CN213025839U - Multi-electrode type patch ceramic capacitor - Google Patents
Multi-electrode type patch ceramic capacitor Download PDFInfo
- Publication number
- CN213025839U CN213025839U CN202021830022.8U CN202021830022U CN213025839U CN 213025839 U CN213025839 U CN 213025839U CN 202021830022 U CN202021830022 U CN 202021830022U CN 213025839 U CN213025839 U CN 213025839U
- Authority
- CN
- China
- Prior art keywords
- electrode
- ceramic body
- face
- electrodes
- ceramic capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
The utility model discloses a multi-electrode type surface-mounted ceramic capacitor, which comprises a ceramic body, a surface electrode and a bottom electrode; the surface electrodes are arranged on the upper surface of the ceramic body and are insulated from each other; the number of the bottom electrodes is one, and the bottom electrodes are arranged on the lower surface of the ceramic body; at least one surface electrode is completely opposite to the bottom electrode, and at least one surface electrode is partially opposite to the bottom electrode; each electrode on the upper surface of the traditional multi-electrode type patch ceramic capacitor is completely opposite to the common electrode, so that the surface electrodes with the areas decreasing by multiple are inconvenient to be connected with an external circuit; and the utility model discloses a multi-electrode type paster ceramic capacitor has at least a face electrode to be totally just right with the bottom electrode, makes every face electrode all have great area, has both kept multi-electrode type paster ceramic capacitor's circuit matching function, has reduced the counterpoint required precision when installing again to reduce installation cost.
Description
Technical Field
The utility model relates to a condenser technical field especially relates to a multi-electrode type paster ceramic capacitor.
Background
At present, a binary multi-electrode type patch ceramic capacitor is provided with a plurality of electrodes with areas changing by multiples on the upper surface of a ceramic dielectric layer, and a common electrode on the lower surface of the ceramic dielectric layer to form a plurality of capacitance values regularly changing by multiples (generally twice); the capacitor is an integrated design, has the characteristics of small size, compact structure and excellent high-frequency characteristic, is suitable for a microwave circuit, and is convenient for accurate debugging to realize the circuit matching function. The electrode on each upper surface is completely opposite to the common electrode, so that the capacitance value is determined by the area of the upper surface electrode, and the area of the upper surface electrode corresponding to the smaller capacitance value is smaller. The requirement for alignment accuracy is high when the electrode with a smaller area is connected with an external circuit, so that the installation cost is increased.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multi-electrode type paster ceramic capacitor, both kept multi-electrode type paster ceramic capacitor's circuit matching function, reduced the counterpoint required precision when installing again to simplify the installation, reduce installation cost.
The embodiment of the utility model provides a pair of multi-electrode type paster ceramic capacitor, include: a ceramic body, a face electrode and a bottom electrode; the surface electrodes are arranged on the upper surface of the ceramic body and are insulated from each other; the number of the bottom electrodes is one, and the bottom electrodes are arranged on the lower surface of the ceramic body; at least one of the face electrodes is completely opposite to the bottom electrode, and at least one of the face electrodes is partially opposite to the bottom electrode.
In one embodiment, the face electrodes include a first face electrode, a second face electrode, and a third face electrode;
the first surface electrode and the second surface electrode are completely opposite to the bottom electrode, and the third surface electrode is partially opposite to the bottom electrode; or, the first surface electrode is completely opposite to the bottom electrode, and the second surface electrode and the third surface electrode are both opposite to the bottom electrode.
In one embodiment, the face electrodes include a first face electrode, a second face electrode, a third face electrode, a fourth face electrode, and a fifth face electrode; the first surface electrode, the second surface electrode and the third surface electrode are all completely opposite to the bottom electrode, and the fourth surface electrode and the fifth surface electrode are all partially opposite to the bottom electrode.
In one embodiment, the lower surface of the ceramic body is divided into an electrode region and an insulating region, and the bottom electrode entirely covers the electrode region; the orthographic projection of at least one surface electrode on the lower surface of the ceramic body falls on the electrode area, and the orthographic projection part of at least one surface electrode on the lower surface of the ceramic body falls on the insulating area.
