CN213020433U - Electronic equipment and direct cooling system thereof - Google Patents
Electronic equipment and direct cooling system thereof Download PDFInfo
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- CN213020433U CN213020433U CN202021833372.XU CN202021833372U CN213020433U CN 213020433 U CN213020433 U CN 213020433U CN 202021833372 U CN202021833372 U CN 202021833372U CN 213020433 U CN213020433 U CN 213020433U
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Abstract
The utility model provides a direct cold system of electronic equipment, include the compressor system, the condenser system that communicate by the refrigeration pipeline order and to the direct cold plate system of components and parts contact cooling, the exit end of compressor system sets up the bypass pipeline of the direct cold plate system one end of intercommunication, is equipped with the flow control device who adjusts the cold volume that lets in the direct cold plate system on the bypass pipeline. The compressor system provides internal circulation power of the refrigeration pipeline, the condenser system further cools the fluid in the refrigeration pipeline and then sends the fluid into the direct cooling plate system, meanwhile, a bypass pipeline is arranged to be directly connected with the outlet of the compressor system to the front end of the direct cooling plate system and mixed with the fluid flowing out of the condenser system, the flow regulating device regulates the cooling capacity of the fluid in the bypass pipeline, when the heating load is low, the temperature is stabilized, the system is prevented from being frequently started and stopped, and the cooling mode of the direct cooling system is optimized. The utility model also provides an electronic equipment.
Description
Technical Field
The utility model relates to an electronic equipment technical field, more specifically say, relate to an electronic equipment and electronic equipment directly cool system.
Background
In electronic equipment, the power of components and parts of the equipment is large, the heating density is large, the existing electronic equipment adopts a scheme that water is used as a carrier to serve as single-phase circulating liquid of a cooling system, and the electronic equipment is relatively complex and difficult to realize the light-weight requirement because an active refrigerating system and a liquid path circulating system are additionally arranged. If the electronic equipment is not used continuously, the heating load is interrupted, and the heat dissipation system is easily started and stopped frequently due to load change.
Therefore, how to optimize the cooling structure of the electrical component is a problem to be solved by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a direct cooling system for electronic devices to optimize the cooling structure of electrical components; the utility model also provides an electronic equipment.
In order to achieve the above object, the utility model provides a following technical scheme:
a direct cooling system for electronic equipment is composed of compressor system, condenser system and direct cooling plate system for cooling the components in contact,
the outlet end of the compressor system is provided with a bypass pipeline communicated with one end of the direct cooling plate system, and the bypass pipeline is provided with a flow regulating device for regulating the cold energy introduced into the direct cooling plate system.
Preferably, in the direct cooling system for electronic equipment, the flow rate adjusting device is a bypass valve that is provided in the bypass line and controls the flow rate of the bypass line.
Preferably, in the direct cooling system for electronic equipment, the outlet end of the condenser system is provided with a throttle valve for regulating the outlet flow rate of the condenser system.
Preferably, in the above direct cooling system for electronic equipment, the bypass line is disposed near an outlet position of the throttle valve.
Preferably, in the direct cooling system for electronic equipment, the refrigeration pipeline is filled with a two-phase fluid obtained by converting a gas phase and a liquid phase.
Preferably, in the direct cooling system for electronic equipment, a phase change cold storage material for absorbing cold in the refrigeration pipeline is disposed in the direct cooling plate system.
Preferably, in the direct cooling system for electronic equipment, the direct cooling plate system includes a cooling plate body and a heat exchanger attached to one side of the cooling plate;
the inlet pipe and the outlet pipe of the heat exchanger are communicated with the refrigeration pipeline.
Preferably, in the direct cooling system for electronic equipment, the heat exchanger is a blown plate heat exchanger, a parallel flow heat exchanger or a direct buried pipe heat exchanger.
Preferably, in the direct cooling system for electronic equipment, the system further comprises a bottom plate, a partition plate extending from the middle of the bottom plate and dividing the support end of the bottom plate into a first area and a second area,
the direct chill plate system is disposed in the first zone, and the compressor system and the condenser system are disposed in the second zone.
An electronic device, wherein a generator component and a cooling system for cooling the generator component are arranged in the electronic device, and the cooling system is the direct cooling system for the electronic device.
