CN212950174U

CN212950174U - Enhanced heat dissipation OBC charger

Info

Publication number: CN212950174U
Application number: CN202021673283.3U
Authority: CN
Inventors: 徐东海; 杨盼
Original assignee: Changzhou Wujin Hgpower Co ltd
Current assignee: Changzhou Hongguang Power Technology Co ltd
Priority date: 2020-08-12
Filing date: 2020-08-12
Publication date: 2021-04-13
Anticipated expiration: 2030-08-12

Abstract

The utility model relates to an enhanced heat dissipation OBC charger, which is provided with a shell, a transformer, a PCB assembly and a common mode inductor, wherein the transformer, the PCB assembly and the common mode inductor are arranged in the shell; the transformer and the common mode inductor are arranged on the PCB assembly; the shell comprises a lower shell and a cover plate; the PCB assembly is fixed at the bottom of the lower shell; the transformer is externally coated with a copper body or a copper foil; the copper body or the copper foil is provided with a screw hole; the screw hole is connected with the cover plate through a screw. The utility model discloses the outside package of transformer has copper body or copper foil, is convenient for dispel the heat and shield, is of value to EMC's passing through, and the transformer top is equipped with the screw hole and links to each other with heat dissipation apron screw, and the centre scribbles the sealed glue of organosilicon and is favorable to the fixed of transformer and leakage inductance to the transformer directly radiates out through heat dissipation apron with the heat of leakage inductance, has strengthened the stability and the thermal diffusivity of transformer and leakage inductance greatly.

Description

Enhanced heat dissipation OBC charger

Technical Field

The utility model relates to a new energy automobile technical field, in particular to enhancement mode heat dissipation OBC charger.

Background

With the development of new energy vehicles, on-board charging (OBC) chargers are increasingly widely used, which can dynamically adjust charging current or voltage parameters, perform corresponding actions, complete a charging process, have housings for protection functions, and install related components in the housings, so that a large amount of heat is generated in the housings during a working process, the heat dissipation problem of most existing OBC chargers cannot be effectively solved, and the heat dissipation problem affects the service life of the entire charger.

Disclosure of Invention

The utility model aims at overcoming the defect that prior art exists, provide an appearance comparatively regular, do benefit to the series-parallel connection of multimode, can provide convenience for realizing high-power, and the enhancement mode heat dissipation OBC charger that the radiating effect is good.

Realize the utility model discloses the technical scheme of purpose is: an enhanced heat dissipation OBC charger is provided with a shell, and a transformer, a PCB assembly and a common mode inductor which are arranged in the shell; the transformer and the common mode inductor are arranged on the PCB assembly; the shell comprises a lower shell and a cover plate; the PCB assembly is fixed at the bottom of the lower shell; the transformer is externally coated with a copper body or a copper foil; the copper body or the copper foil is provided with a screw hole; the screw hole is connected with the cover plate through a screw.

According to the technical scheme, organic silicon sealant is coated between the copper body or the copper foil and the cover plate.

According to the technical scheme, the insulating ceramic plate is adhered to the inner part of the radiating side wall of the lower shell through the organic silicon heat-conducting glue.

According to the technical scheme, the transistor is adhered to the inner side of the insulating ceramic piece through the organic silicon heat-conducting glue.

According to the technical scheme, the common mode inductor is connected to the PCB assembly through the support column.

After the technical scheme is adopted, the utility model discloses following positive effect has:

(1) the utility model discloses the outside package of transformer has copper body or copper foil, is convenient for dispel the heat and shield, is of value to EMC's passing through, and the transformer top is equipped with the screw hole and links to each other with heat dissipation apron screw, and the centre scribbles the sealed glue of organosilicon and is favorable to the fixed of transformer and leakage inductance to the transformer directly radiates out through heat dissipation apron with the heat of leakage inductance, has strengthened the stability and the thermal diffusivity of transformer and leakage inductance greatly.

(2) The utility model discloses be equipped with the heat dissipation wall, the transistor that the heat dissipation wall position includes that MOS pipe, schottky and rectifier bridge pass through the organosilicon heat-conducting glue and link to each other with the potsherd to the potsherd passes through the organosilicon heat-conducting glue and links to each other with the radiator, and the heat transmission to the heat dissipation wall of transistor is glued and potsherd through the heat conduction, realizes concentrating the heat dissipation, thereby has strengthened the thermal diffusivity of transistor greatly, and the potsherd has also played insulating effect.

