CN212967674U - Power module and chip packaging structure thereof - Google Patents
Power module and chip packaging structure thereof Download PDFInfo
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- CN212967674U CN212967674U CN202022496520.XU CN202022496520U CN212967674U CN 212967674 U CN212967674 U CN 212967674U CN 202022496520 U CN202022496520 U CN 202022496520U CN 212967674 U CN212967674 U CN 212967674U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The application discloses a power module and a chip packaging structure thereof, which comprise a lead frame, at least two pins, at least two base islands, a rectifier bridge, a fly-wheel diode, a control chip and a plastic packaging adhesive layer; the pins are arranged at the edge of the lead frame and comprise a live wire pin, a zero line pin, a high-voltage power supply pin, a signal ground pin, a drain electrode pin and a sampling pin; the base island is arranged in the lead frame; the rectifier bridge, the freewheeling diode and the control chip are arranged on the at least two base islands and are connected to the pins through the base islands or the leads; the plastic packaging adhesive layer coats the structure; a first alternating current input end of the rectifier bridge is connected with a live wire pin, a second alternating current input end of the rectifier bridge is connected with a zero line pin, a first output end of the rectifier bridge is connected with a high-voltage power supply pin, a second output end of the rectifier bridge is connected with a signal ground pin, a first end of the freewheeling diode is connected with the zero line pin, and a second end of the freewheeling diode is connected with the signal ground pin. By the mode, the whole size of the chip packaging structure can be reduced.
Description
Technical Field
The application relates to the technical field of electronic devices, in particular to a power module and a chip packaging structure thereof.
Background
A light Emitting diode (led) is a solid semiconductor device that converts electrical energy into light energy. The device has the advantages of low power consumption, good light condensation effect, high reaction speed, strong controllability, high impact force bearing capacity, long service life, environmental protection and the like. The LED lighting product has entered into thousands of households, enters the large-scale application stage of the whole population, and can comprehensively replace the traditional lighting lamp. Meanwhile, the market price of the LED lighting product reaches the competitive blanching stage. This requires a continuous reduction in the cost of the LED lighting circuitry. A chip packaging structure integrating an AC-DC chip and a rectifier bridge stack begins to enter a mass production stage, and is widely applied to an alternating current LED driving power supply scheme.
The current mainstream chip packaging structure integrating the small AC-DC chip and the rectifier bridge stack generally adopts an HSOP7 packaging scheme, but the HSOP7 has larger packaging size than the traditional ESOP6, consumes more epoxy plastic packaging material during packaging, and a plastic packaging mold is also required to be independently opened and cannot be used for a common ESOP6 mold, so that the input cost of the packaging and rib cutting forming mold is required to be increased, and the cost of the chip packaging structure is increased.
Disclosure of Invention
The main technical problem who solves of this application provides a power module and chip package structure thereof to solve the great and higher technical problem of cost of current chip package volume.
In order to solve the technical problem, the application adopts a technical scheme that: a chip packaging structure is provided, which includes: a lead frame; the at least two pins are arranged at the edge of the lead frame and comprise a live wire pin, a zero wire pin, a high-voltage power supply pin, a signal ground pin, a drain electrode pin and a sampling pin; at least two base islands arranged in the lead frame; the rectifier bridge, the freewheeling diode and the control chip are arranged on the at least two base islands and are connected to the pins through the base islands or the leads; the plastic packaging adhesive layer coats the lead frame, the at least two base islands, the rectifier bridge, the freewheeling diode and the control chip; the first alternating current input end of the rectifier bridge is connected with the live wire pin through the base island or the lead, the second alternating current input end of the rectifier bridge is connected with the zero wire pin through the base island or the lead, the first output end of the rectifier bridge is connected with the high-voltage power supply pin through the base island or the lead, the second output end of the rectifier bridge is connected with the signal ground pin through the base island or the lead, the first end of the freewheeling diode is connected with the zero wire pin, and the second end of the freewheeling diode is connected with the signal ground pin.