In one embodiment, the lower surface of the ceramic body has a first rectangular shape, the electrode region has a second rectangular shape having a notch at an outer edge thereof, four sides of the first rectangular shape overlap four sides of the second rectangular shape, the insulating region has the same shape as the notch, and the bottom electrode has the same shape as the electrode region.
In one embodiment, the shape of the notch includes a rectangle, a circle, a semicircle, or a diamond.
In one embodiment, the lower surface of the ceramic body has a rectangular shape, two adjacent sides of the electrode region overlap two sides of the rectangular shape, a gap exists between two adjacent sides of the electrode region and two other sides of the rectangular shape, the insulating region has the same shape as the gap, and the bottom electrode has the same shape as the electrode region.
In one embodiment, the edge of at least one of the face electrodes coincides with an edge of at least one side of the ceramic body, and the edge of at least one of the face electrodes is distant from the edge of any one side of the ceramic body.
In one embodiment, the facing areas of the plurality of face electrodes and the bottom electrode are in fixed proportion.
In one embodiment, the ceramic body has a symmetrical shape.
In the multi-electrode type patch ceramic capacitor of the embodiment, each of the surface electrodes has a larger area by making at least one of the surface electrodes face the bottom electrode, so that the circuit matching function of the multi-electrode type patch ceramic capacitor is maintained, and the requirement on alignment precision during installation is reduced, thereby reducing the installation cost.
Drawings
In order to more clearly illustrate the technical solution of the present invention, the drawings required for the embodiments will be briefly described below, and obviously, the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic view of a three-dimensional assembly structure of a multi-electrode type chip ceramic capacitor according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a surface electrode of a multi-electrode type patch ceramic capacitor according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a bottom electrode of a multi-electrode type chip ceramic capacitor according to an embodiment of the present invention;
fig. 4 is a schematic diagram illustrating an orthographic projection of a surface electrode of a multi-electrode type chip ceramic capacitor on a lower surface of the ceramic body and an overlap of a bottom electrode according to an embodiment of the present invention;
fig. 5 is a schematic view of a three-dimensional assembly structure of a multi-electrode type chip ceramic capacitor according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a surface electrode of a multi-electrode type patch ceramic capacitor according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a bottom electrode of a multi-electrode type chip ceramic capacitor according to an embodiment of the present invention;
fig. 8 is a schematic view showing an overlapping condition of an orthographic projection of a surface electrode of the multi-electrode type chip ceramic capacitor on the lower surface of the ceramic body and a bottom electrode according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be understood that the step numbers used herein are for convenience of description only and are not intended as limitations on the order in which the steps are performed.
It is to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
The terms "comprises" and "comprising" indicate the presence of the described features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
The term "and/or" refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, an embodiment of the present invention provides a multi-electrode type chip ceramic capacitor 100, including: a ceramic body 10, a face electrode 20, and a bottom electrode 30.
The plurality of surface electrodes 20 are provided on the upper surface of the ceramic body 10 and insulated from each other. The number of the bottom electrodes 30 is one, and is disposed on the lower surface of the ceramic body 10. At least one of the face electrodes 20 is diametrically opposed to the bottom electrode 30, and at least one of the face electrodes 20 is partially diametrically opposed to the bottom electrode 30.
In one embodiment, the ceramic body 10 is made of an insulating material capable of improving power dissipation performance of the capacitor, and the surface electrodes 20 are insulated from each other by forming a gap through the ceramic body 10, and the surface electrodes 20 and the bottom electrodes 30 are also insulated from each other by forming a gap through the ceramic body 10. On the upper surface of the ceramic body 10, the orthographic projection of at least one surface electrode 20 in the plurality of surface electrodes 20 on the lower surface of the ceramic body 10 falls into the bottom electrode 30 completely, i.e. at least one surface electrode 20 is completely opposite to the bottom electrode 30, and the orthographic projection parts of the other surface electrodes 20 on the lower surface of the ceramic body 10 fall into the bottom electrode 30, i.e. the other surface electrodes 20 are partially opposite to the bottom electrode 30. Thus, the circuit matching function of the multi-electrode type chip ceramic capacitor 100 is maintained, and the requirement for alignment accuracy during mounting is reduced, thereby reducing the mounting cost.