The utility model provides a direct cold system of electronic equipment, include the compressor system, the condenser system that communicate by the refrigeration pipeline order and to the direct cold plate system of components and parts contact cooling, the exit end of compressor system sets up the bypass pipeline that communicates direct cold plate system one end, is equipped with the flow control device who adjusts the cold volume that lets in direct cold plate system on the bypass pipeline. The compressor system provides internal circulation power of the refrigeration pipeline, the fluid in the refrigeration pipeline is further cooled by the condenser system and then is sent into the direct cooling plate system, meanwhile, a bypass pipeline is arranged to be directly connected with an outlet of the compressor system to the direct cooling plate system and mixed with the fluid flowing out of the condenser system, the flow regulating device regulates the cooling capacity of the fluid in the bypass pipeline, when the heating load is low, the temperature is stabilized, the system is prevented from being frequently started and stopped, and the cooling mode of the direct cooling system is optimized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of a direct cooling system for electronic equipment provided by the present invention;
fig. 2 is a schematic view of an arrangement structure of a direct cooling system of an electronic device provided by the present invention;
fig. 3 is a schematic view of a first arrangement structure of a direct cooling plate system in the direct cooling system of the electronic device according to the present invention;
fig. 4 is a schematic diagram of a second arrangement structure of the direct cooling plate system in the direct cooling system of the electronic device according to the present invention;
fig. 5 is a schematic view of a third arrangement structure of a direct cooling plate system in the direct cooling system of an electronic device according to the present invention.
Detailed Description
The utility model discloses a direct cooling system of electronic equipment, which optimizes the cooling structure of electrical elements; the utility model also provides an electronic equipment.
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1 and fig. 2, fig. 1 is a schematic diagram of a direct cooling system for electronic equipment provided by the present invention; fig. 2 is a schematic diagram of an arrangement structure of the direct cooling system of the electronic device provided by the present invention.
This embodiment provides a direct cooling system of electronic equipment, include the compressor system 2, the condenser system 3 that are linked together by refrigeration pipeline 1 order, and to the direct cold plate system 4 of components and parts contact cooling, the exit end of compressor system 2 sets up the bypass pipeline 5 of communicating direct cold plate system 4 one end, is equipped with the flow control device who adjusts the cold volume that lets in direct cold plate system 4 on the bypass pipeline 5. Compressor system 2 provides the internal circulation power of refrigeration pipeline 1, send into direct cold plate system 4 after further cooling to the interior fluid of refrigeration pipeline 1 by condenser system 3, set up the export of bypass pipeline 5 lug connection compressor system 2 to the front end of direct cold plate system 4 simultaneously, mix with the fluid that condenser system 3 flows out, the cold volume of fluid in the flow control device regulation bypass pipeline, when the load that generates heat is low load, the stable temperature, avoid the system to frequently open and stop, the cooling method to direct cold system has been optimized.
In an embodiment of the present invention, the bypass line 5 is provided with a bypass valve 6 for controlling the flow rate thereof. The flow of fluid in the bypass pipeline 5 is controlled by the bypass valve 6, the fluid directly discharged by the compressor system 2 is regulated, the mixing temperature of the fluid cooled by the condenser system 3 is controlled, the flow of the fluid introduced into the direct cooling plate system 4 is stabilized at a preset temperature, the cooling requirement of the electronic equipment during working under low load is met, the equipment does not need to be shut down at the moment, the stable working state is kept, when the electronic equipment is switched to different loads, the cooling requirement can be met only by regulating the opening degree of the bypass valve 6, the flow of the direct cooling system flowing into the compressor system 2 maintains the working temperature of the compressor system 2, frequent start and stop of the system is avoided, and the stability of the working state of the system is ensured.
The flow adjusting device is a bypass valve 6 arranged on a bypass pipeline 5, and the temperature of the direct cooling plate system 4 can be controlled to be higher than the dew point temperature of air in a mode of controlling the temperature of fluid through the bypass valve 6, so that the risk of condensation of the direct cooling plate is effectively reduced.
In an embodiment of the present disclosure, the outlet end of the condenser system 3 is provided with a throttle valve 7 for adjusting the outlet flow rate. The outlet end of the condenser system 3 is provided with a throttle valve 7 for regulating the flow of the fluid entering the direct cooling plate system 4,
in particular, the bypass line 5 is arranged close to the outlet position of the throttle valve 7.
By arranging the bypass pipeline 5, the cold energy introduced into the direct cooling system by the direct cooling plate system 4 plays a role of hot gas bypass, under the condition that the heat load of the electronic component is at a low load, when the cold energy output of the direct cooling system is far greater than the heat load, the fluid with higher temperature discharged by the compressor system 2 directly passes through the bypass valve 6, preferably an electromagnetic valve, is bypassed to the inlet position of the direct cooling plate system 4, is mixed with the cold fluid originally entering the inlet of the direct cooling plate system 4 and neutralized into intermediate temperature, which is equivalent to the attenuation of the refrigerating capacity of the direct cooling system, and is reduced to the refrigerating effect equivalent to the heat load, thereby avoiding the situation that the direct cooling system instantaneously reduces the temperature of the direct cooling plate system 4, reducing the situations of frequent shutdown and frequent startup of the direct cooling system, and simultaneously avoiding the possibility that the temperature of the direct cooling plate system 4 is reduced to the dew point temperature of air through the bypass control function, the risk of condensation of the direct cold plate system 4 is effectively reduced.
