CN212988782U - Nano conductive rubber sensor packaging structure - Google Patents
Nano conductive rubber sensor packaging structure Download PDFInfo
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- CN212988782U CN212988782U CN202022378425.XU CN202022378425U CN212988782U CN 212988782 U CN212988782 U CN 212988782U CN 202022378425 U CN202022378425 U CN 202022378425U CN 212988782 U CN212988782 U CN 212988782U
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Abstract
The utility model relates to a pressure measurement technical field provides a nanometer conductive rubber sensor packaging structure. The utility model discloses a rubber substrate is adopted to wrap up nanometer conductive rubber sensor, and the rubber substrate wrapped up with the sensor is sealed with the casing, the cover plate and the sealing cover, the packaging structure is ingenious, the rubber substrate plays the role of buffer layer, the sensor stress can be balanced, the phenomenon of structural damage caused by stress concentration can not appear, and the sensor has excellent performances of high temperature resistance, water resistance, fire resistance, ultraviolet resistance, acid and alkali corrosion resistance and the like; the casing parcel can play the effect of protection rubber substrate in the rubber substrate outside, and the test range can be enlargied to the apron, gives compression deformation headspace simultaneously, and sealed lid plays fixed and sealed effect, can protect the apron to prevent the bias voltage. The utility model provides an encapsulation structure can improve the life-span and the fatigue stability of sensor.
Description
Technical Field
The utility model relates to a pressure measurement technical field especially relates to a wide range high tenacity nanometer conductive rubber sensor and preparation and packaging method thereof.
Background
The nanometer conductive rubber is a composite material with conductive performance obtained by doping nanometer conductive filler into an insulating matrix, has good piezoresistive property, durability and flexibility, and has wide application in the pressure sensing field.
The traditional nano conductive rubber sensor has unreasonable packaging structure design, can not effectively offset the internal stress of the sensor, causes stress concentration, is easy to damage the structure of the sensor, and greatly influences the use stability and the service life of the sensor. The problems severely limit the application of the nano conductive rubber sensor in the aspects of building engineering, bridge engineering, internet of things, intelligent wearing, medical health and the like.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a nano conductive rubber sensor package structure; the utility model provides an encapsulation structure design benefit can make the sensor atress more balanced, improves the life-span and the fatigue stability of sensor.
In order to realize the purpose of the utility model, the utility model provides a following technical scheme:
a nano conductive rubber sensor packaging structure comprises a shell, a packaging piece, a lead, a cover plate and a sealing cover;
the top of the shell is open, a through hole is formed in the side wall of the shell, and threads are arranged on the top of the outer side of the shell;
the packaging piece is arranged inside the shell, and the size of the packaging piece is matched with that of the inside of the shell;
the packaging piece comprises a nano conductive rubber sensor and a rubber substrate coated on the surface of the nano conductive rubber sensor; the nano conductive rubber sensor comprises nano conductive rubber and electrodes respectively arranged on the upper surface and the lower surface of the nano conductive rubber;
one end of the lead is connected with the electrode, and the other end of the lead extends out of the hole of the shell;
the longitudinal section of the cover plate is of a convex structure, the bottom of the cover plate is in contact with the top of the packaging piece, and the size of the bottom of the cover plate is matched with the inner diameter of the shell;
threads are arranged on the side wall of the inner part of the sealing cover, and the sealing cover and the shell are fastened through the threads; the top of the sealing cover is provided with an opening, the size of the opening is matched with that of the top of the cover plate, and the top of the cover plate extends out of the opening.
Preferably, the shell, the cover plate and the sealing cover are all made of stainless steel.
Preferably, the electrode is made of a conductive film material; the thickness of the conductive film material is 0.02-0.05 mm.
Preferably, the conductive film material comprises copper foil, zinc foil, aluminum foil, copper mesh or conductive fabric.
Preferably, the thickness of the nano conductive rubber sensor is 0.2-2.5 mm.
