CN212967633U

CN212967633U - Wafer box

Info

Publication number: CN212967633U
Application number: CN202021529683.7U
Authority: CN
Inventors: 胡明; 高文丽; 尚书丽; 王虎; 聂铭思; 陈雷
Original assignee: Wuhan Ruijing Laser Chip Technology Co ltd
Current assignee: Wuhan Ruijing Laser Chip Technology Co ltd
Priority date: 2020-07-29
Filing date: 2020-07-29
Publication date: 2021-04-13
Anticipated expiration: 2030-07-29

Abstract

The utility model discloses a wafer box belongs to semiconductor wafer chip preparation technical field. The wafer cassette includes: the top cover is detachably connected with the bottom cover; the hold-down mechanism includes: the connecting plate and more than three pressing claws; the connecting plate may be disposed between the bottom cover and the top cover; the first ends of more than three pressing claws are fixedly connected with the connecting plate; more than three supporting blocks are fixedly arranged on the bottom cover, and the more than three supporting blocks correspond to the more than three pressing claws one by one; the supporting block is provided with a placing groove, and the second end of the pressing claw can be pressed into the corresponding placing groove. The utility model discloses the brilliant operation of being convenient for of wafer case can lock the position of wafer piece on the horizontal direction to when making the operation of uncapping shift, the wafer can not take place to slide.

Description

Wafer box

Technical Field

The utility model relates to a semiconductor wafer chip preparation technical field, in particular to wafer box.

Background

In the field of semiconductor wafer chip manufacturing, an eight-claw wafer cassette is generally used for transferring wafers, and the eight-claw wafer cassette can better hold and transfer the wafers by virtue of a unique elastic eight-claw fixing structure.

However, due to the nature of the eight-claw structure, the conventional wafer cassette can only be turned over and turned back to open when in operation, and the wafer is completely and independently supported by the eight independent claws.

SUMMERY OF THE UTILITY MODEL

The utility model provides a wafer box has solved or has partly solved among the prior art wafer box operation inconvenience, easily leads to the technical problem of wafer landing simultaneously.

In order to solve the technical problem, the utility model provides a wafer box includes: the top cover, the bottom cover and the pressing mechanism; the top cover is detachably connected with the bottom cover; the hold-down mechanism includes: the connecting plate and more than three pressing claws; the connecting plate is arranged between the bottom cover and the top cover; the first ends of more than three pressing claws are fixedly connected with the connecting plate; more than three supporting blocks are fixedly arranged on the bottom cover, and the more than three supporting blocks correspond to the more than three pressing claws one by one; the supporting block is provided with a placing groove, and the second end of the pressing claw can be pressed into the corresponding placing groove.

Further, the wafer cassette further includes: a spring; the first end of the spring is fixedly connected with the connecting plate, and the second end of the spring is in contact with the top cover.

Further, the wafer cassette further includes: rotating the ball; a first end of the rotating ball is rotatably coupled to a second end of the spring, and a second end of the rotating ball contacts the cap.

Further, more than three pressing claws are arranged on the connecting plate at equal angle and uniform intervals.

Further, more than three supporting blocks are arranged on the bottom cover at equal angle and uniform intervals.

Further, the shape of the placement groove is L-shaped.

Further, the shape of the bottom cover is matched with the shape of the top cover; the size of the bottom cover is matched with that of the top cover.

Further, the top cover is in threaded connection with the bottom cover.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

the top cover is detachably connected with the bottom cover, the connecting plate is arranged between the bottom cover and the top cover, the first ends of the more than three pressing claws are fixedly connected with the connecting plate, the more than three supporting blocks are fixedly arranged on the bottom cover and correspond to the more than three pressing claws one to one, the arranging grooves are formed in the supporting blocks, and the second ends of the pressing claws can be pressed into the corresponding arranging grooves, so that the bottom cover and the top cover are disassembled, the invalid areas of the large edge and the small edge of the wafer are placed in the arranging grooves, the bottom cover and the top cover are connected together, the top cover presses the pressing claws through the connecting plate, the pressing claws are pressed into the corresponding arranging grooves, the invalid areas of the large edge and the small edge of the wafer are pressed into the arranging grooves, the operation is convenient, the wafer can be locked at the position in the horizontal direction, and the wafer cannot slide when the opening operation is transferred.

Drawings

Fig. 1 is a schematic structural view of a wafer cassette according to an embodiment of the present invention;

FIG. 2 is a schematic view of a base plate of the wafer cassette of FIG. 1;

FIG. 3 is a schematic view of a pressing claw of the wafer cassette of FIG. 1;

FIG. 4 is a schematic structural diagram of a top cover of the wafer cassette of FIG. 1;

Detailed Description

Referring to fig. 1-4, an embodiment of the present invention provides a wafer cassette including: top cap 1, bottom 2 and hold-down mechanism 3.

The top cover 1 is detachably connected with the bottom cover 2.

The pressing mechanism 3 includes: a connecting plate 3-1 and more than three press claws 3-2.

The connection plate 3-1 is disposed between the bottom cover 2 and the top cover 1.

