CN212992681U - Flexible circuit board jointed board structure and flexible circuit board chip mounting device - Google Patents
Flexible circuit board jointed board structure and flexible circuit board chip mounting device Download PDFInfo
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- CN212992681U CN212992681U CN202022065549.2U CN202022065549U CN212992681U CN 212992681 U CN212992681 U CN 212992681U CN 202022065549 U CN202022065549 U CN 202022065549U CN 212992681 U CN212992681 U CN 212992681U
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Abstract
The utility model discloses a flexible circuit board makeup structure and flexible circuit board paster device, wherein, flexible circuit board makeup structure, include: a substrate; the flexible circuit board is bonded on the substrate and is provided with a patch area and a non-patch area; the chip mounting area of the flexible circuit board is bonded with the substrate through the first reinforcing layer; and the second reinforcing layer is arranged on the flexible circuit board, the first bonding area is far away from the patch area, the second reinforcing layer is close to the first bonding area, and the non-patch area of the flexible circuit board is adhered to the substrate through the second reinforcing layer. The utility model discloses an adopt first strengthening layer and the second strengthening layer of setting between flexible circuit board and base plate, through setting up first strengthening layer in SMD district, set up the second strengthening layer in SMD district, make SMD district and SMD district homoenergetic fixed on the base plate to prevent that the relative base plate of flexible circuit board from removing.
Description
Technical Field
The utility model relates to a SIP chip pastes dress field, in particular to flexible circuit board makeup structure and flexible circuit board paster device.
Background
With the rapid development of electronic technology, miniaturized electronic products, especially wearable products, are becoming more and more popular among consumers. Along with wearing class product's more and more renewal, the miniaturization of its product, multi-functionalization demand is higher and higher, and in the face of the new trend in market, single module integrates and hardly satisfies multi-functional and miniaturized dual demand, and the extra FPC (flexible circuit board) connecting wire that adds becomes new selection.
The FPC is used as an indispensable part of a miniature circuit board, the thickness of the FPC is very thin, generally 0.1mm-0.2mm, when the circuit board is connected, the FPC board is easily damaged by inserting a connector, in order to compensate the damage, a reinforcing plate is generally reinforced at a contact end of the FPC board, the thickness of the reinforcing plate is generally 0.2mm-0.3mm, when the FPC is used for mounting devices, due to unevenness of the bottom, when the FPC is placed on a carrier for mounting, the mounting deviation and the infirm of the devices can occur to the mounted devices, and the challenges are brought to the FPC mounting process.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims at providing a practical flexible circuit board makeup structure and flexible circuit board paster device.
In order to achieve the above object, the utility model provides a flexible circuit board makeup structure, include:
a substrate;
the flexible circuit board is bonded on the substrate and is provided with a patch area and a non-patch area;
the chip mounting area of the flexible circuit board is bonded with the substrate through the first reinforcing layer; and
the flexible circuit board is provided with a first bonding area far away from the patch area, the second reinforcing layer is close to the first bonding area, and the non-patch area of the flexible circuit board is adhered to the substrate through the second reinforcing layer.
Optionally, the flexible circuit board further has a second adhesion area, and the patch area is disposed at the second adhesion area;
the flexible circuit board is provided with a first end portion and a second end portion far away from the first end portion, the first bonding area is arranged close to the first end portion, and the second bonding area is arranged close to the second end portion.
Optionally, a thickness of the first stiffening layer is equal to a thickness of the second stiffening layer.
Optionally, the first reinforcing layer and/or the second reinforcing layer are made of a high temperature resistant tape.
Optionally, the number of the flexible circuit boards is multiple, and the multiple flexible circuit boards are arranged on the substrate in a matrix.
Optionally, the number of the flexible circuit boards is multiple, the flexible circuit boards are arranged on the substrate at equal intervals, and the flexible circuit boards in adjacent rows are arranged in central symmetry.
Optionally, the flexible circuit board splicing structure further includes:
the flexible circuit board is further provided with a third bonding area far away from the first bonding area and the second bonding area, and the third bonding area is bonded with the substrate through the third reinforcing layer.
The utility model discloses on the basis of above-mentioned flexible circuit board makeup structure, provide a flexible circuit board paster device, include:
a patch mechanism;
a furnace passing carrier; and
as for the flexible circuit board jointed board structure, the substrate of the flexible circuit board jointed board structure is arranged on the furnace passing carrier, so that the chip mounting mechanism is used for mounting a chip on the flexible circuit board jointed board structure.
Optionally, the edge of the substrate of the flexible circuit board jointed board structure is connected with the furnace-passing carrier through a connecting piece.