According to an embodiment of the present invention, the at least two base islands include a first base island, a second base island, a third base island, a fourth base island and a fifth base island, and the rectifier bridge includes a first rectifier diode, a second rectifier diode, a third rectifier diode and a fourth rectifier diode; the first base island is connected to the zero line pin, the first rectifier diode is arranged on the first base island, the cathode of the first rectifier diode is electrically connected with the first base island, and the anode of the first rectifier diode is connected with the third base island; the second base island is connected to the live wire pin, the second rectifier diode is arranged on the second base island, the cathode of the second rectifier diode is electrically connected with the second base island, and the anode of the second rectifier diode is connected with the third base island; the third base island is connected to the high-voltage power supply pin, the third rectifier diode is arranged on the third base island, the cathode of the third rectifier diode is electrically connected with the third base island, and the anode of the third rectifier diode is electrically connected with the drain pin; the fourth base island is connected to the signal ground pin, the fourth rectifier diode is arranged on the fourth base island, the cathode of the fourth rectifier diode is electrically connected with the fourth base island, and the anode of the fourth rectifier diode is connected with the second base island; the freewheeling diode is arranged on the fifth base island, the first end of the freewheeling diode is electrically connected with the first base island, the second end of the freewheeling diode is electrically connected with the fifth base island, and the fifth base island is electrically connected with the fourth base island.
According to an embodiment of the present invention, the control chip has a ground port, a drain port, a sampling port, and a high voltage port, the control chip is disposed on the fifth island, the ground port is electrically connected to the signal ground pin, the drain port is electrically connected to the drain pin through a lead, the sampling port is electrically connected to the sampling pin through a lead, and the high voltage port is electrically connected to the high voltage power supply pin through a lead.
According to an embodiment of the present invention, the control chip and the fifth base island are insulated from each other, and the ground port is electrically connected to the signal ground pin through a lead; or
And the ground port of the control chip is adhered to the fifth base island through conductive adhesive or conductive material and is electrically connected with the fifth base island.
According to an embodiment of the present invention, the first base island and the second base island are spaced side by side along a first direction, the third base island and the fourth base island are spaced side by side along the first direction, the fifth base island includes a first sub base island and a second sub base island, the first sub base island is spaced side by side along a second direction perpendicular to the first direction from the first base island and the third base island, and the second sub base island is connected to a side of the first sub base island near the third base island and extends between the first base island and the second base island and between the third base island and the fourth base island.
According to an embodiment of the present invention, the control chip is disposed on the first sub-base island, and the freewheel diode is disposed on the second sub-base island.
According to an embodiment of the present invention, the zero line pin, the high voltage power supply pin, and the drain pin are located on one side of the lead frame, and the live line pin, the signal ground pin, and the sampling pin are located on the other side of the lead frame.
According to an embodiment of the present invention, the chip package structure includes a connecting rib, and some or all of the at least two base islands are connected to the lead frame through the connecting rib.
According to an embodiment of the present invention, a through hole is disposed at a position of the lead frame corresponding to the at least one base island, at least a portion of the at least one base island is disposed in the through hole, and a surface of the base island facing away from the control chip is flush with a surface of the lead frame facing away from the control chip, or exceeds a surface of the lead frame facing away from the control chip.
In order to solve the above technical problem, another technical solution adopted by the present application is to provide a power module, where the power module at least includes: such as the chip package structure described above.
The beneficial effect of this application is: be different from prior art's condition, this application is through with the rectifier bridge, freewheel diode and control chip set up respectively on two at least base islands, and utilize base island or lead wire and set up in lead frame outlying pin electricity and be connected, in order to utilize pin and external circuit electricity to be connected, thereby can be with the rectifier bridge, freewheel diode and control chip encapsulation are in a packaging body, not only can reduce chip package structure's overall size, reduce the consumption of plastic envelope glue film, and then reduce the cost of manufacture, and need not to set up magnetic element such as inductance or transformer again in chip package structure's outside, so, can promote chip package structure's integrated level, so that chip package structure's installation and use, in addition, at chip package structure's inside encapsulation freewheel diode, can also promote chip package structure work's stability.
Drawings
Fig. 1 is a schematic plan view of a chip package structure according to the present application;
fig. 2 is a schematic top view of a chip package structure in the related art;
FIG. 3 is a front view of the chip package structure of FIG. 2;
FIG. 4 is a schematic top view of a chip package structure according to the present application;
fig. 5 is a front view of the chip package structure in fig. 4.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic plan view of a chip package structure according to the present application. In the present embodiment, the chip package structure 100 includes a lead frame 10, at least two leads, at least two islands, a rectifier bridge, a freewheeling diode 70, a control chip 50, and a molding compound layer 60. At least two pins are arranged at the edge of the lead frame 10, and the at least two pins comprise a live wire pin 21, a zero wire pin 22, a high-voltage power supply pin 23, a signal ground pin 24, a drain electrode pin 25 and a sampling pin 26; at least two base islands are arranged in the lead frame 10; the rectifier bridge, the freewheeling diode 70 and the control chip 50 are arranged on at least two base islands and connected to the pins through the base islands or leads; the plastic package adhesive layer 60 coats the lead frame 10, the at least two base islands, the rectifier bridge, the freewheeling diode 70 and the control chip 50; the first alternating current input end of the rectifier bridge is connected with a live wire pin 21 through a base island or a lead, the second alternating current input end of the rectifier bridge is connected with a zero wire pin 22 through the base island or the lead, the first output end of the rectifier bridge is connected with a high-voltage power supply pin 23 through the base island or the lead, the second output end of the rectifier bridge is connected with a signal ground pin 24 through the base island or the lead, the first end of the freewheeling diode 70 is connected with the zero wire pin 22, and the second end of the freewheeling diode 70 is connected with the signal ground pin 24.
The embodiment of the present application is implemented by disposing the rectifier bridge, the freewheeling diode 70 and the control chip 50 on at least two base islands respectively, and is electrically connected with pins provided at the periphery of the lead frame 10 using a base island or a lead, to be electrically connected with an external circuit using the pins, therefore, the rectifier bridge, the freewheeling diode 70 and the control chip 50 can be packaged in a package body, the overall size of the chip packaging structure 100 can be reduced, the consumption of the plastic packaging adhesive layer 60 can be reduced, thereby reducing the manufacturing cost, and no magnetic element such as inductor or transformer is required to be arranged outside the chip package structure 100, the integration level of the chip package structure 100 may be improved to facilitate the installation and use of the chip package structure 100, and in addition, the freewheeling diode 70 is packaged inside the chip package structure 100, which can also improve the stability of the chip package structure 100.
When the plastic package adhesive layer 60 is used for packaging, one end of each pin needs to be packaged inside the plastic package adhesive layer 60 so as to be fixed by the plastic package adhesive layer 60, and the other end of each pin extends out of the plastic package adhesive layer 60 so as to be connected with an external circuit.
Further, the end of some or all of the leads extending out of the lead frame 10 may be bent to facilitate the insertion fit with an external circuit board, thereby simplifying the installation complexity of the chip package structure 100.
The plastic encapsulant layer 60 may be rectangular, and is used to integrate the lead frame 10 and the device and protect the internal device. The plastic sealing adhesive layer 60 may be epoxy adhesive, or the plastic sealing adhesive layer 60 may be other types of sealant.
Optionally, the plastic encapsulant layer 60 may adopt the external dimension of the ESOP6, so that the plastic encapsulant layer can be shared with the existing plastic encapsulant, and the rib cutting and forming mold can be saved, thereby reducing the production cost.
Specifically, as shown in fig. 2 and 3, fig. 2 and 3 are schematic plan structure views of a chip package structure in the related art. Currently, the chip package structure 200 generally adopts the external dimensions of EHSOP7, and the length L1, the width D1 and the height H1 of the packaged chip package structure 200 are 6.2mm, 3.9mm and 1.2mm, respectively. As shown in fig. 4 and 5, fig. 4 and 5 are schematic plan views of the chip package structure in the present application. By adopting the external dimensions of the ESOP6, the length L2, the width D2 and the height H2 of the packaged chip package structure 100 are 4.9mm, 3.9mm and 1.4mm, respectively. Therefore, the plastic package adhesive layer 60 adopts the external dimension of ESOP6 in the application, not only can the existing plastic package mold be adopted, the increase of the input cost of the packaging and rib cutting forming mold is avoided, but also the volume of the plastic package adhesive layer 60 can be reduced by about 9.2%, so that the use of the plastic package adhesive layer 60 can be reduced, and the cost is further saved.
At least two base islands can be isolated and set by means of electrical isolation and the like, wherein each base island has a region for arranging at least one rectifier diode or control chip 50, the size of each base island can be set according to the number and size of the rectifier diodes or control chips 50 required to be arranged, the shape of each base island can be set according to the size and position of the rectifier diodes or control chips 50 required to be arranged, and the base islands can be square, rectangular, L-shaped, T-shaped or the like or other irregular shapes and the like. And some or all of the plurality of base islands may be used for arranging a chip of a special size or a chip requiring a specific arrangement position, for example, in one embodiment, some or all of the plurality of base islands are suitable for arranging a rectifying diode chip (or a rectifying bridge chip); in another embodiment, the plurality of base islands include base islands adapted to arrange Metal Oxide Semiconductor Field Effect Transistor (MOSFET) chips, and the size of the base islands is set according to the size and the number of the Metal Oxide Semiconductor Field Effect Transistor (MOSFET) chips. Different types of chips may be disposed in the same base island, for example, in one embodiment, the base island may be disposed with a rectifying diode chip, and other chips (e.g., the control chip 50, etc.) may also be disposed.
In one embodiment, each base island according to the present invention has, in addition to the area where the control chip 50 is disposed, an area for connecting a lead for connection with a chip disposed on the base island through the lead. The region for connecting the leads may be located outside the region for arranging the chip. The base island can realize connection with chips arranged on other base islands through leads. The wire may be a metal wire, such as a copper wire, a gold wire, a silver wire, or the like. The leads may be connected electrically by wire bonding.
Further, some or all of the plurality of base islands may be connected to the lead frame 10 by the tie bars 80. The connecting rib 80 can be connected to the base island and connected to the edge or even the outer side of the lead frame 10 to support the base island, and particularly, for the base island with a large size and easy deformation, the connecting rib can effectively support the base island, so that the structure and the position of the connecting rib can be kept stable.
When the connecting rib 80 extends out of the lead frame 10, the portion of the lead frame 10 beyond the lead frame may be cut after the chip package structure 100 is packaged, so that the edge of the chip package structure 100 is smooth and beautiful.
Further, the connecting ribs 80 may be attached to one or more sides of the lead frame 10 as desired when attached to the lead frame 10. For example, in the present embodiment, the tie bars 80 may be extended and connected to opposite sides of the lead frame 10, as shown in fig. 1. Specifically, the connecting ribs 80 may include first connecting ribs 80a and second connecting ribs 80b, and the first connecting ribs 80a and the second connecting ribs 80b are respectively connected to opposite sides of the base island and extend to be connected to the lead frame 10 on the corresponding side. In this manner, by connecting the opposite sides of the base island with the lead frames 10 of the corresponding sides, respectively, the base island can be uniformly stressed, and the connection strength of the base island with the lead frames 10 can be increased.
As shown in fig. 1, the at least two base islands include a first base island 31, a second base island 32, a third base island 33, a fourth base island 34, and a fifth base island 35, the first base island 31 is connected to the null line pin 22, the second base island 32 is connected to the fire line pin 21, the third base island 33 is connected to the high-voltage power supply pin 23, and the fourth base island 34 is connected to the signal ground pin 24. The drain pin 25 and the sampling pin 26 may be independently arranged on the lead frame 10.
Further, as shown in fig. 1, the rectifier bridge includes four rectifier diodes, namely a first rectifier diode 41, a second rectifier diode 42, a third rectifier diode 43 and a fourth rectifier diode 44. The first rectifying diode 41 is disposed on the first base island 31, and a cathode of the first rectifying diode 41 is bonded on the first base island 31 through a conductive adhesive or a solder paste to be electrically connected with the first base island 31 and further electrically connected with the neutral pin 22, and an anode of the first rectifying diode 41 is connected with the third base island 33 through a metal lead and further electrically connected with the high-voltage power supply pin 23. The second rectifying diode 42 is disposed on the second base island 32, and a cathode of the second rectifying diode 42 is bonded to the second base island 32 through a conductive adhesive or a solder paste to be electrically connected to the second base island 32 and further to be electrically connected to the live wire pin 21, and an anode of the second rectifying diode 42 is connected to the third base island 33 through a metal lead and further to be electrically connected to the high-voltage power supply pin 23. The third rectifying diode 43 is disposed on the third base island 33, and a cathode of the third rectifying diode 43 is bonded to the third base island 33 through a conductive adhesive or a solder paste to be electrically connected to the third base island 33 and further to the high-voltage power supply pin 23, and an anode of the third rectifying diode 33 is connected to the drain pin 25 through a metal lead. The fourth rectifying diode 44 is disposed on the fourth base island 34, and a cathode of the fourth rectifying diode 44 is bonded on the fourth base island 34 through a conductive adhesive or a solder paste to be electrically connected to the fourth base island 34 and further to be electrically connected to the signal ground pin 24, and an anode of the fourth rectifying diode 44 is connected to the second base island 32 through a metal lead and further to be electrically connected to the live wire pin 21. The freewheeling diode 70 is disposed on the fifth base island 35, and a first end of the freewheeling diode 70 is electrically connected to the first base island 31 and further electrically connected to the neutral pin 22, a second end of the freewheeling diode 70 is electrically connected to the fifth base island 35, the fifth base island 35 is electrically connected to the fourth base island 34, and further the second end of the freewheeling diode 70 is electrically connected to the signal ground pin 24.
It should be noted that the rectifier diode may be a diode formed by a single PN junction, or may be a diode structure obtained by other equivalent forms, including but not limited to a MOS transistor, which is not described herein in detail.
It should be noted that "connected to a pin" in the present invention includes, but is not limited to, directly connecting the pin through a metal lead (one end of the metal lead is disposed on the pin), and also includes a conductive member connected to the pin through a metal lead (one end of the metal lead is disposed on the conductive member connected to the pin), and the electrical connection can be achieved, and is not limited to this embodiment.
It should be noted that the rectifier bridge may be implemented by selecting different islands based on different types of devices, and is not limited to this embodiment, and any setting manner that can implement the connection relationship of the rectifier bridge may be adopted, which is not described herein in detail.
Further, the control chip 50 has a ground port GND, a Drain port Drain, a sampling port CS, and a high voltage port, the control chip 50 is disposed on the fifth base island 35, the ground port GND is electrically connected to the signal ground pin 24, the Drain port Drain is electrically connected to the Drain pin 25 through a lead, the sampling port CS is electrically connected to the sampling pin 26 through a lead, and the high voltage port is electrically connected to the high voltage power supply pin 23 through a lead, so that each port of the control chip 50 can be electrically connected to an external circuit through each pin of the chip package structure 100.
The control chip 50 may be bonded to the fifth base island 35 by a conductive adhesive or a solder paste, so as to electrically connect the ground port GND of the control chip 50 to the fifth base island 35, and since the fifth base island 35 is electrically connected to the fourth base island 34, the ground port GND may be electrically connected to the signal ground pin 24, so as to simplify an electrical connection structure and improve manufacturing efficiency, and the fifth base island 35 may be used to dissipate heat from the control chip 50, so as to improve heat dissipation efficiency of the control chip 50.
It is understood that the ground port GND of the control chip 50 may be electrically connected to the fifth base island 35 through a metal wire to electrically connect to the signal ground pin 24.
