CN212967668U

CN212967668U - Packaging structure for radio frequency microwave power amplifier device

Info

Publication number: CN212967668U
Application number: CN202021469549.2U
Authority: CN
Inventors: 李玉
Original assignee: Sichuan Qihang Yingchuang Technology Co ltd
Current assignee: Sichuan Qihang Yingchuang Technology Co ltd
Priority date: 2020-07-23
Filing date: 2020-07-23
Publication date: 2021-04-13
Anticipated expiration: 2030-07-23

Abstract

The utility model discloses a packaging structure for radio frequency microwave power amplifier device, including packaging box and the fixed a plurality of pins that set up at packaging box lateral wall lower extreme, the fixed protection shield that is equipped with on the inside diapire of packaging box, be equipped with the chip on the protection shield, be equipped with the viscose layer between protection shield and the chip, the viscose layer is in the same place the fixed bonding of protection shield and chip, packaging box's opening part is equipped with the encapsulation lid through block mechanism is fixed, just the encapsulation lid sets up with the closely laminating of packaging box, it is equipped with the cushion chamber to inlay on packaging box's the lower wall, the fixed first spring that is equipped with in the cushion chamber. The utility model relates to an ingenious, structure scientific and reasonable has realized the good fixed of encapsulation lid, prevents probably to the harm that the chip produced in the installation, prevents simultaneously that the encapsulation lid from receiving the condition emergence that the extrusion destroys the chip easily after the installation to the splicing of having guaranteed the chip can keep the intercommunication always with the pin.

Description

Packaging structure for radio frequency microwave power amplifier device

Technical Field

The utility model relates to a device encapsulation technical field especially relates to an encapsulation structure for radio frequency microwave power amplifier device.

Background

In a radio frequency microwave-based power amplifier, designs such as a monolithic microwave integrated circuit and a hybrid integrated circuit are widely used, and a currently commonly used radio frequency power amplifier module selects copper or other metal conductor materials as a metal substrate, places all radio frequency power amplifier chips and related matching circuit components on the metal substrate, and then performs bonding connection and packaging to form a module;

after the packaging box is packaged by the packaging cover of the existing packaging structure for the radio frequency microwave power amplifier device, if the packaging box is subjected to external pressure, the packaging cover is often pressed in, so that the chip body is damaged, even the chip is thoroughly damaged, and great economic loss is caused; meanwhile, due to the influence of vibration and the like, the existing connecting sheet fixed on the chip is separated from the conductor sheet, so that the connection between the chip and the pin is interrupted, and the chip is disabled.

SUMMERY OF THE UTILITY MODEL

The purpose of the utility model is to solve the shortcoming that exists among the prior art, if: the existing packaging structure is easy to damage a chip during packaging, the chip is easy to damage by extrusion after being installed, meanwhile, a connecting sheet of the chip is often disconnected with a pin, so that a device cannot normally operate, and the packaging structure for the radio frequency microwave power amplifier device is provided.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a packaging structure for a radio frequency microwave power amplifier comprises a packaging box and a plurality of pins fixedly arranged at the lower end of the side wall of the packaging box, wherein a protective plate is fixedly arranged on the bottom wall inside the packaging box, a chip is arranged on the protective plate, an adhesive layer is arranged between the protective plate and the chip and fixedly adheres the protective plate and the chip together, a packaging cover is fixedly arranged at an opening of the packaging box through a clamping mechanism, the packaging cover is tightly attached to the packaging box, a buffer cavity is embedded on the lower wall of the packaging cover, a first spring is fixedly arranged in the buffer cavity, a movable block is fixedly arranged at the lower end of the first spring, a buffer plate is fixedly arranged at the lower end of the movable block, the buffer plate is attached to the chip, a sliding groove is arranged on the side wall of the chip, a sliding block is arranged in the sliding groove in a sliding manner, a second spring is fixedly arranged on, the second spring is fixedly arranged in the sliding groove, the side wall of the sliding block is fixedly provided with a connecting piece, two ends of the lower wall in the packaging box are fixedly provided with fixing rods, the fixing rods are internally fixedly provided with conductor pieces, one ends of the conductor pieces are in contact with the connecting piece, and the other ends of the conductor pieces are fixedly connected with the pins.

Preferably, block mechanism is including setting up the smooth chamber in the encapsulation lid, be equipped with corresponding card chamber in the lateral wall of encapsulation box, smooth chamber and the card intracavity are equipped with the kelly jointly, the fixed two fixed blocks that are equipped with on the lateral wall of kelly, the fixed block sets up in smooth chamber, just be equipped with on the lateral wall of smooth chamber with fixed block assorted stopper, the fixed third spring that is equipped with between fixed block and the stopper, the one end fixedly connected with of kelly in smooth chamber is connected the rope, the one end rotation of kelly is kept away from in the smooth intracavity is equipped with the threaded rod, connects the fixed setting of the other end of rope on the threaded rod, the threaded rod runs through the encapsulation lid setting, just the fixed screw cap that is equipped with in upper end of threaded rod.

