CN213071091U - Gripper assembly for vertically holding semiconductor wafers - Google Patents
Gripper assembly for vertically holding semiconductor wafers Download PDFInfo
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- CN213071091U CN213071091U CN202021630114.1U CN202021630114U CN213071091U CN 213071091 U CN213071091 U CN 213071091U CN 202021630114 U CN202021630114 U CN 202021630114U CN 213071091 U CN213071091 U CN 213071091U
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- gripper assembly
- hole
- curved surface
- assembly according
- horseshoe
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Abstract
The utility model provides a holder subassembly for keeping semiconductor wafer vertically, including the horseshoe piece portion that has a piece thickness, this horseshoe piece portion has outside shape and inside circular shape on the front side and the opening on the opposite side of this front side, this inside circular shape is including returning back the portion, this portion of returning back has the flat surface that has the flat surface width, has the curved surface of curved surface width and the angle between this flat surface and this curved surface, this curved surface includes the through-hole between this inside circular shape and this outside shape, this through-hole has through-hole diameter and directional this open-ended the central axis.
Description
Technical Field
The utility model relates to a holder subassembly for keeping semiconductor wafer vertically.
Background
In the manufacture of modern semiconductor Integrated Circuits (ICs), it is necessary to deposit layers of different materials over previously formed layers and structures. However, previous configurations often made the top surface topography unsuitable for subsequent deposition of material layers. For example, when printing a lithographic pattern having a small geometry on a previously formed layer, a very shallow depth of focus is required. It is therefore necessary to have a flat and planar surface, otherwise some parts of the pattern will be in focus and other parts will not. In addition, if the irregularities are not flattened prior to certain processing steps, the surface topography of the substrate can become more irregular, which causes further problems due to layer stacking during further processing. Depending on the type of mold and geometry dimensions involved, surface irregularities can lead to poor yield and device performance. It is therefore desirable to achieve some type of planarization or polishing of the film during IC fabrication.
One method for achieving planarization of semiconductor substrates is Chemical Mechanical Polishing (CMP). In general, CMP involves relative movement of a semiconductor substrate relative to a polishing material to remove surface irregularities from the substrate. The polishing material is wetted with a polishing fluid typically comprising at least one of an abrasive or a chemical.
Once polished, the semiconductor substrate is transferred to a series of cleaning modules that remove abrasive particles and/or other contaminants that adhere to the substrate after polishing. The cleaning module must remove any residual polishing material before it can harden on the substrate and create defects. These cleaning modules may include, for example, an ultrasonic cleaner, one or more scrubbers, and a dryer. Cleaning modules that support the substrate in a vertical orientation are particularly advantageous because they also utilize gravity to enhance particle removal during the cleaning process, and they are generally more compact.
While current CMP systems have been shown to be robust and reliable systems, the configuration of the system equipment requires that substrates be cleaned in a variable and flexible process sequence.
SUMMERY OF THE UTILITY MODEL
The utility model provides a holder subassembly for keeping semiconductor wafer vertically, including the horseshoe piece portion that has a piece thickness, this horseshoe piece portion has outside shape and inside circular shape on the front side and the opening on the opposite side of this front side, this inside circular shape is including returning back the portion, this portion of returning back has the flat surface that has the flat surface width, has the curved surface of curved surface width and the angle between this flat surface and this curved surface, this curved surface includes the through-hole between this inside circular shape and this outside shape, this through-hole has through-hole diameter and directional this open-ended the central axis.
Drawings
Figure 1 shows a gripper assembly for vertically holding a semiconductor wafer according to the present invention. Which shows a top view and a side view along the a-a axis of the horseshoe-shaped piece portion 101.
A gripper assembly for vertically holding a semiconductor wafer comprises a horseshoe-shaped sheet portion 101, the horseshoe-shaped sheet portion 101 having a sheet thickness 102 having an outer shape and an inner circular shape 106 on a front side and an opening on a side opposite to the front side.
The inner circular shape 106 includes a setback having a setback depth 104, a flat surface with a flat surface width, a curved surface with a curved surface width, and an angle 103 between the flat surface and the circular surface.
The gripper assembly includes additional holes 105 to reduce the weight of the apparatus.
Figure 2 shows a detail of the gripper assembly shown in figure 1. The substrate holder assembly includes a hole having a larger diameter 201 near the outer shape and a smaller diameter 202 near the inner circular shape. In addition, a substrate width 203 is shown.
Fig. 3 shows a gripper assembly 301, the gripper assembly 301 comprising a semiconductor wafer 302 attached thereto and a hole 303, the hole 303 may be used to actively flush fluid to the edge or to suck back the remaining media of the semiconductor wafer.
Detailed Description
The primary purpose of the described gripper assembly is to hold a semiconductor wafer vertically. However, other round and flat workpieces may be held. Therefore, the description is not limited to other purposes of the apparatus.
