CN212932760U - Current sensor - Google Patents

Abstract

The utility model provides a current sensor, it includes conductor, magnetic sensor chip and signal processing chip, and the magnetic sensor chip includes signal first positive end, signal first negative end and signal second positive end, and signal first positive end and signal second positive end are symmetrical about the central line of conductor; a signal first negative terminal is positioned on the central line of the conductor; the signal processing chip comprises a third signal positive end, a second signal negative end and a fourth signal positive end, and the third signal positive end and the fourth signal positive end are symmetrical about the center line of the conductor; the signal second negative end is positioned on the central line of the conductor; a first routing wire connecting the first signal positive terminal and the third signal positive terminal; a second routing wire for connecting the first negative end and the second negative end; and a third routing wire for connecting the second positive end of the signal and the fourth positive end of the signal. Compared with the prior art, the utility model discloses an inductive coupling among the electric current sensor is eliminated to the routing mode to promote electric current sensor's detection precision.

Description

Current sensor

[ technical field ] A method for producing a semiconductor device

The utility model relates to a current sensor technical field especially relates to a magnetism resistance current sensor who eliminates inductive coupling through routing mode.

[ background of the invention ]

Current sensors for measuring the magnitude of current are widely used in various electronic devices. In the current sensor in the prior art, a U-shaped conductor is integrated inside the current sensor, two magneto-resistance sensors are arranged around the conductor, so that a current to be measured flows through the U-shaped conductor integrated inside the sensor, and the two magneto-resistance sensors perform differential measurement on a magnetic field generated by the current in the conductor, thereby achieving the purpose of detecting (or detecting) the current to be measured.

However, in the case of the current sensor, a high-frequency current generates an induced voltage in a closed loop, thereby affecting the detection accuracy of the current. In order to reduce the inductive coupling, a method of reducing the distance between the magnetic sensor chip and the signal processing chip to reduce the wire bonding surrounding area is generally adopted, but the inductive coupling cannot be fundamentally eliminated.

Therefore, it is necessary to provide a solution to the above problems.

[ Utility model ] content

An object of the utility model is to provide a current sensor, it eliminates the inductive coupling among the current sensor through the routing mode to promote current sensor's detection precision.

According to an aspect of the utility model, the utility model provides a current sensor, it detects the measured current according to the magnetic induction that the measured current produced, and it includes conductor, magnetic sensor chip and signal processing chip, the arrangement of magnetic sensor chip and signal processing chip mutual interval in same one side of conductor. The conductor is used for providing a flowing channel for the measured current so that the measured current can flow through the conductor; the magnetic sensor chip comprises a signal first positive end Vp11, a signal first negative end Vn11 and a signal second positive end Vp21, wherein the signal first positive end Vp11 and the signal second positive end Vp21 are symmetrical about a center line of the conductor; the signal first negative terminal Vn11 is located on the centre line of the conductor; the signal processing chip comprises a signal third positive end Vp12, a signal second negative end Vn12 and a signal fourth positive end Vp22, wherein the signal third positive end Vp12 and the signal fourth positive end Vp22 are symmetrical about the center line of the conductor; the signal second negative terminal Vn12 is located on the centre line of the conductor; a first wire bond 104c connecting the first signal positive terminal Vp11 and the third signal positive terminal Vp 12; a second wire 104d connecting the first signal negative terminal Vn11 and the second signal negative terminal Vn 12; a third wire bond 104e connecting the second positive signal terminal Vp21 and the fourth positive signal terminal Vp 22.

Further, the signal first positive terminal Vp11 and the signal third positive terminal Vp12 are located on one side of the center line of the conductor; the signal second positive terminal Vp21 and the signal fourth positive terminal Vp22 are located on the other side of the center line of the conductor.

Further, an area surrounded by the signal first positive terminal Vp11, the signal third positive terminal Vp12, the signal first negative terminal Vn11, the signal second negative terminal Vn12, the first wire bond 104c and the second wire bond 104d is referred to as a first area; the area surrounded by the second signal positive terminal Vp21, the fourth signal positive terminal Vp22, the first signal negative terminal Vn11, the second signal negative terminal Vn12, the third wire bonding 104e and the second wire bonding 104d is called a second area; the first region and the second region have equal area and opposite direction.