Alternatively, the control chip 50 may also be disposed on other base islands according to design requirements, and when disposed on other base islands, the substrate of the control chip 50 is disposed in an insulating manner with respect to the base island, including but not limited to an insulating adhesive, so as to prevent short circuit and have a slightly poor heat dissipation effect. The specific setting mode can be set according to the needs, and is not described in detail herein. At this time, the control chip 50 may be electrically connected to the third base island 33 through a wire.
Further, the at least two pins may be arranged on the same side or on different sides of the lead frame 10. The at least two pins may be identical or different in shape. The shape of the lead may be, for example, a straight bar type, a T type, an L type, or the like.
Further, when at least two pins are distributed on the periphery of the lead frame 10, the distance between adjacent pins is generally set to be greater than 2.0mm, including but not limited to 2mm to 3mm or 2.5mm to 3.5mm, and the like, so as to meet the requirement of high-voltage safety distance.
Optionally, in the present embodiment, at least two leads are spaced apart from each other on two opposite sides of the lead frame 10. Because a certain safety distance needs to exist between adjacent pins, if the six pins in fig. 1 are distributed asymmetrically, for example, two pins are arranged on one side, and four pins are arranged on the other side, the shortest length of the lead frame 10 needs to be larger than the minimum span of the four pins, that is, the shortest length of the lead frame 10 needs to be larger than or equal to the sum of the width of the four pins and the length of the safety distance between the four pins, so that the overall length of the lead frame 10 is larger.
Therefore, in the embodiment, three of the six leads may be disposed on one side of the lead frame 10, and the other three leads may be disposed on the other side of the lead frame 10, so that the length of the lead frame 10 may be shortened, and the volume of the chip package structure 100 may be reduced.
If the width of the pin is set to be small, not only can the signal transmission capability be poor, but also the strength of the pin is small, when the chip packaging structure 100 is matched with an external circuit in an inserting manner, bending or breaking easily occurs, and if the width of the pin is set to be large, the size of the chip packaging structure 100 is large, so that the width of the pin can be set to be 0.5 mm-1 mm, for example, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm and the like, so as to obtain the minimum size while ensuring that the pin has enough strength.
Optionally, in a specific embodiment, as shown in fig. 1, the zero line pin 22, the high voltage supply pin 23, and the drain pin 25 may be disposed on one side of the lead frame 10, and the fire line pin 21, the signal ground pin 24, and the sampling pin 26 may be disposed on the other side of the lead frame 10, so that when the rectifier bridge and the control chip 50 are electrically connected to the pins, the length of the leads may be shortened, and further, the layout of the rectifier bridge and the control chip 50 is more reasonable, the structure is more compact, and the overlong length of the leads is avoided, so as to increase the transmission loss of the signals.
Alternatively, in other optional embodiments, at least two pins may be arranged in other types according to the arrangement positions of the rectifier bridge and the control chip 50, which is not specifically limited in this embodiment of the application.
Further, the first base island 31 and the second base island 32 may be arranged side by side at an interval in a first direction, as shown in fig. 1, the first direction being an up-down direction in the drawing. The third base island 33 and the fourth base island 34 are arranged side by side at an interval in the first direction, that is, in the up-down direction shown in the drawing, and the fifth base island 35 includes a first sub base island 352 and a second sub base island 354, and the first sub base island 352 is arranged side by side at an interval with the first base island 31 and the third base island 33 in the second direction perpendicular to the first direction, that is, the first base island 31, the third base island 33, and the first sub base island 352 are arranged side by side at an interval in the left-right direction shown in fig. 1. The second sub base island 354 is connected to a side of the first sub base island 352 near the third base island 33, and is extended between the first base island 31 and the second base island 32 and between the third base island 33 and the fourth base island 34.
Alternatively, the control chip 50 may be disposed on the first sub-base island 352 and the freewheel diode 70 may be disposed on the second sub-base island 354. In this way, the space in the lead frame 10 can be fully utilized to increase the area of the first sub-base island 352, and further increase the heat dissipation area of the first sub-base island 352 for disposing the control chip 50, thereby enhancing the heat dissipation of the control chip 50, and the length of the lead wire for electrically connecting the freewheel diode 70 can be shortened by disposing the freewheel diode 70 on the second sub-base island 354, thereby reducing the signal transmission loss.
Further, a through hole is formed in a position, corresponding to the at least one base island, of the lead frame 10, at least a portion of the at least one base island is disposed in the through hole, and a surface, facing away from the control chip 50, of the base island is flush with a surface, facing away from the control chip 50, of the lead frame 10, or exceeds a surface, facing away from the control chip 50, of the lead frame 10. Thus, at least part of the base island is sunk and arranged in the lead frame 10, so that the thickness of the chip packaging structure 100 can be reduced, and the surface of the base island, which is far away from the control chip 50, is exposed to enhance heat dissipation, so that the control chip 50 is conveniently dissipated, and the power of the control chip 50 is increased.
The present application further provides a power module on the basis of the above chip package structure 100. The power module of this embodiment is applied to a low-power LED driving power supply in a non-isolated situation, and is suitable for high-voltage linearity, or optionally, may also be another type of power module, and this embodiment of the present application is not particularly limited.
Unlike the prior art, the present application provides a high-speed power supply by disposing a rectifier bridge, a freewheeling diode 70 and a control chip 50 on at least two base islands, and is electrically connected with pins provided at the periphery of the lead frame 10 using a base island or a lead, to be electrically connected with an external circuit using the pins, therefore, the rectifier bridge, the freewheeling diode 70 and the control chip 50 can be packaged in a package body, the overall size of the chip packaging structure 100 can be reduced, the consumption of the plastic packaging adhesive layer 60 can be reduced, thereby reducing the manufacturing cost, and no magnetic element such as inductor or transformer is required to be arranged outside the chip package structure 100, the integration level of the chip package structure 100 may be improved to facilitate the installation and use of the chip package structure 100, and in addition, the freewheeling diode 70 is packaged inside the chip package structure 100, which can also improve the stability of the chip package structure 100.
The above description is only an embodiment of the present application, and not intended to limit the scope of the present application, and all modifications that can be made by using equivalent structures or equivalent principles in the contents of the specification and the drawings or directly or indirectly applied to other related technical fields are also included in the scope of the present application.
Claims (10)
1. A chip package structure, comprising:
a lead frame;
the at least two pins are arranged at the edge of the lead frame and comprise a live wire pin, a zero wire pin, a high-voltage power supply pin, a signal ground pin, a drain electrode pin and a sampling pin;
at least two base islands arranged in the lead frame;
the rectifier bridge, the freewheeling diode and the control chip are arranged on the at least two base islands and are connected to the pins through the base islands or the leads; and
the plastic packaging adhesive layer coats the lead frame, the at least two base islands, the rectifier bridge, the freewheeling diode and the control chip;
the first alternating current input end of the rectifier bridge is connected with the live wire pin through the base island or the lead, the second alternating current input end of the rectifier bridge is connected with the zero wire pin through the base island or the lead, the first output end of the rectifier bridge is connected with the high-voltage power supply pin through the base island or the lead, the second output end of the rectifier bridge is connected with the signal ground pin through the base island or the lead, the first end of the freewheeling diode is connected with the zero wire pin, and the second end of the freewheeling diode is connected with the signal ground pin.
