CN213057101U - Shock attenuation wafer delivery wagon - Google Patents
Shock attenuation wafer delivery wagon Download PDFInfo
- Publication number
- CN213057101U CN213057101U CN202021254922.2U CN202021254922U CN213057101U CN 213057101 U CN213057101 U CN 213057101U CN 202021254922 U CN202021254922 U CN 202021254922U CN 213057101 U CN213057101 U CN 213057101U
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- Prior art keywords
- wafer
- mounting panel
- vehicle body
- wheel
- sides
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000035939 shock Effects 0.000 title claims abstract description 29
- 238000013016 damping Methods 0.000 claims abstract description 36
- 238000012546 transfer Methods 0.000 claims abstract description 9
- 235000012431 wafers Nutrition 0.000 claims description 52
- 230000006978 adaptation Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 7
- 239000004065 semiconductor Substances 0.000 abstract description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
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Abstract
The utility model discloses a wafer delivery wagon with shock attenuation effect relates to semiconductor material transfer equipment technical field. The utility model comprises a vehicle body, wherein four corners of the bottom of the vehicle body are respectively provided with a wheel assembly, the wheel assembly is connected with the vehicle body through a damping assembly, the damping assembly comprises four upright posts welded with the bottom of the vehicle body into a whole, a damping spring sleeved on the upright posts and a nut fixedly connecting the wheel assembly on the upright posts; the wheel subassembly includes mount pad and wheel, the mount pad includes mounting panel and the connecting plate of setting in the mounting panel both sides, and four stands pass four through-holes on the mounting panel respectively, lower extreme and nut threaded connection, damping spring is located between mounting panel and the automobile body bottom, and the cover is established on the stand. The utility model discloses a shock attenuation wafer delivery wagon has good shock attenuation effect, can control the minimum level of vibration to keep the transfer of high quality, complete wafer.
Description
Technical Field
The utility model relates to a semiconductor material transfer device technical field, more specifically say and relate to a shock attenuation wafer delivery wagon that says so.
Background
The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon with the purity as high as 99.999999999 percent. The wafer manufacturer melts the polysilicon, seeds are seeded into the melt, and then the seed is slowly pulled out to form a cylindrical monocrystalline silicon ingot, and the process is called 'crystal growth' because the silicon ingot is formed by the gradual generation of the seeds determined by the orientation of one crystal plane in the molten silicon raw material. The silicon crystal bar is cut, barreled, sliced, chamfered, polished, laser etched and packed to form the basic material of semiconductor circuit factory, i.e. silicon wafer.
In the semiconductor manufacturing industry, wafers are required to be transported, and are sensitive to shock and vibration. If vibration and impact are out of control, the defects of cracks, breakage and the like can be caused to the wafer. Therefore, it is required to specially design a cart having a high shock-absorbing effect. Meanwhile, wafer products are generally heavier, and the problems of safety and efficiency balance exist in the transportation process. At present, the wafer transport vehicle on the market can only transport one wafer at a time under the premise of ensuring the operation safety.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defect and not enough that exist among the above-mentioned prior art, the utility model provides a shock attenuation wafer delivery wagon, the utility model aims to provide a handcart with good shock attenuation effect to satisfy in the semiconductor production industry, to the transportation of wafer, can not cause the condition such as crackle, fracture to appear in the wafer. The utility model discloses a shock attenuation wafer delivery wagon has good shock attenuation effect, can control the minimum level of vibration to keep the transfer of high quality, complete wafer. Meanwhile, the automatic wafer conveying device has good ergonomic design, and can convey six wafers at a time on the premise of ensuring the operation safety, so that the safe and efficient conveying operation is realized.