Referring to fig. 2 and 3, in one embodiment, the surface electrode 20 includes a first surface electrode 21, a second surface electrode 22, and a third surface electrode 23, and the lower surface of the ceramic body 10 includes a bottom electrode 30 and a bare ceramic body 10. The first surface electrode 21 and the second surface electrode 22 are both opposite to the bottom electrode 30, and the third surface electrode 23 is partially opposite to the bottom electrode 30, or the first surface electrode 21 is completely opposite to the bottom electrode 30, and the second surface electrode 22 and the third surface electrode 23 are both opposite to the bottom electrode 30.
It is understood that the first plane electrode 21 and the second plane electrode 22 are completely opposite to the bottom electrode 30, i.e., the orthographic projections of the first plane electrode 21 and the second plane electrode 22 on the lower surface of the ceramic body 10 completely overlap with the bottom electrode 30. The third surface electrode 23 is partially opposite to the bottom electrode 30, i.e. the orthographic projection of the third surface electrode 23 on the lower surface of the ceramic body 10 is partially overlapped with the bottom electrode 30 and the bare ceramic body 10 respectively. Alternatively, the first face electrode 21 is completely opposite to the bottom electrode 30, i.e., the orthographic projection of the first face electrode 21 on the lower surface of the ceramic body 10 completely overlaps the bottom electrode 30. The second surface electrode 22 and the third surface electrode 23 are partially opposite to the bottom electrode 30, i.e. the orthographic projections of the second surface electrode 22 and the third surface electrode 23 on the lower surface of the ceramic body 10 are partially overlapped with the bottom electrode 30 and the bare ceramic body 10, respectively.
Only the third surface electrode 23 is partially opposite to the bottom electrode 30, and under the condition that the area of the third surface electrode 23 is large, the capacitance value generated by the opposite area of the third surface electrode 23 and the bottom electrode 30 is small enough to meet the capacitance value requirement, so that the requirement on the alignment precision is low when the third surface electrode 23 is connected with an external circuit, and the multi-electrode chip ceramic capacitor 100 is convenient to install.
The second surface electrode 22 and the third surface electrode 23 are only partially aligned with the bottom electrode 30, and under the condition that the areas of the second surface electrode 22 and the third surface electrode 23 are large, the capacitance values generated by the alignment areas of the second surface electrode 22 and the third surface electrode 23 corresponding to the bottom electrode 30 are small enough to meet the capacitance value requirement, so that the alignment accuracy requirement is low when the second surface electrode 22 and the third surface electrode 23 are connected with an external circuit, and the multi-electrode type chip ceramic capacitor 100 is convenient to install.
Referring to fig. 5 and 6, in one embodiment, the surface electrode 20 includes a first surface electrode 21, a second surface electrode 22, a third surface electrode 23, a fourth surface electrode 24, and a fifth surface electrode 25. The first surface electrode 21, the second surface electrode 22 and the third surface electrode 23 are completely opposite to the bottom electrode 30, and the fourth surface electrode 24 and the fifth surface electrode 25 are partially opposite to the bottom electrode 30.
It is understood that the first, second and third face electrodes 21, 22 and 23 are completely opposite to the bottom electrode 30, i.e., the orthographic projections of the first, second and third face electrodes 21, 22 and 23 on the lower surface of the ceramic body 10 completely overlap the bottom electrode 30. The fourth surface electrode 24 and the fifth surface electrode 25 are partially opposite to the bottom electrode 30, i.e. the orthographic projections of the fourth surface electrode 24 and the fifth surface electrode 25 on the lower surface of the ceramic body 10 are partially overlapped with the bottom electrode 30 and the bare ceramic body 10, respectively.
Of course, in other embodiments, the first surface electrode 21, the second surface electrode 22, the third surface electrode 23, and the fourth surface electrode 24 are completely opposite to the bottom electrode 30, and partially opposite to the fifth surface electrode 25 and the bottom electrode 30, which is not limited herein.
