CN213026087U - Micro device transfer device and system - Google Patents

Abstract

The utility model discloses a micro device transfer device and system belongs to the electron field of making. Aiming at the problems of low micro device transfer efficiency and high error rate in the prior art, the invention provides a micro device transfer device and a system, wherein the micro device transfer device comprises a receiving device for transferring a micro device to a transfer mechanism; and the switching mechanism comprises a projecting device and a transfer wheel arranged opposite to the receiving device, and transfers the micro device on the receiving device to the transfer substrate by utilizing the electrostatic induction transfer technology. The electrostatic induction transfer technology is used for carrying out mass transfer on the micro device, the mass transfer of the micro device can be realized, and the efficiency and the accuracy are high.

Description

Micro device transfer device and system

Technical Field

The utility model relates to an electron preparation technical field, more specifically say, relate to a micro device transfer device and system.

Background

The micro device has small size and high precision, the existing micro device is mainly transferred and assembled in an adsorption mode, such as a vacuum system adsorption transfer method, but the transfer efficiency is low, the cost is high, and the micro device is aimed at micro devices such as micro light-emitting diodes or other electronic micro devices.

With the development of optoelectronic technology, the volume of many optoelectronic components gradually decreases to a smaller size, and various Micro-display (Micro-display) technologies are introduced in a more successive manner in recent years. Among them, due to the breakthrough in the manufacturing size of the light emitting diode LED, the Micro light emitting diode, i.e., the Micro-LED display, manufactured by arranging the light emitting diodes in an array has been gradually emphasized in the market. The micro Light Emitting Diode display is not only comparable to an Organic Light Emitting Diode (OLED) display in terms of contrast and power consumption, but also has absolute advantages in reliability and life, and thus has great potential to become a mainstream display technology for wearable electronics applied to future mobile communication electronics and internet of things.

The micro light emitting diode display arranges the light emitting diodes in an array on the circuit substrate to form pixels of a projection picture or a display picture. In the fabrication of a micro-led display, a plurality of led components must be arranged on a substrate and aligned to predetermined contact locations on the substrate. When the color display, even full color display, is to be realized by using different color leds, how to achieve fast packaging and accurate alignment is a very important issue. The light emitting color of the light emitting elements includes red, green and blue, and the light emitting color of the light emitting elements may include other different colors, and in some embodiments, a light emitting element may emit light of a single color, or a light emitting element may emit light of different colors. The micro-led display technology is a self-luminous display technology, and the volume of the led is reduced to at least 1% of the original volume by the structure of the thin-film, micro-sized and arrayed led, and has the characteristics of low power consumption, high brightness, high resolution, high color saturation, fast response speed, long service life and the like, and the development potential of the micro-led display technology is very much focused. In the process of micro led production, how to realize "bulk die transfer" is the key to how to transfer a large number of micro leds onto a substrate. In the prior art, a Micro Electro Mechanical System (MEMS) is usually used to pick up a micro light emitting diode, however, the MEMS pick-up process has high requirements on the flatness, cleanliness, etc. of the substrate on which the micro light emitting diode is located before and after transfer, and the pick-up process is complex to control and has high cost.

The invention provides a micro light emitting diode transfer method, which provides an LED chip initial substrate provided with a plurality of LED chips, as disclosed in Chinese patent application No. 201711354228.0, published 2018, 5 and 8. Meanwhile, providing a transfer bottom plate provided with a plurality of grooves, and transferring the LED chips to the grooves to obtain the transfer bottom plate for bearing the LED chips. And providing a circuit substrate, bonding the transfer base plate and the circuit substrate, and welding the electrodes of the LED chips and the circuit substrate. Separating the transfer backplane from the circuit substrate. The LED chips are arranged on the LED chip initial substrate, and are transferred to the circuit substrate through the transfer bottom plate, so that a large number of LED chips can be transferred at a time, the production efficiency is improved, and the chip offset is avoided.

