CN212932387U - Epoxy resin curing agent luminousness detection device - Google Patents
Epoxy resin curing agent luminousness detection device Download PDFInfo
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- CN212932387U CN212932387U CN202021524897.5U CN202021524897U CN212932387U CN 212932387 U CN212932387 U CN 212932387U CN 202021524897 U CN202021524897 U CN 202021524897U CN 212932387 U CN212932387 U CN 212932387U
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- resin curing
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Abstract
The utility model provides an epoxy curing agent luminousness detection device, include: the upper part of the sample tank is provided with an opening for containing the epoxy resin curing agent to be detected; the infrared emission module is positioned right below the sample tank and used for emitting infrared beams with preset frequency and light intensity as incident beams; the infrared receiving module is positioned right above the sample groove and used for receiving the infrared light beam penetrating through the epoxy resin curing agent to be detected as a receiving light beam; and the microprocessor is used for controlling the infrared transmitting module and the infrared receiving module to work and processing the light intensity of the incident light beam and the received light beam to obtain the light transmittance of the epoxy resin curing agent to be detected, wherein m multiplied by n infrared receiving probes in the infrared receiving module correspond to m multiplied by n infrared transmitting probes in the transmitting module one to one, the bottom wall of the sample tank is a light-transmitting plate made of an infrared transmitting material, m is a positive integer not less than 2, and n is a positive integer not less than 2.
Description
Technical Field
The utility model belongs to the technical field of curing agent detection device, concretely relates to epoxy curing agent luminousness detection device.
Background
Epoxy resin curing agents are widely used in the fields of electronics, electrical appliances, and the like because of their excellent curing effect. During use, the infrared transmittance of the epoxy resin curing agent changes with time. When the light transmittance is reduced to a predetermined value, the curing effect of the epoxy resin curing agent is lost and the epoxy resin curing agent cannot be used. Therefore, in order to ensure the curing quality of the epoxy resin curing agent, the light transmittance of the epoxy resin curing agent needs to be detected.
The traditional measurement method of epoxy resin curing agents is to judge whether the requirements are met by manually observing the transmittance of the curing agents. However, the measurement method of manual observation is not only susceptible to the factors of individual subjective factors to cause inaccurate judgment, but also has extremely low detection efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model relates to a solve above-mentioned problem and go on, aim at provides an epoxy curing agent luminousness detection device, not only can improve the degree of accuracy of epoxy curing agent luminousness testing result, has improved the detection efficiency of epoxy luminousness moreover.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides an epoxy curing agent luminousness detection device has such characteristic, include: the upper part of the sample tank is provided with an opening for containing the epoxy resin curing agent to be detected; the infrared emission module is positioned right below the sample tank and used for emitting infrared beams with preset frequency and light intensity as incident beams; the infrared receiving module is positioned right above the sample groove and used for receiving the infrared light beam penetrating through the epoxy resin curing agent to be detected as a receiving light beam; and the microprocessor is used for controlling the infrared transmitting module and the infrared receiving module to work and processing the light intensity of the incident light beam and the received light beam to obtain the light transmittance of the epoxy resin curing agent to be detected, wherein the infrared transmitting module comprises an infrared transmitting probe group which is in an array structure and provided with m multiplied by n infrared transmitting probes, the infrared receiving module comprises an infrared receiving probe group which is in an array structure and provided with m multiplied by n infrared receiving probes in one-to-one correspondence with the m multiplied by n infrared transmitting probes, the bottom wall of the sample tank is a light-transmitting plate made of an infrared transmitting material, m is a positive integer not less than 2, and n is a positive integer not less than 2.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: further comprising: the box has from down to the lower part that upwards arranges in proper order and places the room, the room is put in the middle and the room is put on upper portion, and wherein, infrared emission module and infrared receiving module are fixed respectively to be set up and place the room and place indoor on upper portion in the lower part, and sample cell detachably sets up and places indoor in the middle.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: wherein the light-transmitting plate is any one of a quartz glass plate, a zinc sulfide plate and a zinc selenide plate.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: further comprising: and the power supply module is used for respectively supplying power to the microprocessor, the infrared transmitting module and the infrared receiving module.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: the power module comprises a first voltage-stabilizing power supply, a second voltage-stabilizing power supply and a third voltage-stabilizing power supply, the first voltage-stabilizing power supply is connected with the microprocessor through a lead, the second voltage-stabilizing power supply is connected with the infrared emission module through a lead, and the third voltage-stabilizing power supply is connected with the infrared receiving module through a lead.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: wherein, the connection relation among the m multiplied by n infrared emission probes is parallel connection.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: wherein, the connection relation among the m multiplied by n infrared receiving probes is parallel connection.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: wherein, the microprocessor is a singlechip.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: further comprising: and the wireless module is used for connecting the microprocessor with an upper computer.
The utility model provides an among the epoxy curing agent luminousness detection device, can also have such characteristic: wherein, the side wall of the sample groove is a plastic plate.
Action and effect of the utility model
According to the utility model, the epoxy resin curing agent luminousness detection device comprises a sample groove, an infrared emission module, an infrared receiving module and a microprocessor, wherein the bottom wall of the sample groove is a light-transmitting plate made of infrared transmission material, the infrared emission module and the infrared receiving module are respectively positioned under and above the sample groove, the infrared emission module is provided with m x n infrared emission probes, the infrared receiving module is provided with m x n infrared receiving probes corresponding to the m x n infrared emission probes, the microprocessor can control the infrared emission module and the infrared receiving module to work and process the light intensity of the incident light beam and the received light beam, thereby obtaining the luminousness of the epoxy resin curing agent to be detected, therefore, the epoxy resin curing agent luminousness detection device can realize the automatic monitoring of the luminousness of the epoxy resin curing agent, the test result is stable and reliable, the test efficiency is higher, the structure is simple, and the manufacturing cost is low.
Drawings
FIG. 1 is an exploded view of an apparatus for detecting transmittance of epoxy resin curing agent in an embodiment of the present invention;
fig. 2 is a circuit diagram of an infrared emission probe in an infrared emission module according to an embodiment of the present invention; and
fig. 3 is a schematic structural diagram of a circuit diagram supporting device of an infrared connector in an infrared receiving module according to an embodiment of the present invention in an initial state.
Detailed Description
In order to make the utility model discloses the technological means, creation characteristic, achievement purpose and efficiency that realize are easily understood and are known, and following embodiment combines the attached drawing to be right the utility model discloses an epoxy curing agent luminousness detection device does specifically to explain.
Fig. 1 is an exploded installation diagram of an epoxy resin curing agent light transmittance detection device in the embodiment of the present invention.
As shown in fig. 1, in the present embodiment, an epoxy resin curing agent light transmittance detecting device 100 is used for detecting light transmittance of an epoxy resin curing agent to be detected, and includes a box 10, a sample tank 20, an infrared emitting module 30, an infrared receiving module 40, a microprocessor (not shown in the figure), and a power supply module (not shown in the figure).
As shown in fig. 1, the case 10 has a rectangular parallelepiped shape and has an opening on one side. The box body 10 is provided therein with a lower partition frame 11 and an upper partition frame 12 arranged in a lower-upper manner, so as to partition the inner space of the box body 10 into a lower placing chamber 101, an intermediate placing chamber 102, and an upper placing chamber 103, which are arranged in this order from the bottom up and communicate with each other.
As shown in fig. 1, the sample tank 20 is detachably disposed in the intermediate chamber 102 and is used for containing the epoxy resin curing agent to be tested. The sample well 20 is a rectangular parallelepiped structure having an open upper portion, and has a bottom wall 21 and a side wall 22 extending upward along the peripheral edge of the bottom wall 21.
The bottom wall 21 is a light-transmitting plate made of an infrared-transmitting material, so that the infrared beam emitted by the infrared-emitting module 30 can penetrate and irradiate into the epoxy resin curing agent to be detected in the sample tank 20. The light-transmitting plate is any one of a quartz glass plate, a zinc sulfide plate and a zinc selenide plate, and in this embodiment, the light-transmitting plate is a quartz glass plate with a projection wavelength of 0.14 to 2.5 micrometers.
The side wall 21 is a conventional plastic plate, which in this embodiment is a polypropylene (PP) plate.
Fig. 2 is a circuit diagram of an infrared emission probe in the infrared emission module according to an embodiment of the present invention.
As shown in fig. 1 and 2, the infrared emitting module 30 is located right below the sample tank 20 and is fixedly disposed in the lower placing chamber 101 for emitting an infrared beam of a predetermined frequency and light intensity as an incident beam to irradiate the epoxy resin curing agent to be detected. The infrared emission module 30 includes an emission box 31 and an infrared emission probe group 32.
The launch box 31 has a shape matching the shape of the lower storage chamber 101.
The infrared emission probe group 32 has an array structure having m × n infrared emission probes 321, m being a positive integer not less than 2, and n being a positive integer not less than 2. In the embodiment, the connection relationship between the m × n infrared emission probes 321 is parallel, and the wavelength of the infrared beam emitted by each infrared emission probe 321 is 0.1-2.5 micrometers. Fig. 2 shows a 2 × 4 array structure of infrared emission probe groups, in which the infrared emission probes IRL1 to IRL8 are connected in parallel.
Fig. 3 is a schematic structural diagram of a circuit diagram supporting device of an infrared connector in an infrared receiving module according to an embodiment of the present invention in an initial state.
As shown in fig. 1 and 3, the infrared receiving module 40 is located right above the sample tank 20 and is fixedly disposed in the upper placing chamber 103 for receiving an infrared light beam transmitted through the epoxy resin curing agent to be detected as a receiving light beam. The infrared receiving module 40 includes a receiving box 41 and an infrared receiving probe group 42.
The receiving box 41 has a shape matching the shape of the upper placing chamber 103.
The infrared receiving probe group 42 is in an array structure, and has m × n infrared receiving probes 421, and the m × n infrared receiving probes 421 and the m × n infrared emitting probes are arranged in a one-to-one correspondence manner. In the present embodiment, the connection relationship between the m × n infrared receiving probes 421 is parallel. Fig. 3 shows a 2 × 4 array of IR receiving probe sets, in which the IR receiving probes IR1 to IR8 are connected in parallel.
The microprocessor is a single chip microcomputer, is arranged in the upper placing chamber 103 or the lower placing chamber 101, and is used for controlling the infrared transmitting module 30 and the infrared receiving module 40 to work, and processing the light intensity of the incident light beam and the received light beam to obtain the light transmittance of the epoxy resin curing agent to be detected. In this embodiment, the microprocessor is an AT89C51 type single chip microcomputer.
The power module is used for supplying power to the microprocessor, the infrared transmitting module 30 and the infrared receiving module 40 respectively, and comprises a first voltage-stabilizing power supply, a second voltage-stabilizing power supply and a third voltage-stabilizing power supply.
The first voltage-stabilized source is 7805 type voltage-stabilized source, is connected with the microprocessor through a lead and provides 5V voltage for the microprocessor.
The second voltage-stabilized power supply is a 7805 voltage-stabilized power supply, is connected with the infrared emission module 30 through a lead, and provides 5V voltage for the infrared emission module 30.
The third regulated power supply is a 7812 type regulated power supply, is connected with the infrared receiving module 40 through a lead, and provides 12V voltage for the infrared receiving module 40.
Effects and effects of the embodiments
According to the epoxy resin curing agent light transmittance detection device related to the embodiment, because the device is provided with the sample groove, the infrared emission module, the infrared receiving module and the microprocessor, the bottom wall of the sample groove is a light-transmitting plate made of an infrared transmission material, the infrared emission module and the infrared receiving module are respectively positioned right below and right above the sample groove, the infrared emission module is provided with m × n infrared emission probes, the infrared receiving module is provided with m × n infrared receiving probes corresponding to the m × n infrared emission probes in a one-to-one manner, the microprocessor can control the infrared emission module and the infrared receiving module to work and process the light intensity of the incident light beam and the received light beam, so as to obtain the light transmittance of the epoxy resin curing agent to be detected, the epoxy resin curing agent light transmittance detection device in the embodiment can realize automatic monitoring of the light transmittance of the epoxy resin curing agent, the test result is stable and reliable, the test efficiency is higher, the structure is simple, and the manufacturing cost is low.
In addition, because still have the box, this box has from the lower part that up arranged in proper order down and places the room, the room is put in the centre and the room is put on upper portion, and infrared emission module and infrared receiving module are fixed the setting respectively and are being put room and upper portion and place indoorly in the lower part, and sample cell detachably sets up and places indoorly in the centre to integrate whole detection device, further improved the portability and the accuracy that detect.
In addition, because still have power module, this power module contains the three constant voltage power supply of power supply to microprocessor, infrared emission module and infrared receiving module respectively, has further improved detection stability.
The above embodiments are preferred examples of the present invention, and are not intended to limit the scope of the present invention.
For example, in the utility model discloses in, epoxy curing agent luminousness detection device can also include wireless module for make microprocessor and host computer be connected, thereby obtain the testing result information transmission with microprocessor and show or further processing analysis for host computer like the computer.
Claims (10)
1. The utility model provides an epoxy curing agent luminousness detection device which characterized in that includes:
the upper part of the sample tank is provided with an opening for containing the epoxy resin curing agent to be detected;
the infrared emission module is positioned right below the sample tank and used for emitting infrared beams with preset frequency and light intensity as incident beams;
the infrared receiving module is positioned right above the sample groove and used for receiving the infrared light beam penetrating through the epoxy resin curing agent to be detected as a receiving light beam; and
the microprocessor is used for controlling the infrared transmitting module and the infrared receiving module to work and processing the light intensity of the incident beam and the received beam to obtain the light transmittance of the epoxy resin curing agent to be detected,
wherein the infrared emission module comprises an infrared emission probe group which is in an array structure and is provided with m multiplied by n infrared emission probes,
the infrared receiving module comprises an infrared receiving probe group which is in an array structure and is provided with m x n infrared receiving probes corresponding to the m x n infrared transmitting probes one by one,
the bottom wall of the sample groove is a light-transmitting plate made of infrared transmission material,
the m is a positive integer not less than 2, and the n is a positive integer not less than 2.
2. The apparatus for detecting transmittance of an epoxy resin curing agent according to claim 1, further comprising:
a box body which is provided with a lower placing chamber, a middle placing chamber and an upper placing chamber which are sequentially arranged from bottom to top,
wherein the infrared transmitting module and the infrared receiving module are respectively and fixedly arranged in the lower placing chamber and the upper placing chamber,
the sample groove is detachably arranged in the intermediate placing chamber.
3. The apparatus for detecting transmittance of epoxy resin curing agent according to claim 1, characterized in that:
wherein the light-transmitting plate is any one of a quartz glass plate, a zinc sulfide plate and a zinc selenide plate.
4. The apparatus for detecting transmittance of an epoxy resin curing agent according to claim 1, further comprising:
and the power supply module is used for supplying power to the microprocessor, the infrared transmitting module and the infrared receiving module respectively.
5. The apparatus for detecting transmittance of epoxy resin curing agent according to claim 4, characterized in that:
wherein the power module comprises a first regulated power supply, a second regulated power supply and a third regulated power supply,
the first stabilized voltage supply is connected with the microprocessor through a lead,
the second stabilized voltage supply is connected with the infrared emission module through a lead,
and the third voltage-stabilized power supply is connected with the infrared receiving module through a lead.
6. The apparatus for detecting transmittance of epoxy resin curing agent according to claim 1, characterized in that:
wherein, the connection relation among the m multiplied by n infrared emission probes is parallel connection.
7. The apparatus for detecting transmittance of epoxy resin curing agent according to claim 1, characterized in that:
wherein, the connection relation among the m multiplied by n infrared receiving probes is parallel connection.
8. The apparatus for detecting transmittance of epoxy resin curing agent according to claim 1, characterized in that:
wherein, the microprocessor is a singlechip.
9. The apparatus for detecting transmittance of an epoxy resin curing agent according to claim 1, further comprising:
and the wireless module is used for connecting the microprocessor and the upper computer.
10. The apparatus for detecting transmittance of epoxy resin curing agent according to claim 1, characterized in that:
wherein, the side wall of the sample groove is a plastic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021524897.5U CN212932387U (en) | 2020-07-28 | 2020-07-28 | Epoxy resin curing agent luminousness detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021524897.5U CN212932387U (en) | 2020-07-28 | 2020-07-28 | Epoxy resin curing agent luminousness detection device |
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| Publication Number | Publication Date |
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| CN212932387U true CN212932387U (en) | 2021-04-09 |
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| CN202021524897.5U Active CN212932387U (en) | 2020-07-28 | 2020-07-28 | Epoxy resin curing agent luminousness detection device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114047165A (en) * | 2022-01-13 | 2022-02-15 | 江苏奥琳斯邦装备科技股份有限公司 | Epoxy curing agent luminousness detection device |
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2020
- 2020-07-28 CN CN202021524897.5U patent/CN212932387U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114047165A (en) * | 2022-01-13 | 2022-02-15 | 江苏奥琳斯邦装备科技股份有限公司 | Epoxy curing agent luminousness detection device |
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