Optionally, the connector is a high temperature resistant tape.
The technical scheme of the utility model is that the flexible circuit board can be bonded on the substrate by adopting the first strengthening layer and the second strengthening layer which are arranged between the flexible circuit board and the substrate, thereby realizing the fixation of the flexible circuit board; the first reinforcing layer is arranged in the chip mounting area, and the second reinforcing layer is arranged in the non-chip mounting area, so that the chip mounting area and the non-chip mounting area can be fixed on the substrate, and the flexible circuit board is prevented from moving relative to the substrate; because the first bonding area is far away from the patch area, when the second reinforcing layer is close to the first bonding area, the stress distribution between the flexible circuit board and the substrate is relatively more balanced, and the non-patch area of the flexible circuit board is prevented from warping or moving.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of a jointed board structure of a flexible printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a side of a flexible printed circuit facing a substrate;
FIG. 3 is a schematic structural diagram of a plurality of flexible printed circuit boards according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another embodiment of the present invention in a state of multiple flexible circuit boards being jointed together.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | Furnace- |
11 | Connecting |
| 20 | |
30 | Flexible circuit board |
| 31 | First adhesive region | 32 | |
| 33 | Non-patch area | 34 | Second |
| 35 | Third |
36 | |
| 37 | |
40 | Second |
| 50 | First |
60 | Third stiffening layer |
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1 and 2, the present invention provides a flexible circuit board jointed board structure, including: a substrate 20; a flexible circuit board 30 adhered to the substrate 20, the flexible circuit board 30 having a patch area 32 and a non-patch area 33; the chip mounting structure comprises a first reinforcing layer 50, wherein the chip mounting region 32 of the flexible circuit board 30 is bonded with the substrate 20 through the first reinforcing layer 50; and a second reinforcing layer 40, the flexible circuit board 30 has a first bonding region 31 far away from the chip region 32, the second reinforcing layer 40 is arranged near the first bonding region 31, and the non-chip region 33 of the flexible circuit board 30 is bonded with the substrate 20 through the second reinforcing layer 40.
The flexible circuit board 30 is used for mounting a connector or other chip structures, the connector or the chip is mounted on the flexible circuit board 30 back to one side of the substrate 20, the flexible circuit board 30 is bonded on the substrate 20 and then corresponds to the position of the patch area 32, the flexible circuit board 30 faces to the surface of one side of the substrate 20, and the positions outside the patch area 32 are non-patch areas 33.
The substrate 20 serves as a carrier of the flexible circuit board 30, and the flexible circuit board 30 is adhered to the substrate 20 so that the flexible circuit board 30 maintains a preset position and a preset angle. The first stiffening layer 50 and the second stiffening layer 40 are disposed on a side of the flexible circuit board 30 facing the substrate 20.
The first reinforcing layer 50 is used for bonding the chip mounting region 32 of the flexible circuit board 30 to the substrate 20, so that the chip mounting region 32 of the flexible circuit board 30 is fixed on the substrate 20. The first stiffening layer 50 may be used to increase the thickness of the mounting region 32 of the flexible circuit board 30, so as to facilitate mounting of the flexible circuit board 30.
The second reinforcing layer 40 is used for bonding the non-chip area 33 of the flexible circuit board 30 to the substrate 20, so that the non-chip area 33 of the flexible circuit board 30 is fixed on the substrate 20. Since the first adhesion region 31 is disposed away from the chip region 32, the second reinforcing layer 40 is disposed close to the first adhesion region 31, so that the second reinforcing layer 40 is disposed away from the chip region 32. When the second stiffening layer 40 bonds the non-chip area 33 of the flexible circuit board 30 and the substrate 20 to each other, the flexible circuit board 30 is fixed on the substrate 20 by the first stiffening layer 50 and the second stiffening layer 40. In an embodiment of the present invention, the first reinforcing layer 50 and/or the second reinforcing layer 40 are made of high temperature resistant adhesive tape, so that the jointed board structure is not easily deformed when passing through the chip mounter.
The thicknesses of the first and second stiffening layers 40 and 32 may be the same, so that the distances between the chip region 32 and the non-chip region 33 of the flexible circuit board 30 and the substrate 20 are equal to prevent the flexible circuit board 30 from being displaced. The thicknesses of the first reinforcing layer 50 and the second reinforcing layer 40 may not be completely the same, and the thickness of the second reinforcing layer 40 is close to the thickness of the first reinforcing layer 50, so as to prevent the excessive thickness of the first reinforcing layer 50 and the second reinforcing layer 40 from causing the excessive distance difference between different parts of the flexible circuit board 30 and the substrate 20. Because the first stiffening layer 50 with the second stiffening layer 40 plays the bonding the flexible circuit board 30 with the effect of base plate 20, when the first stiffening layer 50 with the second stiffening layer 40 thickness is close to or equals, the stability of flexible circuit board 30 is higher.