Further, the signal first positive terminal Vp11 and the signal second positive terminal Vp21 are interconnected inside the magnetic sensor chip; the signal third positive terminal Vp12 and signal fourth positive terminal Vp22 are interconnected inside the signal processing chip; the first area and the second area are opposite in direction: the first and second regions are symmetrical about a centerline of the conductor.

Further, the measured current flowing through the conductor generates a first magnetic field at the first region; the measured current flowing through the conductor generates a second magnetic field at the second region; wherein, the first magnetic field and the second magnetic field are approximately or completely equal in magnitude and same in direction.

Further, the conductor is the U type conductor, the U type conductor includes first shank, second shank to and connect the connecting portion between first shank and second shank, wherein, the electric current opposite direction on first shank and the second shank, first shank and second shank are located respectively the both sides of the central line of conductor, the magnetic sensor chip with first shank and second shank set up relatively.

According to the utility model discloses a another aspect, the utility model provides another kind of current sensor, its magnetic induction that produces according to the measured current detects the measured current, and it includes conductor, magnetic sensor chip and signal processing chip, the arrangement of magnetic sensor chip and signal processing chip mutual spaced in same one side of conductor.

The conductor is used for providing a flowing channel for the measured current so that the measured current can flow through the conductor; the magnetic sensor chip includes a signal first positive end Vp11 and a signal first negative end Vn11, the signal first positive end Vp11 and the signal first negative end Vn11 being symmetric about a centerline of the conductor; the signal processing chip comprises a signal second positive terminal Vp12 and a signal second negative terminal Vn12, the signal second positive terminal Vp12 and the signal second negative terminal Vn12 are symmetrical about the center line of the conductor; a fourth wire 204c connecting the first signal positive terminal Vp11 and the second signal positive terminal Vp 12; a fifth wire 204d connecting the first negative terminal Vn11 and the second negative terminal Vn 12.

Further, the signal first positive terminal Vp11 and the signal second negative terminal Vn12 are located at one side of the center line of the conductor 201; the signal second positive terminal Vp12 and the signal first negative terminal Vn11 are located on the other side of the centerline of the conductor 201.

Further, a lower half portion area surrounded by the signal first positive terminal Vp11, the signal first negative terminal Vn11, the fourth wire 204c and the fifth wire 204d is referred to as a third area; the upper half area surrounded by the signal second positive terminal Vp12, the signal second negative terminal Vn12, the fourth wire 204c and the fifth wire 204d is called a fourth area; the third area and the fourth area are equal in area and opposite in direction.

Further, the third area and the fourth area are opposite in direction: the third and fourth regions are symmetric about an axis of symmetry, and the axis of symmetry is perpendicular to a centerline of the conductor.

Further, the measured current flowing through the conductor generates a third magnetic field in the third region; the measured current flowing through the conductor generates a fourth magnetic field at the fourth region; and the third magnetic field and the fourth magnetic field are approximately or completely equal in magnitude and same in direction.

Further, the conductor is the U type conductor, the U type conductor includes first shank, second shank to and connect the connecting portion between first shank and second shank, wherein, the electric current opposite direction on first shank and the second shank, first shank and second shank are located respectively the both sides of the central line of conductor, the magnetic sensor chip with first shank and second shank set up relatively.

Compared with the prior art, the utility model discloses a set up the routing mode between magnetic sensor chip and the signal processing chip to offset closed circuit magnetic flux completely or approximately, fundamentally eliminates the inductive coupling among the current sensor, thereby promotes current sensor's detection precision.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor. Wherein:

fig. 1 is a schematic structural diagram of a current sensor having a first wire bonding mode according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a current sensor with a second wire bonding method according to another embodiment of the present invention.

[ detailed description ] embodiments

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.

Reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with at least one implementation of the invention is included. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Unless otherwise specified, the terms connected, and connected as used herein mean electrically connected, directly or indirectly.

