CN213025428U

CN213025428U - Interlayer bridging structure of conductive film

Info

Publication number: CN213025428U
Application number: CN202022155536.4U
Authority: CN
Inventors: 王林生; 王士发
Original assignee: Shenzhen Yixiantong Electronics Co ltd
Current assignee: Shenzhen Yixiantong Electronics Co ltd
Priority date: 2020-09-27
Filing date: 2020-09-27
Publication date: 2021-04-20
Anticipated expiration: 2030-09-27

Abstract

The utility model relates to the technical field of conductive films, and discloses an interlayer bridging structure of a conductive film, which comprises a substrate, a first structural layer, a bridging layer, an adhesive layer, a second structural layer, a surface layer and an insulating layer, wherein the first structural layer is stacked on the upper surface of the substrate, the bridging layer is positioned at the top of the first structural layer, and the adhesive layer is respectively positioned at the upper side and the lower side of the bridging layer; the utility model discloses a first structure layer, the layer of building a bridge, the adhesive linkage, the second structure layer, the conductive region, the setting of bridge region and electrically conductive joining region, it is high to have safety and stability, can prevent that the short circuit from appearing in the conductive film, the electrically conductive efficiency of conductive film has effectively been increased, and then can prolong conductive film life's advantage, the electric conductivity and the security of having solved the layer-to-layer bridge structure that present conductive film used are relatively poor, be connected two-layer conductive layer and external control ware electricity through the lead wire district, the problem of short circuit appears outside the lead wire district of conductive layer exposes easily.

Description

Interlayer bridging structure of conductive film

Technical Field

The utility model relates to a conductive film technical field specifically is a bridging structure between layer of conductive film.

Background

The transparent conductive film is a film with good conductivity and high light transmittance in a visible light wave band, is widely applied to the fields of flat panel display, photovoltaic devices, touch panels, electromagnetic shielding and the like, and has a wide market space. The charged carriers of the conductive film are scattered by the surface and interface during transport, and when the thickness of the film is comparable to the free path of electrons, the influence on the surface and interface becomes significant, which is called the size effect of the film. It is equivalent to a reduction in the free path of the carriers and therefore the conductivity of the thin film is less than that of a bulk of the same material.

The interlayer bridging structure used by the current conducting film is poor in conductivity and safety, the two conducting layers are electrically connected with an external controller through the lead wire regions, the lead wire regions of the conducting layers are exposed outside and are prone to short circuit, and therefore the conducting film can be damaged.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an interlaminar bridging structure of conductive film, it is high to possess safety and stability, can prevent that the short circuit from appearing in the conductive film, has effectively increased the electrically conductive efficiency of conductive film, and then can prolong conductive film life's advantage, the conductivity and the security of having solved the interlaminar bridging structure of present conductive film use are relatively poor, be connected two-layer conductive layer and external control ware electricity through the lead wire district, the problem of short circuit appears outside exposed in the lead wire district of conductive layer easily.

In order to achieve the above object, the utility model provides a following technical scheme: an interlayer bridging structure of conductive film comprises a substrate, a first structure layer, a bridging layer, an adhesive layer, a second structure layer, a surface layer and an insulating layer, the first structural layer is stacked on the upper surface of the substrate, the bridging layer is positioned on the top of the first structural layer, the bonding layers are respectively positioned on the upper side and the lower side of the bridging layer, the bridging layer is tightly attached to the first structural layer through the adhesive layer, the second structural layer is positioned at the top of the bridging layer, the second structural layer is bonded with the bridging layer through the bonding layer, the conductive area is stacked on the upper surface of the second structural layer, the insulating layer is respectively positioned on the lower surface of the substrate and the upper surface of the surface layer, a conductive region is embedded in the first structural layer, the bridge erecting region is embedded in the bridge erecting layer, the conductive connecting region is embedded in the surface of the second structure layer, and the conductive connecting region penetrates through the top of the surface layer.

Preferably, the substrate and the surface layer are made of transparent glass, the surface of the substrate is bonded with the sealing layer, the sealing layer is respectively positioned on the periphery of the substrate and the periphery of the surface layer, and the sealing layer is made of natural rubber.

Preferably, a plurality of conductive region grooves are formed in the surface of the first structural layer, the conductive region grooves are distributed in an array manner, conductive materials are filled in the conductive region grooves, leads are arranged between the conductive regions, and the conductive regions are electrically connected through the leads.

Preferably, the number of the conductive connection areas is a plurality of, the conductive connection areas are symmetrically distributed, bridging area grooves are formed in the surfaces of the bridging areas and correspond to the positions of the conductive connection areas, and conductive materials are filled in the bridging area grooves.

