CN212955414U - Structure of conductive device for electroplating - Google Patents
Structure of conductive device for electroplating Download PDFInfo
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- CN212955414U CN212955414U CN202021911539.XU CN202021911539U CN212955414U CN 212955414 U CN212955414 U CN 212955414U CN 202021911539 U CN202021911539 U CN 202021911539U CN 212955414 U CN212955414 U CN 212955414U
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Abstract
The utility model discloses a structure of electric installation of electroplating usefulness, including current conducting plate and conducting block, the below of current conducting plate is provided with electrically conductive base, and the surface of electrically conductive base has seted up the base fixed orifices, the conducting block sets up in the top of current conducting plate, and both sides all are provided with horizontal fixed orifices around the conducting block, vertical fixed orifices has been seted up to the front side of current conducting plate, the mounting groove has all been seted up to the left and right sides of current conducting plate, and the inside of mounting groove is provided with electrically conductive V-arrangement wheel, the inside of electrically conductive V-arrangement wheel is provided with the pivot, the top of conducting block is provided with electroplates the material. This electrically conductive device for electroplating's structure can make electroplating material at the uniform velocity toward a direction state of advancing, for the continuous stable transport current of electroplating material in the motion, is provided with the conducting block and can makes electroplating material be in horizontal guide effect, makes electroplating material be in stable electrified state, is provided with the mounting groove and is convenient for realize the installation to electrically conductive V-arrangement wheel.
Description
Technical Field
The utility model relates to a conductive device technical field specifically is a conductive device's of electroplating usefulness structure.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. The outer layer of many coins is also plated.
The structure of the existing conductive device for electroplating has the defects that the conductive distribution is uneven in the electroplating process, and the electroplated material cannot be in a stable charged state at any time, so that the problem of the whole electroplating process is influenced, the use requirements of people cannot be well met, and technical innovation is performed on the basis of the structure of the existing conductive device for electroplating aiming at the above situation.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a conductive device's of electroplating usefulness structure to there is the electroplating in-process conductive distribution inhomogeneous in solving the current conductive device's of electroplating usefulness structure in the above-mentioned background art, and the material of electroplating can not be in at any time and stabilize electrified state, thereby influences the problem of whole electroplating process, the user demand problem of satisfying people that can not be fine.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electroplate structure of conductive device of usefulness, includes current conducting plate and conducting block, the below of current conducting plate is provided with electrically conductive base, and the surface of electrically conductive base has seted up the base fixed orifices, the conducting block sets up in the top of current conducting plate, and both sides all are provided with horizontal fixed orifices around the conducting block, longitudinal fixity hole has been seted up to the front side of current conducting plate, the mounting groove has all been seted up to the left and right sides of current conducting plate, and the inside of mounting groove is provided with electrically conductive V-arrangement wheel, the inside of electrically conductive V-arrangement wheel is provided with the pivot, the top of conducting block is provided with electroplates.
Preferably, the conducting plate is in threaded connection with the conducting base through the transverse fixing hole, and the conducting base and the conducting plate are in a cross structure.
Preferably, the base fixing holes penetrate through the conductive base, and the number of the base fixing holes is four.
Preferably, the conductive block is fixedly connected with the conductive plate through the longitudinal fixing hole, and the conductive block is made of a conductive stainless steel material.
Preferably, the conductive block is arranged to enable the electroplating material to be in a horizontal guiding effect, and enable the electroplating material to move forward in one direction at a constant speed all the time, so that the electroplating material is in a stable charged state.
Preferably, the conductive V-shaped wheel is movably connected with the rotating shaft, and the conductive V-shaped wheel and the conductive block are positioned on the same horizontal plane.