According to the utility model discloses a shock attenuation wafer delivery wagon, which comprises a carriage body, bottom of the car body's four corners is provided with wheel assembly, its characterized in that respectively: the car body is provided with a wafer containing bin for placing wafers, and bin doors are arranged on two sides of the wafer containing bin; the wheel assembly is connected with the vehicle body through a damping assembly, the damping assembly comprises four upright columns welded with the bottom of the vehicle body into a whole, a damping spring sleeved on the upright columns and a nut for fixedly connecting the wheel assembly on the upright columns; the wheel assembly comprises a mounting seat and wheels, the mounting seat comprises a mounting plate and connecting plates arranged on two sides of the mounting plate, the connecting plates are oppositely arranged on two sides of the mounting plate, the upper ends of the connecting plates are connected with the mounting plate, a rotating shaft is arranged between the lower ends of the connecting plates on two sides, and the wheels are arranged between the connecting plates on two sides through the rotating shaft; the damping device is characterized in that through holes matched with the four stand columns are formed in the mounting plate, the four stand columns penetrate through the four through holes in the mounting plate respectively, the lower ends of the four stand columns are in threaded connection with the nuts, and the damping springs are located between the mounting plate and the bottom of the vehicle body and sleeved on the stand columns. The utility model designs a wafer transport shock attenuation car with good shock attenuation effect, its shock attenuation effect is realized through the damper between wheel subassembly and the automobile body bottom, four stands support and direction for damper and wheel subassembly among the damper, when the automobile body is at transportation process, the vibration of wheel can pass through damper's absorption, make on the vibration of wheel can not conduct the automobile body, or on less some vibration transmits the automobile body, can be at minimum level with the vibration control of automobile body, keep high quality, the transfer of complete wafer.
According to the utility model discloses an embodiment, the mounting panel of mount pad and the connecting plate integrated into one piece of setting in the mounting panel both sides, and the mount pad is whole to be "U" type of falling. Mounting panel and connecting plate integrated into one piece, firstly convenient processing, secondly ensure the uniformity of four wheel assembly models, the vibration of wheel can be absorbed by damping spring more effectively.
According to the utility model discloses an embodiment, the wheel includes wheel hub and rim, the rim adopts the rubber material to make. The wheel of this application itself has certain shock attenuation effect, and the rim of rubber material also can reduce partly vibration.
An upper layer of wafer containing bin and a lower layer of wafer containing bin are arranged on the vehicle body.
The wafer transport vehicle with the good damping effect is designed, the damping effect is achieved through the damping assembly between the wheel assembly and the bottom of the vehicle body, the four stand columns in the damping assembly provide support and guide for the damping spring and the wheel assembly, and when the vehicle body is transported, vibration of the wheel can be absorbed through the damping spring, so that the vibration of the wheel is not transmitted to the vehicle body, or a small part of vibration is transmitted to the vehicle body, the vibration of the vehicle body can be controlled at the lowest level, and high-quality and complete transfer of wafers is kept; the mounting plate and the connecting plate are integrally formed, so that the machining is convenient, the consistency of the models of the four wheel assemblies is ensured, and the vibration of the wheels can be more effectively absorbed by the damping spring; the wheel of this application itself has certain shock attenuation effect, and the rim of rubber material also can reduce partly vibration.
Drawings
FIG. 1 is a schematic view of the overall structure of the damping transportation truck of the present invention;
FIG. 2 is a schematic view of the mounting structure of the wheel assembly and the shock-absorbing assembly in the shock-absorbing transporting vehicle of the present invention;
reference numerals: 1. the automobile body, 2, wafer hold storehouse, 3, door, 4, stand, 5, nut, 6, damping spring, 7, mount pad, 8, wheel, 9, mounting panel, 10, connecting plate, 11, pivot, 12, wheel hub, 13, rim.
Detailed Description
The technical solution of the present invention will be further elaborated with reference to the drawings attached to the description.