Through making first stiffening layer 50 with second stiffening layer 40 is right from two positions flexible circuit board 30 fixes, flexible circuit board 30 can be firmly fixed on base plate 20, carrying out the SMD, flexible circuit board 30 is difficult to relatively base plate 20 removes to it is more accurate to make the paster.
Because the second reinforcing layer 40 is far away from the patch area 32, when the jointed board structure is integrally placed in a patch device, the flexible circuit board 30 is far away from the patch area 32, so that warping is not easy to occur, and the problem of interference with patch positioning caused by local warping can be avoided. Because the second stiffening layer 40 is kept away from the chip mounting area 32 sets up, it is not necessary right the whole setting in non-chip mounting area 33 the second stiffening layer 40 can effectively reduce the area of second stiffening layer 40, and it is right to realize when flexible circuit board 30 goes on fixing, it is extravagant to reduce the material of second stiffening layer 40. Because the second reinforcing layer 40 is disposed on the first bonding region 31, the first bonding region 31 is only a local region of the non-chip region 33, when the second reinforcing layer 40 is bonded, the second reinforcing layer 40 does not need to be completely matched with the shape of the flexible circuit board 30, so that the second reinforcing layer 40 can be conveniently formed and processed, and when the second reinforcing layer 40 is disposed on the flexible circuit board 30, alignment and positioning can be conveniently performed, so that the second reinforcing layer 40 is more efficiently mounted; because the second stiffening layer 40 only needs to pull the local part in the non-patch area on the flexible circuit board, it is right that the material quantity of the second stiffening layer 40 is less relatively, can effectively reduce processing cost.
The shape of the flexible circuit board 30 determines the location of the patch area 32. Since the mounting region 32 of the flexible circuit board 30 is generally disposed near one edge thereof for facilitating mounting and subsequent mounting, the first reinforcing layer 50 is disposed near one edge of the flexible circuit board 30.
In an embodiment of the present invention, the flexible circuit board 30 is a polygonal structure, the patch area 32 is close to a vertex angle or an edge of a polygon of the flexible circuit board 30, there is a position on the flexible circuit board 30 that is far away from the patch area 32, the first adhesion area 31 is located on the flexible circuit board 30, which is far away from the position of the patch area 32. Taking the flexible circuit board 30 as a quadrangle as an example, the chip mounting region 32 is disposed near one of the corners of the quadrangle, and the first adhesive region 31 is disposed near the corner corresponding to the chip mounting region 32.
In another embodiment of the present invention, the flexible circuit board 30 has an oval structure, the patch area 32 is close to one end of the long axis of the flexible circuit board 30, and the first adhesive area 31 is close to the other end of the long axis of the flexible circuit board 30. When the flexible circuit board 30 is circular, the first adhesion area 31 and the patch area 32 are respectively disposed near both ends of the diameter of the flexible circuit board 30.
In another embodiment of the present invention, the flexible circuit board 30 is a special-shaped structure as shown in fig. 2, the mounting area 32 is close to one of the end portions of the flexible circuit board 30, and the first bonding area 31 is close to the flexible circuit board 30 away from the end portion of the mounting area 32, so as to prevent the jointed board structure from deforming or shifting after entering the chip mounter.
In an embodiment of the present invention, the flexible circuit board 30 further has a second adhesion area 34, and the patch area 32 is disposed at the second adhesion area 34; the flexible circuit board 30 has a first end 36 and a second end 37 distal from the first end 36, the first adhesive region 31 is disposed proximate to the first end 36, and the second adhesive region 34 is disposed proximate to the second end 37.
The first end portion 36 and the second end portion 37 are two edges of the flexible circuit board 30, respectively. Taking the structure of the flexible circuit board 30 as shown in fig. 2 as an example, the first end 36 is the lower end of the flexible circuit board 30, the second end 37 is the upper end of the flexible circuit board 30, and the second adhesion region 34 is disposed near the upper end of the flexible circuit board 30, so that the patch region 32 is near one end of the flexible circuit board 30. The first bonding region 31 is close to the first end portion 36, so that the two downward ends of the flexible circuit board 30 are bonded to the substrate 20 via the first reinforcing layer 50 and the second reinforcing layer 40, respectively.
