CN213092968U - Reduce paster inductance packaging hardware of glue loss - Google Patents
Reduce paster inductance packaging hardware of glue loss Download PDFInfo
- Publication number
- CN213092968U CN213092968U CN202022394898.9U CN202022394898U CN213092968U CN 213092968 U CN213092968 U CN 213092968U CN 202022394898 U CN202022394898 U CN 202022394898U CN 213092968 U CN213092968 U CN 213092968U
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- CN
- China
- Prior art keywords
- packaging
- glue
- groove
- chip inductor
- storage cavity
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 74
- 239000003292 glue Substances 0.000 title claims abstract description 50
- 238000003860 storage Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model relates to a reduce paster inductance packaging hardware of glue loss, including the encapsulation platform, the encapsulation platform has seted up the encapsulation groove, the lower extreme in encapsulation groove is equipped with a supporting bench, the supporting bench sets up on first telescopic link; the packaging table is provided with four glue dispensing devices along the periphery of the packaging groove; the adhesive dispensing device comprises: the packaging plate is connected with the second telescopic rod, the other end of the second telescopic rod is connected to the packaging table, a groove is formed in the packaging plate, the glue storage cavity is of a hollow cylindrical structure, one end of the glue storage cavity is communicated with the groove through a hose, and the pressing rod is movably arranged at the other end of the glue storage cavity. The utility model discloses simple structure can realize the encapsulation operation to the paster inductance automatically, adopts four-point packaging mode can have the use amount of effectively practicing thrift glue, and economic nature is good, and practical value is high.
Description
Technical Field
The utility model relates to a paster inductance packaging technology field especially relates to a reduce paster inductance packaging hardware of glue loss.
Background
Paster inductance, also known as power inductance, heavy current inductance and surface mounting high power inductance, paster inductance encapsulation mainly is with epoxy glue seal fill out its gap, traditional paster inductance packaging mode is with high condensed ring oxygen glue point on its gap, it wipes glue into the gap to dip in the cloth of alcohol through the manual work, the purpose of cleaning is for guaranteeing paster inductance gap peripheral pleasing to the eye and the clean incomplete glue of central code printing district, but need the whole handheld paster inductance of workman to process when traditional mode encapsulation, the encapsulation operation is slow, inefficiency and extravagant glue.
SUMMERY OF THE UTILITY MODEL
(1) Technical problem to be solved
The embodiment of the utility model provides a reduce paster inductance packaging hardware of glue loss can reduce the use amount of glue when paster inductance encapsulation.
(2) Technical scheme
The utility model provides a chip inductor packaging device for reducing glue loss, which comprises a packaging table, wherein a packaging groove is formed on the packaging table, a supporting table is arranged at the lower end of the packaging groove, and the supporting table is arranged on a first telescopic rod; the packaging table is provided with four glue dispensing devices along the periphery of the packaging groove; the adhesive dispensing device comprises: the packaging plate is connected with the second telescopic rod, the other end of the second telescopic rod is connected to the packaging table, a groove is formed in the packaging plate, the glue storage cavity is of a hollow cylindrical structure, one end of the glue storage cavity is communicated with the groove through a hose, and the pressing rod is movably arranged at the other end of the glue storage cavity.
Further, the packaging table is horizontally arranged.
Further, the first telescopic rod is vertically arranged.
Further, the first telescopic rod and the second telescopic rod are both cylinders.
Further, the cross section of the packaging groove is of a square structure.
Furthermore, the four glue dispensing devices are uniformly arranged at the corners of the square structure of the packaging groove.
Further, the package board is an L-shaped structure and is used for abutting against corners of the chip inductor.
Further, the second telescopic rod is arranged in parallel to the plane where the packaging table is located.
Furthermore, a piston skin is arranged on the peripheral wall of one end of the pressing rod, which is arranged in the glue storage cavity.
Further, store up and glue the vertical setting in chamber, just store up and glue the chamber and pass through the connecting rod and connect in on the encapsulation platform.
(3) Advantageous effects
The utility model discloses simple structure can realize the encapsulation operation to the paster inductance automatically, adopts four-point packaging mode can have the use amount of effectively practicing thrift glue, and economic nature is good, and practical value is high.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a chip inductor packaging apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic top view of a package stage according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of an encapsulation plate in an embodiment of the present invention.
In the figure: the packaging device comprises a packaging table 1, a packaging groove 2, a supporting table 3, a first telescopic rod 4, a glue dispensing device 5, a packaging plate 51, a groove 511, a second telescopic rod 52, a glue storage cavity 53, a pressing rod 54, a piston skin 541, a hose 55 and a connecting rod 6.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the invention, but are not intended to limit the scope of the invention, i.e., the invention is not limited to the embodiments described, but covers any modifications, substitutions and improvements in the parts, components and connections without departing from the spirit of the invention.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The present application will be described in detail with reference to the accompanying drawings 1-3, in conjunction with an embodiment.
Referring to fig. 1 to 3, a chip inductor packaging device for reducing glue loss according to an embodiment of the present invention includes a packaging table 1, a packaging groove 2 is formed on the packaging table 1, a supporting table 3 is arranged at a lower end of the packaging groove 2, and the supporting table 3 is arranged on a first telescopic rod 4; the packaging table 1 is provided with four glue dispensing devices 5 along the periphery of the packaging groove 2; the dispensing device 5 includes: the packaging structure comprises a packaging plate 51, a second telescopic rod 52, a glue storage cavity 53 and a pressing rod 54, wherein the outer side of the packaging plate 51 is connected with the second telescopic rod 52, the other end of the second telescopic rod 52 is connected to the packaging table 1, a groove 511 is formed in the packaging plate 51, the glue storage cavity 53 is of a hollow cylindrical structure, one end of the glue storage cavity is communicated with the groove 511 through a hose 55, and the pressing rod 54 is movably arranged at the other end of the glue storage cavity 53.