Preferably, the thickness of the rubber matrix is 4mm to 6 mm.
Preferably, the wire comprises a copper enameled wire, a stainless steel yarn or a conductive fiber.
Preferably, a buffer pad is further disposed at a position where the sealing cover and the cover plate are contacted.
The utility model provides a nano conductive rubber sensor packaging structure, which comprises a shell, a packaging piece, a lead, a cover plate and a sealing cover; the packaging piece comprises a nanometer conductive rubber sensor and a rubber substrate coated on the surface of the nanometer conductive rubber sensor. The utility model provides an encapsulation structure design benefit encapsulates the sensor in rubber matrix center, and rubber matrix has the cushioning effect, makes the sensor atress balanced, does not have stress concentration and the phenomenon of structural failure, and rubber matrix's design makes the holistic performance such as outstanding high temperature resistant, waterproof, fire prevention, resistant ultraviolet, acid and alkali corrosion resistance that possesses of sensor simultaneously, consequently has better ageing-resistant stability, has longer life and security under the high load condition.
The utility model provides a packaging structure utilizes casing, apron and sealed lid to seal the packaging part, and wherein the casing wraps up in the rubber substrate outside, can play the effect of protection rubber substrate, and the test range can be enlargied to the apron, gives compression deformation headspace simultaneously, and sealed lid plays the effect of fixing and sealing, can protect the apron to prevent the bias voltage; the utility model discloses a design of casing, apron and sealed lid makes the sensor after the encapsulation possess stronger external disturbance and the ability of corroding of resisting, makes the conductive rubber atress more balanced in the pressure cycle test, has faster elasticity compression deformation's of recovering ability, reduces permanent deformation, has higher piezoelectricity signal corresponding frequency, the base line drift phenomenon can not appear in the cycle test, has longer life-span and better fatigue stability.
Drawings
Fig. 1 is a schematic structural diagram of a packaged structure of a nano conductive sensor according to the present invention; in fig. 1: 1-nanometer conductive rubber, 2-electrode, 3-lead, 4-shell, 5-rubber base, 6-cover plate, 7-sealing cover, 8-buffer pad;
fig. 2 is a schematic structural view of a housing used in an embodiment of the present invention;
fig. 3 is a schematic structural view of a cover plate used in an embodiment of the present invention;
fig. 4 is a schematic structural view of a sealing cover used in an embodiment of the present invention;
fig. 5 is a schematic structural view of a hot press forming mold used in an embodiment of the present invention.
Detailed Description
The utility model provides a packaging structure of nanometer conductive rubber sensor, concrete structure is shown as figure 1, and the following is specifically explained with reference to figure 1.
The utility model provides an encapsulation structure includes the casing. In the utility model, the top of the shell is open, and can be a hollow cylinder with an open top; the top of the outer side of the shell is provided with a circle of threads, and the side wall of the shell is provided with a through hole; the thickness of the shell is preferably 2 mm; the utility model has no special requirements on the size and position of the through hole, and the lead can be led out; the utility model has no special requirement on the specific size of the shell and can be set according to the size of the sensor to be packaged; in the specific embodiment of the utility model, the schematic structure of casing is as shown in fig. 2, and wherein the external diameter of casing is 20mm, and the internal diameter is 16mm, highly is 12mm, and casing thickness is 2mm, and the diameter of hole is 1.5mm on the lateral wall, and the screw thread specification is M20X 1.5, and the thread depth is 6.4 mm.
The utility model provides a packaging structure includes the packaging part. In the present invention, the package comprises a nano conductive rubber sensor and a rubber substrate coated on the surface of the nano conductive rubber sensor; the nano conductive rubber sensor comprises nano conductive rubber and electrodes respectively arranged on the upper surface and the lower surface of the nano conductive rubber.