In an embodiment of the present disclosure, the refrigeration pipeline 1 is filled with a two-phase fluid converted from a gas phase to a liquid phase. The two-phase fluid has two phase states of gas phase and liquid phase, the fluid refrigerated by the compressor system 2 takes heat out of the external environment through a condensing fan of the condenser system 3, flows out in a liquid state, is throttled by the throttle valve 6 and then is introduced into the direct cooling plate system 4 to absorb the heat from the electronic components, the fluid is boiled and evaporated into gas phase inside, and then returns to the side of the compressor system 2. The two-phase fluid has higher heat exchange efficiency and improves the heat dissipation effect on the electronic components.
In an embodiment of the present disclosure, the direct cooling plate system 4 is provided with a phase-change cold storage material for absorbing cold in the refrigeration pipeline.
The direct cooling plate system 4 comprises a cooling plate body 41 and a heat exchanger attached to one side of the cooling plate; the inlet pipe and the outlet pipe of the heat exchanger are communicated with the refrigeration pipeline.
The direct cold plate system 4 is attached to an electronic component by a cold plate main body 41 and absorbs the electronic component to emit heat, a heat exchanger is attached to one side of the cold plate main body, an inlet pipe and an outlet pipe of the heat exchanger are communicated with a refrigeration pipeline, and cold storage materials are arranged in the cold plate main body 41. The cold storage material is preferably prepared by adopting a phase change material.
The direct cold plate system 4 is used as an access terminal of the direct cold system, when the phase change cold storage material in the cold plate main body 41 is in a liquid state, the direct cold system is in a refrigeration state, the phase change cold storage material of the cold plate main body 41 absorbs and stores the surplus cold energy of the system except for cooling for the heat load, and the phase change cold storage material is solidified into a solid state after being cooled until the direct cold system is closed.
Before the direct cooling system enters the next refrigeration cycle, the solid phase change cold storage material in the cold plate main body 41 releases the cold energy stored by the cold plate main body to cool the electronic components and other thermal loads, and the phase change cold storage material returns to the liquid state after releasing the cold energy.
By the circulation, the phase change cold storage material of the cold plate main body can play two roles, namely, under the low-load state of the thermal load of electronic components and the like, the refrigeration time of the refrigeration system is prolonged when the cold output by the compressor system 2 is greatly larger than the thermal load, and the situations of premature shutdown and frequent startup are avoided; secondly, under the condition that the thermal load is instantly increased, the phase change cold storage material in the cold plate main body 41 can release cold energy, and the cold storage tank plays a role of constant temperature buffering under the conditions that the starting delay of the direct cooling system and the system output do not instantly reach the maximum cold output.
As shown in fig. 3-5, fig. 3 is a schematic view of a first arrangement structure of a direct cooling plate system in a direct cooling system of an electronic device according to the present invention; fig. 4 is a schematic diagram of a second arrangement structure of the direct cooling plate system in the direct cooling system of the electronic device according to the present invention; fig. 5 is a schematic view of a third arrangement structure of a direct cooling plate system in the direct cooling system of an electronic device according to the present invention.
In one embodiment of the present case, the heat exchanger is a blown plate heat exchanger 42, a parallel flow heat exchanger 43 or a straight borehole heat exchanger 44.
The direct cold plate system 4 adopts a mode of combining the inflation plate heat exchanger 42 and the cold plate main body 41, the pressure bearing of the inflation plate heat exchanger 42 is good, the pipeline flow direction and the flow distribution can be made in advance, and the grooving treatment on the cold plate is not needed.
The direct cooling plate system 4 adopts a mode of combining the parallel flow heat exchanger 43 and the cold plate main body 41, and the inside of a pipeline of the parallel flow heat exchanger 43 has a better heat exchange effect and is effectively cooled.
The direct cold plate system 4 adopts a mode of combining the direct buried pipe heat exchanger 44 and the cold plate main body 41, and the heat exchange part of the direct buried pipe heat exchanger 44 is a pipe fitting, so that the manufacture is simple.
