CN115787017A - Independent tin electroplating process for glass sintered insulator binding post - Google Patents
Independent tin electroplating process for glass sintered insulator binding post Download PDFInfo
- Publication number
- CN115787017A CN115787017A CN202211598602.2A CN202211598602A CN115787017A CN 115787017 A CN115787017 A CN 115787017A CN 202211598602 A CN202211598602 A CN 202211598602A CN 115787017 A CN115787017 A CN 115787017A
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- CN
- China
- Prior art keywords
- glass sintered
- insulator
- glass
- binding post
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011521 glass Substances 0.000 title claims abstract description 52
- 239000012212 insulator Substances 0.000 title claims abstract description 48
- 238000000034 method Methods 0.000 title claims abstract description 34
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 238000009713 electroplating Methods 0.000 title claims abstract description 20
- 229910052718 tin Inorganic materials 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 238000002955 isolation Methods 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 10
- 238000009413 insulation Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims 6
- 239000011135 tin Substances 0.000 abstract description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000010923 batch production Methods 0.000 abstract description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052737 gold Inorganic materials 0.000 abstract description 4
- 239000010931 gold Substances 0.000 abstract description 4
- 229910052709 silver Inorganic materials 0.000 abstract description 4
- 239000004332 silver Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 229910000833 kovar Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The invention provides a process for independently electroplating tin on a binding post of a glass sintered insulator, which belongs to the technical field of manufacturing of glass sintered insulators, and the process is simple and reliable, novel in process, convenient to operate, capable of being commonly used for electroplating gold, silver, nickel, copper, tin and other novel independent electroplating processes of similar glass sintered insulator binding posts with different shapes and sizes, reusable, suitable for batch production and capable of improving the quality of product parts.
Description
Technical Field
The invention belongs to the technical field of glass sintered insulator manufacturing, and particularly relates to a process for independently electroplating tin on a binding post of a glass sintered insulator.
Background
With the arrival of the electronic age, the glass sintered insulator connector is widely applied in the fields of aerospace, aviation, various electronic and electrical product devices. The glass sintered insulator is generally made of kovar alloy materials and comprises a base, binding posts and a glass insulator, wherein a plurality of or dozens of binding posts of the kovar alloy are connected with the base of the kovar alloy through high-temperature sintering of glass, the binding posts of the insulator and the base are integrated, but the binding posts of the insulator and the base are insulated mutually after the glass is sintered. At present, the glass sintered insulator is generally electroplated with more tin, silver and gold, and tin, gold and silver coatings have good weldability, so that reliable welding guarantee is provided for a subsequent connector welding wire. However, the post of the glass sintered insulator cannot be electroplated separately, so most of the electroplating processes of the glass sintered insulator are integral electroplating.
Taking the TZ-3 280T02.00 lower cover assembly glass sintered insulator as an example, a lower cover part made of kovar alloy material and 15 binding post parts made of kovar alloy material are connected together through high-temperature glass sintering, and the design drawing requires that 15 kovar binding posts are electroplated with tin (5-8) mu m. In the prior art, a binding post part and a lower cover part are connected into a whole, the binding post part is limited by electroplating bath liquid and bound to be connected with the conducting requirement, and the whole part needs to enter the bath during electroplating, so that the independent electroplating cannot be realized, and only the whole electroplating can be carried out. There is therefore a need for improvements.
Disclosure of Invention
The technical problems solved by the invention are as follows: the invention provides an independent tin electroplating process for a glass sintered insulator binding post, which is simple and reliable, novel, convenient to operate, reusable, suitable for batch production and capable of improving the quality of product parts.
The technical scheme adopted by the invention is as follows: the utility model provides a glass sintering insulator terminal electroplates tin technology alone, glass sintering insulator includes the base, a plurality of terminals of circumference equipartition on the base, a plurality of terminals pass through high temperature glass sintering and connect on the base, specifically include following step:
step 1): the isolation gasket is sleeved with the plurality of wiring terminals according to hole positions and then is placed on the surface of the base;
step 2): the binding posts are sequentially wound and connected with each other by using a conductive metal wire;
step 3): the two ends of the conductive metal wire wound on the binding posts are sleeved by the insulating guide pipes and insulated with the base, and then are mutually wound and screwed tightly
Step 4): and (3) treating the plurality of glass sintered insulators according to the methods from the step 1) to the step 3), sequentially connecting the plurality of treated glass sintered insulators with each other by using a conductive metal wire, and then binding the glass sintered insulators on a conductive hanger, so that the independent tinning process of the binding post of the glass sintered insulator can be realized.