The first ends of more than three pressing claws 3-2 are fixedly connected with the connecting plate 3-1.

More than three supporting blocks 4 are fixedly arranged on the bottom cover 2, and the more than three supporting blocks 4 correspond to the more than three pressing claws 3-2 one by one.

The supporting block 4 is provided with a placing groove, and the second end of the pressing claw 3-2 can be pressed into the corresponding placing groove.

In the specific embodiment of the application, the top cover 1 is detachably connected with the bottom cover 2, the connecting plate 3-1 is arranged between the bottom cover 2 and the top cover 1, the first ends of more than three press claws 3-2 are fixedly connected with the connecting plate 3-1, the bottom cover 2 is fixedly provided with more than three supporting blocks 4, the more than three supporting blocks 4 correspond to the more than three press claws 3-2 one by one, the supporting blocks 4 are provided with placing grooves, and the second ends of the press claws 3-2 can be pressed into the corresponding placing grooves, so that the bottom cover 2 is detached from the top cover 1, the invalid regions of the large edge and the small edge of the wafer are placed in the placing grooves, the bottom cover 2 is connected with the top cover 1, the top cover 1 presses the press claws 3-2 through the connecting plate 3-1, the press claws 3-2 are pressed into the corresponding placing grooves, the invalid regions of the large edge and the small edge of the wafer are pressed in the placing grooves, the wafer opening device is convenient to operate, and can lock the wafer in the horizontal direction, so that the wafer cannot slide when the cover opening operation is transferred.

Specifically, the wafer cassette further includes: and a spring 5.

The first end of the spring 5 is fixedly connected with the connecting plate 3-1, and the second end of the spring 5 is contacted with the top cover 1.

When the top cover 1 presses the pressing claws 3-2 through the connecting plate 3-1, the springs 5 can stretch and retract to match with wafers with different thicknesses, and the fact that the pressing claws 3-2 press the invalid areas of the large edge and the small edge of the wafer is stable is guaranteed.

Specifically, the wafer cassette further includes: the ball 6 is rotated.

A first end of the turning ball 6 is rotatably connected with a second end of the spring 5. In the present embodiment, a bearing seat is fixedly provided at the second end of the spring 5, and one end of the rotating ball 6 is rotatably provided in the bearing seat. The second end of the turning ball 6 is in contact with the cap 1.

When the top cover 1 is connected with the bottom cover 2 or the top cover 1 is separated from the bottom cover 2, the top cover 1 is operated, and the rotating ball 6 rotates, so that the friction force is reduced to the minimum when the top cover 1 rotates, and the top cover 1 is prevented from interfering the pressing claws 3-2 to press the large edge and the small edge of the wafer.

Specifically, more than three pressing claws 3-2 are arranged on the connecting plate 3-1 at equal angular intervals. More than three supporting blocks 4 are arranged on the bottom cover 2 at equal angle and uniform intervals, so that the stability of locking the wafer is ensured.

Specifically, the shape of the placing groove is L-shaped, so that the invalid areas of the large side and the small side of the wafer can be conveniently placed.

Specifically, the shape of the bottom cover 2 matches the shape of the top cover 1; the size of the bottom cover 2 is matched with that of the top cover 1, so that the tightness of the bottom cover 2 and the top cover 1 after locking is ensured, and the wafer is prevented from being polluted.

Specifically, the top cover 1 is in threaded connection with the bottom cover 2, so that the assembly and disassembly are convenient.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.

Claims

1. A wafer cassette, comprising: the top cover, the bottom cover and the pressing mechanism;

the top cover is detachably connected with the bottom cover;

the hold-down mechanism includes: the connecting plate and more than three pressing claws;

the connecting plate is arranged between the bottom cover and the top cover;

the first ends of more than three pressing claws are fixedly connected with the connecting plate;

more than three supporting blocks are fixedly arranged on the bottom cover, and the more than three supporting blocks correspond to the more than three pressing claws one by one;

the supporting block is provided with a placing groove, and the second end of the pressing claw can be pressed into the corresponding placing groove.

2. The wafer cassette of claim 1, further comprising: a spring;

the first end of the spring is fixedly connected with the connecting plate, and the second end of the spring is in contact with the top cover.

3. The wafer cassette of claim 2, further comprising: rotating the ball;

a first end of the rotating ball is rotatably coupled to a second end of the spring, and a second end of the rotating ball contacts the cap.

4. The wafer cassette according to claim 1, characterized in that:

more than three pressing claws are arranged on the connecting plate at equal angle and uniform intervals.

5. The wafer cassette according to claim 1, characterized in that:

more than three supporting blocks are arranged on the bottom cover at equal angle and uniform intervals.

6. The wafer cassette according to claim 1, characterized in that:

the shape of the placement groove is L-shaped.

7. The wafer cassette according to claim 1, characterized in that:

the shape of the bottom cover is matched with that of the top cover;

the size of the bottom cover is matched with that of the top cover.

8. The wafer cassette according to claim 1, characterized in that:

the top cover is in threaded connection with the bottom cover.