However, in the method described above, when manufacturing a micro led display panel, individual micro leds must be sucked and transferred to the display panel. Electrostatic forces, magnetic forces or vacuum suction are typically used to draw the micro-leds. And the above method cannot achieve the desired effect for smaller devices with a device size, light emitting components of 1 to 100 microns. The conventional electrostatic force suction transfer apparatus mainly uses the mems technology, which has the disadvantages of complex structure, high cost, and low yield. The conventional magnetic force suction transfer device also uses the mems technology, and thus has the disadvantages of complex structure, high cost, low yield, etc. In addition, the magnetic material needs to be additionally coated on the micro light emitting diode, thereby requiring additional manufacturing processes and costs. The conventional vacuum suction transfer apparatus uses a micro vacuum suction nozzle, and the ratio of the height to the inner diameter of the micro vacuum suction nozzle must be less than a critical value to ensure the suction capability. When the size of the micro light emitting diode is very small, the height and thickness of the vacuum suction nozzle are also reduced. Therefore, the suction transfer device is easily deformed to lower the suction efficiency during the operation, and even breaks the suction transfer device, so that the conventional vacuum suction transfer device is not suitable for the suction of small micro-components.

Disclosure of Invention

1. Technical problem to be solved

To the problem that micro device transfer efficiency is low, the error rate is high that exists among the prior art, the utility model provides a micro device transfer device and system, it can realize micro device's huge transfer, and is efficient, the rate of accuracy is good.

2. Technical scheme

The purpose of the utility model is realized through the following technical scheme.

A micro device transfer apparatus includes a projection apparatus and a receiving apparatus; the receiving device and the projecting device rotate or move relatively; photosensitive material layers are respectively arranged on the surfaces of the projection device and the receiving device; the photosensitive material layer senses the luminescence of the luminous sources of the projection device and the receiving device and the electricity distribution of the electricity distributor; the projecting device and the receiving device are respectively provided with a luminous source; the light source generates electric potential control on the surfaces of the photosensitive material layers of the projection device and the receiving device, and the projection device and the receiving device are respectively provided with a power distributor for distributing power on the surfaces of the projection device and the receiving device.

Furthermore, the light emitting source is arranged at the outer side or the inner side of the projection device and the receiving device.

Furthermore, the light source is a laser emitter or an LPH light source.

Furthermore, the projection device and the receiving device are of a single-roller structure, a belt type structure or a plane structure.

Furthermore, the belt type structure projection device comprises at least 2 rotating wheels and a photosensitive belt surrounding the periphery of the rotating wheels, wherein a photosensitive material layer is arranged on the photosensitive belt.

A micro device transfer system comprises the micro device transfer device, a transfer substrate passes between a transfer roller and a receiving device, and the transfer roller transfers micro devices on the receiving device to the transfer substrate.

A micro device transfer method comprises the following steps:

A. by adopting the transfer device or the transfer system, the projection device rotates or moves, the electrical distributor distributes electricity to generate high-potential negative static charge on the surface of the projection device, the high-potential negative static charge is converted into low-potential negative static charge at the position to be adsorbed with the micro device after being irradiated by the light emitting source, and the low-potential negative static charge on the surface of the projection device and the high-potential negative static charge of the micro device are utilized to generate a static effect to adsorb the micro device on the photosensitive material;

B. the surfaces of the projection device and the receiving device, which are provided with the photosensitive materials, are relatively moved, the electrical distributors of the corresponding devices respectively distribute electricity on the surfaces of the corresponding structures to generate high-potential negative static charges during the relative movement, and the projection device irradiates the surface of the projection device through the control light-emitting source without transferring the surface position of the position to generate low-potential negative static charges; when the projecting device and the receiving device rotate for the next circle or move for the next time, the electricity is distributed by the electricity distributor again to generate the high-potential negative static charges on the surface of the device, and then the light source is controlled to irradiate the next transfer position;

C. when the receiving device rotates or moves, the electricity distributor on the receiving device distributes electricity to generate high-potential negative static charges on the surface of the receiving device, the high-potential negative static charges are emitted to the position, corresponding to the micro device on the projection device, on the surface of the receiving device through the light emitted by the light emitting source, the low-potential negative static charges are generated by the light emitted by the light emitting source and irradiated on the surface of the receiving device, the high-potential negative static charges are generated on the corresponding micro device to be projected by the projection device, the receiving device is in the low-potential negative static charges, and the two static charges have potential difference to generate a static effect to adsorb and transfer; transferring the micro device on the projecting device to the receiving device;

the position of the micro device on the receiving device, which is not transferred, is not irradiated by the luminous source, so that the static charges with the surface potential being in a high potential negative state can not adsorb the static charges in a low potential negative state irradiated by the luminous source on the projecting device;

when the projecting device and the receiving device mutually rotate for the next circle or move for the next time, the projecting device and the receiving device are re-electrified by respective electrifying devices again, high-potential negative static charges are generated on the corresponding surfaces, the two groups of luminous sources respectively emit light and irradiate the corresponding positions of the projecting device and the receiving device, and the step B, C is repeated;