Preferably, the bonding layer is a UV adhesive layer, the thickness of the UV adhesive layer is 1-5 μm, the insulating layer is an insulating coating coated on the surface of the substrate and the surface layer, and the insulating coating is a ceramic particle high-temperature film-forming material.

Preferably, the bridging region is respectively overlapped with the projection parts of the conductive region and the conductive connection region in the horizontal plane, and the bridging region is respectively and electrically connected with the conductive region and the conductive connection region.

Compared with the prior art, the beneficial effects of the utility model are as follows:

the utility model discloses a first structure layer, the layer of building a bridge, the adhesive linkage, the second structure layer, the conductive region, the setting of bridge region and electrically conductive joining region, it is high to have safety and stability, can prevent that the short circuit from appearing in the conductive film, the electrically conductive efficiency of conductive film has effectively been increased, and then can prolong conductive film life's advantage, the electric conductivity and the security of having solved the layer-to-layer bridge structure that present conductive film used are relatively poor, be connected two-layer conductive layer and external control ware electricity through the lead wire district, the problem of short circuit appears outside the lead wire district of conductive layer exposes easily.

Drawings

FIG. 1 is a schematic sectional view of the structure of the present invention;

FIG. 2 is a perspective view of the present invention;

fig. 3 is a perspective view of the first structural layer structure of the present invention;

fig. 4 is a three-dimensional schematic view of the bridge layer structure of the present invention.

In the figure: 1. a substrate; 2. a first structural layer; 3. a bridging layer; 4. an adhesive layer; 5. a second structural layer; 6. a surface layer; 7. an insulating layer; 8. a conductive region; 9. a bridging area; 10. a conductive connection region; 11. a sealing layer; 12. a conductive area groove; 13. a lead wire; 14. and a groove in the bridging area.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, an interlayer bridging structure of a conductive film includes a substrate 1, a first structural layer 2, a bridging layer 3, an adhesive layer 4, a second structural layer 5, a surface layer 6 and an insulating layer 7, wherein the first structural layer 2 is stacked on the upper surface of the substrate 1, the bridging layer 3 is located on the top of the first structural layer 2, the adhesive layer 4 is respectively located on the upper and lower sides of the bridging layer 3, the bridging layer 3 is closely attached to the first structural layer 2 through the adhesive layer 4, the second structural layer 5 is located on the top of the bridging layer 3, the second structural layer 5 is attached to the bridging layer 3 through the adhesive layer 4, a conductive region 8 is stacked on the upper surface of the second structural layer 5, the insulating layer 7 is respectively located on the lower surface of the substrate 1 and the upper surface layer 6, a conductive region 8 is embedded in the first structural layer 2, a bridging region 9 is embedded in the bridging layer 3, the surface of second structural layer 5 inlays and is equipped with electrically conductive joining region 10, electrically conductive joining region 10 runs through to the top on top layer 6, through first structural layer 2, bridging layer 3, adhesive linkage 4, second structural layer 5, conductive region 8, bridging region 9 and electrically conductive joining region 10's setting, it is high to have safety and stability, can prevent that the short circuit from appearing in the conductive film, the electrically conductive efficiency of conductive film has effectively been increased, and then can prolong conductive film life's advantage, the conductivity and the security of the interlaminar bridging structure who has solved present conductive film use are relatively poor, be connected two-layer conductive layer and external controller electricity through the lead wire district, the problem of short circuit appears in the lead wire district exposure outside easily of conductive layer.

Referring to fig. 1 and 2, the substrate 1 and the surface layer 6 are made of transparent glass, the sealing layer 11 is adhered to the surface of the substrate 1, the sealing layer 11 is respectively located around the substrate 1 and the surface layer 6, the sealing layer 11 is made of natural rubber, and the sealing layer 11 is arranged to increase the safety performance of the conductive film and prevent the conductive film from being damaged due to water inflow.

Referring to fig. 1 and 3, a plurality of conductive region grooves 12 are formed on the surface of the first structural layer 2, the conductive region grooves 12 are distributed in an array, conductive material is filled in the conductive region grooves 12, leads 13 are disposed between the conductive regions 8, the conductive regions 8 are electrically connected by the leads 13, and by disposing the conductive region grooves 12 and the leads 13, the number of the conductive films connected to an external controller can be reduced, and the conductive efficiency of the conductive films can be increased.

Referring to fig. 1, 2 and 4, the number of the conductive connection areas 10 is several, the conductive connection areas 10 are symmetrically distributed, bridging area grooves 14 are formed on the surface of the bridging area 9, the bridging area grooves 14 correspond to the conductive connection areas 10, conductive materials are filled in the bridging area grooves 14, and the bridging area grooves 14 are arranged to increase the insulation between the first structure layer 2 and the second structure layer 5 and reduce the occurrence of short circuit between the conductive area 8 and the conductive connection areas 10.