In the present invention, the components of the nano conductive rubber preferably include a rubber base material, a nano conductive filler and a vulcanizing agent; the rubber base material preferably comprises Polydimethylsiloxane (PDMS), fumed silica, Liquid Silica (LSR), nitrile rubber (NBR), Ethylene Propylene Diene Monomer (EPDM) or polyurethane elastomer (TPU), and in a specific embodiment of the present invention, the type of the fumed silica is preferably GS-1050 u; the nano conductive filler preferably comprises one or more of superconducting carbon black, conductive carbon nanotubes and conductive graphene; the vulcanizing agents preferably comprise bis-25 vulcanizing agents and/or bis-24 vulcanizing agents; the utility model has no special requirement for the addition of the nanometer conductive filler and the vulcanizing agent, and can be set according to the addition known by the technicians in the field; the utility model has no special requirements on the preparation method of the nanometer conductive rubber, and the nanometer conductive rubber is prepared according to the method well known by the technical personnel in the field.
In the present invention, the electrode is preferably a conductive thin film material; the conductive film material is preferably copper foil, zinc foil, aluminum foil, copper mesh or conductive fabric; the conductive fabric is preferably silver-plated fiber fabric; the thickness of the conductive film material is preferably 0.02 mm-0.05 mm, and more preferably 0.03-0.04 mm.
The utility model has no special requirements on the preparation method of the nanometer conductive rubber sensor, and the nanometer conductive rubber sensor can be prepared by a method well known by the technical personnel in the field.
The utility model discloses in, the thickness of nanometer conductive rubber sensor is preferably 0.2 ~ 2.5mm, and more preferably is 0.5 ~ 2.0 mm.
In the utility model, the thickness of the rubber matrix is preferably 4-6 mm; the rubber matrix preferably comprises a rubber matrix material and a vulcanizing agent; the type of the rubber base material is preferably consistent with that of the rubber base material in the nano conductive rubber sensor; the mechanical properties of the same rubber base material are similar, the rubber base and the nano conductive rubber sensor have synchronous stress contraction ratios after being packaged, the structural damage caused by unbalanced stress in the sensor is avoided, and the sensitivity and the consistency of the sensor can be improved; the optional kind of vulcanizer is unanimous with above-mentioned scheme, and no longer the repeated description here, the utility model discloses do not have special requirement to the addition of vulcanizer, add according to the addition that technical personnel in the field are familiar with.
The utility model provides a packaging structure includes the wire. In the utility model, the preferable conducting wire comprises a copper enameled wire, a stainless steel yarn or a conductive fiber, and particularly can be a red copper enameled wire; one end of each wire is connected with the electrode, the other end of each wire extends out of the hole of the shell, and the number of the wires is 2, and the wires are respectively connected with the electrodes on the upper surface and the lower surface of the nano-wire rubber sensor. The utility model discloses it does not have special requirement to the connected mode of wire, adopt the connected mode that technical personnel in the field are familiar with can.
The utility model provides an encapsulation structure includes the apron. In the utility model, the longitudinal section of the cover plate is of a convex structure, the bottom of the cover plate is in contact with the top of the packaging part, the size of the bottom of the cover plate is matched with the inner diameter of the shell, the bottom of the cover plate specifically refers to the end with larger size, and the top specifically refers to the end with smaller size; in a specific embodiment of the present invention, the cover plate has a structure as shown in fig. 3, wherein the diameter of the bottom of the cover plate is 15.94mm, the diameter of the top is 10mm, the thickness of the top is 4.5mm, and the thickness of the bottom is 2 mm.
The utility model provides a packaging structure which comprises a sealing cover, wherein the inner wall of the sealing cover is provided with a thread, and the sealing cover and the shell are fastened through the thread; the top of the sealing cover is provided with an opening, the size of the opening is matched with that of the top of the cover plate, and the top of the cover plate extends out of the opening. The utility model discloses in, sealed lid specifically is uncovered for the bottom, and the top is provided with open-ended tubular structure, plays fixed and sealed effect, can protect the apron to prevent the bias voltage. In a specific embodiment of the present invention, the sealing cover has a schematic structural diagram as shown in fig. 4, wherein the diameter of the sealing cover is 24mm, the diameter of the opening is 10.1mm, the thickness of the sealing cover is 2mm, the length of the side wall is 6mm, the thread specification is M20 × 1.5, and the depth of the thread is 6 mm.
