CN212933466U - Computer power supply with heat conducting device - Google Patents
Computer power supply with heat conducting device Download PDFInfo
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- CN212933466U CN212933466U CN202021658891.7U CN202021658891U CN212933466U CN 212933466 U CN212933466 U CN 212933466U CN 202021658891 U CN202021658891 U CN 202021658891U CN 212933466 U CN212933466 U CN 212933466U
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- air guide
- heat dissipation
- power supply
- pcb
- heat
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Abstract
The utility model discloses a computer power supply with a heat conduction device, which comprises a power supply shell and a PCB arranged in the inner cavity of the power supply shell, wherein the bottom of the power supply shell is provided with a fan device, the bottom of the PCB is provided with a heat dissipation plate, the top of the heat dissipation plate is provided with a plurality of PIN feet, and each PIN foot is respectively welded on the PCB; the bottom surface of the heat dissipation plate is provided with a plurality of heat dissipation fins in an array manner along the circumferential direction, the inner end of each heat dissipation fin is surrounded to form an air guide cavity, the air guide cavity is vertically aligned with the fan device, an air guide groove is formed between every two adjacent heat dissipation fins at intervals, the inner end of the air guide groove is connected with the air guide cavity, and the outer end of the air guide groove penetrates through the side part of the heat dissipation plate; when the fan device runs, air is blown towards the air guide cavity to form unidirectional air flow which is guided to each air guide groove by the air guide cavity and radiates outwards so as to radiate the internal heat of the PCB. Compared with the prior art, the heat generated in the computer power supply can be effectively reduced, and the service life of components such as an integrated circuit board in the computer power supply can be prolonged.
Description
Technical Field
The utility model belongs to the technical field of computer power supply technique and specifically relates to a take heat conduction device's computer power supply is related to.
Background
The working efficiency of a computer power supply is generally between 70% and 85%, the rest part of the computer power supply is converted into heat to be dissipated, the temperature of a circuit board in the computer power supply is increased in the heat dissipation process, and in order to avoid adverse effects of overhigh temperature on a power supply assembly, a conventional heat dissipation method is to arrange a heat dissipation fan and an air outlet in a power supply shell to form unidirectional heat dissipation airflow so as to dissipate the heat in the power supply shell. However, the heat dissipation structure has the problem that heat is accumulated on the circuit board, and the components on the circuit board are easily burnt out due to the excessively high operating temperature.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a take heat conduction device's computer power can effectively give off the PCB board and carry the heat of carrying the component on the PCB board, reduces its operating temperature, reduces the fault rate to the not enough of prior art existence.
In order to realize the purpose, the utility model discloses the technical scheme who adopts is: the computer power supply with the heat conducting device comprises a power supply shell and a PCB arranged in an inner cavity of the power supply shell, wherein a fan device is arranged at the bottom of the power supply shell, a heat dissipation plate is arranged at the bottom of the PCB, a plurality of PIN PINs are arranged at the top of the heat dissipation plate, and the PIN PINs are respectively welded on the PCB; the bottom surface of the heat dissipation plate is provided with a plurality of heat dissipation fins in an array manner along the circumferential direction, the inner end of each heat dissipation fin is surrounded to form an air guide cavity, the air guide cavity is vertically aligned with the fan device, an air guide groove is formed between every two adjacent heat dissipation fins at intervals, the inner end of the air guide groove is connected with the air guide cavity, and the outer end of the air guide groove penetrates through the side part of the heat dissipation plate; when the fan device runs, air is blown towards the air guide cavity to form unidirectional air flow which is guided to each air guide groove by the air guide cavity and radiates outwards so as to radiate the internal heat of the PCB.
In a further technical scheme, a suspension bracket is arranged at the bottom of an inner cavity of the power supply shell and comprises a bracket plate and edge supporting legs which are respectively arranged on the bracket plate, and the supporting legs are respectively welded or screwed with the power supply shell; a bracket plate opening penetrates through the middle position of the bracket plate and is respectively aligned with the air guide cavity and the fan device up and down; the heat dissipation plate is fixedly connected to the top surface of the support plate.
In a further technical scheme, a heat-conducting insulating gasket is arranged between the bottom surface of the PCB and the top surface of the heat dissipation plate.
In a further technical scheme, the PCB at least comprises a capacitor, an inductor, a resistor and a transformer.
In a further technical scheme, an air inlet is formed in the bottom of the power supply shell, the air inlet is vertically aligned with the air guide cavity, an air cover is arranged on the outer side of the air inlet, and a fan device is arranged on the inner side of the air inlet.
After the structure is adopted, compared with the prior art, the utility model the advantage that has is: the utility model provides a computer power supply with a heat conduction device, which distributes the internal heat of a PCB through a heat dissipation plate welded at the bottom of the PCB, reduces the internal operating temperature and improves the working stability; the radiating air guide groove structure forms outward radiating one-way airflow, so that heat of the radiating fins is efficiently taken away, and the radiating efficiency of the radiating plate is further improved.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is an exploded view of the present invention.
Fig. 2 is a schematic structural view of the heat dissipating plate of the present invention.