Fig. 1 is a schematic structural diagram of a current sensor having a first wire bonding manner according to an embodiment of the present invention. The current sensor 100 shown in fig. 1 includes: the sensor comprises a conductor 101, a magnetic sensor chip 102, a signal processing chip 103, a signal output pin 106, a wire bonding group 104 positioned between the magnetic sensor chip 102 and the signal processing chip 103, and a wire bonding group 105 positioned between the signal processing chip 103 and the signal output pin 106. The magnetic sensor chip 102 and the signal processing chip 103 are arranged on the same side of the conductor 101 at intervals.

The conductor 101 is used for providing a flowing channel for the measured current I, so that the measured current I can flow through the conductor 101. In the embodiment shown in fig. 1, the conductor 101 is a U-shaped conductor, which includes a first leg portion 101a, a second leg portion 101b, and a connecting portion 101c connected between the first leg portion 101a and the second leg portion 101 b; the first leg portion 101a and the second leg portion 101b are respectively located on both sides of a center line of the conductor 101; the detected current I flows through the first leg portion 101a, the connecting portion 101c, and the second leg portion 101b in this order, wherein the currents on the first leg portion 101a and the second leg portion 101b are opposite.

The magnetic sensor chip 102 is configured to convert a magnetic field generated by the current flowing through the conductor 101 in the magnetically sensitive region of the magnetic sensor chip 102 into a voltage output. In the embodiment shown in fig. 1, the magnetic sensor chip 102 is disposed opposite the first leg 101a and the second leg 101 b; the magnetic sensor chip 102 includes five pads (or pads), specifically, a first power terminal VDD1, a first ground terminal GND1, a first signal positive terminal Vp11, a first signal negative terminal Vn11 and a second signal positive terminal Vp21, which are sequentially arranged at intervals in a direction from the first leg 101a to the second leg 101 b. Wherein the signal first positive terminal Vp11 and the signal second positive terminal Vp21 are symmetric about a centerline of the conductor 101 and are interconnected inside the magnetic sensor chip 102; the signal first negative terminal Vn11 is located on the centre line of said conductor 101.

The signal processing chip 103 is configured to process the voltage output by the magnetic sensor chip 102 to generate a detection signal.

In the embodiment shown in fig. 1, the signal processing chip 103 is disposed opposite to the first leg portion 101a and the second leg portion 101b, and is closer to the connection portion 101c of the U-shaped conductor 101 than the magnetic sensor chip 102. The signal processing chip 103 includes eight pads (or pads), specifically, a second power end VDD2, a second ground end GND2, a third signal positive end Vp12, a second signal negative end Vn12, and a fourth signal positive end Vp22, which are sequentially arranged from the first leg 101a to the second leg 101b at intervals, and the second power end VDD2, the second ground end GND2, the third signal positive end Vp12, the second signal negative end Vn12, and the fourth signal positive end Vp22 are located at a side close to the sensor magnetic chip 102; and a third power terminal VDD3, a third ground terminal GND3 and a signal output terminal VOUT1 which are sequentially arranged at intervals from the first leg 101a to the second leg 101b, wherein the third power terminal VDD3, the third ground terminal GND3 and the signal output terminal VOUT1 are positioned at a side far away from the magnetic sensor chip 102. Wherein the signal third positive terminal Vp12 and the signal fourth positive terminal Vp22 are symmetrical about the centerline of the conductor 101 and are interconnected inside the signal processing chip 103; the signal second negative terminal Vn12 is located on the center line of said conductor 101; the second power source terminal VDD2 and the third power source terminal VDD3 are interconnected inside the signal processing chip 103; the second ground GND2 and the third ground GND3 are interconnected inside the signal processing chip 103.

It should be noted that, in the embodiment shown in fig. 1, the signal first positive terminal Vp11 and the signal third positive terminal Vp12 are located on one side of the center line of the conductor 101 (for example, on the left side of the center line of the conductor 101 in fig. 1); the signal second positive terminal Vp21 and the signal fourth positive terminal Vp22 are located on the other side of the centerline of the conductor 101 (e.g., to the right of the centerline of the conductor 101 in fig. 1).

The wire set 104 includes wires 104a, 104b, 104c, 104d, and 104 e. The first power supply terminal VDD1 and the second power supply terminal VDD2 are interconnected by a wire 104 a; the first ground GND1 and the second ground GND2 are interconnected by a wire bond 104 b; the signal first positive terminal Vp11 and the signal third positive terminal Vp12 are interconnected by a wire bond 104c (which may be referred to as a first wire bond); the signal first negative terminal Vn11 and the signal second negative terminal Vn12 are interconnected by a wire bond 104d (which may be referred to as a second wire bond); the signal second positive terminal Vp21 and the signal fourth positive terminal Vp22 are interconnected by a wire bond 104e (which may be referred to as a third wire bond).

For convenience of description, the present invention refers to the area enclosed by the first positive signal terminal Vp11, the third positive signal terminal Vp12, the first negative signal terminal Vn11, the second negative signal terminal Vn12, the wire bonding 104c and the wire bonding 104d as the first area; the area enclosed by the signal second positive terminal Vp21, the signal fourth positive terminal Vp22, the signal first negative terminal Vn11, the signal second negative terminal Vn12, the wire bond 104e and the wire bond 104d is referred to as a second area. Wherein, the first region and the second region have equal area and opposite direction. In the embodiment shown in fig. 1, the opposite directions of the first and second regions may be interpreted as: the first and second regions are symmetrical about a center line of the conductor 101.

The measured current I in the U-shaped conductor 101 generates a first magnetic field B in an area (i.e. a first area) surrounded by Vp12, Vp11, Vn11, Vn12, 104c and 104d₁₁The second magnetic field B is generated in an area (i.e., a second region) surrounded by Vp22, Vp21, Vn11, Vn12, 104d and 104e₁₂First magnetic field B₁₁And a second magnetic field B₁₂The size is equal, and the direction is the same to make the net magnetic flux between magnetic sensor chip 102 and signal processing chip 103 be zero, eliminated the inductive coupling among the current sensor, promoted current sensor's detection accuracy.

With continued reference to fig. 1, the wire bond 105 includes wire bonds 105a, 105b, 105 c.

The signal output pin 106 is used for outputting a detection signal generated by the signal processing chip 103. In the embodiment shown in fig. 1, the signal output pin 106 is located outside the connection portion 101c of the U-shaped conductor 101, and the signal output pin 106 includes a pin 106a (which may be referred to as a power pin VDD), a pin 106b (which may be referred to as a ground pin GND), a pin 106c (which may be referred to as an output pin VOUT), and a pin 106d, which are sequentially arranged at intervals in a direction from the first leg portion 101a to the second leg portion 101 b. The third power supply terminal VDD3 and the pin 106a are interconnected by a wire bond 105 a; the third ground GND3 and the pin 106b are interconnected by a wire bond 105b, and the signal output terminal VOUT1 and the pin 106c are interconnected by a wire bond 105 c.

Please refer to fig. 2, which is a schematic structural diagram of a current sensor with a second wire bonding method according to another embodiment of the present invention. The current sensor 200 shown in fig. 2 includes: the sensor comprises a conductor 201, a magnetic sensor chip 202, a signal processing chip 203, signal output pins 206, a wire bonding group 204 positioned between the magnetic sensor chip 202 and the signal processing chip 203, and a wire bonding group 205 positioned between the signal processing chip 203 and the signal output pins 206. The magnetic sensor chip 202 and the signal processing chip 203 are arranged on the same side of the conductor 201 at intervals.

The conductor 201 is used for providing a flowing channel for a measured current I, so that the measured current I can flow through the conductor 201. In the embodiment shown in fig. 2, the conductor 201 is a U-shaped conductor, and the U-shaped conductor includes a first leg 201a, a second leg 201b, and a connecting portion 201c connected between the first leg 201a and the second leg 201 b; the first leg 201a and the second leg 201b are respectively positioned on two sides of the center line of the conductor 201; the detected current I flows through the first leg portion 201a, the connecting portion 201c, and the second leg portion 201b in this order, wherein the currents on the first leg portion 201a and the second leg portion 201b are opposite.