In the present invention, a cushion pad is preferably further provided at a position where the sealing cover and the cover plate contact each other.
In the present invention, the material of the housing, the cover plate and the sealing cover is preferably stainless steel.
The utility model discloses in, the electrically conductive rubber sensor packaging structure of nanometer is preferred to be prepared through following steps:
(1) providing a shell, wherein the structure is as described in the scheme above;
providing a hot-pressing forming die, wherein the hot-pressing forming die is of a three-layer cylinder structure, the centers of three layers of cylinders in the three-layer cylinder structure are the same and are mutually connected, the diameters of the three layers of cylinders are sequentially reduced from top to bottom, and the diameter of the cylinder at the lowest layer is smaller than the inner diameter of the shell;
mixing a rubber base material and a vulcanizing agent, putting the mixture into a shell, pressurizing the mixture in the shell by using a hot-press forming die to perform hot-press curing treatment, and then removing the hot-press forming die to form a rubber concave cavity in the shell;
(2) providing a nano-wire rubber sensor, wherein the nano-wire rubber sensor comprises nano-conductive rubber and electrodes arranged on the upper surface and the lower surface of the nano-conductive rubber;
connecting electrodes on the upper surface and the lower surface of the nano conductive rubber sensor with a lead, then placing the lead into the rubber concave cavity, leading the other end of the lead out of a hole on the side wall of the shell, filling the shell with a mixture of a rubber base material and a vulcanizing agent, and then carrying out hot-pressing vulcanization packaging to obtain a packaging piece;
(3) providing a cover plate and a sealing cover, wherein the structure is as the scheme;
the cover plate is placed on the top of the package, and then the top opening of the sealing cover is passed through the upper portion of the cover plate, and the sealing cover and the case are sealed by means of screw threads.
In the utility model, the hot-pressing forming die is preferably a solid structure, the utility model has no special requirement on the specific size of the hot-pressing forming die and can be set according to the size of the sensor to be packaged; in the embodiment of the present invention, the structure and size of the hot press forming mold are as shown in fig. 5, wherein the diameter of the top cylinder is 25mm, the diameter of the middle cylinder is 15.92mm, and the diameter of the bottom cylinder is 14 mm.
The utility model discloses in, the temperature of hot pressing solidification treatment is preferably 150 ~ 185 ℃, more preferably 155 ~ 180 ℃, and pressure is preferably 5 ~ 25MPa, more preferably 10 ~ 20MPa, and time is preferably 15 min.
The utility model discloses in, the temperature of hot pressing vulcanization encapsulation is preferred 90 ~ 280 ℃, more preferred 110 ~ 260 ℃, and pressure is preferred 2 ~ 25MPa, more preferred 4 ~ 22 MPa; after the hot-pressing vulcanization packaging is completed, the rubber base material is vulcanized and molded, and the nano conductive rubber sensor is completely packaged in the rubber base.
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention.
Example 1
Providing a shell, wherein the structure is shown in figure 2, the structure of the hot-press forming die is shown in figure 3, the structure of the cover plate is shown in figure 4, the structure of the sealing cover is shown in figure 5, and the shell, the hot-press forming die, the cover plate and the sealing cover are all made of stainless steel; the rubber base material for packaging is gas-phase silica gel GS-1050u, the vulcanizing agent is bis-25, and the addition amount of the vulcanizing agent is 1% of the mass of the gas-phase silica gel; the wire is a red copper enameled wire.