D. the transferring substrate passes through the space between the transfer printing roller and the receiving device, the photosensitive material of the receiving device is in negative static charge and the high-potential positive static charge is conducted by the transfer printing roller, the negative static charge and the high-potential positive static charge have potential difference to generate static effect, and the micro device on the photosensitive material of the receiving device is transferred onto the transferring substrate through the static effect;

E. the position of the next transfer substrate is changed by position difference or axial movement, and the position corresponds to the micro device projected next time;

F. the step B, C, D, E is repeated until the projection of the micro device on the projection device is completed.

Furthermore, the surface distance between the projection device and the receiving device is less than 3 mm.

Furthermore, the micro device transferred by the projection device and the receiving device in the micro device transferring method is in any pattern and size.

3. Advantageous effects

Compared with the prior art, the utility model has the advantages of:

the electric field transfer technology is adopted in the scheme, massive transfer of small-sized micro devices can be achieved, the transfer efficiency is high through a printing mode, the transfer accuracy is high, smooth and automatic transfer of the whole industry can be completed by combining corresponding detection and later-stage supplementary equipment, the cost is low, and the efficiency is high.

Drawings

FIG. 1 is a schematic view of a transfer device;

FIG. 2 is a side schematic view of the transfer device configuration;

FIG. 3 is a schematic side view of another configuration of the transfer device configuration;

FIG. 4 is a schematic view of the micro device being transferred from the projection device to the surface of the receiving device;

FIG. 5 is a schematic view of the transfer of the micro devices in group A1 from the projection device to the surface of the receiving device;

FIG. 6 is a schematic view of the transfer of the micro devices in group A2 from the projection device to the surface of the receiving device;

fig. 7 is a schematic structural diagram of a transfer device including a planar projection device.

The reference numbers in the figures illustrate:

1. a micro device; 202. a receiving device; 203. a transfer roller; 204. a projection device; 241. a photosensitive belt; 242. A rotating wheel; 5. transferring the substrate; 6. a distributor; 7. a light emitting source.

Detailed Description

The invention is described in detail below with reference to the drawings and specific examples.

Example 1

In order to solve the above problems, the present solution provides a transfer apparatus, a transfer system and a corresponding transfer method for a micro device designed by using an electrostatic force transfer technique.

The micro device 1 in this scheme is a micro light emitting diode or other micro electronic components, which may be a photoelectric component, such as a light emitting diode, a light sensing component, a solar cell, etc., or other electronic components unrelated to light, such as a sensor, a transistor, etc., within the scope of this scheme, a micro light emitting diode may be used as in this scheme. The present solution aims to transfer particles of the micro device 1 onto the transfer substrate 5 by the transfer device, and the transfer substrate 5 can be cut or set in an early stage according to the requirement in the later production.

As shown in fig. 1, 2 and 3, the micro device transferring apparatus of the present embodiment includes a projecting device 204, a receiving device 202 and a transfer roller 203, wherein the micro device 1 is placed on the projecting device 204, and the transfer substrate 5 is movable in the axial direction. The specific moving device can be various, for example, a guide rail device can be arranged above the moving device, and the motor drives the transfer substrate to move axially, so that the realization mode is various, and the description is omitted. As long as the transfer substrate can be moved axially. The projection device 204 and the receiving device 202 are each provided with a layer of photosensitive material, such as selenium, zinc oxide, cadmium sulfide, Organic photoconductor, etc., as the photosensitive material OPC of the printer, which is an Organic Photo-Conductor Drum in the english full name of the structure of the photosensitive material, and is called OPC for short. The OPC drum is a photoelectric converter formed by coating OPC material on the surface of conductive aluminium cylinder, and features that it is an insulator in dark place to maintain a certain static charge. When the light with a certain wavelength is irradiated. Becoming a conductor. The charge is discharged through the aluminum base, and an electrostatic latent image is formed. When the laser is irradiated from the inner side to the photosensitive material, the photosensitive material is a light-permeable material.