By bringing the first bonding area 31 close to the first end 36 and the second bonding area 34 close to the second end 37, after the flexible circuit board 30 is bonded to the substrate 20, both the upper and lower ends of the flexible circuit board 30 are fixed to the substrate 20, and when entering a chip mounter, the end of the flexible circuit board 30 is not easily warped or moved, so that the flexible circuit board 30 can be kept in a stable state. When the flexible circuit board 30 has another shape, the first end portion 36 and the second end portion 37 are both end portions in the length direction of the flexible circuit board 30.
In order to improve the stability of the flexible circuit board 30, in an embodiment of the present invention, the flexible circuit board 30 splicing structure further includes: a third reinforcing layer 60, wherein the flexible circuit board 30 further has a third bonding region 35 far away from the first bonding region 31 and the second bonding region 34, and the third bonding region 35 is bonded to the substrate 20 through the third reinforcing layer 60.
The third stiffening layer 60 may correspond to the thickness of the first stiffening layer 50 and/or the second stiffening layer 40; the third stiffening layer 60 may be made of the same material as the first stiffening layer 50 and/or the second stiffening layer 40.
The third adhesion region 35 is disposed apart from the first adhesion region 31 and the second adhesion region 34, respectively, so that the flexible circuit board 30 has three portions adhered to the substrate 20.
The positions of the first, second and third adhesive regions 31, 34, 35 may be determined according to the specific shape of the flexible circuit board 30. When the flexible circuit board 30 has an elongated structure, the first and second adhesion regions 31 and 34 are located at two ends of the flexible circuit board 30, respectively, and the third adhesion region 35 may be located between the first and second adhesion regions 31 and 34.
When the flexible circuit board 30 has a special-shaped structure as shown in fig. 2, the first, second, and third adhesion regions 31, 34, and 35 may be disposed near three ends of the flexible circuit board 30, which may be three ends away from the geometric center of the flexible circuit board 30.
Referring to fig. 3, in an embodiment of the present invention, the number of the flexible circuit boards 30 is plural, and the plural flexible circuit boards 30 are arranged in a matrix on the substrate 20. The flexible circuit boards 30 are regularly distributed on the substrate 20.
It is a plurality of first stiffening layer 50 on the flexible circuit board 30 and second stiffening layer 40's position is the same, will be a plurality of flexible circuit board 30 is fixed after on the base plate 20, it is single first stiffening layer 50 of flexible circuit board 30 all produces the traction to base plate 20 with the second stiffening layer 40 of adjacent flexible circuit board 30, makes adjacently produce the effort of mutual traction through base plate 20 between the flexible circuit board 30, because it is a plurality of flexible circuit board 30 is the matrix and arranges, and is adjacent distance between the flexible circuit board 30 is the same, and produced mutual traction force is also the same, makes a plurality of flexible circuit board 30 is in form balanced state on the base plate 20, and then can prevent flexible circuit board 30 on the base plate 20 drops.
Referring to fig. 4, in another embodiment of the present invention, the number of the flexible circuit boards 30 is plural, a plurality of the flexible circuit boards 30 are arranged on the substrate 20 at equal intervals, and the flexible circuit boards 30 in adjacent rows are arranged in a central symmetry manner.
The flexible circuit boards 30 are uniformly distributed on the substrate 20 according to the arrangement mode shown in fig. 4, the arrangement modes of the flexible circuit boards 30 in adjacent rows are the same, and the arrangement modes of the flexible circuit boards 30 in adjacent rows are relatively changed. In this embodiment, the flexible circuit boards 30 in adjacent rows are arranged in a central symmetry manner, so that the acting forces of the adjacent flexible circuit boards 30 on the substrate 20 are in a relatively balanced state. After the arrangement, the flexible circuit boards 30 in adjacent rows can be staggered relatively, so that the space on the substrate 20 can be fully utilized, and the space utilization rate is improved.
The utility model discloses still provide an embodiment of flexible circuit board 30 paster device.
The circuit board chip device includes: a patch mechanism; a furnace-passing carrier 10; and the flexible circuit board jointed board structure according to any of the above embodiments, wherein the substrate 20 of the flexible circuit board jointed board structure is arranged on the furnace carrier, so that the chip mounting mechanism mounts a chip on the flexible circuit board 30 on the flexible circuit board jointed board structure.
The flexible circuit board jointed board structure is used for fixing a flexible circuit board 30 on the substrate 20, fixing the substrate 20 on the furnace passing carrier 10, and inputting the furnace passing carrier 10 into the chip mounting mechanism to carry out chip mounting operation. The chip mounting mechanism can be a chip mounter. The flexible circuit board 30 patch device may also include other features, as may be found in the prior art.