The magnetic sensor chip 202 is configured to convert a magnetic field generated by the current flowing through the conductor 201 in a magnetically sensitive region of the magnetic sensor chip 202 into a voltage output. In the embodiment shown in fig. 2, the magnetic sensor chip 202 is disposed opposite to the first leg 201a and the second leg 201 b; the magnetic sensor chip 202 includes four pads (or pads), specifically, a first power terminal VDD1, a first ground terminal GND1, a first signal positive terminal Vp11 and a first signal negative terminal Vn11, which are sequentially arranged from the first leg 201a to the second leg 201b at intervals. Wherein the signal first positive terminal Vp11 and the signal first negative terminal Vn11 are symmetrical about the center line of the conductor 201.

The signal processing chip 203 is configured to process the voltage output by the magnetic sensor chip 202 to generate a detection signal.

In the embodiment shown in fig. 2, the signal processing chip 203 is disposed opposite to the first leg 201a and the second leg 201b, and is closer to the connection portion 201c of the U-shaped conductor 201 than the magnetic sensor chip 202. The signal processing chip 203 includes seven pads (or pads), specifically, a second power terminal VDD2, a second ground terminal GND2, a second signal positive terminal Vp12 and a second signal negative terminal Vn12, which are sequentially arranged from the first leg 201a to the second leg 201b at intervals, and the second power terminal VDD2, the second ground terminal GND2, the second signal positive terminal Vp12 and the second signal negative terminal Vn12 are located at a side close to the magnetic sensor chip 202; and a third power terminal VDD3, a third ground terminal GND3 and a signal output terminal VOUT1 sequentially arranged at intervals from the first leg 201a to the second leg 201b, wherein the third power terminal VDD3, the third ground terminal GND3 and the signal output terminal VOUT1 are located at a side far away from the magnetic sensor chip 202. Wherein the signal second positive terminal Vp12 and the signal second negative terminal Vn12 are symmetrical about the centerline of the conductor 201; the second power source terminal VDD2 and the third power source terminal VDD3 are interconnected inside the signal processing chip 203; the second ground GND2 and the third ground GND3 are interconnected inside the signal processing chip 203.

It should be noted that, in the embodiment shown in fig. 2, the signal first positive terminal Vp11 and the signal second negative terminal Vn12 are located on one side of the centerline of the conductor 201 (for example, on the left side of the centerline of the conductor 201 in fig. 2); the signal second positive terminal Vp12 and the signal first negative terminal Vn11 are located on the other side of the centerline of the conductor 201 (e.g., to the right of the centerline of the conductor 201 in fig. 2).

The wire set 204 includes wires 204a, 204b, 204c, and 204 d. Wherein, the first power source terminal VDD1 and the second power source terminal VDD2 are interconnected by a wire 204 a; the first ground GND1 and the second ground GND2 are interconnected by a wire 204 b; the signal first positive terminal Vp11 and the signal second positive terminal Vp12 are interconnected by a wire bond 204c (which may be referred to as a fourth wire bond); the signal first negative terminal Vn11 and the signal second negative terminal Vn12 are interconnected by a wire bond 204d (which may be referred to as a fifth wire bond), wherein the wire bond 204c and the wire bond 204d intersect, and the intersection is O.

For convenience of description, the present invention refers to a lower half area (i.e. an area surrounded by the first signal positive terminal Vp11, the first signal negative terminal Vn11 and the intersection O) surrounded by the first signal positive terminal Vp11, the first signal negative terminal Vn11, the wire 204c and the wire 204d as a third area; the upper half region surrounded by the signal second positive terminal Vp12, the signal second negative terminal Vn12, the wire 204c and the wire 204d (i.e., the region surrounded by the signal second positive terminal Vp12, the signal second negative terminal Vn12 and the intersection O) is referred to as a fourth region. Wherein, the third area and the fourth area are equal in area and opposite in direction. In the embodiment shown in fig. 2, the opposite directions of the third and fourth regions may be interpreted as: the third and fourth regions are symmetric about an axis of symmetry, and the axis of symmetry is perpendicular to the centerline of the conductor 201.