The gripper assembly for vertically holding the semiconductor wafer preferably comprises a horseshoe-shaped piece having a circular shape on one side and an opening on the other side.
The circular shape of the horseshoe-shaped piece is made large enough so that a semiconductor wafer can be placed therein. Thus, the preferred size of the horseshoe-shaped piece portion may vary for each size of semiconductor wafer.
The horseshoe-shaped sheet portion comprises a return portion extending around an inner side of the sheet portion. The setback includes a first end and an opposite second end. Preferably, both ends have the same geometry.
Figure 1 shows a preferred form of the substrate holder described. Which shows a top view and a side view along the a-a axis of the horseshoe-shaped piece portion 101. A gripper assembly for vertically holding a semiconductor wafer comprises a horseshoe-shaped sheet portion 101, the horseshoe-shaped sheet portion 101 having a sheet thickness 102 having an outer shape and an inner circular shape 106 on a front side and an opening on a side opposite to the front side. The inner circular shape 106 includes a setback having a setback depth 104, a flat surface with a flat surface width, a curved surface with a curved surface width, and an angle 103 between the flat surface and the circular surface. The gripper assembly includes additional holes 105 to reduce the weight of the apparatus.
Preferably, both ends of the sheet portion include a recess on the inner side adapted to hold the semiconductor wafer. The bottom of the recess preferably comprises a through hole having a diameter and a central axis directed towards the opening of the sheet.
The aperture may be used both as a drain system during withdrawal of the semiconductor wafer from the bath and as an active liquid supply or withdrawal system to remove possible particles and etch chemistries in that area. Thus, fluid can flow freely or under pressure through the hole, thus cleaning the area where the semiconductor wafer contacts the wafer portion from liquid and possible particles. In order to avoid cross-contamination from one tank to another, a suck-back function may also be used, especially when chemical etching is performed with the same piping system. The effect is optimal if the centre axis of the through hole is directed towards the opening of the tab.
More preferably, the maximum diameter of the through hole is less than the width of the groove and greater than 60% of the width of the groove. The diameter of the through-hole is preferably large enough to allow fluid to flow through the through-hole without the use of other means than gravity. More preferably, the diameter near the outside of the sheet portion is larger than the diameter near the inside of the sheet portion.
The setback depth is preferably no greater than 10 mm. More preferably, the depth is not greater than 5 mm. Therefore, the semiconductor wafer can be easily held therein.
And the height of the run-back is not more than 20mm, more preferably not more than 5 mm.
Claims (10)
1. A gripper assembly for vertically holding a semiconductor wafer, comprising
A horseshoe-shaped sheet portion having a sheet portion thickness,
the horseshoe-shaped piece has an outer shape and an inner circular shape on a front side and an opening on a side opposite to the front side, the inner circular shape comprising a setback having a flat surface with a flat surface width, a curved surface with a curved surface width and an angle between the flat surface and the curved surface, characterized in that the curved surface comprises a through hole between the inner circular shape and the outer shape, the through hole having a through hole diameter and a central axis directed towards the opening.
2. Gripper assembly according to claim 1,
the via diameter is not greater than 90% and not less than 10% of the curved surface width.
3. Gripper assembly according to claim 1,
the diameter of the through hole in the inner circular shape is smaller than the diameter of the through hole in the outer shape.
4. Gripper assembly according to claim 1,
the horseshoe-shaped piece portion includes two through holes arranged on the horseshoe-shaped piece portion axisymmetrically.
5. Gripper assembly according to claim 1,
the larger angle between the central axis and the curved surface in the vicinity of the through hole is not less than 130 °.
6. Gripper assembly according to claim 1,
the angle between the flat surface and the curved surface is not less than 90 °.
7. Gripper assembly according to claim 1,
the through-hole is designed to receive a connection for flushing or sucking back etching chemistry from the contact area between the wafer and the holder with a fluid.
8. Gripper assembly according to claim 1,
the depth of the receding portion is not more than 10 mm.
9. Gripper assembly according to claim 1,
the height of the retraction part is not more than 20 mm.
10. Gripper assembly according to claim 1,
a semiconductor wafer is attached to the gripper assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021630114.1U CN213071091U (en) | 2020-08-07 | 2020-08-07 | Gripper assembly for vertically holding semiconductor wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021630114.1U CN213071091U (en) | 2020-08-07 | 2020-08-07 | Gripper assembly for vertically holding semiconductor wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213071091U true CN213071091U (en) | 2021-04-27 |
Family
ID=75580792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021630114.1U Active CN213071091U (en) | 2020-08-07 | 2020-08-07 | Gripper assembly for vertically holding semiconductor wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213071091U (en) |
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2020
- 2020-08-07 CN CN202021630114.1U patent/CN213071091U/en active Active
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