(3) The utility model discloses a common mode inductance has adopted and has raised the design, and other components and parts of its bottom mountable have strengthened space utilization greatly to the volume of module has been dwindled.

(4) The utility model discloses the outside cuboid design of adopting, the appearance is comparatively regular, can adapt to various shells, also does benefit to the series-parallel connection of multimode piece, provides convenience for realizing high-power supply.

Drawings

In order that the present invention may be more readily and clearly understood, the following detailed description of the present invention is given in conjunction with the accompanying drawings, in which

Fig. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the cover removing plate of the present invention;

fig. 3 is a schematic view of the heat dissipating wall plate of the present invention.

Detailed Description

(example 1)

Referring to fig. 1 to 3, the present invention has a housing, and a transformer 5, a PCB assembly 3 and a common mode inductor 6 disposed in the housing; the transformer 5 and the common mode inductor 6 are arranged on the PCB assembly 3; the shell comprises a lower shell and a cover plate 1; the PCB assembly 3 is fixed at the bottom of the lower shell; the transformer 5 is coated with a copper body or a copper foil 4; organic silicon sealant is coated between the copper body or the copper foil 4 and the cover plate 1. The copper body or the copper foil 4 is provided with a screw hole 9; the screw holes 9 are connected to the cover plate 1 by screws. The transformer 5 outside package has the copper body or copper foil 4, the heat dissipation and the shielding of being convenient for, be of value to EMC's passing through, 5 tops of transformer are equipped with screw hole 9 and are continuous with 1 screw of heat dissipation apron, and the centre scribbles the sealed glue of organosilicon and is favorable to the fixed of transformer 5 and leakage inductance, and transformer 5 directly dispels through heat dissipation apron 1 with the heat of leakage inductance, has strengthened transformer 5 and the stability and the thermal diffusivity of leakage inductance greatly.

An insulating ceramic plate 7 is adhered to the inside of the heat dissipation side wall 2 of the lower shell through organic silicon heat conduction glue. The transistor 8 is pasted on the inner side of the insulating ceramic plate 7 through organic silicon heat conducting glue, and the transistor 8 comprises an MOS (metal oxide semiconductor) tube, a Schottky and a rectifier bridge. The heat of the transistor is transmitted to the radiating wall through the heat conducting glue and the ceramic wafer, so that concentrated radiating is realized, the radiating performance of the transistor is greatly enhanced, and the ceramic wafer also plays an insulating role.

The common mode inductor 6 is connected to the PCB assembly 3 through the support posts. The common mode inductor adopts a lifting design, and other components can be mounted at the bottom of the common mode inductor, so that the space utilization rate is greatly enhanced, and the size of a module is reduced.

The above-mentioned embodiments, further detailed description of the objects, technical solutions and advantages of the present invention, it should be understood that the above-mentioned embodiments are only specific embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims

1. An enhanced heat dissipation OBC charger is provided with a shell, and a transformer (5), a PCB assembly (3) and a common mode inductor (6) which are arranged in the shell; the transformer (5) and the common mode inductor (6) are arranged on the PCB assembly (3); the method is characterized in that: the housing comprises a lower shell and a cover plate (1); the PCB assembly (3) is fixed at the bottom of the lower shell; the transformer (5) is coated with a copper body or a copper foil (4) outside; the copper body or the copper foil (4) is provided with a screw hole (9); the screw hole (9) is connected with the cover plate (1) through a screw.

2. The enhanced heat dissipation OBC charger of claim 1, wherein: and organic silicon sealant is coated between the copper body or the copper foil (4) and the cover plate (1).

3. The enhanced heat dissipation OBC charger of claim 1 or 2, wherein: and an insulating ceramic plate (7) is adhered to the inside of the heat dissipation side wall (2) of the lower shell through organic silicon heat conduction glue.

4. The enhanced heat dissipation OBC charger of claim 3, wherein: and the inner side of the insulating ceramic sheet (7) is adhered with a transistor (8) through organic silicon heat-conducting glue.

5. The enhanced heat dissipation OBC charger of claim 4, wherein: the common mode inductor (6) is connected to the PCB assembly (3) through a support post.