The area of the lower half part area (namely, the third area) surrounded by Vp11, Vn11, 204c and 204d by the measured current I in the U-shaped conductor 201 generates a third magnetic field B₂₁The fourth magnetic field B is generated in the area of the upper half region surrounded by Vp12, Vn12, 204c and 204d (i.e., the fourth region)₂₂A third magnetic field B₂₁And a fourth magnetic field B₂₂The sizes are approximately equal, and the directions are the same, so that the net magnetic flux between the magnetic sensor chip 202 and the signal processing chip 203 is zero, the inductive coupling in the current sensor is eliminated, and the detection accuracy of the current sensor is improved.

With continued reference to fig. 2, the wire bonds 205 include wire bonds 205a, 205b, 205 c.

The signal output pin 206 is used for outputting a detection signal generated by the signal processing chip 203. In the embodiment shown in fig. 2, the signal output pin 206 is located outside the connection portion 201c of the U-shaped conductor 201, and the signal output pin 206 includes a pin 206a (which may be referred to as a power pin VDD), a pin 206b (which may be referred to as a ground pin GND), a pin 206c (which may be referred to as an output pin VOUT), and a pin 206d, which are sequentially arranged at intervals in a direction from the first leg portion 201a to the second leg portion 201 b. Wherein, the third power source terminal VDD3 and the pin 206a are interconnected by a wire 205 a; the third ground GND3 and the pin 206b are interconnected by a wire 205b, and the signal output terminal VOUT1 and the pin 206c are interconnected by a wire 205 c.

To sum up, the utility model discloses a set up the routing mode between magnetic sensor chip 102, 202 and the signal processing chip 103, 203 for net magnetic flux between magnetic sensor chip 102, 202 and the signal processing chip 103, 203 is complete or near zero, with totally or near offsetting closed circuit magnetic flux, and fundamentally eliminates the inductive coupling among the current sensor, thereby promotes current sensor's detection precision.

In the present invention, the terms "connected", "connecting", and the like denote electrical connections, and, unless otherwise specified, may denote direct or indirect electrical connections.

The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment, but all equivalent modifications or changes made by those skilled in the art according to the present invention should be included in the protection scope of the claims.

Claims (12)

1. A current sensor for detecting a current to be detected according to magnetic induction generated by the current to be detected is characterized by comprising a conductor, a magnetic sensor chip and a signal processing chip, wherein the magnetic sensor chip and the signal processing chip are arranged on the same side of the conductor at intervals,

the conductor is used for providing a flowing channel for the measured current so that the measured current can flow through the conductor;

the magnetic sensor chip comprises a signal first positive end Vp11, a signal first negative end Vn11 and a signal second positive end Vp21, wherein the signal first positive end Vp11 and the signal second positive end Vp21 are symmetrical about a center line of the conductor; the signal first negative terminal Vn11 is located on the centre line of the conductor;

the signal processing chip comprises a signal third positive end Vp12, a signal second negative end Vn12 and a signal fourth positive end Vp22, wherein the signal third positive end Vp12 and the signal fourth positive end Vp22 are symmetrical about the center line of the conductor; the signal second negative terminal Vn12 is located on the centre line of the conductor;

a first wire bond 104c connecting the first signal positive terminal Vp11 and the third signal positive terminal Vp 12;

a second wire 104d connecting the first signal negative terminal Vn11 and the second signal negative terminal Vn 12;

a third wire bond 104e connecting the second positive signal terminal Vp21 and the fourth positive signal terminal Vp 22.

2. The current sensor of claim 1,

the signal first positive terminal Vp11 and the signal third positive terminal Vp12 are located to one side of the centerline of the conductor;

the signal second positive terminal Vp21 and the signal fourth positive terminal Vp22 are located on the other side of the center line of the conductor.