Since the flexible circuit board 30 is fixed on the substrate, when the furnace carrier 10 is placed in the placement mechanism, the flexible circuit board 30 can be kept in a preset stable state, and the quality of the chip mounted on the flexible circuit board 30 can be improved.
In this embodiment, the edge of the substrate 20 of the flexible circuit board 30 with a jointed board structure is connected to the furnace carrier 10 through a connecting member 11. The connecting member 11 is used for fixing the substrate 20 on the furnace carrier 10.
When the substrate 20 is manufactured, a positioning hole may be preset on the substrate 20 to fix the substrate 20 at a preset position. The connecting member 11 may be clamped to the edges of the substrate 20 and the furnace carrier 10, or the substrate 20 may be bonded to the furnace carrier 10. In this embodiment, the substrate 20 is preferably connected to the furnace carrier 10 through a high temperature resistant adhesive tape.
Claims (10)
1. A flexible circuit board splicing structure is characterized by comprising:
a substrate;
the flexible circuit board is bonded on the substrate and is provided with a patch area and a non-patch area;
the chip mounting area of the flexible circuit board is bonded with the substrate through the first reinforcing layer; and
the flexible circuit board is provided with a first bonding area far away from the patch area, the second reinforcing layer is close to the first bonding area, and the non-patch area of the flexible circuit board is adhered to the substrate through the second reinforcing layer.
2. The flexible circuit board panel structure of claim 1, wherein the flexible circuit board further has a second adhesive area, the patch area being disposed at the second adhesive area;
the flexible circuit board is provided with a first end portion and a second end portion far away from the first end portion, the first bonding area is arranged close to the first end portion, and the second bonding area is arranged close to the second end portion.
3. The flexible circuit board panel structure of claim 1, wherein the thickness of the first reinforcing layer is equal to the thickness of the second reinforcing layer.
4. The jointed board structure of flexible circuit board as claimed in claim 1, wherein the first and/or second reinforcing layers are made of high temperature resistant adhesive tape.
5. The flexible circuit board panel structure according to any one of claims 1 to 4, wherein the number of the flexible circuit boards is plural, and the plural flexible circuit boards are arranged in a matrix on the substrate.
6. The flexible circuit board panel structure according to any one of claims 1 to 4, wherein the number of the flexible circuit boards is plural, the plural flexible circuit boards are arranged on the substrate at equal intervals, and the flexible circuit boards in adjacent columns are arranged in central symmetry.
7. The flexible circuit board panel assembly structure of claim 2, wherein the flexible circuit board panel assembly structure further comprises:
the flexible circuit board is further provided with a third bonding area far away from the first bonding area and the second bonding area, and the third bonding area is bonded with the substrate through the third reinforcing layer.
8. A flexible circuit board chip device, comprising:
a patch mechanism;
a furnace passing carrier; and
the flexible circuit board panel structure of any one of claims 1 to 7, wherein the substrate of the flexible circuit board panel structure is disposed on the furnace carrier so that the chip mounting mechanism mounts a chip on the flexible circuit board panel structure.
9. The flexible circuit board patch device according to claim 8, wherein an edge of the substrate of the flexible circuit board patch structure is connected to the furnace carrier by a connector.
10. The flexible circuit board patch device of claim 9, wherein the connector is a high temperature resistant tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022065549.2U CN212992681U (en) | 2020-09-17 | 2020-09-17 | Flexible circuit board jointed board structure and flexible circuit board chip mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022065549.2U CN212992681U (en) | 2020-09-17 | 2020-09-17 | Flexible circuit board jointed board structure and flexible circuit board chip mounting device |
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| Publication Number | Publication Date |
|---|---|
| CN212992681U true CN212992681U (en) | 2021-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202022065549.2U Active CN212992681U (en) | 2020-09-17 | 2020-09-17 | Flexible circuit board jointed board structure and flexible circuit board chip mounting device |
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| CN (1) | CN212992681U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113440734A (en) * | 2021-06-30 | 2021-09-28 | 固安翌光科技有限公司 | Optical device for photodynamic therapy and method of making same |
-
2020
- 2020-09-17 CN CN202022065549.2U patent/CN212992681U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113440734A (en) * | 2021-06-30 | 2021-09-28 | 固安翌光科技有限公司 | Optical device for photodynamic therapy and method of making same |
| CN113440734B (en) * | 2021-06-30 | 2023-02-21 | 固安翌光科技有限公司 | Optical device for photodynamic therapy and method of making same |
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