Preferably, the rotating shaft is in threaded connection with the conductive plate through the mounting groove, and the rotating shaft penetrates through the inside of the conductive V-shaped wheel.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the conductive base is arranged to realize the installation and fixation of the conductive plate through the base fixing hole, so that the whole device is in a horizontal state, the transverse fixing hole is used for connecting the conductive base and the conductive plate, and the base fixing hole is arranged to realize the installation and fixation of the conductive base, so that the whole conductive device can be installed and fixed, and the processing of electroplating materials is facilitated;
2. the conductive block is arranged to enable the electroplating material to be in a horizontal guiding effect, the electroplating material can be enabled to move forward in one direction at a constant speed all the time, the electroplating material is enabled to be in a stable charged state, and the installation groove is arranged to facilitate the installation of the conductive V-shaped wheel;
3. the conductive V-shaped wheel is arranged and can rotate under the action of the rotating shaft, so that the electroplating material can move forwards at a constant speed, the electroplating material can keep stable current transmission in the movement, the rotating shaft is arranged and can play a role in mounting and fixing the conductive V-shaped wheel, and meanwhile, the conductive V-shaped wheel can be driven to rotate on the surface of the conductive V-shaped wheel.
Drawings
FIG. 1 is a schematic view of the structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
fig. 3 is a schematic rear view of the present invention;
FIG. 4 is a left side view of the structure of the present invention;
FIG. 5 is a schematic view of the electroplating material of the present invention.
In the figure: 1. a conductive plate; 2. a conductive base; 3. a conductive V-shaped wheel; 4. a conductive block; 5. a base fixing hole; 6. a longitudinal fixing hole; 7. a transverse fixing hole; 8. a rotating shaft; 9. electroplating the material; 10. and (4) mounting the groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides an electroplate structure of conductive device of usefulness, including current conducting plate 1 and conducting block 4, the below of current conducting plate 1 is provided with electrically conductive base 2, and the base fixed orifices 5 has been seted up on the surface of electrically conductive base 2, conducting block 4 sets up in current conducting plate 1's top, and both sides all are provided with horizontal fixed orifices 7 around conducting block 4, vertical fixed orifices 6 have been seted up to current conducting plate 1's front side, mounting groove 10 has all been seted up to current conducting plate 1's the left and right sides, and the inside of mounting groove 10 is provided with electrically conductive V-arrangement wheel 3, the inside of electrically conductive V-arrangement wheel 3 is provided with pivot 8, the top of conducting block 4 is provided.
The utility model discloses in: the conductive plate 1 is in threaded connection with the conductive base 2 through the transverse fixing hole 7, and the conductive base 2 and the conductive plate 1 are in a cross structure; be provided with electrically conductive base 2 and can realize fixing the installation of current conducting plate 1 through base fixed orifices 5, make whole device be in the horizontally state, horizontal fixed orifices 7 is used for electrically conductive base 2 and current conducting plate 1 to be connected.
The utility model discloses in: the base fixing holes 5 penetrate through the conductive base 2, the number of the base fixing holes 5 is four, and the base fixing holes 5 are used for mounting and fixing the conductive base 2, so that the whole conductive device can be mounted and fixed, and the processing of the electroplating material 9 is facilitated;
the utility model discloses in: the conductive block 4 is fixedly connected with the conductive plate 1 through the longitudinal fixing hole 6, and the conductive block 4 is made of conductive stainless steel; the conductive block 4 is arranged to enable the electroplating material 9 to be in a horizontal guiding function, and enable the electroplating material 9 to move forward in one direction at a constant speed all the time, so that the electroplating material 9 is in a stable charged state.
The utility model discloses in: the conductive block 4 is arranged to enable the electroplating material 9 to be in a horizontal guiding function, and enable the electroplating material 9 to move forward in one direction at a constant speed all the time, so that the electroplating material 9 is in a stable charged state; the provision of the mounting groove 10 facilitates the mounting of the conductive V-wheel 3.
The utility model discloses in: the conductive V-shaped wheel 3 is movably connected with the rotating shaft 8, and the conductive V-shaped wheel 3 and the conductive block 4 are positioned on the same horizontal plane; the conductive V-shaped wheel 3 can rotate under the action of the rotating shaft 8, so that the electroplating material 9 can move forwards at a constant speed, and the electroplating material 9 can keep stable current transmission during movement.
The utility model discloses in: the rotating shaft 8 is in threaded connection with the conductive plate 1 through the mounting groove 10, and the rotating shaft 8 penetrates through the conductive V-shaped wheel 3; be provided with pivot 8 and can play the fixed effect of installation to electrically conductive V-arrangement wheel 3, can drive electrically conductive V-arrangement wheel 3 and rotate on its surface simultaneously.