3. The current sensor of claim 2,

the area enclosed by the first signal positive end Vp11, the third signal positive end Vp12, the first signal negative end Vn11, the second signal negative end Vn12, the first wire bond 104c and the second wire bond 104d is called a first area;

the area surrounded by the second signal positive terminal Vp21, the fourth signal positive terminal Vp22, the first signal negative terminal Vn11, the second signal negative terminal Vn12, the third wire bonding 104e and the second wire bonding 104d is called a second area;

the first region and the second region have equal area and opposite direction.

4. The current sensor of claim 3,

the signal first positive terminal Vp11 and the signal second positive terminal Vp21 are interconnected inside the magnetic sensor chip;

the signal third positive terminal Vp12 and signal fourth positive terminal Vp22 are interconnected inside the signal processing chip;

the first area and the second area are opposite in direction: the first and second regions are symmetrical about a centerline of the conductor.

5. The current sensor of claim 3,

the measured current flowing through the conductor generates a first magnetic field at the first region;

the measured current flowing through the conductor generates a second magnetic field at the second region;

wherein, the first magnetic field and the second magnetic field are approximately or completely equal in magnitude and same in direction.

6. The current sensor of claim 1,

the conductor is a U-shaped conductor which comprises a first leg part, a second leg part and a connecting part connected between the first leg part and the second leg part, wherein the current directions on the first leg part and the second leg part are opposite,

the first leg and the second leg are respectively located on both sides of a center line of the conductor,

the magnetic sensor chip is disposed opposite the first and second legs.

7. A current sensor for detecting a current to be detected according to magnetic induction generated by the current to be detected is characterized by comprising a conductor, a magnetic sensor chip and a signal processing chip, wherein the magnetic sensor chip and the signal processing chip are arranged on the same side of the conductor at intervals,

the conductor is used for providing a flowing channel for the measured current so that the measured current can flow through the conductor;

the magnetic sensor chip includes a signal first positive end Vp11 and a signal first negative end Vn11, the signal first positive end Vp11 and the signal first negative end Vn11 being symmetric about a centerline of the conductor;

the signal processing chip comprises a signal second positive terminal Vp12 and a signal second negative terminal Vn12, the signal second positive terminal Vp12 and the signal second negative terminal Vn12 are symmetrical about the center line of the conductor;

a fourth wire 204c connecting the first signal positive terminal Vp11 and the second signal positive terminal Vp 12;

a fifth wire 204d connecting the first negative terminal Vn11 and the second negative terminal Vn 12.

8. The current sensor of claim 7,

the signal first positive terminal Vp11 and the signal second negative terminal Vn12 are located on one side of the centerline of the conductor 201;

the signal second positive terminal Vp12 and the signal first negative terminal Vn11 are located on the other side of the centerline of the conductor 201.

9. The current sensor of claim 8,

the lower half part area surrounded by the signal first positive end Vp11, the signal first negative end Vn11, the fourth wire 204c and the fifth wire 204d is called a third area;

the upper half area surrounded by the signal second positive terminal Vp12, the signal second negative terminal Vn12, the fourth wire 204c and the fifth wire 204d is called a fourth area;

the third area and the fourth area are equal in area and opposite in direction.

10. The current sensor of claim 9,

the third area and the fourth area have opposite directions: the third and fourth regions are symmetric about an axis of symmetry, and the axis of symmetry is perpendicular to a centerline of the conductor.

11. The current sensor of claim 9,

the measured current flowing through the conductor generates a third magnetic field at the third region;

the measured current flowing through the conductor generates a fourth magnetic field at the fourth region;

and the third magnetic field and the fourth magnetic field are approximately or completely equal in magnitude and same in direction.

12. The current sensor of claim 8,

the conductor is a U-shaped conductor which comprises a first leg part, a second leg part and a connecting part connected between the first leg part and the second leg part, wherein the current directions on the first leg part and the second leg part are opposite,

the first leg and the second leg are respectively located on both sides of a center line of the conductor,

the magnetic sensor chip is disposed opposite the first and second legs.

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