In the step 1), the isolation gasket is a circular ring structure which is made according to the arrangement condition of the wiring posts on the base, and a plurality of through holes are uniformly distributed on the isolation gasket according to the number and the circumference of the wiring posts.
Preferably, the isolation gasket is made of polytetrafluoroethylene material.
In the step 2), the conductive metal wire is a conductive copper wire.
In the step 3), the two ends of the conductive metal wire wound on the plurality of binding posts are firstly sleeved with the insulating guide pipe I, insulated from the base, and then mutually wound and tightened, and then sleeved with the insulating guide pipe II.
And the diameter of the insulating conduit II is larger than that of the insulating conduit I.
Preferably, the insulation conduit I and the insulation conduit II are both made of transparent rubber hoses.
Compared with the prior art, the invention has the advantages that:
1. according to the scheme, the isolated gasket, the insulated conduit and the copper wire are adopted according to the shapes and the sizes of the base and the wiring terminal of the glass sintered insulator, so that the independent electrotinning process is carried out on the wiring terminal of the glass sintered insulator, and the method is simple and reliable, novel in process and convenient to operate;
2. the independent electroplating process of the glass sintered insulator can be universally used for electroplating gold, silver, nickel, copper, tin and other similar types, the novel independent electroplating process of the glass sintered insulator binding posts with different shapes and sizes can be repeatedly used, the independent electroplating process is suitable for batch production, and the quality of product parts is improved.
Drawings
FIG. 1 is a schematic structural view of a glass sintered insulator according to the present invention;
FIG. 2 is a schematic view of the structure of the isolation gasket of the present invention;
FIG. 3 is a schematic view of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-3, embodiments of the present invention are described in detail.
A technology for independently electroplating tin on a binding post of a glass sintered insulator is disclosed, and is shown in figure 1, wherein the glass sintered insulator comprises a base 1, a plurality of binding posts 2 are uniformly distributed on the circumference of the base 1, and the binding posts 2 are connected to the base 1 through high-temperature glass sintering.
The process specifically comprises the following steps:
step 1): the isolation gasket 3 is sleeved with the plurality of wiring terminals 2 according to hole positions and then is placed on the surface of the base 1;
specifically, isolation gasket 3 is the ring structure of making according to the arrangement condition of terminal 2 on base 1, the last quantity circumference equipartition according to terminal 2 of isolation gasket 3 has a plurality of perforation.
Preferably, the insulating gasket 3 is made of polytetrafluoroethylene material.
Step 2): a plurality of binding posts 2 are sequentially wound and connected with each other by a conductive metal wire 4;
preferably, the conductive metal wire 4 is a conductive copper wire.
Step 3): the two ends of the conductive metal wire 4 which is wound on the plurality of binding posts 2 are sheathed by an insulating conduit and are insulated from the base 1, and then the conductive metal wire is mutually wound and tightened.
The two ends of the conductive metal wire 4 are firstly sleeved with an insulation conduit I5 to be isolated and insulated from the base 1, then are mutually wound and twisted tightly, and then are sleeved with an insulation conduit II 6.
Preferably, the diameter of the insulated conduit II 6 is larger than that of the insulated conduit I5.
Preferably, the insulation conduit I5 and the insulation conduit II 6 are both made of transparent rubber hoses.
And step 4): and (4) treating the glass sintered insulators according to the methods of the steps 1) to 3), sequentially connecting the treated glass sintered insulators with each other by using a conductive metal wire 4, and binding the glass sintered insulators on a conductive hanger, so that the independent tinning process of the binding post of the glass sintered insulator can be realized.
The invention realizes the independent tin electroplating process of the glass sintered insulator binding post, has simple and reliable method, novel process, convenient operation and repeated use, is suitable for batch production and improves the quality of product parts.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein, and any reference signs in the claims are not to be construed as limiting the claims.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A process for independently electroplating tin on a binding post of a glass sintered insulator is characterized by comprising the following steps: the glass sintered insulator comprises a base (1), a plurality of binding posts (2) are uniformly distributed on the circumference of the base (1), the binding posts (2) are connected to the base (1) through high-temperature glass sintering, and the glass sintered insulator specifically comprises the following steps:
step 1): the isolation gasket (3) is sleeved with the plurality of wiring terminals (2) according to hole positions and then is placed on the surface of the base (1);
step 2): a plurality of binding posts (2) are sequentially wound and connected with each other by conductive metal wires (4);
step 3): two ends of the conductive metal wire (4) wound on the binding posts (2) are sleeved by insulating guide pipes to be isolated and insulated from the base (1) and then are wound and tightened;
and step 4): and (3) treating the plurality of glass sintered insulators according to the methods from the step 1) to the step 3), sequentially connecting the plurality of treated glass sintered insulators with each other by using a conductive metal wire (4), and binding the glass sintered insulators on a conductive hanger, so that the independent tinning process of the binding post of the glass sintered insulator can be realized.
2. The process for plating tin on the binding post of the glass sintering insulator independently as claimed in claim 1, wherein: in the step 1), the isolation gasket (3) is a circular ring structure which is made according to the arrangement condition of the binding posts (2) on the base (1), and a plurality of through holes are uniformly distributed on the isolation gasket (3) according to the number and circumference of the binding posts (2).
3. The process for plating tin on the glass sintered insulator binding post according to claim 1 or 2, wherein the process comprises the following steps: the isolation gasket (3) is made of polytetrafluoroethylene materials.
4. The process for plating tin on the binding post of the glass sintering insulator independently as claimed in claim 1, wherein: in the step 2), the conductive metal wire (4) is a conductive copper wire.
5. The process for plating tin on the binding post of the glass sintering insulator independently as claimed in claim 1, wherein: in the step 3), the two ends of the conductive metal wire (4) wound on the plurality of binding posts (2) are firstly sheathed with the insulating guide pipe I (5) to be insulated from the base (1) and then are mutually wound and tightened, and then are sheathed with the insulating guide pipe II (6).
6. The process of claim 5, wherein the tin plating process is carried out on the glass sintered insulator binding post independently, and is characterized in that: the diameter of the insulating guide pipe II (6) is larger than that of the insulating guide pipe I (5).
7. The process for plating tin on the binding post of the glass sintered insulator independently as claimed in claim 5, wherein: the insulation conduit I (5) and the insulation conduit II (6) are both made of transparent rubber hoses.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202211598602.2A CN115787017A (en) | 2022-12-12 | 2022-12-12 | Independent tin electroplating process for glass sintered insulator binding post |
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CN202211598602.2A CN115787017A (en) | 2022-12-12 | 2022-12-12 | Independent tin electroplating process for glass sintered insulator binding post |
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CN115787017A true CN115787017A (en) | 2023-03-14 |
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CN202211598602.2A Pending CN115787017A (en) | 2022-12-12 | 2022-12-12 | Independent tin electroplating process for glass sintered insulator binding post |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102703960A (en) * | 2012-07-04 | 2012-10-03 | 中国振华集团群英无线电器材厂 | Winding-free electroplating clamp of relay base |
CN112941603A (en) * | 2021-04-07 | 2021-06-11 | 西安宏盾新材料科技有限公司 | Electroplating device for single-core connector core |
CN113943958A (en) * | 2021-11-10 | 2022-01-18 | 四川泛华航空仪表电器有限公司 | Method for locally plating cadmium and gold on socket sintering assembly |
-
2022
- 2022-12-12 CN CN202211598602.2A patent/CN115787017A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102703960A (en) * | 2012-07-04 | 2012-10-03 | 中国振华集团群英无线电器材厂 | Winding-free electroplating clamp of relay base |
CN112941603A (en) * | 2021-04-07 | 2021-06-11 | 西安宏盾新材料科技有限公司 | Electroplating device for single-core connector core |
CN113943958A (en) * | 2021-11-10 | 2022-01-18 | 四川泛华航空仪表电器有限公司 | Method for locally plating cadmium and gold on socket sintering assembly |
Non-Patent Citations (1)
Title |
---|
江洪涛等: "玻璃封接组件表面处理工艺难点探讨", 《电镀与涂饰》, vol. 35, no. 5, 31 December 2016 (2016-12-31), pages 256 - 261 * |
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