Through the heat exchanger of the direct cooling plate system, different heat exchangers are selected according to different working conditions of electronic components for heat exchange and cooling, and the heat exchange requirements of different electronic components are met.
In a specific embodiment of the scheme, the heat exchanger further comprises a bottom plate 8, a partition plate 9 which divides a supporting end of the bottom plate 8 into a first area and a second area extends out of the middle of the bottom plate 8, the direct cooling plate system 4 is arranged in the first area, and the compressor system 2 and the condenser system 3 are arranged in the second area. The partition plate 9 is arranged on the bottom plate, so that the refrigeration part and the heat exchange part of the direct cooling system are separated into different working spaces, the heat exchange of the two parts is reduced, and the heat exchange effect of the electronic components is ensured.
Based on the direct cooling system of the electronic equipment that provides in the above-mentioned embodiment, the utility model also provides an electronic equipment, be provided with generator components and parts in it and to its refrigerated cooling system, this cooling system is the direct cooling system of the electronic equipment that provides in the above-mentioned embodiment.
Because the electronic device adopts the electronic device direct cooling system of the above embodiment, please refer to the above embodiment for the beneficial effects brought by the electronic device direct cooling system of the electronic device.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. A direct cooling system of electronic equipment is characterized by comprising a compressor system, a condenser system and a direct cooling plate system for cooling components in a contact manner, wherein the compressor system and the condenser system are sequentially communicated through a refrigeration pipeline,
the outlet end of the compressor system is provided with a bypass pipeline communicated with one end of the direct cooling plate system, and the bypass pipeline is provided with a flow regulating device for regulating the cold energy introduced into the direct cooling plate system.
2. The direct cooling system for electronic equipment according to claim 1, wherein said flow regulator is a bypass valve provided on said bypass line and controlling the flow rate thereof.
3. The direct cooling system for electronic equipment according to claim 2, wherein the outlet end of the condenser system is provided with a throttle valve for regulating the outlet flow rate of the condenser system.
4. The electronic equipment direct cooling system of claim 3, wherein the bypass line is disposed proximate to an exit location of the throttle valve.
5. The direct cooling system for electronic equipment according to claim 1, wherein the refrigeration pipeline is filled with a two-phase fluid converted from a gas phase to a liquid phase.
6. The direct cooling system for electronic equipment according to claim 1, wherein a phase change cold storage material for absorbing cold in the refrigeration pipeline is arranged in the direct cooling plate system.
7. The electronic device direct cooling system of claim 1, wherein the direct cooling plate system comprises a cooling plate body, and a heat exchanger attached to one side of the cooling plate;
and an inlet pipe and an outlet pipe of the heat exchanger are communicated with the refrigeration pipeline.
8. The electronic equipment direct cooling system of claim 7, wherein the heat exchanger is a blown plate heat exchanger, a parallel flow heat exchanger, or a direct borehole heat exchanger.
9. The direct cooling system for electronic equipment according to claim 1, further comprising a bottom plate, wherein a partition plate is protruded from a middle portion of the bottom plate to divide a support end of the bottom plate into a first region and a second region,
the direct chill plate system is disposed in the first zone, and the compressor system and the condenser system are disposed in the second zone.
10. An electronic device having disposed therein a generator component and a cooling system for cooling the same, wherein the cooling system is a direct cooling system for an electronic device as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021833372.XU CN213020433U (en) | 2020-08-27 | 2020-08-27 | Electronic equipment and direct cooling system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021833372.XU CN213020433U (en) | 2020-08-27 | 2020-08-27 | Electronic equipment and direct cooling system thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213020433U true CN213020433U (en) | 2021-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021833372.XU Active CN213020433U (en) | 2020-08-27 | 2020-08-27 | Electronic equipment and direct cooling system thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111829214A (en) * | 2020-08-27 | 2020-10-27 | 深圳市英维克科技股份有限公司 | Electronic equipment and direct cooling system thereof |
| WO2024191372A1 (en) * | 2023-03-10 | 2024-09-19 | Enover Isi Si̇stemleri̇ Anoni̇m Şi̇rketi̇ | Electronic equipment cooling system with heat transfer fluid |
-
2020
- 2020-08-27 CN CN202021833372.XU patent/CN213020433U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111829214A (en) * | 2020-08-27 | 2020-10-27 | 深圳市英维克科技股份有限公司 | Electronic equipment and direct cooling system thereof |
| WO2024191372A1 (en) * | 2023-03-10 | 2024-09-19 | Enover Isi Si̇stemleri̇ Anoni̇m Şi̇rketi̇ | Electronic equipment cooling system with heat transfer fluid |
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