2021-04-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021966366.1U Active CN213093196U (en) | 2020-09-10 | 2020-09-10 | Transient suppression high-side overvoltage protection IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213093196U (en) |
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2020
- 2020-09-10 CN CN202021966366.1U patent/CN213093196U/en active Active
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