CN212983088U

CN212983088U - SMD1 encapsulation shell rack plating anchor clamps

Info

Publication number: CN212983088U
Application number: CN202021446710.4U
Authority: CN
Inventors: 孙志明; 许乐
Original assignee: Shenzhen Honggang Mechanism & Equipment Co ltd
Current assignee: Shenzhen Honggang Optoelectronic Packaging Technology Co.,Ltd.
Priority date: 2020-07-21
Filing date: 2020-07-21
Publication date: 2021-04-16
Anticipated expiration: 2030-07-21

Abstract

The utility model relates to a rack plating technical field discloses a SMD1 encapsulation shell rack plating anchor clamps, include: the large clamp spring coil and the small clamp spring coil are used for clamping the SMD1 packaging shell, so that the SMD1 packaging shell is subjected to rack plating. The large clamp spring ring and the small clamp spring ring play a clamping and fixing role, the SMD1 packaging shell can be conveniently clamped for hanging plating, the large clamp spring ring and the small clamp spring ring are simple to manufacture and low in cost, can be repeatedly used, are both made of beryllium bronze, and are pollution-free to electroplating liquid and high in recovery value.

Description

SMD1 encapsulation shell rack plating anchor clamps

Technical Field

The utility model relates to a rack plating technical field especially relates to a SMD1 encapsulation shell rack plating anchor clamps.

Background

The electroplating hanger can be different types of hangers according to the shape of the part, the technical requirements of the plating layer, the electroplating process and the size of equipment. Such as automated lines and manual lines. In general, a plating workshop is prepared with a general hanger suitable for various common parts and a special hanger designed and manufactured for only a certain part. The universal hanger has various types and forms and is suitable for various processes and parts. Special hangers fall into two categories: one is a special hanger designed and manufactured for the production of mass parts; the other is a special hanger designed according to the complex geometry of parts and special process requirements. The universal hanger is suitable for various parts and processes. The form and structure of the universal electroplating hanger are determined according to the geometric shape of the plated piece, the technical requirements of the plating layer, the process method and the size of equipment.

The rack plating is characterized in that: is suitable for electroplating of various parts; during electroplating, the current density of a single piece is high and cannot change along with time, the bath voltage is low, the temperature rise of the plating solution is slow, the carrying-out quantity is small, and the uniformity of the plated piece is good; but the productivity is low and the maintenance amount of equipment and auxiliary tools is large.

Therefore, how to conveniently carry out rack plating becomes a technical problem to be solved urgently.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model lies in how to conveniently carry out rack plating.

Therefore, according to the first aspect, the embodiment of the utility model discloses a SMD1 encapsulation shell rack plating anchor clamps includes: the large clamp spring coil and the small clamp spring coil are used for clamping the SMD1 packaging shell, so that the SMD1 packaging shell is subjected to rack plating.

Optionally, the large circlip is of a different diameter than the small circlip.

Optionally, the number of the small circlips is set to two groups, and the two groups are symmetrically distributed on two sides of the large circlip.

Alternatively, the large circlip and the small circlip may each be made of rollers of different diameters.

Optionally, the large jump ring coil and the small jump ring coil are both made of beryllium copper.

The utility model discloses following beneficial effect has: the large clamp spring ring and the small clamp spring ring play a clamping and fixing role, the SMD1 packaging shell can be conveniently clamped for hanging plating, the large clamp spring ring and the small clamp spring ring are simple to manufacture and low in cost, can be repeatedly used, are both made of beryllium bronze, and are pollution-free to electroplating liquid and high in recovery value.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a SMD1 package casing rack plating fixture disclosed in this embodiment;

fig. 2 is a partial structural schematic view of a SMD1 package casing rack plating fixture disclosed in this embodiment.

Reference numerals: 1. an SDM product; 2. a large circlip; 3. a small circlip.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

The embodiment of the utility model discloses SMD1 encapsulates shell and hangs plating anchor clamps, as shown in fig. 1 and fig. 2, include: the large clamp spring coil 2 and the small clamp spring coil 3, and the large clamp spring coil 2 and the small clamp spring coil 3 are used for clamping the SMD1 packaging shell, so that the SMD1 packaging shell is subjected to rack plating.

It should be noted that the large clamp spring coil 2 and the small clamp spring coil 3 play a role in clamping and fixing, and are convenient to clamp an SMD1 packaging shell for rack plating, the large clamp spring coil 2 and the small clamp spring coil 3 are simple to manufacture, low in cost and capable of being used repeatedly, and the large clamp spring coil 2 and the small clamp spring coil 3 are both made of beryllium bronze, so that pollution to electroplating solution is avoided, and the recovery value is high; the SDM product 1 is convenient to carry out rack plating.

As shown in fig. 1, the large circlip 2 is different in diameter from the small circlip 3.

As shown in fig. 1, the number of the small circlips 3 is two, and the two groups are symmetrically distributed on two sides of the large circlip 2.

It should be noted that, two groups of small jump ring coils 3 are symmetrically distributed on two sides of the large jump ring coil 2, so as to conveniently and firmly clamp the SMD1 packaging shell, and improve the success rate of electroplating processing.

As shown in fig. 1, the large coil 2 and the small coil 3 can be made of rollers having different diameters.

As shown in figure 1, the large jump ring coil 2 and the small jump ring coil 3 are both made of beryllium copper.

The working principle is as follows: the large clamp spring coil 2 and the small clamp spring coil 3 play a role in clamping and fixing, the SMD1 packaging shell can be conveniently clamped for hanging plating, the large clamp spring coil 2 and the small clamp spring coil 3 are simple to manufacture, the cost is low, the large clamp spring coil 2 and the small clamp spring coil 3 can be repeatedly used, the large clamp spring coil 2 and the small clamp spring coil 3 are made of beryllium bronze, pollution to electroplating solution is avoided, and the recovery value is high.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. The utility model provides a SMD1 encapsulation shell rack plating anchor clamps which characterized in that includes: the large clamp spring coil (2) and the small clamp spring coil (3) are both used for clamping the SMD1 packaging shell, so that the SMD1 packaging shell is subjected to rack plating.

2. The SMD1 package rack plating jig of claim 1, wherein the large circlip (2) and the small circlip (3) are different in diameter.

3. The SMD1 package rack plating fixture of claim 1, characterized in that the number of the small circlips (3) is set to two groups, symmetrically distributed on both sides of the large circlip (2).

4. The SMD1 package rack plating jig of any one of claims 1-3 characterized in that the large circlip (2) and the small circlip (3) can both be made of rollers with different diameters.

5. The SMD1 package casing rack plating fixture of claim 1, characterized in that the large circlip (2) and the small circlip (3) are made of beryllium bronze.