The receiving device 202 and the projecting device 204 move relatively, in this embodiment, roll relatively, and the micro device 1 attached to the projecting device 204 is transferred to the receiving device 202; the surface of the receiving device 202 is provided with a photosensitive material layer, the side surface of the receiving device 202 is provided with a distributor 6 and a light source 7, the light source 7 is a laser emitter or an LPH light source, the LPH is an LED printing Head, and the LPH is an LED (light Emitting diode) Print Head, so that the potential of the designated position on the surface of the photosensitive material can be reduced.

The electric distributor 6 distributes electricity to the surface of the receiving device 202, corresponding electric potential can be generated under general conditions, and then the light emitting source 7 projects at a position corresponding to the requirement, because of the characteristics of the photosensitive material layer, electrons at the illumination position can be eliminated, corresponding potential difference is generated, the corresponding micro device 1 is adsorbed through the potential difference, in specific work, the micro device 1 which can directly transfer high-potential negative static charge on the surface of the projecting device 204 is often rotated once, the distance between the receiving device 202 and the projecting device 204 can be set according to the requirement, as long as smooth transfer can be ensured, the distance smaller than 3mm can be designed in the embodiment. The corresponding projection device 204 can be in various forms, such as a single roller type as shown in fig. 1, or a belt type as shown in fig. 2, and a plane type as shown in fig. 7, as long as the relative projection with the receiving device 202 is ensured.

After the transfer by the receiving device 202 and the projecting device 204, the transfer roller 203 is disposed opposite to the receiving device 202 for transferring the micro devices 1 on the receiving device 202 onto the transfer substrate 5 passing between the transfer roller 203 and the receiving device 202.

The specific projection device 204 may be designed as a roller as shown in fig. 1, or as a belt type as shown in fig. 2, and includes at least 2 rotating wheels 242, and a photosensitive belt 241 surrounding the rotating wheels 242, and the corresponding electrical distributor 6 and the light emitting source 7 may be designed on the inner side or the outer side of the roller or the belt, and may be designed according to the requirement, for example, the roller or the belt is transparent or in other forms, and may be selected according to the requirement, as long as it is ensured that the corresponding potential is properly controlled, and the photosensitive belt 241 may be a light-transmitting film belt. The axial length of the light emitting source 7, the photosensitive layer surface and the distributor 6 on the receiving device 202 and the projecting device 204 is larger than that of all the transfer device combinations. The receiving device 202 may also be a roller design or a belt type design, which may be the same as the projecting device 204.

A micro device transfer system comprises a plurality of said micro device transfer apparatuses through which a transfer substrate 5 is passed, the transfer apparatuses transferring micro devices 1 on a receiving apparatus 202 onto the transfer substrate 5. For example, three RGB devices may be transferred, and three transfer devices may be disposed on one production line to transfer three color devices. The specific work time is designed according to the requirements, and the rotating speed of the corresponding transfer part, the power distribution time of the power distributor 6 and the light emitting source 7 and the light emitting area are reasonably controlled by the control system.

As shown in fig. 4, 5 and 6, a micro device transferring method includes the following steps:

A. by adopting the micro device transfer system, a specific installation structure and a support mode can be selected according to requirements, and how and installation are not repeated, the micro device transfer system can be integrally adsorbed, two ends of the micro device transfer system can be supported like a roller installed on a printer, and a corresponding shell is arranged for supporting the micro device transfer system, the projection device 204 rotates, the electricity distributor 6 distributes electricity on the surface of an OPC layer of the projection device 204 to generate high-potential negative electrostatic charge, the high-potential negative electrostatic charge is irradiated on the position to be adsorbed with the micro device through light, the high-potential negative electrostatic charge is converted into low-potential negative electrostatic charge, the micro device is placed on a tray conducting the high-potential negative electrostatic charge, and the micro device 1 is adsorbed on the projection device 204 by utilizing the electrostatic effect generated by the low-potential negative electrostatic charge of the photosensitive material and; the projection device 204 has the micro device 1 attached thereto; the scheme only can attract a single particle, and does not attract one piece, so that the one piece is easily attracted in the past. The arrangement of the light emitting source 7 and the electricity distributor 6 can ensure accurate adsorption.