Fig. 3 is a schematic view of another angle of the heat dissipating plate of the present invention.
Detailed Description
The following are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby.
As shown in fig. 1 to 3, the computer power supply with the heat conduction device comprises a power supply casing 1 and a PCB 2 arranged in an inner cavity of the power supply casing 1, wherein a fan device 5 is arranged at the bottom of the power supply casing 1, a heat dissipation plate 3 is arranged at the bottom of the PCB 2, a plurality of PIN PINs 31 are arranged at the top of the heat dissipation plate 3, and the PIN PINs 31 are respectively welded on the PCB 2; the bottom surface of the heat dissipation plate 3 is provided with a plurality of heat dissipation fins 32 in an array manner along the circumferential direction, the inner end of each heat dissipation fin 32 surrounds to form an air guide cavity 30, the air guide cavity 30 is vertically aligned with the fan device 5, air guide grooves are formed between two adjacent heat dissipation fins 32 at intervals, the inner ends of the air guide grooves are connected with the air guide cavities 30, and the outer ends of the air guide grooves penetrate through the side part of the heat dissipation plate 3; when in operation, the fan device 5 blows air towards the air guide cavity 30 to form unidirectional air flow which is guided to each air guide groove by the air guide cavity 30 and radiates outwards so as to radiate the internal heat of the PCB 2. The radiation type heat dissipation fins 32 can rapidly take away heat, and the conduction efficiency of the internal heat of the PCB 2 is improved.
Specifically, a suspension bracket is arranged at the bottom of the inner cavity of the power supply casing 1, the suspension bracket comprises a bracket plate 4 and edge supporting legs respectively arranged on the bracket plate 4, and each supporting leg is respectively welded or screwed with the power supply casing 1; a support plate opening 40 penetrates through the middle position of the support plate 4, and the support plate opening 40 is vertically aligned with the air guide cavity 30 and the fan device 5 respectively; the heat dissipation plate 3 is fixedly connected to the top surface of the bracket plate 4.
Specifically, a heat conductive insulating spacer is disposed between the bottom surface of the PCB 2 and the top surface of the heat dissipating plate 3.
Specifically, the PCB includes at least a capacitor, an inductor, a resistor, and a transformer.
Specifically, the bottom of the power supply casing 1 is provided with an air inlet, the air inlet is vertically aligned with the air guiding cavity 30, the outer side of the air inlet is provided with an air cover 51, and the inner side of the air inlet is provided with the fan device 5.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (5)
1. Take heat-transfer device's computer power, including power casing and set up in the PCB board of power casing's inner chamber, the bottom of power casing is seted up and is provided with fan unit, its characterized in that: the bottom of the PCB is provided with a heat dissipation plate, the top of the heat dissipation plate is provided with a plurality of PIN PINs, and the PIN PINs are respectively welded on the PCB;
the bottom surface of the heat dissipation plate is provided with a plurality of heat dissipation fins in an array manner along the circumferential direction, the inner end of each heat dissipation fin is surrounded to form an air guide cavity, the air guide cavity is vertically aligned with the fan device, an air guide groove is formed between every two adjacent heat dissipation fins at intervals, the inner end of the air guide groove is connected with the air guide cavity, and the outer end of the air guide groove penetrates through the side part of the heat dissipation plate;
when the fan device runs, air is blown towards the air guide cavity to form unidirectional air flow which is guided to each air guide groove by the air guide cavity and radiates outwards so as to radiate the internal heat of the PCB.
2. The computer power supply with heat conducting device of claim 1, wherein: the bottom of the inner cavity of the power supply shell is provided with a suspension bracket, the suspension bracket comprises a bracket plate and edge supporting legs respectively arranged on the bracket plate, and each supporting leg is respectively welded or screwed with the power supply shell; a bracket plate opening penetrates through the middle position of the bracket plate and is respectively aligned with the air guide cavity and the fan device up and down;
the heat dissipation plate is fixedly connected to the top surface of the support plate.
3. The computer power supply with heat conducting device of claim 2, wherein: and a heat-conducting insulating gasket is arranged between the bottom surface of the PCB and the top surface of the heat dissipation plate.
4. The computer power supply with heat conducting device of claim 1, wherein: the PCB at least comprises a capacitor, an inductor, a resistor and a transformer.
5. The computer power supply with heat conducting device of claim 1, wherein: the bottom of the power supply shell is provided with an air inlet, the air inlet is vertically aligned with the air guide cavity, the outer side of the air inlet is provided with an air cover, and the inner side of the air inlet is provided with the fan device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021658891.7U CN212933466U (en) | 2020-08-11 | 2020-08-11 | Computer power supply with heat conducting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021658891.7U CN212933466U (en) | 2020-08-11 | 2020-08-11 | Computer power supply with heat conducting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212933466U true CN212933466U (en) | 2021-04-09 |
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ID=75335611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021658891.7U Active CN212933466U (en) | 2020-08-11 | 2020-08-11 | Computer power supply with heat conducting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212933466U (en) |
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2020
- 2020-08-11 CN CN202021658891.7U patent/CN212933466U/en active Active
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