Preferably, the connecting part of the packaging cover and the packaging box is arranged in an inclined shape, and the area of the upper wall of the packaging cover is larger than that of the lower wall.

Preferably, the fixed push pedal that is equipped with between first spring and the movable block, the thickness of push pedal is thick setting, just for the smooth setting of inseparable laminating between the lateral wall of push pedal and the lateral wall of cushion chamber.

Preferably, the buffer plate is made of natural rubber with excellent elasticity.

Preferably, protective paint is coated on the threaded rod and the screw cap.

Compared with the prior art, the beneficial effects of the utility model are that: through the shape arrangement of the packaging cover and the arrangement of the clamping mechanism, the situation that the packaging cover is extruded and possibly collapsed after the packaging cover is installed is effectively prevented, the safety of a chip is ensured, and unnecessary economic loss is avoided; through the mutual cooperation of spout, slider, second spring and splicing for the splicing is pressed on the conductor piece under the effect of second spring all the time, thereby prevents the connection disconnection of splicing and pin, has guaranteed that the device can normally work.

Drawings

Fig. 1 is a schematic diagram of an overall structure of a package structure for a radio frequency microwave power amplifier device according to the present invention;

fig. 2 is a schematic front structural view of a package structure for a radio frequency microwave power amplifier device according to the present invention;

FIG. 3 is a schematic view of the structure at B in FIG. 2;

fig. 4 is a schematic structural diagram at a in fig. 2.

In the figure: the packaging structure comprises a packaging box 1, a pin 2, a protection plate 3, a viscose layer 4, a chip 5, a packaging cover 6, a buffer cavity 7, a first spring 8, a movable block 9, a buffer plate 10, a conductor piece 11, a sliding chute 12, a sliding block 13, a second spring 14, a connecting piece 15, a fixed rod 16, a sliding cavity 17, a clamping rod 18, a threaded rod 19, a connecting rope 20, a screw cap 21, a fixed block 22, a limiting block 23, a third spring 24 and a clamping cavity 25.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-4, a packaging structure for a radio frequency microwave power amplifier device comprises a packaging box 1 and a plurality of pins 2 fixedly arranged at the lower end of the side wall of the packaging box 1, a protection plate 3 is fixedly arranged on the bottom wall inside the packaging box 1, a chip 5 is arranged on the protection plate 3, an adhesive layer 4 is arranged between the protection plate 3 and the chip 5, the protection plate 3 and the chip 5 are fixedly bonded together by the adhesive layer 4, a packaging cover 6 is fixedly arranged at the opening of the packaging box 1 through a clamping mechanism, the packaging cover 6 is effectively prevented from being extruded and possibly collapsed after the packaging cover 6 is installed, the safety of the chip 5 is ensured, unnecessary economic loss is avoided, the connecting part of the packaging cover 6 and the packaging box 1 is arranged in an inclined manner, the area of the upper wall of the packaging cover 6 is larger than that of the lower wall, the clamping mechanism comprises a sliding cavity 17 arranged in the packaging cover 6, a corresponding clamping cavity 25 is arranged in the side wall of the packaging box 1, a clamping rod 18 is jointly arranged in the sliding cavity 17 and the clamping cavity 25, two fixing blocks 22 are fixedly arranged on the side wall of the clamping rod 18, the fixing blocks 22 are arranged in the sliding cavity 17, a limiting block 23 matched with the fixing blocks 22 is arranged on the side wall of the sliding cavity 17, a third spring 24 is fixedly arranged between the fixing blocks 22 and the limiting block 23, one end of the clamping rod 18 in the sliding cavity 17 is fixedly connected with a connecting rope 20, one end of the sliding cavity 17 far away from the clamping rod 18 is rotatably provided with a threaded rod 19, the other end of the connecting rope 20 is fixedly arranged on the threaded rod 19, the threaded rod 19 penetrates through the packaging cover 6, a screw cap 21 is fixedly arranged at the upper end of the threaded rod 19, protective paint is coated on the threaded rod 19 and the screw cap 21, and oxidation rusting phenomena which are easy to occur, the packaging cover 6 is tightly attached to the packaging box 1, a buffer cavity 7 is embedded on the lower wall of the packaging cover 6, a first spring 8 is fixedly arranged in the buffer cavity 7, a movable block 9 is fixedly arranged at the lower end of the first spring 8, a push plate is fixedly arranged between the first spring 8 and the movable block 9, the thickness of the push plate is thicker, the side wall of the push plate and the side wall of the buffer cavity 7 are in tight-attached smooth arrangement, the movable block 9 can be conveniently moved, the movable block 9 can be prevented from being inclined during moving, a buffer plate 10 is fixedly arranged at the lower end of the movable block 9, the buffer plate 10 is made of natural rubber with excellent elasticity, the chip 5 can be further prevented from being damaged due to external vibration and extrusion, the buffer plate 10 and the chip 5 are attached, a chute 12 is arranged on the side wall of the chip 5, a sliding block 13 is arranged in the chute 12 in a sliding manner, the fixed second spring 14 that is equipped with of upper wall of slider 13, second spring 14 sets up at spout 12 internal fixation, still the fixed splicing 15 that is equipped with on the lateral wall of slider 13, the fixed dead lever 16 that is equipped with in lower wall both ends in the encapsulation box 1, dead lever 16 internal fixation is equipped with conductor piece 11, the one end and the splicing 15 contact setting of conductor piece 11, the other end and the pin 2 fixed connection of conductor piece 11, through spout 12, slider 13, the mutually supporting of second spring 14 and splicing 15, make splicing 15 pressed on conductor piece 11 under the effect of second spring 14 all the time, thereby prevent splicing 15 and pin 2's disconnection, guaranteed that the device can normally work.

The utility model discloses in, when needs encapsulate chip 5, with chip 5 through the fixed setting of viscose on protection plate 3, be connected splicing 15 and conductor piece 11 simultaneously, will encapsulate the opening that lid 6 corresponds encapsulation box 1 and prevent, later rotate screw cap 21 with the screwdriver for threaded rod 19 rotates, under the effect of third spring 24, kelly 18 removes in to calorie chamber 25, the terminal diapire with calorie chamber 25 of kelly 18 offsets, accomplished the installation to encapsulation lid 6 promptly.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A packaging structure for a radio frequency microwave power amplifier device comprises a packaging box (1) and a plurality of pins (2) fixedly arranged at the lower end of the side wall of the packaging box (1), and is characterized in that a protection plate (3) is fixedly arranged on the inner bottom wall of the packaging box (1), a chip (5) is arranged on the protection plate (3), an adhesive layer (4) is arranged between the protection plate (3) and the chip (5), the protection plate (3) and the chip (5) are fixedly bonded together by the adhesive layer (4), a packaging cover (6) is fixedly arranged at the opening of the packaging box (1) through a clamping mechanism, the packaging cover (6) is tightly attached to the packaging box (1), a buffer cavity (7) is embedded on the lower wall of the packaging cover (6), a first spring (8) is fixedly arranged in the buffer cavity (7), and a movable block (9) is fixedly arranged at the lower end of the first spring (8), the fixed buffer board (10) that is equipped with of lower extreme of movable block (9), buffer board (10) and chip (5) laminating setting, be equipped with spout (12) on the lateral wall of chip (5), it is equipped with slider (13) to slide in spout (12), the upper wall of slider (13) is fixed and is equipped with second spring (14), second spring (14) set up in spout (12) internal fixation, still fixed splicing (15) that is equipped with on the lateral wall of slider (13), lower wall both ends in encapsulation box (1) are fixed and are equipped with dead lever (16), dead lever (16) internal fixation is equipped with conductor piece (11), the one end and splicing (15) contact setting of conductor piece (11), the other end and pin (2) fixed connection of conductor piece (11).

2. The packaging structure for the radio frequency microwave power amplifier device according to claim 1, wherein the clamping mechanism comprises a sliding cavity (17) arranged in the packaging cover (6), the side wall of the packaging box (1) is provided with a corresponding clamping cavity (25), the sliding cavity (17) and the clamping cavity (25) are provided with a clamping rod (18) together, the side wall of the clamping rod (18) is fixedly provided with two fixing blocks (22), the fixing blocks (22) are arranged in the sliding cavity (17), the side wall of the sliding cavity (17) is provided with a limiting block (23) matched with the fixing blocks (22), a third spring (24) is fixedly arranged between the fixing blocks (22) and the limiting block (23), one end of the clamping rod (18) in the sliding cavity (17) is fixedly connected with a connecting rope (20), one end of the sliding cavity (17) far away from the clamping rod (18) is rotatably provided with a threaded rod (19), the other end of the connecting rope (20) is fixedly arranged on a threaded rod (19), the threaded rod (19) penetrates through the packaging cover (6) and is provided with a screw cap (21) fixedly arranged at the upper end of the threaded rod (19).

3. The packaging structure for the radio frequency microwave power amplifier device according to claim 1, wherein the connecting portion of the packaging cover (6) and the packaging box (1) is arranged in an inclined manner, and the area of the upper wall of the packaging cover (6) is larger than that of the lower wall.

4. The packaging structure for the radio frequency microwave power amplifier device according to claim 1, wherein a push plate is fixedly arranged between the first spring (8) and the movable block (9), the thickness of the push plate is thicker, and the side wall of the push plate and the side wall of the buffer cavity (7) are smoothly arranged in a close fit manner.

5. The packaging structure for RF microwave power amplifier device according to claim 1, wherein the buffer board (10) is made of natural rubber with excellent elasticity.

6. The packaging structure for the RF microwave power amplifier device as claimed in claim 2, wherein the threaded rod (19) and the screw cap (21) are coated with protective paint.