Specifically, encapsulation platform 1 level sets up, the vertical setting of first telescopic link 4, first telescopic link 4 with second telescopic link 52 is the cylinder, the cross-section of encapsulation groove 2 is square structure, four adhesive deposite device 5 evenly sets up the corner of the square structure of encapsulation groove 2, packaging board 51 is L shape structure, be used for with the corner butt of chip inductor, second telescopic link 52 is parallel encapsulation platform 1 place plane sets up, press the stick 54 to set up store up and be equipped with piston skin 541 on the perisporium of the one end in the gluey chamber 53, store up the vertical setting in gluey chamber 53, just store up gluey chamber 53 and connect through connecting rod 6 encapsulation platform 1 is last.
The working principle is as follows: in the embodiment of the utility model, firstly, the support table 3 is supported by the first telescopic rod 4 and can move up and down, so that the support table 3 can be lifted up by the upward movement of the first telescopic rod 4 before the chip inductor is packaged, and an operator can conveniently place the chip inductor on the upper side of the support table; then, the first telescopic rod 4 drives the support table 3 to move downwards until the plane of the chip inductor moves to be coplanar with the plane of the dispensing device 5; then, four adhesive deposite device 5 that set up are from tightening the paster inductance all around, specifically do: the second telescopic rod 52 in each spot gluing device 5 is pushed forward, the L-shaped packaging plate 51 compresses the corner of the chip inductor, the groove 511 on the packaging plate 51 just faces the position of the chip inductor to be packaged, and then the pressing rod 54 is pushed, the pressing rod 54 pushes the glue in the glue storage cavity 53 to be injected into the groove 511 through the hose 55, so that the glue packaging work of the packaged part of the chip inductor is sequentially realized. Finally, the pushing of the pressing rod 54 is stopped, the second telescopic rod 52 retracts, and the first telescopic rod 4 rises, so that the worker can pick up the packaged chip inductor conveniently.
To sum up, the utility model discloses simple structure can realize automatically that the use amount of glue can effectively be practiced thrift to the encapsulation operation of paster inductance to the four-point packaging mode, and economic nature is good, and practical value is high.
It should be clear that the embodiments in this specification are described in a progressive manner, and the same or similar parts in the embodiments are referred to each other, and each embodiment focuses on the differences from the other embodiments. For embodiments of the method, reference is made to the description of the apparatus embodiments in part. The present invention is not limited to the specific steps and structures described above and shown in the drawings. Also, a detailed description of known process techniques is omitted herein for the sake of brevity.
The above description is only an example of the present application and is not limited to the present application. Various modifications and alterations to this application will become apparent to those skilled in the art without departing from the scope of this invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.
Claims (10)
1. A chip inductor packaging device capable of reducing glue loss is characterized by comprising a packaging table, wherein a packaging groove is formed in the packaging table, a supporting table is arranged at the lower end of the packaging groove, and the supporting table is arranged on a first telescopic rod; the packaging table is provided with four glue dispensing devices along the periphery of the packaging groove; the adhesive dispensing device comprises: the packaging plate is connected with the second telescopic rod, the other end of the second telescopic rod is connected to the packaging table, a groove is formed in the packaging plate, the glue storage cavity is of a hollow cylindrical structure, one end of the glue storage cavity is communicated with the groove through a hose, and the pressing rod is movably arranged at the other end of the glue storage cavity.
2. A chip inductor packaging apparatus for reducing glue loss as claimed in claim 1, wherein said packaging stage is disposed horizontally.
3. A chip inductor packaging device for reducing glue loss according to claim 1 or 2, wherein the first telescopic rod is vertically disposed.
4. The chip inductor packaging apparatus for reducing glue loss according to claim 1, wherein the first and second telescoping rods are both air cylinders.
5. A chip inductor packaging device for reducing glue loss according to claim 1, wherein the cross section of the packaging groove is a square structure.
6. The chip inductor packaging device of claim 5, wherein four of the dispensing devices are uniformly disposed at corners of the square structure of the packaging groove.
7. The chip inductor packaging device of claim 1, wherein the packaging board has an L-shaped structure for abutting against corners of the chip inductor.
8. The chip inductor packaging apparatus for reducing glue consumption according to claim 1, wherein the second telescopic rod is disposed parallel to a plane on which the packaging stage is disposed.
9. The chip inductor packaging device of claim 1, wherein a piston skin is disposed on a peripheral wall of an end of the pressing rod disposed in the glue storage cavity.
10. The chip inductor packaging device capable of reducing glue loss according to claim 1, wherein the glue storage cavity is vertically arranged and connected to the packaging table through a connecting rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022394898.9U CN213092968U (en) | 2020-10-23 | 2020-10-23 | Reduce paster inductance packaging hardware of glue loss |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022394898.9U CN213092968U (en) | 2020-10-23 | 2020-10-23 | Reduce paster inductance packaging hardware of glue loss |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213092968U true CN213092968U (en) | 2021-04-30 |
Family
ID=75615020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022394898.9U Expired - Fee Related CN213092968U (en) | 2020-10-23 | 2020-10-23 | Reduce paster inductance packaging hardware of glue loss |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213092968U (en) |
-
2020
- 2020-10-23 CN CN202022394898.9U patent/CN213092968U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210430 |