B. The surfaces of the projecting device 204 and the receiving device 202 on which the photosensitive material layers are arranged move relatively, the charging devices 6 of the corresponding devices generate high-potential negative static charges by charging on the surfaces of the corresponding structures respectively during the relative movement, the projecting device 204 irradiates on the surface of the projecting device 204 by controlling the light emitting source 7, namely LPH (low power height) to emit light, the surface position of the micro device 1 which needs to be transferred does not need to generate a low-potential negative static charge position, the light emitting source 7 does not emit light and irradiate, and the high-potential negative static charges are reserved. When the projection device 204 and the receiving device 202 rotate for the next circle, the electricity is distributed by the electricity distributor again to generate high-potential negative static charges on the surface of the device; controlling the illumination of the light-emitting source 7 to carry out the transfer of different positions;

C. when the receiving device 202 rotates, the electricity distributor on the receiving device 202 distributes electricity to generate high-potential negative static charges on the surface, by controlling the light emitting source 7 to emit light to irradiate the position corresponding to the micro device 1 to be received on the surface, the surface of the device generates electrostatic charges with negative low potential after being irradiated by the light emitting source 7, the micro device 1 to be projected by the corresponding projecting device 204 is in the electrostatic charges with negative high potential, the receiving device 202 is in the electrostatic charges with negative low potential, the two have potential difference, electrostatic effect is generated to attract and transfer the micro device 1 on the projecting device 204 to the receiving device 202, the micro device 1 on the projecting device 204 is transferred to the receiving device 202, the position of the micro device 1 on the receiving device 202 which is not transferred is realized, the light emitting source 7 does not emit light, so that the electrostatic charges with negative high potential on the surface are not attracted to the projecting device 204, and the micro device 1 which is irradiated by the light emitting source 7 and is;

when the projecting device 204 and the receiving device 202 move again, and are transferred next time, the electric distributor 6 is used to distribute electricity again, so as to generate high-potential negative static charges on the surface, the two groups of light-emitting sources 7 respectively emit light and irradiate the corresponding positions of the projecting device 204 and the receiving device 202, and the step B, C is repeated; the micro device 1 to be transferred for the next movement may specifically replace the new projection device 204 full of micro devices 1, similar to the manner of replacing the cartridge, or may also be full of micro devices 1 in the projection device 204 by projection or other manners, such as full of the projection device 204 by adsorbing particles in a micro device slot similar to a printer. There are many specific ways to re-mount the micro device 1, and the details are not repeated herein.

D. The transfer substrate 5 passes between the transfer roller 203 and the receiving device 202, the negative electrostatic charge on the surface of the receiving device 202 and the high-potential positive electrostatic charge conducted by the transfer roller 203 have a potential difference to generate an electrostatic effect, the micro device 1 on the receiving device 202 is transferred onto the transfer substrate 5 through the electrostatic effect, and the micro device is transferred onto the transfer substrate 5;

E. the next transfer substrate 5 changes position by a position difference or axial movement, corresponding to the next projection of the micro device 1;

F. and repeating the steps B.C.D and E until the micro device 1 on the projection device 204 is projected. The corresponding projection is completed.

In actual operation, the charge on the surface of the micro device 1 is the same as the polarity of the photosensitive material layer on the surface of the projecting device 204 and the photosensitive material layer on the surface of the receiving device 202, and is opposite to the polarity of the photosensitive material layer on the surface of the transfer roller 203. If the surface charge of the micro device 1 and the polarity of the projection device 204 are negative static potential, the polarity of the surface of the receiving device 202 is negative, and the polarity of the transfer roller 203 is positive static potential;

for example, the polarity of the electrostatic potential on the surface of the projection device 204 and the electrostatic potential on the surface of the receiving device 202 are positive, and the electrostatic potential on the transfer roller 203 is negative. The size of the static potential is in direct proportion to the size of the micro device 1, the size of the micro device 1 is increased, the static potential is also increased, the size of the micro device 1 is smaller than 200 mu m, and the micro device 1 which is very small can be transferred by the device.

The positive and negative potentials may be reversed, so long as the potential difference that can be absorbed is ensured to be generated. The potential is not limited to be positive or negative.

As shown in FIG. 4, the projection device 204 shown in FIG. 1 is used herein to describe a single wheel configuration;

the starting point of the projecting device 204 corresponds to the starting point 0,0 of the receiving device 202;

when the first circle is transferred, the electricity distributor 6 distributes electricity to generate high-potential negative static charges on the surface when the projector 204 rotates, the group position of the A1 micro devices, the light emitting source 7 does not emit light and irradiates to retain the high-potential negative static charges, the rest positions are irradiated by the light emitting source 7 to generate low-potential negative static charges, the positions irradiated by the light emitting source 7 on the corresponding receiving device 202 generate low-potential negative static charges, the light emitting sources 7 at the rest positions do not emit light and irradiate and retain the high-potential negative static charges, the group light emitting source 7 corresponding to the A1 micro devices on the projector 204 does not emit light and irradiates, and electrostatic force is generated by potential difference between the two positions, so that the group of the A1 micro devices on the projector 204 is adsorbed on the receiving device 202 and then is transferred to the transfer substrate; wherein the group of a1 micro devices comprises a1-1 a1-2 a1-3.