The working principle of the structure of the conductive device for electroplating is as follows: firstly, the current conducting plate 1 is connected with the current conducting base 2 through the transverse fixing hole 7 in a threaded manner, so that the current conducting plate 1 and the current conducting base 2 are fixed in a cross structure, secondly, the current conducting block 4 is fixed above the current conducting plate 1 through the longitudinal fixing hole 6, the current conducting block 4 can enable the electroplating material 9 to be in a horizontal guiding effect, the electroplating material 9 can always advance in one direction at a constant speed, so that the electroplating material 9 is in a stable electrified state, secondly, the rotating shaft 8 penetrates through the inside of the current conducting V-shaped wheel 3, then the current conducting V-shaped wheel 3 is installed in the installation groove 10, so that the current conducting block 4 and the V-shaped groove of the current conducting V-shaped wheel 3 are positioned on the same horizontal plane, then, the current conducting base 2 is fixed through the base fixing hole 5, so that the whole device can be fixed, and finally, the electroplating material 9 advances along the surfaces of the current conducting V-shaped, and the conductive V-shaped wheel 3 can rotate under the action of the rotating shaft 8, so that the electroplating material 9 can move forwards at a constant speed, and the electroplating material 9 can keep stable current transmission during movement.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A structure of a conductive device for electroplating, comprising a conductive plate (1) and a conductive block (4), characterized in that: the utility model discloses a solar energy collector, including current conducting plate (1), conducting block (4), horizontal fixed orifices (7), mounting groove (10), and the inside of mounting groove (10) is provided with electrically conductive V-arrangement wheel (3), the inside of electrically conductive V-arrangement wheel (3) is provided with pivot (8), the top of conducting block (4) is provided with electroplates material (9), and the surface of conducting base (2) has seted up base fixed orifices (5), conducting block (4) set up in the top of conducting plate (1), and both sides all are provided with horizontal fixed orifices (7) around conducting block (4), the front side of conducting plate (1) is seted up vertical fixed orifices (6), mounting groove (10) have all been seted up to the left and right sides of conducting plate (1), and the inside of.
2. A structure of a conductive device for plating according to claim 1, characterized in that: the conducting plate (1) is in threaded connection with the conducting base (2) through the transverse fixing hole (7), and a cross structure is formed between the conducting base (2) and the conducting plate (1).
3. A structure of a conductive device for plating according to claim 1, characterized in that: the base fixing holes (5) penetrate through the conductive base (2), and the number of the base fixing holes (5) is four.
4. A structure of a conductive device for plating according to claim 1, characterized in that: the conducting block (4) is fixedly connected with the conducting plate (1) through the longitudinal fixing hole (6), and the conducting block (4) is made of stainless steel materials capable of conducting electricity.
5. A structure of a conductive device for plating according to claim 1, characterized in that: the mounting grooves (10) are parallel to each other about the vertical central axis of the conductive plate (1), and the number of the mounting grooves (10) is two.
6. A structure of a conductive device for plating according to claim 1, characterized in that: the conductive V-shaped wheel (3) is movably connected with the rotating shaft (8), and the conductive V-shaped wheel (3) and the conductive block (4) are positioned on the same horizontal plane.
7. A structure of a conductive device for plating according to claim 1, characterized in that: the rotating shaft (8) is in threaded connection with the conductive plate (1) through the mounting groove (10), and the rotating shaft (8) penetrates through the inside of the conductive V-shaped wheel (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021911539.XU CN212955414U (en) | 2020-09-04 | 2020-09-04 | Structure of conductive device for electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021911539.XU CN212955414U (en) | 2020-09-04 | 2020-09-04 | Structure of conductive device for electroplating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212955414U true CN212955414U (en) | 2021-04-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021911539.XU Active CN212955414U (en) | 2020-09-04 | 2020-09-04 | Structure of conductive device for electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212955414U (en) |
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2020
- 2020-09-04 CN CN202021911539.XU patent/CN212955414U/en active Active
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