Mixing a rubber base material and a vulcanizing agent, putting the mixture into a shell, pressurizing the mixture in the shell by using a hot-press forming die to carry out hot-press curing treatment, wherein the temperature is 175 ℃, the pressure is 10MPa, and the time is 15min, then removing the hot-press forming die, and forming a rubber concave cavity in the shell;
providing a nano conductive rubber sensor, wherein the nano conductive rubber sensor comprises nano conductive rubber and electrodes arranged on the upper surface and the lower surface of the nano conductive rubber; the rubber base material of the nano conductive rubber is high-strength gas-phase silica gel GS-1050u, the nano conductive filler is superconducting carbon black, and the vulcanizing agent is bis-25; the conductive film material is silver-plated fiber fabric with the thickness of 0.02 mm.
Connecting electrodes on the upper surface and the lower surface of the nano conductive rubber sensor with a lead, then placing the lead into a rubber cavity, leading the other end of the lead out of a hole on the side wall of a shell, filling a mixture of a rubber matrix material and a vulcanizing agent in the shell, and then carrying out hot-pressing vulcanization packaging at the temperature of 175 ℃, under the pressure of 10MPa for 10min to obtain a packaging piece, wherein the thickness of a rubber matrix layer is 4 mm;
and placing a cover plate on the top of the packaging part, then enabling the top opening of the sealing cover to penetrate through the upper part of the cover plate, and fastening the sealing cover and the shell through threads to obtain the sensor packaging structure.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (8)
1. A nano conductive rubber sensor packaging structure is characterized by comprising a shell, a packaging part, a lead, a cover plate and a sealing cover;
the top of the shell is open, a through hole is formed in the side wall of the shell, and threads are arranged on the top of the outer side of the shell;
the packaging piece is arranged inside the shell, and the size of the packaging piece is matched with that of the inside of the shell;
the packaging piece comprises a nano conductive rubber sensor and a rubber substrate coated on the surface of the nano conductive rubber sensor; the nano conductive rubber sensor comprises nano conductive rubber and electrodes respectively arranged on the upper surface and the lower surface of the nano conductive rubber;
one end of the lead is connected with the electrode, and the other end of the lead extends out of the hole of the shell;
the longitudinal section of the cover plate is of a convex structure, the bottom of the cover plate is in contact with the top of the packaging piece, and the size of the bottom of the cover plate is matched with the inner diameter of the shell;
threads are arranged on the side wall of the inner part of the sealing cover, and the sealing cover and the shell are fastened through the threads; the top of the sealing cover is provided with an opening, the size of the opening is matched with that of the top of the cover plate, and the top of the cover plate extends out of the opening.
2. The package structure of claim 1, wherein the housing, the cover plate, and the sealing cap are made of stainless steel.
3. The package structure of claim 1, wherein the electrode is a conductive thin film material; the thickness of the conductive film material is 0.02-0.05 mm.
4. The package structure of claim 3, wherein the conductive film material comprises copper foil, zinc foil, aluminum foil, copper mesh, or conductive fabric.
5. The package structure of claim 1, wherein the nano conductive rubber sensor has a thickness of 0.2-2.5 mm.
6. The package structure of claim 1, wherein the rubber substrate has a thickness of 4mm to 6 mm.
7. The package structure of claim 1, wherein the conductive wire comprises a copper enameled wire, a stainless steel yarn, or a conductive fiber.
8. The package structure of claim 1, wherein a cushion is further disposed at a position where the sealing cover contacts the cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022378425.XU CN212988782U (en) | 2020-10-23 | 2020-10-23 | Nano conductive rubber sensor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022378425.XU CN212988782U (en) | 2020-10-23 | 2020-10-23 | Nano conductive rubber sensor packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN212988782U true CN212988782U (en) | 2021-04-16 |
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| CN202022378425.XU Active CN212988782U (en) | 2020-10-23 | 2020-10-23 | Nano conductive rubber sensor packaging structure |
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| CN (1) | CN212988782U (en) |
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- 2020-10-23 CN CN202022378425.XU patent/CN212988782U/en active Active
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