Example 1
As a preferred embodiment of the present invention, referring to fig. 1 and 2 of the specification, the present embodiment discloses:
a shock absorption wafer conveying vehicle comprises a vehicle body 1, wherein wheel assemblies are respectively arranged at four corners of the bottom of the vehicle body 1, a wafer containing bin 2 for containing wafers is arranged on the vehicle body 1, and a bin door 3 is arranged on one side of the wafer containing bin 2; the wheel assembly is connected with the vehicle body 1 through a damping assembly, the damping assembly comprises four upright posts 4 welded with the bottom of the vehicle body 1 into a whole, a damping spring 6 sleeved on the upright posts 4 and a nut 5 fixedly connecting the wheel assembly on the upright posts 4; the wheel assembly comprises a mounting seat 7 and wheels 8, the mounting seat 7 comprises a mounting plate 9 and connecting plates 10 arranged on two sides of the mounting plate 9, the connecting plates 10 are oppositely arranged on two sides of the mounting plate 9, the upper end of each connecting plate 10 is connected with the mounting plate 9, a rotating shaft 11 is arranged between the lower ends of the connecting plates 10 on two sides, and the wheels 8 are arranged between the connecting plates 10 on two sides through the rotating shafts 11; set up the through-hole with four stands 4 adaptations on the mounting panel 9, four stands 4 pass four through-holes on the mounting panel 9 respectively, lower extreme and nut 5 threaded connection, damping spring 6 is located between mounting panel 9 and the 1 bottom of automobile body, and the cover is established on stand 4. The application has designed a shock attenuation wafer delivery wagon that has good shock attenuation effect, its shock attenuation effect is realized through the damper between wheel subassembly and the 1 bottom of automobile body, four stands 4 support and direction for damper 6 and wheel subassembly provide among the damper, when automobile body 1 in transportation process, absorb the vibration of wheel 8 through damper 6, make the vibration of wheel 8 can not conduct on automobile body 1, or on less some vibrations transmit automobile body 1, can be at the minimum level with the vibration control of automobile body 1, keep high quality, the transfer of complete wafer.
Example 2
As another preferred embodiment of the present invention, referring to fig. 1 and 2 of the specification, the present embodiment discloses:
a shock absorption wafer conveying vehicle comprises a vehicle body 1, wherein wheel assemblies are respectively arranged at four corners of the bottom of the vehicle body 1, a wafer containing bin 2 for containing wafers is arranged on the vehicle body 1, and a bin door 3 is arranged on one side of the wafer containing bin 2; the wheel assembly is connected with the vehicle body 1 through a damping assembly, the damping assembly comprises four upright posts 4 welded with the bottom of the vehicle body 1 into a whole, a damping spring 6 sleeved on the upright posts 4 and a nut 5 fixedly connecting the wheel assembly on the upright posts 4; the wheel assembly comprises a mounting seat 7 and wheels 8, the mounting seat 7 comprises a mounting plate 9 and connecting plates 10 arranged on two sides of the mounting plate 9, the connecting plates 10 are oppositely arranged on two sides of the mounting plate 9, the upper end of each connecting plate 10 is connected with the mounting plate 9, a rotating shaft 11 is arranged between the lower ends of the connecting plates 10 on two sides, and the wheels 8 are arranged between the connecting plates 10 on two sides through the rotating shafts 11; set up the through-hole with four stands 4 adaptations on the mounting panel 9, four stands 4 pass four through-holes on the mounting panel 9 respectively, 4 lower extremes of stand and nut 5 threaded connection, damping spring 6 is located between mounting panel 9 and the 1 bottom of automobile body, and the cover is established on stand 4. Mounting panel 9 of mount pad 7 and the connecting plate 10 integrated into one piece that sets up in mounting panel 9 both sides, and the whole type that is down "U" of mount pad 7. Mounting panel 9 and connecting plate 10 integrated into one piece, firstly convenient processing, secondly ensure the uniformity of four wheel assembly models, damping spring 6 can absorb the vibration of wheel 8 more effectively.