2. The chip package structure according to claim 1, wherein the at least two base islands include a first base island, a second base island, a third base island, a fourth base island, and a fifth base island, and the rectifier bridge includes a first rectifier diode, a second rectifier diode, a third rectifier diode, and a fourth rectifier diode;
the first base island is connected to the zero line pin, the first rectifier diode is arranged on the first base island, the cathode of the first rectifier diode is electrically connected with the first base island, and the anode of the first rectifier diode is connected with the third base island; the second base island is connected to the live wire pin, the second rectifier diode is arranged on the second base island, the cathode of the second rectifier diode is electrically connected with the second base island, and the anode of the second rectifier diode is connected with the third base island; the third base island is connected to the high-voltage power supply pin, the third rectifier diode is arranged on the third base island, the cathode of the third rectifier diode is electrically connected with the third base island, and the anode of the third rectifier diode is electrically connected with the drain pin; the fourth base island is connected to the signal ground pin, the fourth rectifier diode is arranged on the fourth base island, the cathode of the fourth rectifier diode is electrically connected with the fourth base island, and the anode of the fourth rectifier diode is connected with the second base island; the freewheeling diode is arranged on the fifth base island, the first end of the freewheeling diode is electrically connected with the first base island, the second end of the freewheeling diode is electrically connected with the fifth base island, and the fifth base island is electrically connected with the fourth base island.
3. The chip package structure according to claim 2, wherein the control chip has a ground port, a drain port, a sampling port, and a high voltage port, the control chip is disposed on the fifth base island, the ground port is electrically connected to the signal ground pin, the drain port is electrically connected to the drain pin by a lead, the sampling port is electrically connected to the sampling pin by a lead, and the high voltage port is electrically connected to the high voltage power supply pin by a lead.
4. The chip package structure according to claim 3, wherein the control chip and the fifth base island are insulated from each other, and the ground port is electrically connected to the signal ground pin by a lead; or
And the ground port of the control chip is adhered to the fifth base island through conductive adhesive or conductive material and is electrically connected with the fifth base island.
5. The chip packaging structure according to claim 2, wherein the first base island and the second base island are spaced side by side along a first direction, the third base island and the fourth base island are spaced side by side along the first direction, the fifth base island includes a first sub-base island and a second sub-base island, the first sub-base island is spaced side by side along a second direction perpendicular to the first direction from the first base island and the third base island, and the second sub-base island is connected to a side of the first sub-base island near the third base island and extends between the first base island and the second base island and between the third base island and the fourth base island.
6. The chip package structure according to claim 5, wherein the control chip is disposed on the first sub-base island, and the freewheel diode is disposed on the second sub-base island.
7. The chip package structure according to claim 1, wherein the zero line pin, the high voltage supply pin, and the drain pin are located on one side of the lead frame, and the fire line pin, the signal ground pin, and the sampling pin are located on the other side of the lead frame.
8. The chip package structure according to claim 1, wherein the chip package structure comprises a tie bar, and some or all of the at least two base islands are connected to the lead frame through the tie bar.
9. The chip package structure according to claim 1, wherein a through hole is formed in the lead frame at a position corresponding to the at least one base island, at least a portion of the at least one base island is disposed in the through hole, and a surface of the base island facing away from the control chip is flush with a surface of the lead frame facing away from the control chip, or exceeds a surface of the lead frame facing away from the control chip.
10. The power module at least comprises:
the chip package structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022496520.XU CN212967674U (en) | 2020-11-02 | 2020-11-02 | Power module and chip packaging structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202022496520.XU CN212967674U (en) | 2020-11-02 | 2020-11-02 | Power module and chip packaging structure thereof |
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| CN212967674U true CN212967674U (en) | 2021-04-13 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038620A (en) * | 2023-07-20 | 2023-11-10 | 上海纳矽微电子有限公司 | Package structure of lead frame and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117038620A (en) * | 2023-07-20 | 2023-11-10 | 上海纳矽微电子有限公司 | Package structure of lead frame and manufacturing method thereof |
| CN117038620B (en) * | 2023-07-20 | 2024-05-03 | 上海纳矽微电子有限公司 | Package structure of lead frame and manufacturing method thereof |
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Address after: 528415 1st floor, building 6, No.1 MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee after: Zhongshan Zhuoman Microelectronics Co.,Ltd. Address before: 528415 1st floor, building 6, No.1 MuLinSen Avenue, Xiaolan Town, Zhongshan City, Guangdong Province Patentee before: Zhongshan MuLinSen Microelectronics Co.,Ltd. |