In the second transfer, the transfer substrate 5 is rotationally moved forward by a distance of one micro device 1 from the starting point X-axis direction,

when the projecting device 204 rotates, the distributor distributes electricity to generate high-potential negative static charges on the surface, the group position light-emitting sources 7 of the A2 micro devices do not emit light to irradiate and retain the high-potential negative static charges, the rest positions are irradiated by the light-emitting sources 7 to generate low-potential negative static charges, the positions corresponding to the positions irradiated by the light-emitting sources 7 on the receiving device 202 generate low-potential negative static charges, the other positions are not irradiated by the light-emitting sources 7 to retain the high-potential negative static charges, the group light-emitting sources 7 corresponding to the A2 micro devices on the projecting device 204 do not emit light to irradiate, and electrostatic forces are generated by potential differences between the positions, so that the group of the A2 micro devices on the projecting device 204 is adsorbed on the receiving device 202 and then is; wherein the group of a2 micro devices comprises a2-1 a2-2 a2-3.

In the third circle of transfer, the transfer substrate 5 moves forward by the distance of two micro devices 1 from the starting point X-axis direction, so that when the projecting device 204 and the receiving device 202 rotate for the next circle, the electrical charge is charged again by the charger to generate high-potential negative electrostatic charge on the surface of the photosensitive material, the light source 7 on the projecting device 204 does not emit light to irradiate the A3 micro device group, and the light source 7 on the receiving device 202 emits light to irradiate the corresponding position of the A3 micro device group, and electrostatic force is generated by the potential difference between the two groups, so that the group of A3 micro devices on the projecting device 204 is adsorbed on the receiving device 202 and then transferred onto the transfer substrate 5;

and sequentially transferring the array of the micro devices in the group A from front to back by the same method, and after the transfer of the array of the micro devices in the group A is finished, moving the transfer substrate 5 in the Y-axis direction of the starting point by the distance of one micro device 1 and returning to the zero point in the X-axis direction of the starting point to transfer the array of the micro devices in the group B, wherein the transfer is finished in the same way as the array of the micro devices in the group A. After the group B micro device array is transferred, the transfer substrate 5 moves the distance between the two micro devices in the Y-axis direction of the starting point and returns to the zero point in the X-axis direction to perform group C array transfer, the group C array transfer is completed, and the transfer of all the micro device group arrays to the transfer substrate 5 is completed in the same way.

The linear speed ratio of the receiving device 202 to the transfer roller 203 is 1:1, and the linear speed ratio of the receiving device 202 to the transfer substrate 5 is 1: 1.

The scheme can realize the massive transfer of the miniature device 1 with small size by an electric field transfer technology, has high transfer efficiency and good transfer accuracy by a printing mode, can complete the smooth and automatic transfer of the whole industry by combining corresponding detection and later supplementary equipment, and has low cost and high efficiency.

Example 2

As shown in fig. 7, the projection device 204 is designed in a planar manner and moves in one direction, the receiving device 202 rotates relatively on the projection device 204, the distributor 6 and the light emitting source 7 are respectively arranged on one side or two sides of the projection device 204 and are fixed, as long as the distributor 6 is ensured to be upstream in the moving direction, the light emitting source 7 is ensured to be downstream, thus, the distributor 6 distributes electricity first, then the light source 7 irradiates to generate potential difference, as shown in fig. 7, the distributor 6 is arranged on the upper side of the projector 204, the light source 7 is arranged on the lower side of the projector 204, a certain position of the projector 204 passes through the distributor 6 first and then reaches the light source 7, the distributor 6 distributes electricity to generate high potential negative static charge on the surface of the photosensitive material of the projector 204, the negative static charge is irradiated by the light source 7, converting the high potential negative electrostatic charge to a low potential negative electrostatic charge at the location where the micro device is to be attached;