Example 3
As another preferred embodiment of the present invention, referring to fig. 1 and 2 of the specification, the present embodiment discloses:
a shock absorption wafer conveying vehicle comprises a vehicle body 1, wherein wheel assemblies are respectively arranged at four corners of the bottom of the vehicle body 1, a wafer containing bin 2 for containing wafers is arranged on the vehicle body 1, and a bin door 3 is arranged on one side of the wafer containing bin 2; the wheel assembly is connected with the vehicle body 1 through a damping assembly, the damping assembly comprises four upright posts 4 welded with the bottom of the vehicle body 1 into a whole, a damping spring 6 sleeved on the upright posts 4 and a nut 5 fixedly connecting the wheel assembly on the upright posts 4; the wheel assembly comprises a mounting seat 7 and wheels 8, the mounting seat 7 comprises a mounting plate 9 and connecting plates 10 arranged on two sides of the mounting plate 9, the connecting plates 10 are oppositely arranged on two sides of the mounting plate 9, the upper end of each connecting plate 10 is connected with the mounting plate 9, a rotating shaft 11 is arranged between the lower ends of the connecting plates 10 on two sides, and the wheels 8 are arranged between the connecting plates 10 on two sides through the rotating shafts 11; set up the through-hole with four stands 4 adaptations on the mounting panel 9, four stands 4 pass four through-holes on the mounting panel 9 respectively, 4 lower extremes of stand and nut 5 threaded connection, damping spring 6 is located between mounting panel 9 and the 1 bottom of automobile body, and the cover is established on stand 4. The mounting plate 9 of the mounting seat 7 and the connecting plates 10 arranged on two sides of the mounting plate 9 are integrally formed, and the mounting seat 7 is integrally inverted U-shaped. According to an embodiment of the present invention, the wheel 8 comprises a hub 12 and a rim 13, the rim 13 is made of rubber. The wheel 8 of this application itself has certain shock attenuation effect, and the rim 13 of rubber material also can reduce partly vibration. An upper layer and a lower layer of wafer containing bins 2 are arranged on the vehicle body 1.
The detailed description set forth above in connection with the appended drawings describes exemplary embodiments but does not represent all embodiments that may be practiced or fall within the scope of the claims. The term "exemplary" used throughout this specification means "serving as an example, instance, or illustration," and does not mean "preferred" or "advantageous" over other embodiments. The detailed description includes specific details for the purpose of providing an understanding of the described technology. However, the techniques may be practiced without these specific details. In some instances, well-known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the described embodiments.
The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (5)
1. The utility model provides a shock attenuation wafer delivery wagon, includes automobile body (1), the four corners of automobile body (1) bottom is provided with wheel assembly, its characterized in that respectively: the wheel assembly is connected with the vehicle body (1) through a damping assembly, the damping assembly comprises four upright posts (4) integrally connected with the bottom of the vehicle body (1), a damping spring (6) sleeved on the upright posts (4) and a nut (5) for fixedly connecting the wheel assembly on the upright posts (4); the wheel assembly comprises a mounting seat (7) and wheels (8), the mounting seat (7) comprises a mounting plate (9) and connecting plates (10) arranged on two sides of the mounting plate (9), the connecting plates (10) are oppositely arranged on two sides of the mounting plate (9), the upper ends of the connecting plates (10) are connected with the mounting plate (9), a rotating shaft (11) is arranged between the lower ends of the connecting plates (10) on two sides, and the wheels (8) are mounted between the connecting plates (10) on two sides through the rotating shaft (11); set up on mounting panel (9) with the through-hole of four stand (4) adaptations, four stand (4) pass four through-holes on mounting panel (9) respectively, lower extreme and nut (5) threaded connection, damping spring (6) are located between mounting panel (9) and automobile body (1) bottom, and the cover is established on stand (4).
2. The shock absorbing wafer transport cart of claim 1, wherein: mounting panel (9) and the connecting plate (10) integrated into one piece that set up in mounting panel (9) both sides of mount pad (7), and mount pad (7) wholly is "U" type.
3. A shock absorbing wafer transfer cart as claimed in claim 1 or 2, wherein: the wheel (8) comprises a hub (12) and a rim (13), and the rim (13) is made of rubber.
4. A shock absorbing wafer transfer cart as claimed in claim 1 or 2, wherein: the wafer containing bin (2) for containing wafers is arranged on the cart body (1), and a bin door (3) is arranged on one side of the wafer containing bin (2).
5. The shock absorbing wafer transport cart of claim 4, wherein: an upper layer and a lower layer of wafer containing bins (2) are arranged on the vehicle body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021254922.2U CN213057101U (en) | 2020-06-30 | 2020-06-30 | Shock attenuation wafer delivery wagon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021254922.2U CN213057101U (en) | 2020-06-30 | 2020-06-30 | Shock attenuation wafer delivery wagon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213057101U true CN213057101U (en) | 2021-04-27 |
Family
ID=75569708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021254922.2U Expired - Fee Related CN213057101U (en) | 2020-06-30 | 2020-06-30 | Shock attenuation wafer delivery wagon |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213057101U (en) |
-
2020
- 2020-06-30 CN CN202021254922.2U patent/CN213057101U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210427 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |