CN213022912U - Fault detection device of semiconductor etching equipment - Google Patents

Fault detection device of semiconductor etching equipment Download PDF

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Publication number
CN213022912U
CN213022912U CN202021081790.8U CN202021081790U CN213022912U CN 213022912 U CN213022912 U CN 213022912U CN 202021081790 U CN202021081790 U CN 202021081790U CN 213022912 U CN213022912 U CN 213022912U
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fixedly provided
telescopic
top side
connecting rod
fixed mounting
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CN202021081790.8U
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Chinese (zh)
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廖海涛
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Jiangsu Yiwen Microelectronics Technology Co Ltd
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Jiangsu Yiwen Microelectronics Technology Co Ltd
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Abstract

The utility model discloses a fault detection device of semiconductor sculpture equipment relates to fault detection field for semiconductor sculpture equipment, including examining test table, the top side fixed mounting who examines test table has two support columns, and flexible groove has all been seted up to the top side of two support columns, and equal slidable mounting has flexible post in two flexible inslots, and the top side of two flexible posts extends to outside two flexible grooves respectively and equal fixed mounting has the horizontal pole. The utility model discloses rational in infrastructure, accessible sliding control piece drives two laser emission pen horizontal migration to can contrast the data collection to two semiconductors simultaneously, the data of gathering carry out the analysis contrast through processing center, finally can obtain the position that semiconductor etching equipment broke down automatically, no longer need artifical naked eye to observe the contrast, can effectively avoid artifical visual error and lead to the erroneous judgement trouble, improved the speed and the accuracy of detection.

Description

Fault detection device of semiconductor etching equipment
Technical Field
The utility model relates to a semiconductor etching equipment uses the fault detection field, in particular to semiconductor etching equipment's fault detection device.
Background
In the manufacture of semiconductor devices, different material levels on integrated circuits or flat panel displays are generally formed by chemical and physical deposition or etching, and when etching fails, generally, the acceptable semiconductor is compared with the unacceptable semiconductor, and the position of the possible failure of the equipment is judged according to the comparison result.
The existing detection mode is that detection personnel generally observe and contrast through naked eyes, but the naked eye observation is difficult to directly compare some small errors, and visual errors easily appear in manual observation, so that some correct places are judged to be in fault, the fault detection device needs to be checked and compared for many times, time and labor are wasted, the detection speed is low, and the accuracy is low.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a fault detection device of semiconductor etching equipment to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a fault detection device of semiconductor etching equipment, including examining the test table, the top side fixed mounting who examines the test table has two support columns, flexible groove has all been seted up to the top side of two support columns, equal slidable mounting has flexible post in two flexible inslots, the top side of two flexible posts extends to outside two flexible grooves respectively and equal fixed mounting has the horizontal pole, T type sliding tray has all been seted up to one side that two horizontal poles are close to each other, equal slidable mounting has T type sliding block in two T type sliding tray, one side that two T type sliding blocks are close to each other extends to outside two T type sliding tray respectively and fixed mounting has same carriage release lever, examine and be equipped with the control block on the test table, the shift hole has been seted up to one side of control block, the one end of carriage release lever runs through the shift hole, the top side fixed mounting of control.
Preferably, the support column is provided with a fastening bolt, the inner wall of one side of the telescopic groove is provided with a fastening hole, and one end of the fastening bolt penetrates through the fastening hole and is in contact with one side of the telescopic column.
Preferably, the top side of the detection table is fixedly provided with two abutting pieces, and one side of each of the two abutting pieces is fixedly provided with a pre-alignment piece.
Preferably, the top side fixed mounting who examines the test table has two fixed blocks, and the connecting hole has all been seted up to one side of two fixed blocks, and equal slidable mounting has the connecting rod in two connecting holes, and the both ends of two connecting rods extend to outside two connecting holes respectively.
Preferably, one end of the connecting rod is fixedly provided with the extrusion piece, and the other end of the connecting rod is fixedly provided with the spring plate.
Preferably, one side fixed mounting of fixed block has the one end of cup jointing the extrusion spring on the connecting rod, and the other end fixed mounting of extrusion spring is on one side of spring plate.
Preferably, the peripheral positions of the bottom side of the detection table are fixedly provided with upright posts.
The utility model discloses a technological effect and advantage:
1. the utility model discloses it is rational in infrastructure, can drive two laser emission pen horizontal migration through the sliding control piece to can compare the data collection to two semiconductors simultaneously, the data of gathering carry out analysis contrast through the processing center, can obtain the position that semiconductor etching equipment breaks down automatically finally, no longer need artifical naked eye to observe the contrast, can effectively avoid artifical visual error and lead to the erroneous judgement trouble, improved the speed and the accuracy of detection;
2. utilize the spring plate, the extrusion spring, the connecting rod, the extrusion piece, flexible post and fastening bolt's design, when the pulling spring plate, can tensile extrusion spring, also can drive the connecting rod simultaneously and remove, the connecting rod removes and drives the extrusion piece and remove, and then can place the semiconductor, then loosen the spring plate, under the spring action of extrusion spring, can drive the extrusion piece and extrude fixed semiconductor, it is fixed effectual, when rotating fastening bolt, can loosen or fixed flexible post, flexible post removes and drives the laser emission pen and remove, and then can adjust the height of laser emission pen, thereby can detect the contrast to the semiconductor of equidimension not, the application scope of device has been improved.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;
fig. 4 is a schematic structural view of the joint of the inspection table and the extrusion sheet of the present invention.
In the figure: 1. a detection table; 2. a support pillar; 3. a telescopic groove; 4. a telescopic column; 5. a cross bar; 6. a T-shaped sliding groove; 7. a T-shaped sliding block; 8. a travel bar; 9. a control block; 10. moving the hole; 11. a processing center; 12. a laser emitting pen; 13. fastening a bolt; 14. supporting the blocking piece; 15. pre-aligning the tablets; 16. a fixed block; 17. a connecting rod; 18. extruding the sheet; 19. a spring plate; 20. a compression spring; 21. and (4) a column.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a fault detection device of semiconductor etching equipment as shown in figures 1-4, which comprises a detection table 1, two support columns 2 are fixedly arranged on the top side of the detection table 1, telescopic grooves 3 are respectively arranged on the top sides of the two support columns 2, telescopic columns 4 are respectively arranged in the two telescopic grooves 3 in a sliding way, the top sides of the two telescopic columns 4 respectively extend out of the two telescopic grooves 3 and are respectively and fixedly provided with a cross rod 5, T-shaped sliding grooves 6 are respectively arranged on one sides of the two cross rods 5 which are close to each other, T-shaped sliding blocks 7 are respectively arranged in the two T-shaped sliding grooves 6 in a sliding way, one sides of the two T-shaped sliding blocks 7 which are close to each other respectively extend out of the two T-shaped sliding grooves 6 and are fixedly provided with a same moving rod 8, a control block 9 is arranged on the detection table 1, a moving hole 10 is arranged on one side of, the top side fixed mounting of control block 9 has processing center 11, the bottom side fixed mounting of control block 9 has two laser emission pens 12, when removing control block 9, control block 9 removes and drives two laser emission pens 12 and remove, thereby can contrast the data collection to two semiconductors simultaneously, the data of gathering carry out the analysis contrast through processing center 11, the position that semiconductor etching equipment broke down can be derived automatically finally, no longer need artifical naked eye to observe the contrast, can effectively avoid artifical visual error and lead to the erroneous judgement trouble, the speed and the accuracy of detection have been improved.
Further, in the above scheme, the supporting column 2 is provided with the fastening bolt 13, the inner wall of one side of the telescopic groove 3 is provided with the fastening hole, one end of the fastening bolt 13 penetrates through the fastening hole and is in contact with one side of the telescopic column 4, when the fastening bolt 13 is rotated, the telescopic column 4 can be loosened or fixed, and then the height of the laser emitting pen 12 can be adjusted.
Further, in the above scheme, two abutting pieces 14 are fixedly mounted on the top side of the detection table 1, a pre-alignment piece 15 is fixedly mounted on one side of each of the two abutting pieces 14, the abutting pieces 14 are arranged to facilitate fixing of the position of the semiconductor, and the two semiconductors are respectively aligned with the positions of the two laser emitting pens 12 by the arrangement of the pre-alignment piece 15.
Further, in above-mentioned scheme, the top side fixed mounting who examines platform 1 has two fixed blocks 16, and the connecting hole has all been seted up to one side of two fixed blocks 16, and equal slidable mounting has connecting rod 17 in two connecting holes, and outside two ends of two connecting rods 17 extended to two connecting holes respectively, through setting up fixed block 16 for connecting rod 17 can only the horizontal slip.
Further, in the above scheme, one end of the connecting rod 17 is fixedly provided with the pressing piece 18, and the other end of the connecting rod 17 is fixedly provided with the spring plate 19, so that when the spring plate 19 is moved, the connecting rod 17 is driven to move, and the connecting rod 17 moves to drive the pressing piece 18 to move.
Further, in the above scheme, one side fixed mounting of fixed block 16 has the one end of the extrusion spring 20 of cup jointing on connecting rod 17, and the other end fixed mounting of extrusion spring 20 is on one side of spring plate 19, and when unclamping spring plate 19, under the spring action of extrusion spring 20, can drive extrusion piece 18 extrusion fixed semiconductor, fixed effectual, and then can detect the contrast to the semiconductor of equidimension not, improved the application scope of device.
Further, in the above scheme, the columns 21 are fixedly installed at the periphery of the bottom side of the detection table 1, and the columns 21 are arranged, so that the positions of the devices can be conveniently placed and fixed.
This practical theory of operation:
firstly pulling two spring plates 19, wherein the spring plates 19 can stretch an extrusion spring 20 when moving, and can drive a connecting rod 17 to move, the connecting rod 17 can drive an extrusion sheet 18 to move, qualified semiconductors and unqualified semiconductors can be placed respectively at the moment, then the spring plates 19 are loosened, the two extrusion sheets 18 can be driven to extrude and fix two semiconductors respectively under the action of the elastic force of the extrusion spring 20, after the fixation is finished, a tester can rotate a fastening bolt 13, the fastening bolt 13 rotates to loosen a telescopic column 4, the telescopic column 4 moves to drive a laser emission pen 12 to move, after the laser emission pen moves to a proper position, the fastening bolt 13 is rotated reversely, the height of the laser emission pen 12 can be fixed, so that the semiconductors with different sizes can be tested and compared, the application range of the device is improved, finally the tester can slide a control block 9, the control block 9 moves to drive the two laser emission pens 12 to move, thereby can contrast the data acquisition to two semiconductors simultaneously, the data of gathering carry out analysis contrast through processing center 11, can obtain the position that semiconductor etching equipment broke down automatically at last, no longer need artifical naked eye to observe the contrast, can effectively avoid artifical visual error and lead to the erroneous judgement trouble, improved the speed and the accuracy of detection.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims (7)

1. The utility model provides a fault detection device of semiconductor etching equipment, is including examining test table (1), its characterized in that: the detection table is characterized in that two support columns (2) are fixedly installed on the top side of the detection table (1), telescopic grooves (3) are formed in the top sides of the two support columns (2), telescopic columns (4) are installed in the two telescopic grooves (3) in a sliding mode, the top sides of the two telescopic columns (4) extend out of the two telescopic grooves (3) respectively and are fixedly installed with cross rods (5), T-shaped sliding grooves (6) are formed in one sides, close to each other, of the two cross rods (5), T-shaped sliding blocks (7) are installed in the two T-shaped sliding grooves (6) in a sliding mode, one sides, close to each other, of the two T-shaped sliding blocks (7) extend out of the two T-shaped sliding grooves (6) respectively and are fixedly installed with a same moving rod (8), a control block (9) is arranged on the detection table (1), a moving hole (10) is formed in one side of the, the top side of the control block (9) is fixedly provided with a processing center (11), and the bottom side of the control block (9) is fixedly provided with two laser emitting pens (12).
2. The apparatus according to claim 1, wherein: the support column (2) is provided with a fastening bolt (13), the inner wall of one side of the telescopic groove (3) is provided with a fastening hole, and one end of the fastening bolt (13) penetrates through the fastening hole and is in contact with one side of the telescopic column (4).
3. The apparatus according to claim 1, wherein: the top side of the detection table (1) is fixedly provided with two abutting separation sheets (14), and one side of each of the two abutting separation sheets (14) is fixedly provided with a pre-alignment sheet (15).
4. The apparatus according to claim 1, wherein: examine top side fixed mounting of platform (1) has two fixed blocks (16), and the connecting hole has all been seted up to one side of two fixed blocks (16), and equal slidable mounting has connecting rod (17) in two connecting holes, and the both ends of two connecting rods (17) extend to outside two connecting holes respectively.
5. The apparatus according to claim 4, wherein: one end of the connecting rod (17) is fixedly provided with an extrusion sheet (18), and the other end of the connecting rod (17) is fixedly provided with a spring plate (19).
6. The apparatus according to claim 4, wherein: one side fixed mounting of fixed block (16) has the one end of cup jointing extrusion spring (20) on connecting rod (17), and the other end fixed mounting of extrusion spring (20) is on one side of spring board (19).
7. The apparatus according to claim 1, wherein: the periphery of the bottom side of the detection table (1) is fixedly provided with upright posts (21).
CN202021081790.8U 2020-06-12 2020-06-12 Fault detection device of semiconductor etching equipment Active CN213022912U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021081790.8U CN213022912U (en) 2020-06-12 2020-06-12 Fault detection device of semiconductor etching equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021081790.8U CN213022912U (en) 2020-06-12 2020-06-12 Fault detection device of semiconductor etching equipment

Publications (1)

Publication Number Publication Date
CN213022912U true CN213022912U (en) 2021-04-20

Family

ID=75494906

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021081790.8U Active CN213022912U (en) 2020-06-12 2020-06-12 Fault detection device of semiconductor etching equipment

Country Status (1)

Country Link
CN (1) CN213022912U (en)

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