Only the fourth surface electrode 24 or the fifth surface electrode 25 is partially opposite to the bottom electrode 30, and under the condition that the area of the fourth surface electrode 24 or the fifth surface electrode 25 is large, the capacitance value generated by the opposite area of the fourth surface electrode 24 and the fifth surface electrode 25 corresponding to the bottom electrode 30 is small enough to meet the capacitance value requirement, so that the requirement on the alignment precision is low when the fourth surface electrode 24 and the fifth surface electrode 25 are connected with an external circuit, and the multi-electrode type chip ceramic capacitor 100 is convenient to install.
In summary, no matter how many the surface electrodes 20 are, it is sufficient to ensure that at least one of the surface electrodes 20 and the bottom electrode 30 are completely opposite to each other, and the other surface electrodes 20 and the bottom electrode 30 are partially opposite to each other, and no particular limitation is imposed thereon.
Referring to fig. 3, in one embodiment, the lower surface of the ceramic body 10 is divided into an electrode region and an insulating region 302, and the bottom electrode 30 entirely covers the electrode region. An orthographic projection of at least one planar electrode 20 on the lower surface of the ceramic body 10 falls on the electrode region, and an orthographic projection part of at least one planar electrode 20 on the lower surface of the ceramic body 10 falls on the insulating region.
Referring to fig. 4, taking three surface electrodes 20 as an example, the first surface electrode 21 and the second surface electrode 22 are completely opposite to the bottom electrode 30, and the third surface electrode 23 is partially opposite to the bottom electrode 30. The facing area of the first surface electrode 21 and the bottom electrode 30 is S1, and the capacitance value generated correspondingly is C1. The area of the second surface electrode 22 opposite to the bottom electrode 30 is S2, and the capacitance value generated correspondingly is C2. The facing area of the third surface electrode 23 and the bottom electrode 30 is S3, and the capacitance value generated correspondingly is C3. Referring to fig. 3, in an embodiment, the lower surface of the ceramic body 10 is a first rectangle, the electrode region is a second rectangle having a notch at an outer edge, four sides of the first rectangle overlap four sides of the second rectangle, the insulating region has the same shape as the notch, and the bottom electrode 30 has the same shape as the electrode region.
It will be appreciated that the bottom electrode 30 entirely covers the electrode area. Referring to fig. 4, the first plane electrode 21 and the second plane electrode 22 completely fall into the bottom electrode 30 in the projection of the lower surface of the ceramic body 10, and the third plane electrode 23 falls into the bottom electrode 30 and the bare ceramic body 10 in the projection of the lower surface of the ceramic body 10. Thus, the area of the bottom electrode 30 is large, facilitating the mounting of the multi-electrode type chip ceramic capacitor 100.
In a specific embodiment, the shape of the second rectangular notch includes a rectangle, a circle, a semicircle or a diamond.
Referring to fig. 7, in an embodiment, the lower surface of the ceramic body 10 has a rectangular shape, two adjacent sides of the electrode region overlap two sides of the rectangular shape, two adjacent sides of the electrode region have a gap with two other sides of the rectangular shape, the insulating region has the same shape as the gap, and the bottom electrode 30 has the same shape as the electrode region.
It is understood that the bottom electrode 30 entirely covers the electrode area, and referring to fig. 8, the projections of the first surface electrode 21, the second surface electrode 22 and the third surface electrode 23 on the lower surface of the ceramic body 10 completely fall into the bottom electrode 30, and the projections of the fourth surface electrode 24 and the fifth surface electrode 25 on the lower surface of the ceramic body 10 fall into the bottom electrode 30 and the bare ceramic body 10. Thus, the area of the bottom electrode 30 is large, facilitating the mounting of the multi-electrode type chip ceramic capacitor 100.
In one embodiment, the edge of at least one of the face electrodes 20 coincides with an edge of at least one side surface of the ceramic body 10, and the edge of at least one of the face electrodes 20 is distant from an edge of any one side surface of the ceramic body 10.