Referring to fig. 1 and 2, the adhesive layer 4 is a UV adhesive layer with a thickness of 1-5 μm, the insulating layer 7 is an insulating layer coated on the surfaces of the substrate 1 and the surface layer 6, and the insulating layer is a ceramic particle high-temperature film-forming material, so that the adhesive strength between the bridging region 9 and the first structural layer 2 and the second structural layer 5 can be increased, and the conductive film can be prevented from short-circuiting.

As shown in fig. 1 and fig. 4, the bridging area 9 is respectively overlapped with the projection portions of the conductive area 8 and the conductive connection area 10 on the horizontal plane, and the bridging area 9 is electrically connected with the conductive area 8 and the conductive connection area 10, so that the bridging area 9 can be electrically connected with the conductive area 8 and the conductive connection area 10 at the same time, and the working efficiency of the conductive film can be increased.

The working principle is as follows: when the conductive film is used, the conductive area 8 and the conductive connection area 10 are mutually insulated, the first structural layer 2 and the second structural layer 5 are insulated, the bridging area 9 is positioned between the first structural layer 2 and the second structural layer 5, the bridging area 9 is simultaneously electrically connected with the conductive area 8 and the conductive connection area 10, the bonding strength between the bridging area 9 and the first structural layer 2 and the second structural layer 5 can be increased through the bonding layer 4 and the insulating layer 7, the conductive film can be prevented from being short-circuited, the sealing layer 11 improves the safety performance of the conductive film, the conductive film is prevented from being damaged due to water inflow, the number of the conductive film connected with an external controller can be reduced through the arrangement of the conductive area groove 12 and the lead 13, the conductive efficiency of the conductive film can be increased, the conductive film only needs to be connected with the external controller on the surface layer 6, and the number of the electrically connected.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an interlaminar bridging structure of conducting film, includes basement (1), first structural layer (2), bridging layer (3), adhesive linkage (4), second structural layer (5), top layer (6) and insulating layer (7), its characterized in that: the structure comprises a substrate (1), a first structural layer (2), a bridging layer (3), a second structural layer (5), an insulating layer (7), a bridging area (9), a bridging connection area (10), a bridging layer (3) and a bridging layer (3), wherein the first structural layer (2) is stacked on the upper surface of the substrate (1), the bridging layer (3) is located at the top of the first structural layer (2), the bonding layer (4) is located on the upper side and the lower side of the bridging layer (3) respectively, the bridging layer (3) is tightly attached to the first structural layer (2) through the bonding layer (4), the second structural layer (5) is located on the top of the bridging layer (3), the second structural layer (5) is bonded to the bridging layer (3) through the bonding layer (4), the conductive area (8) is stacked on the upper surface of the second structural layer (5), the insulating layer (7) is located on the lower surface of the substrate (1) and the upper surface of the top layer (6) respectively, the conductive area (8) is embedded in the first structural layer, the conductive connection region (10) penetrates to the top of the surface layer (6).

2. The interlayer bridging structure of a conductive film according to claim 1, wherein: the substrate (1) and the surface layer (6) are made of transparent glass, the sealing layer (11) is bonded on the surface of the substrate (1), the sealing layer (11) is located on the periphery of the substrate (1) and the surface layer (6) respectively, and the sealing layer (11) is made of natural rubber.

3. The interlayer bridging structure of a conductive film according to claim 1, wherein: a plurality of conductive region grooves (12) are formed in the surface of the first structure layer (2), the conductive region grooves (12) are distributed in an array mode, conductive materials are filled in the conductive region grooves (12), leads (13) are arranged between the conductive regions (8), and the conductive regions (8) are electrically connected through the leads (13).

4. The interlayer bridging structure of a conductive film according to claim 1, wherein: the number of the conductive connection areas (10) is a plurality of, the conductive connection areas (10) are symmetrically distributed, bridging area grooves (14) are formed in the surface of the bridging area (9), the bridging area grooves (14) correspond to the conductive connection areas (10), and conductive materials are filled in the bridging area grooves (14).

5. The interlayer bridging structure of a conductive film according to claim 1, wherein: the adhesive layer (4) is a UV adhesive layer, the thickness of the UV adhesive layer is 1-5 mu m, the insulating layer (7) is an insulating coating coated on the surfaces of the substrate (1) and the surface layer (6), and the insulating coating is a ceramic particle high-temperature film forming matter.

6. The interlayer bridging structure of a conductive film according to claim 1, wherein: the bridging area (9) is respectively superposed with the projection parts of the conductive area (8) and the conductive connection area (10) on the horizontal plane, and the bridging area (9) is respectively electrically connected with the conductive area (8) and the conductive connection area (10).