specifically, the surfaces of the projection device 204 and the receiving device 202, on which the photosensitive materials are disposed, are relatively moved, the charging devices 6 of the corresponding devices respectively charge on the surfaces of the corresponding structures to generate high-potential negative static charges during the relative movement, and the projection device 204 irradiates the surface of the projection device 204 through the control light-emitting source 7 without generating low-potential negative static charges at the surface position of the transfer position; when the projection device 204 and the receiving device 202 rotate or move in a transfer mode, the electrical distributor distributes electricity again to generate the high-potential negative static charge on the surface of the device;

when the receiving device 202 rotates, the electricity distributor on the receiving device 202 distributes electricity to generate high-potential negative static charges on the surface, by controlling the light emitting source 7 to emit light to irradiate the position corresponding to the micro device 1 to be received on the surface, the surface of the device generates electrostatic charges with negative low potential after being irradiated by the light emitting source 7, the micro device 1 to be projected by the corresponding projecting device 204 is in the electrostatic charges with negative high potential, the receiving device 202 is in the electrostatic charges with negative low potential, the two have potential difference, electrostatic effect is generated to attract and transfer the micro device 1 on the projecting device 204 to the receiving device 202, the micro device 1 on the projecting device 204 is transferred to the receiving device 202, the position of the micro device 1 on the receiving device 202 which is not transferred is realized, the light emitting source 7 does not emit light, so that the electrostatic charges with negative high potential on the surface are not attracted to the projecting device 204, and the micro device 1 which is irradiated by the light emitting source 7 and is;

when the projecting device 204 and the receiving device 202 move again, the next transfer is carried out, the electricity is distributed again by the respective electricity distributor 6, high-potential negative static charges are generated on the surface, and the two groups of light-emitting sources 7 respectively emit light and irradiate the corresponding positions of the projecting device 204 and the receiving device 202; the micro device 1 to be transferred in the next movement may specifically replace the new projection device 204 fully covering the micro devices 1, or the projection device 204 may move in the opposite direction, and after returning to the installation position, the micro devices 1 may be fully covered with the projection device 204 by projection or other methods. There are many specific ways to re-mount the micro device 1, and the details are not repeated herein.

The receiving device 202 may also be of planar design and may be of the same design as the projecting device 204. And moves relative to the projection device 204 as it moves.

The same planar-based projection device 204 transfer device as in example 1 may constitute a corresponding micro device transfer system, including several of the micro device transfer devices.

The invention and its embodiments have been described above schematically, without limitation, and the invention can be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The representation in the drawings is only one of the embodiments of the invention, the actual construction is not limited thereto, and any reference signs in the claims shall not limit the claims concerned. Therefore, if a person skilled in the art receives the teachings of the present invention, without inventive design, a similar structure and an embodiment to the above technical solution should be covered by the protection scope of the present patent. Furthermore, the word "comprising" does not exclude other elements or steps, and the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. Several of the components recited in the product claims may also be implemented by one component in software or hardware. The terms first, second, etc. are used to denote names, but not any particular order.

Claims (6)

1. A micro device transfer apparatus, comprising a projection apparatus (204) and a receiving apparatus (202); the receiving device (202) and the projecting device (204) rotate or move relatively; photosensitive material layers are respectively arranged on the surfaces of the projection device (204) and the receiving device (202), and light emitting sources (7) are respectively arranged on the projection device (204) and the receiving device (202); the projecting device (204) and the receiving device (202) are respectively provided with a distributor (6).

2. A micro device transfer apparatus according to claim 1, wherein the light source (7) is disposed outside or inside the projection means (204) and the receiving means (202).

3. A micro device transfer apparatus according to claim 2, wherein the light source (7) is a laser emitter or a LPH light source.

4. The micro device transfer apparatus of claim 1, wherein the projection device (204) and the receiving device (202) are of a single roller, belt, or planar configuration.

5. The micro device transfer apparatus according to claim 4, wherein the belt type structure projecting means (204) comprises not less than 2 rotating wheels (242), and a photosensitive belt (241) surrounding the periphery of the rotating wheels (242), the photosensitive belt (241) having a photosensitive material layer disposed thereon.

6. A micro device transfer system comprising a plurality of micro device transfer apparatuses according to any one of claims 1 to 5, wherein a transfer substrate (5) passes between the transfer roller (203) and the receiving apparatus (202), and the transfer roller (203) transfers the micro devices (1) on the receiving apparatus (202) to the transfer substrate (5).

Images