Referring to fig. 6, the edges of the first surface electrode 21, the second surface electrode 22 and the third surface electrode 23 are not overlapped with the side edges of the ceramic body 10. The fourth surface electrode 24 coincides with one side edge of the ceramic body 10, that is, is adjacent to one side surface of the ceramic body 10, and the fifth surface electrode 25 coincides with both side edges of the ceramic body 10, that is, is adjacent to both side surfaces of the ceramic body 10.
Of course, in other embodiments, the edges of all the surface electrodes 20 do not coincide with the side edges of the ceramic body 10, so long as it is ensured that at least one of the surface electrodes 20 completely faces the bottom electrode 30, and the other surface electrodes 20 partially face the bottom electrode 30, which is not limited herein.
Referring to fig. 4, in one embodiment, the facing areas of the plurality of face electrodes 20 and the bottom electrode 30 are in a fixed ratio.
Taking three surface electrodes 20 as an example, the facing area of the first surface electrode 21 and the bottom electrode 30 is S1, and the capacitance value generated correspondingly is C1. The area of the second surface electrode 22 opposite to the bottom electrode 30 is S2, and the capacitance value generated correspondingly is C2. The facing area of the third surface electrode 23 and the bottom electrode 30 is S3, and the capacitance value generated correspondingly is C3. S1-2 × S2, S2-2 × S3, so C1-2 × C2, C2-2 × C3. Thus, the multi-electrode type patch ceramic capacitor 100 has a circuit matching function.
Taking the five surface electrodes 20 as an example, the facing area of the first surface electrode 21 and the bottom electrode 30 is S1, and the capacitance value generated correspondingly is C1. The area of the second surface electrode 22 opposite to the bottom electrode 30 is S2, and the capacitance value generated correspondingly is C2. The facing area of the third surface electrode 23 and the bottom electrode 30 is S3, and the capacitance value generated correspondingly is C3. The area of the fourth surface electrode 24 facing the bottom electrode 30 is S4, and the capacitance value generated correspondingly is C4. The facing area of the first surface electrode 25 and the bottom electrode 30 is S5, and the capacitance value generated correspondingly is C5. In this embodiment, S1 is 2 × S2, S2 is 2 × S3, S3 is 2 × S4, and S4 is 2 × S5, so C1 is 2 × C2, C2 is 2 × C3, C3 is 2 × C4, and C4 is 2 × C5. As such, the multi-electrode type patch ceramic capacitor of the present embodiment has a circuit matching function.
In a particular embodiment, ceramic body 10 has a symmetrical shape.
In summary, in the multi-electrode type chip ceramic capacitor 100 of the present embodiment, at least one surface electrode 20 is partially aligned with the bottom electrode 30, so that each surface electrode 20 has a larger area, thereby not only maintaining the circuit matching function of the multi-electrode type chip ceramic capacitor 100, but also reducing the requirement for alignment precision during mounting, thereby reducing the mounting cost.
The foregoing is a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations are also considered as the protection scope of the present invention.
Claims (10)
1. A multi-electrode type patch ceramic capacitor, comprising: a ceramic body, a face electrode and a bottom electrode;
the surface electrodes are arranged on the upper surface of the ceramic body and are insulated from each other; the number of the bottom electrodes is one, and the bottom electrodes are arranged on the lower surface of the ceramic body;
at least one of the face electrodes is completely opposite to the bottom electrode, and at least one of the face electrodes is partially opposite to the bottom electrode.
2. The multi-electrode type patch ceramic capacitor according to claim 1, wherein the face electrodes include a first face electrode, a second face electrode, and a third face electrode;
the first surface electrode and the second surface electrode are completely opposite to the bottom electrode, and the third surface electrode is partially opposite to the bottom electrode; or, the first surface electrode is completely opposite to the bottom electrode, and the second surface electrode and the third surface electrode are both opposite to the bottom electrode.
3. The multi-electrode type patch ceramic capacitor according to claim 1, wherein the face electrodes include a first face electrode, a second face electrode, a third face electrode, a fourth face electrode, and a fifth face electrode; the first surface electrode, the second surface electrode and the third surface electrode are all completely opposite to the bottom electrode, and the fourth surface electrode and the fifth surface electrode are all partially opposite to the bottom electrode.
4. A multi-electrode type patch ceramic capacitor according to claim 1, wherein the lower surface of the ceramic body is divided into an electrode region and an insulating region, and the bottom electrode entirely covers the electrode region; the orthographic projection of at least one surface electrode on the lower surface of the ceramic body falls on the electrode area, and the orthographic projection part of at least one surface electrode on the lower surface of the ceramic body falls on the insulating area.
5. A multi-electrode type patch ceramic capacitor according to claim 4, wherein the lower surface of the ceramic body is a first rectangle, the shape of the electrode region is a second rectangle having a notch at the outer edge, the four sides of the first rectangle overlap with the four sides of the second rectangle, the shape of the insulating region is the same as the shape of the notch, and the shape of the bottom electrode is identical to the shape of the electrode region.
6. The multi-electrode type patch ceramic capacitor according to claim 5, wherein the shape of the notch comprises a rectangle, a circle, a semicircle or a diamond.
7. A multi-electrode type patch ceramic capacitor according to claim 4, wherein the lower surface of the ceramic body has a rectangular shape, adjacent two sides of the electrode region overlap with two sides of the rectangular shape, gaps exist between the other adjacent two sides of the electrode region and the other two sides of the rectangular shape, the insulating region has the same shape as the gaps, and the bottom electrode has the same shape as the electrode region.
8. A multi-electrode type patch ceramic capacitor according to claim 5 or 7, wherein the edge of at least one of the face electrodes coincides with the edge of at least one side of the ceramic body, and the edge of at least one of the face electrodes is away from the edge of any one side of the ceramic body.
9. A multi-electrode type patch ceramic capacitor according to claim 5 or 7, wherein a plurality of said face electrodes are in fixed proportion to the facing area of said bottom electrode.
10. The multi-electrode type patch ceramic capacitor according to claim 1, wherein the ceramic body has a symmetrical shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021830022.8U CN213025839U (en) | 2020-08-26 | 2020-08-26 | Multi-electrode type patch ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021830022.8U CN213025839U (en) | 2020-08-26 | 2020-08-26 | Multi-electrode type patch ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213025839U true CN213025839U (en) | 2021-04-20 |
Family
ID=75471109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021830022.8U Active CN213025839U (en) | 2020-08-26 | 2020-08-26 | Multi-electrode type patch ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213025839U (en) |
-
2020
- 2020-08-26 CN CN202021830022.8U patent/CN213025839U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20060120017A1 (en) | Multilayer capacitor | |
| JP5150177B2 (en) | Crystal oscillator | |
| US6477032B2 (en) | Low inductance chip with center via contact | |
| JPS5845822B2 (en) | Shuyuuseki Cairo | |
| CN213025839U (en) | Multi-electrode type patch ceramic capacitor | |
| JPH04345201A (en) | Irreversible circuit component and center conductor for irreversible circuit component | |
| JPS6359012A (en) | Composite electronic component | |
| KR20100019109A (en) | Electrode pad for mounting electronic component and mounting structure of electronic component | |
| KR0174636B1 (en) | Non-reciprocal circuit element | |
| JP2003100552A (en) | Three-terminal ceramic capacitor | |
| CN106329052A (en) | Power divider | |
| CN213242268U (en) | Paster ceramic capacitor | |
| JP2003110314A (en) | Laminated chip balun device and manufacturing method therefor | |
| CN213461696U (en) | Shared screen | |
| JP2003198221A (en) | Chip-type laminated balun element | |
| KR100370515B1 (en) | Laminated ceramic capacitor | |
| JPS6243902A (en) | Triplate type filter | |
| JPH0758525A (en) | Irreversible circuit element | |
| GB2174842A (en) | Monolithic ceramic capacitor for high frequency applications | |
| JP2024058300A (en) | Laminated coil component | |
| JPH05259805A (en) | Piezoelectric resonator | |
| JP2005012055A (en) | Variable capacitor | |
| JPH0744099Y2 (en) | LC filter | |
| JPH0735451Y2 (en) | Piezoelectric device | |
| CN115621258A (en) | Capacitor and chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |