CN212931703U - Film type thermocouple and electronic equipment - Google Patents

Abstract

The application discloses film type thermocouple and electronic equipment, the thermocouple includes first conducting layer and second conducting layer, first conducting layer has the first electrode, the second conducting layer is formed on a surface of first conducting layer, the second conducting layer has the second electrode, wherein, first electrode and second electrode at least part overlap and form a thermoelectric junction, the thermoelectric junction is used for contacting with the part to be measured, the one end that first electrode deviates from the thermoelectric junction and the one end that the second electrode deviates from the thermoelectric junction are used for drawing forth first binding terminal and second binding terminal, first binding terminal and second binding terminal set up in the same one side of thermoelectric junction and are used for external circuit. The film thermocouple can be used for higher temperature measurement, and the measurement range of the thermocouple is enlarged.

Description

Film type thermocouple and electronic equipment

Technical Field

The application relates to the technical field of thermocouples, in particular to a film type thermocouple and electronic equipment.

Background

At present, the industrial industry has great demand on high-temperature measurement, and the common modes comprise contact temperature measurement and non-contact temperature measurement. The contact type temperature measurement means that the thermocouple is tightly attached to the surface of a measured object, and the non-contact type temperature measurement means that the thermal radiation is utilized to measure the temperature. The non-contact temperature measurement is inferior to the contact temperature measurement in accuracy of temperature measurement due to factors such as environment, but in the related art, a thermocouple adopting the contact temperature measurement needs to be in direct contact with the surface of a measured object when high-temperature measurement is carried out, and the thermocouple adopting the contact measurement is limited in use range due to no high temperature resistance.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a film type thermocouple and electronic equipment, and the thermocouple can measure the temperature in a high-temperature environment, so that the application range of the thermocouple is enlarged.

In a first aspect, embodiments of the present application provide a thin film thermocouple; the thermocouple includes: the first conducting layer is provided with a first electrode, the second conducting layer is formed on one surface of the first conducting layer, the second conducting layer is provided with a second electrode, at least part of the first electrode and the second electrode are overlapped to form a thermoelectric junction, the thermoelectric junction is used for being contacted with a component to be tested, one end of the first electrode, which deviates from the thermoelectric junction, and one end of the second electrode, which deviates from the thermoelectric junction, are used for leading out a first binding terminal and a second binding terminal, and the first binding terminal and the second binding terminal are arranged on the same side of the thermoelectric junction and are used for an external circuit.

Based on the thin film thermocouple of this application embodiment, first conducting layer and second conducting layer form first electrode and second electrode after handling, and the at least partial overlapping of first electrode and second electrode forms the thermoelectric junction of this thin film thermocouple, because first conducting layer and second conducting layer adopt to have electric conduction, heat conduction and high temperature resistant material to make usually, replaced the design of traditional metal thermocouple area not high temperature resistant substrate for this thermocouple can be applicable to high temperature measurement, has increased the application range of thermocouple.

In some embodiments, the first electrode includes a first main body portion and a first connection portion connected to the first main body portion, and the second electrode includes a second main body portion and a second connection portion connected to the second main body portion, wherein the first connection portion and the second connection portion at least partially overlap to form a thermoelectric junction, an end of the first main body portion facing away from the thermoelectric junction is used for leading out the first binding terminal, and an end of the second main body portion facing away from the thermoelectric junction is used for leading out the second binding terminal.

Based on the above embodiment, according to the design principle of the thermocouple, the two different heat conducting materials have thermoelectric junctions and cold-electric junctions, in the design, at least parts of the first connecting portion and the second connecting portion are overlapped to form the thermoelectric junctions, one ends of the first main body portion and the second main body portion, which are away from the thermoelectric junctions, are used for leading out the first binding terminals and the second binding terminals, so that the whole thermocouple and the potential acquisition device form a closed loop, and when a temperature gradient exists between the temperature of the component to be measured, which is measured by the thermoelectric junctions, and the ambient temperature, a current is formed in the loop, so that a thermoelectromotive force can be generated.

In some embodiments, the overlapping portion of the first connecting portion and the second connecting portion accounts for 1/3-2/3 of the length of the extending direction of the first connecting portion, and/or the overlapping portion of the second connecting portion and the first connecting portion accounts for 1/3-2/3 of the length of the extending direction of the second connecting portion.

Based on the above embodiment, a designer can reasonably set the overlapping portion between the first connection portion and the second connection portion from the viewpoint of considering that the first connection portion and the second connection portion are not easily separated, and the connection stability between the first electrode and the second electrode is enhanced by increasing the contact area between the first connection portion and the second connection portion.

In some of these embodiments, the first body portion is connected perpendicular to the first connection portion, and/or the second body portion is connected perpendicular to the second connection portion.

Based on the above embodiment, the design that the first main body part is vertically connected with the first connecting part and the second main body part is vertically connected with the second connecting part reduces the overall processing difficulty of the thermocouple.

In some embodiments, the number of the first electrodes and the number of the second electrodes are multiple, the multiple first electrodes and the multiple second electrodes are alternately spaced and arranged in series, an adjacent first electrode and an adjacent second electrode are at least partially overlapped to form a thermoelectric junction, two ends of the multiple first electrodes and the multiple second electrodes after being connected in series are respectively a head end and a tail end, the head end is used for leading out the first binding terminal, and the tail end is used for leading out the second binding terminal.

Based on the embodiment, the first conducting layer is processed to form a plurality of first electrodes, the second conducting layer is processed to form a plurality of second electrodes, and the plurality of first electrodes and the plurality of second electrodes are alternately connected in series to form the thermopile.

In some embodiments, an end of each first electrode located between the head end and the tail end, the end of each first electrode facing away from the thermoelectric junction and an end of the adjacent second electrode facing away from the thermoelectric junction are both used for forming a cold electric junction, and one cold electric junction is used for leading out a third binding terminal, wherein the first binding terminal and the second binding terminal are used for an external circuit, or the first binding terminal and the third binding terminal are used for the external circuit.

Based on the above embodiment, by forming the cold-electric junction at the end of the adjacent first electrode and the second electrode away from the thermoelectric junction and leading out the third binding terminal, the amplification of voltages of different multiples can be realized by externally connecting different third binding ends or second binding ends with a circuit, similar to the resistance adjustment principle of the sliding rheostat.

In some embodiments, the first conductive layer is a copper layer, the second conductive layer is a constantan layer, a thickness dimension of the first conductive layer in a direction perpendicular to the first conductive layer is between 50 microns and 200 microns, and/or a thickness dimension of the second conductive layer in a direction perpendicular to the second conductive layer is between 50 microns and 200 microns.

Based on the above embodiments, the copper layer and the constantan layer have good heat conduction, electric conduction and high temperature resistance, the thermocouple manufactured by the copper layer and the constantan layer has high measurement accuracy and wide measurement range, and the thermocouple with the base material in the relevant metal has a thickness dimension of approximately tens of micrometers, here, in a direction perpendicular to the first conducting layer or the second conducting layer, the thickness dimensions of the first conducting layer and the second conducting layer are both designed to be between 50 micrometers and 200 micrometers and are in the same level as the thickness dimension of the base material, so the thermocouple of the design can also maintain the structural strength of the thermocouple after the base material design is cancelled.

In some embodiments, the side of the first electrode facing away from the second electrode and the side of the second electrode facing away from the first electrode are further provided with an insulating protective layer.

Based on the above embodiments, the insulating protection layer can effectively prevent the first electrode and the second electrode from being oxidized and corroded due to direct exposure to air.

In some of these embodiments, the insulating protective layer is a silicon dioxide layer.

Based on the embodiment, the silicon dioxide layer has good high temperature resistance, and can effectively protect the first electrode and the second electrode when the thermocouple carries out high-temperature measurement.

In a second aspect, the present application provides an electronic device, which includes the thin film thermocouple described above.

According to the electronic device of the embodiment of the application, the thermocouple does not have a base material which is not high in temperature resistance, so that the electronic device with the thermocouple can perform high-temperature measurement.

Based on film-type thermocouple and electronic equipment of this application embodiment, first conducting layer and second conducting layer form first electrode and second electrode after handling, and the at least partial overlapping of first electrode and second electrode forms the thermoelectric junction of this film-type thermocouple, because first conducting layer and second conducting layer adopt to have electric conduction, heat conduction and high temperature resistant material to make usually, replaced the design of traditional metal thermocouple area not high temperature resistant substrate for this thermocouple can be applicable to the high temperature measurement, has increased the application range of thermocouple.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic cross-sectional view of a thermocouple according to the prior art;

FIG. 2 is a schematic structural diagram of a thermocouple in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a thermocouple according to another embodiment of the present application;

FIG. 4 is a schematic structural diagram of a thermocouple including a plurality of first electrodes and a plurality of second electrodes according to an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of a thermocouple including a plurality of first electrodes and a plurality of second electrodes according to another embodiment of the present application;

FIG. 6 is a schematic flow chart illustrating a method for manufacturing a thermocouple according to an embodiment of the present disclosure;

FIG. 7 is a schematic flow chart illustrating a method for manufacturing a thermocouple according to another embodiment of the present application;

FIG. 8 is a cross-sectional view of a second conductive layer electroplated on the first conductive layer in an embodiment of the present application;

FIG. 9 is a schematic cross-sectional view illustrating an embodiment of etching a second conductive layer to form a second pattern structure;

FIG. 10 is a cross-sectional view of a first conductive layer etched to form a first pattern in accordance with an embodiment of the present invention;

FIG. 11 is a cross-sectional view of an embodiment of an electroplated insulating protection layer.

Reference numerals: 10. a thermocouple; 101. a substrate; 102. a first conductive material; 103. a second conductive material; 100. a thermocouple; 110. a first conductive layer; 111. a first graph structure; 1111. a first connection section; 1112. a first conduction segment; 120. a second conductive layer; 121. a second graph structure; 1211. a second connection section; 1212. a second conduction segment; 130. a thermoelectric junction; 140. a cold junction; 150. a first electrode; 160. a second electrode; 170. an insulating protective layer; 181. a first photosensitive film layer; 1811. a cured first photosensitive film layer; 182. a second photosensitive film layer; 1821. and the second photosensitive film layer is cured.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

Referring to fig. 1, the temperature measurement in various industries (especially, the high temperature measurement in the industrial industry) is very demanding, and the common methods include contact temperature measurement and non-contact temperature measurement. The thermocouple 10 is closely attached to the surface of the measured object, and the non-contact temperature measurement utilizes thermal radiation to measure temperature. And the accuracy of non-contact temperature measurement on temperature measurement is inferior to that of contact temperature measurement due to factors such as environment and the like. A typical contact thermocouple 10 uses two different conductive materials, a first conductive material 102 and a second conductive material 103.

However, in the related art, the thermocouple 10 adopting the contact temperature measurement needs to be in direct contact with the surface of the measured object when performing high temperature measurement, and the thermocouple 10 adopting the contact measurement is limited in application range due to the fact that the thermocouple is not resistant to high temperature. For example, eight common contact-type measuring thermocouples 10 have drawbacks in temperature measurement.

The conventional contact temperature measurement scheme and its disadvantages are as follows:

(1) the platinum-rhodium 30-platinum-rhodium 6 has low sensitivity below 600 ℃, and the linearity of thermoelectromotive force is poor;

(2) the platinum-rhodium 10-platinum has low sensitivity, is not suitable for reducing atmosphere, has poor thermoelectromotive force linearity and high price;

(3) the platinum-rhodium 13-platinum has low sensitivity, is not suitable for reducing atmosphere, has poor thermoelectromotive force linearity and high price;

(4) nickel chromium silicon-nickel silicon, not suitable for reducing atmosphere;

(5) nickel chromium-nickel silicon, not suitable for reducing atmospheres;

(6) the nickel-chromium-constantan is not suitable for reducing atmosphere, has low heat conductivity and has micro-hysteresis;

(7) iron-constantan, iron is easy to rust, and the thermoelectric property drift is large;

(8) copper-constantan (copper-nickel alloy), low use temperature, easy oxidation of copper anode.

For the eighth conventional contact-type thermocouple 10, the low temperature of the copper-constantan thermocouple 10 is mainly caused by the poor heat resistance of the base material 101, the base materials 101 are mainly PET base material 101 and PI base material 101, the heat resistance of the PET base material 101 is about 200 ℃, and the heat resistance of the PI base material 101 is about 350 ℃, which greatly limits the application range of the copper-constantan thermocouple 10.

To solve the above-mentioned problems, referring to fig. 2-4, the present invention provides a thin film thermocouple 100, wherein the thermocouple 100 replaces the conventional metal thermocouple 100 with a higher temperature substrate design, and is capable of performing higher temperature measurement, for example, the thermocouple is suitable for higher temperature measurement at about 500 ℃.

The thermocouple 100 is a temperature measuring element commonly used in a temperature measuring instrument, and is used to directly measure a temperature, convert a temperature signal into a thermal electromotive force signal, and convert the thermal electromotive force signal into a temperature of a medium to be measured (a member to be measured described below) through an electric instrument (a secondary instrument). The basic principle of the thermocouple 100 temperature measurement is as follows: the two ends of the two conductors are in contact with each other and can be connected to form a hot node and a cold node in a welding mode, wherein the hot node is used for being in contact with a measured medium, the cold node is usually suspended (namely the temperature measured by the cold node is the ambient temperature), the thermocouple 100 is connected with an electric instrument to form a closed loop, when the hot node and the cold node of the two conductors have a temperature gradient (namely the temperature of the hot node is different from that of the cold node), current passes through the loop, and at the moment, electromotive force (thermoelectric potential) exists between the hot node and the cold node of the thermocouple 100, namely the so-called seebeck effect.

Referring to fig. 2, according to the design principle that the thermocouple 100 includes two different heat conductive materials, in the present application, the thermocouple 100 includes a first conductive layer 110 and a second conductive layer 120.

The first conductive layer 110 is used as one of the heat and electricity conductive materials of the thermocouple 100, and the first conductive layer 110 may be made of a non-metal material, for example, the first conductive layer 110 may be made of an inorganic non-metal material, but considering that the thermocouple 100 mainly measures the temperature of the component to be measured in a contact measurement manner, in order to facilitate the thermocouple 100 to effectively collect the temperature of the component to be measured to ensure the accuracy of the measurement, the first conductive layer 110 should have good heat and electricity conductivity, so the first conductive layer 110 may be made of a metal material having good electricity and heat conductivity, for example, the first conductive layer 110 may be made of one of gold, silver, platinum rhodium, nickel chromium, or nickel copper, and considering the cost of the thermocouple 100, the first conductive layer 110 may be made of one of copper or constantan. It should be noted that the shape of the first conductive layer 110 is not limited herein, for example, the shape of the first conductive layer 110 may be circular or rectangular, and the design may be specifically performed according to the needs of the designer. Similarly, the second conductive layer 120 is used as another thermally and electrically conductive material of the thermocouple 100, and considering that the second conductive layer 120 should have good thermal and electrical conductivity while reducing the cost of the thermocouple 100, the material of the second conductive layer 120 is copper or the other of constantan and different from the first conductive layer 110, for example, the material of the first conductive layer 110 may be constantan, and the material of the second conductive layer 120 is copper, correspondingly. In this embodiment, the material of the first conductive layer 110 is copper, and the material of the second conductive layer 120 is constantan correspondingly, that is, the first conductive layer 110 is a copper layer, and the second conductive layer 120 is a constantan layer.

Further, the thermocouple 100 of the present application eliminates the conventional base material design, the base material acts as a bearing member for the two conductors of the related art, the base material acts like a reinforcing rib to reinforce the structural strength of the thermocouple 100, and in order to ensure that the thermocouple 100 of the present application has a certain structural strength after the base material is eliminated, the term "certain structural strength" as used herein is understood to mean that the thermocouple 100 is not easily deteriorated by an external force (a slight degree of deterioration may be understood as deformation of the thermocouple 100, and a serious degree of deterioration may be understood as breakage of the thermocouple 100), and in the present embodiment, in a direction perpendicular to the first conductive layer 110, the thickness dimension of the first conductive layer 110 is between 50 micrometers and 200 micrometers, and/or a thickness dimension of second conductive layer 120 in a direction perpendicular to second conductive layer 120 is between 50 microns and 200 microns. That is, the thickness dimension of the first conductive layer in a direction perpendicular to the first conductive layer 110 is between 50 micrometers and 200 micrometers; or the thickness dimension of the second conductive layer 120 in the direction perpendicular to the second conductive layer 120 is between 50 micrometers and 200 micrometers; or in the direction perpendicular to the first conductive layer 110, the thickness dimension of the first conductive layer is between 50 micrometers and 200 micrometers, and in the direction perpendicular to the second conductive layer 120, the thickness dimension of the second conductive layer 120 is between 50 micrometers and 200 micrometers. For example, the thickness dimension of the first conductive layer 110 may be one of 50 micrometers, 100 micrometers, 150 micrometers, 200 micrometers, and 250 micrometers, and the thickness dimension of the second conductive layer 120 may be one of 50 micrometers, 100 micrometers, 150 micrometers, 200 micrometers, and 250 micrometers. In the related art, the thickness dimension of the base material is also in the micrometer level, and by setting the thickness dimensions of the first conductive layer 110 and the second conductive layer 120 to be in the micrometer level, the thermocouple 100 in this design can still ensure the structural strength of the thermocouple 100 without the base material.

Referring to fig. 2, according to the design principle that two different heat conductive materials of the thermocouple 100 need to be in direct contact, in the present application, the second conductive layer 120 is formed on one surface of the first conductive layer 110.

The second conductive layer 120 may be plated on one surface of the first conductive layer 110 by electroplating. For example, the second conductive layer 120 may partially cover one surface of the first conductive layer 110, and in this embodiment, the second conductive layer 120 completely covers one surface of the first conductive layer 110.

Referring to fig. 2, according to the principle of manufacturing the thermocouple 100, two wires made of different materials may be used, and two ends of the two wires are wound together to form a simple thermocouple 100, in this application, the first conductive layer 110 has a first electrode 111, and the second conductive layer 120 has a second electrode 121.

The first conductive layer 110 may be subjected to a photolithography process (e.g., exposure, development, etching, etc.) to form a first electrode 111 (corresponding to one of the metal wires), and the second conductive layer 120 may also be subjected to a photolithography process to form a second electrode 121 (corresponding to the other metal wire), where shapes of the first electrode 111 and the second electrode 121 are not limited, and only the first electrode 111 and the second electrode 121 need to be layered. For example, the first conductive layer 110 or the second conductive layer 120 may be etched to form one or more of a V-like shape, an M/W-like shape, an I-like shape, a C-like shape, and an S-like shape, and the shape of the first electrode 111 may be different from that of the second electrode 121. In the present embodiment, the first motor 111 and the second electrode 121 have the same shape.

Specifically, the first electrode 111 includes a first main body portion 1111 and a first connection portion 1112 connected to the first main body portion 1111, and the second electrode 121 includes a second main body portion 1211 and a second connection portion 1212 connected to the second main body portion 1211. For example, the first connection portion 1112 may extend along the longitudinal direction of the first body portion 1111 and be connected to one end of the first body portion 1111, and the second connection portion 1212 may also extend along the longitudinal direction of the second body portion 1211 and be connected to one end of the second body portion 1211, in this embodiment, the first connection portion 1112 is connected perpendicular to the first body portion 1111 (the included angle between the first connection portion 1112 and the first body portion 1111 is 90 degrees), and/or the second connection portion 1212 is connected perpendicular to the second body portion 1211 (the included angle between the second connection portion 1212 and the second body portion 1211 is 90 degrees), for example, the first connection portion 1112 is connected perpendicular to the first body portion 1111, and correspondingly, the second connection portion 1212 is connected to the second body portion 1211 at a certain angle (not equal to 90 degrees); or the second connection portion 1212 is connected to the second main body 1211 perpendicularly, and correspondingly, the first connection portion 1112 is connected to the first main body 1111 at an angle (not equal to 90 degrees); further alternatively, the first connection portion 1112 is connected to the first body portion 1111 vertically, and the second connection portion 1212 is connected to the second body portion 1211 vertically.

Referring to fig. 2, according to the design principle that two conductors of the thermocouple 100 have a hot junction or a cold junction after being soldered by solder, in the present application, at least a portion of the first electrode 111 and the second electrode 121 overlap to form a thermoelectric junction 130 (i.e., the above-mentioned hot junction), and the thermoelectric junction 130 is used for contacting with a component to be tested (i.e., the above-mentioned medium to be tested), wherein, considering that the first conductive layer 110 and the second conductive layer 120 have electrical conductivity themselves, and the second conductive layer 120 can be electroplated on one of the surfaces of the first conductive layer 110, the term "overlap" should be understood as the first conductive layer 110 contacting with the second conductive layer 120 and electrically conducting. Specifically, in the present embodiment, the thermoelectric junction 130 is formed by at least partially overlapping the first connection portion 1112 of the first electrode 111 and the second connection portion 1212 of the second electrode 121, for example, the overlapping portion of the first connection portion 1112 and the second connection portion 1212 may only occupy a small portion of the first connection portion 1112 or the second connection portion 1212, and the overlapping portion of the first connection portion 1112 and the second connection portion 1212 may also occupy half of the first connection portion 1112 or the second connection portion 1212, that is, there is only a contact between the first connection portion 1112 of the first electrode 111 and the second connection portion 1212 of the second electrode 121, as shown in fig. 3, in some embodiments, the overlapping portion of the first connection portion 1112 and the second connection portion 1212 occupies lengths 1/3 to 2/3 of the first connection portion 1112 in the extending direction, and/or the overlapping portion of the second connection portion 1212 and the first connection portion 1112 occupies lengths 1/3 to 2/3 of the second connection portion 1212 in the extending direction, for example, the overlapping portion of the first connection portion 1112 and the second connection portion 1212 may account for 1/3, 1/2, or 2/3 of the length of the first connection portion 1112 in the extending direction, and the overlapping portion of the second connection portion 1212 and the first connection portion 1112 may account for 1/3, 1/2, or 2/3 of the length of the second connection portion 1212 in the extending direction. Further, in order to enhance the connection stability between the first electrode 111 and the second electrode 121, so as to prevent the thermocouple 100 from failing due to an open circuit between the first electrode 111 and the second electrode 121, in the present embodiment, the first connection portion 1112 of the first electrode 111 and the second connection portion 1212 of the second electrode 121 are completely overlapped to form the thermoelectric junction 130, and the structural and electrical connection stability between the first electrode 111 and the second electrode 121 is increased by increasing the contact area between the first connection portion 1112 of the first electrode 111 and the second connection portion 1212 of the second electrode 121.

Referring to fig. 2, according to the temperature measurement principle of the thermocouple 100, the thermocouple 100 needs to be connected with an electrical instrument to form a closed loop, the electrical instrument may be a voltmeter, a tester may connect two ends of the voltmeter with a hot node (the hot node is in contact with a measured medium) and a cold node (the cold node is suspended, that is, the cold node measures an ambient temperature T0) of the thermocouple 100, a temperature gradient is generated between the hot node and the cold node of the thermocouple 100 to form a current in the loop and generate a thermal electromotive force, the tester may look up relevant data according to the reading of the voltmeter to obtain a temperature value T1 corresponding to the thermal electromotive force, and the temperature of the measured medium is Δ T1-T0. In the present application, one end of the first electrode 111 and the second electrode 121, which is away from the thermoelectric junction, is used to lead out the first binding terminal 150 and the second binding terminal 160, and the first binding terminal 150 and the second binding terminal 160 are used to be connected to an external circuit when the thermoelectric junction 130 contacts with a component to be measured, such as an electric potential collecting device, where the electric potential collecting device may be, but not limited to, a voltmeter, a multimeter, and the like, and the electric potential collecting device is only an electric instrument capable of measuring voltage. In order to avoid the temperature of the component to be measured from affecting the first binding terminal 150 and the second binding terminal 160, which may cause inaccurate temperature measurement of the thermocouple 100, when the thermocouple 100 is used to measure the temperature, the thermoelectric junction 130 is in contact with the component to be measured, and the temperature of the component to be measured is relatively high, in this embodiment, the first binding terminal 150 and the second binding terminal 160 are located on the same side of the thermoelectric junction 130 and are both far away from the thermoelectric junction 130. Specifically, an end of the first body portion 1111 facing away from the thermoelectric junction 130 is used to lead out the first binding terminal 150, and an end of the second body portion 121 facing away from the thermoelectric junction 130 is used to lead out the second binding terminal 160.

To sum up, the first conductive layer 110 and the second conductive layer 120 are processed to form the first electrode 111 and the second electrode 121, and at least a portion of the first electrode 111 and the second electrode 121 are overlapped to form the thermoelectric junction 130 of the thin film thermocouple 100, because the first conductive layer 110 and the second conductive layer 120 adopted by the thin film thermocouple 100 are made of conductive, heat conductive and high temperature resistant materials, the design of the traditional metal thermocouple 100 with a base material which is not high temperature resistant is replaced, the thermocouple 100 can be suitable for high temperature measurement, and the application range of the thermocouple 100 is enlarged.

Referring to fig. 4, it can be understood that the reading of the electric potential collecting device is related to the number of the first electrodes 111 and the second electrodes 121 in the thermocouple 100, for example, when one thermocouple 100 includes one first electrode 111 and one second electrode 121, the reading corresponding to the electric potential collecting device is the magnitude of the actual voltage value at the two ends of the first binding terminal 150 and the second binding terminal 160; when one thermocouple 100 includes two first electrodes 111 and two second electrodes 121, the reading of the potential acquiring device corresponds to twice the reading of the potential acquiring device in the thermocouple 100 including only one first electrode 111 and one second electrode 121 under certain conditions, and the term "certain condition" herein should be understood to mean that the first binding terminal 150 and the second binding terminal 160 are led out from the outermost first electrode 111 and the outermost second electrode 121 of the thermocouple 100. When the thermocouple 100 includes a plurality of first electrodes 111 and a plurality of second electrodes 121, there may be an integral multiple of amplification of the reading corresponding to the potential acquisition device, in other words, the last reading of the potential acquisition device may be regarded as the reading result obtained by connecting a plurality of voltage meters in series.

Further, for measuring the temperature of some components to be measured whose temperature is not much different from the ambient temperature, that is, the temperature gradient is small, so that the reading of the potential collecting device is small, which causes an error in the temperature measurement result, and in order to obtain a more accurate temperature measurement result for the tester, in the present embodiment, the first conductive layer 110 includes a plurality of (two or more than two) first electrodes 111 after being processed, the second conductive layer 120 also includes a plurality of second electrodes 121 after being processed, the plurality of first electrodes 111 and the plurality of second electrodes 121 are alternately spaced and arranged in series, and an adjacent first electrode 111 and a second electrode 121 are at least partially overlapped to form a thermoelectric junction 130, two ends of the plurality of first electrodes 111 and the plurality of second electrodes 121 after being connected in series are respectively a head end and a tail end, the head end is used for leading out the first binding terminal 150, and the tail end is used for leading out the second binding terminal 160, the head end is understood to mean the end of the first electrode 111 on one outer side facing away from the thermoelectric junction 130, and the tail end is correspondingly understood to mean the end of the second electrode 121 on the other outer side facing away from the thermoelectric junction 130; of course, the head end can also be understood as the end of the second electrode 121 facing away from the thermoelectric junction 130 on one outer side, and the tail end correspondingly as the end of the first electrode 111 facing away from the thermoelectric junction 130 on the other outer side.

Referring to fig. 5, in some embodiments, an end of the first electrode 111 facing away from the thermoelectric junction 130 between the head end and the tail end and an end of the adjacent second electrode 121 facing away from the thermoelectric junction 130 are both used to form a cold electric junction 140, and one cold electric junction 140 is used to lead out one third binding terminal 170, that is, the end of the first electrode 111 facing away from the thermoelectric junction 130 between the head end and the tail end overlaps with an end of the adjacent second electrode 121 facing away from the thermoelectric junction 130 to form the cold electric junction 140, specifically, an end of the first body portion 1111 of the first electrode 111 facing away from the thermoelectric junction 130 between the head end and the tail end is connected with another first connection portion 1112, an end of the second body portion 1211 of the second electrode 121 facing away from the thermoelectric junction 130 between the head end and the tail end is connected with another second connection portion 1212, the other first connection portion 1112 and the other second connection portion 1212 overlap to form the cold electric junction 140. Further, the first binding terminal 150 and the second binding terminal 160 are used for an external circuit, or the first binding terminal 150 and a third binding terminal 170 are used for an external circuit, that is, the first binding terminal 150 is a fixed end, the second binding terminal 150 and the third binding terminal 170 are active ends, and when the second binding terminal 160 is an active end, the second binding terminal is used for an external circuit, the voltage measured by the thermocouple 100 is a voltage value between the outermost first electrode 111 and the outermost second electrode 121, and when the third binding terminal 170 is an active end, the voltage measured by the thermocouple 100 is a voltage value between the first binding terminal 150 of the outermost first electrode 111 and a third binding terminal 170 thereof. By leading out the third binding terminals 170, the multistage voltage amplification of the thermocouple 100 is realized, and a tester can select the second binding terminal 160 or a proper third binding terminal 170 to be used in an external circuit to display the voltage according to actual needs so as to obtain more accurate temperature.

It can be understood that after the first conductive layer 110 and the second conductive layer 120 are processed to form the first electrode 111 and the second electrode 121, the first electrode 111 and the second electrode 121 are directly exposed to the air and may be oxidized or corroded, so in order to avoid oxidation or corrosion of the first electrode 111 and the second electrode 121, in this embodiment, a side of the first electrode 111 facing away from the second electrode 121 and a side of the second electrode 121 facing away from the first electrode 111 are further provided with an insulating protection layer 170 (not shown in fig. 2-4, as shown in fig. 11), the insulating protection layer 170 may be disposed on a side of the first electrode 111 facing away from the second electrode 121 and a side of the second electrode 121 facing away from the first electrode 111 by electroplating, and the insulating protection layer 170 may also be disposed on a side of the first electrode 111 facing away from the second electrode 121 by spraying, The side of the second electrode 121 facing away from the first electrode 111. The insulating protective layer 170 may be plated, for example, by electron beam evaporation plating. Further, the insulating protection layer 170 may be a PAS layer (passivation layer), and in order to prevent the insulating protection layer 170 from being damaged during high temperature measurement, the insulating protection layer 170 is a silicon dioxide layer (SiO2) in the present embodiment, considering that the thermocouple 100 can perform high temperature measurement after removing the base material.

The embodiment of the application also provides electronic equipment, which comprises the thin film type thermocouple, and the electronic equipment based on the thin film type thermocouple is capable of performing high-temperature measurement because the thermocouple does not have a base material which is not high in temperature resistance.

Referring to fig. 6 to 11, the method for manufacturing the thin film thermocouple 100 is described below, but it should be understood that the method for manufacturing the thin film thermocouple 100 is only one of the methods (or processes) for manufacturing the thin film thermocouple 100, and in other embodiments, the method may include other steps. As shown in fig. 6, the method of manufacturing the thin film thermocouple 100 may include the steps of:

step S1, providing a first conductive layer 110;

step S2, disposing the second conductive layer 120 on one surface of the first conductive layer 110;

step S3, forming a first photosensitive film 181 on the surface of the first conductive layer 110 away from the second conductive layer 120, forming a second photosensitive film 182 on the surface of the second conductive layer 120 away from the first conductive layer 110, exposing the first photosensitive film 181 with a first mask, exposing the second photosensitive film 182 with a second mask, and developing the exposed first conductive layer 110 and second conductive layer 120;

step S4, etching the exposed first photosensitive film layer 181 and the first conductive layer 110 with a first etching solution, so that a portion of the first conductive layer 110 is removed to form a first electrode 111; etching the exposed second photosensitive film 182 and the second conductive layer 120 by using a second etching solution, so that a part of the second conductive layer 120 is removed to form a second electrode 121; and

step S5, stripping the remaining first photosensitive film 181 and the second photosensitive film 182;

the first electrode 111 and the second electrode 121 are at least partially overlapped to form a thermoelectric junction 130, the thermoelectric junction 130 is used for contacting with a component to be tested, one end of the first electrode 111, which is away from the thermoelectric junction 130, and one end of the second electrode 121, which is away from the thermoelectric junction 130, are used for leading out a first binding terminal 150 and a second binding terminal 160, and the first binding terminal 150 and the second binding terminal 160 are arranged on the same side of the thermoelectric junction 130 and are used for externally connecting a circuit.

With reference to fig. 8-11, in particular, in step S1, the first conductive layer 110 is used as one of the heat conductive materials of the thermocouple 100, and may be a copper layer or one of constantan layers, and in this embodiment, the first conductive layer 110 is a copper layer. In view of the fact that the thin film thermocouple 100 is designed without the design of the substrate layer compared to the related art, in order to ensure the structural strength of the thermocouple 100, in the step of the present embodiment, the copper layer with the thickness dimension between 50 mm and 200 mm is used as the first conductive layer 110.

Specifically, in step S2, the second conductive layer 120 is used as another heat conductive material of the thermocouple 100, which may be one of a copper layer and a constantan layer different from the first conductive layer 110, and in the step of this embodiment, the second conductive layer 120 is a constantan layer, and a constantan layer with a thickness dimension of 50 mm to 200 mm is used as the second conductive layer 120.

Specifically, in step S3, a first photosensitive film layer 181 is formed on the surface of the first conductive layer 110 facing away from the second conductive layer 120, and the first photosensitive film layer 181 may be plated on the surface of the first conductive layer 110 facing away from the second conductive layer 120 by electroplating, so that the first photosensitive film layer 181 completely covers the surface of the second conductive layer 120 facing away from the first conductive layer 110. The first photosensitive film 181 is a photosensitive material, which is a medium for transferring a pattern by a photochemical reaction of a material. Similarly, a second photosensitive film 182 is formed on the surface of the second conductive layer 120 away from the first conductive layer 110, and the second photosensitive film 182 can be plated on the surface of the second conductive layer 120 away from the first conductive layer 110 by electroplating, so that the second photosensitive film 182 completely covers the surface of the first conductive layer 110 away from the second conductive layer 120.

Further, after first sensitization rete 181 forms, adopt first mask to expose first sensitization rete 181, corresponding pattern is designed into according to designer's demand to first mask, the ultraviolet light shines from the one side that deviates from first sensitization rete 181 of first mask, first mask has the effect of sheltering from to the ultraviolet light and makes partial ultraviolet light sheltered from and can not shine the surface of first sensitization rete 181, the smooth first sensitization rete 1811 that shines on the surface of first sensitization rete 181 and form the solidification of light that another part in the ultraviolet light is not sheltered from by first mask. Meanwhile, the second mask is used for exposing the second photosensitive film 182, the second mask is also designed into a corresponding pattern according to the requirements of a designer, ultraviolet light irradiates from one side of the second mask, which is far away from the second photosensitive film 182, the second mask has a shielding effect on the ultraviolet light, so that part of the ultraviolet light is shielded and cannot irradiate the surface of the second photosensitive film 182, and the other part of the ultraviolet light, which is not shielded by the second mask, smoothly irradiates the surface of the second photosensitive film 182 and forms a solidified second photosensitive film 1821.

Further, after the exposure of the first photosensitive film layer 181 is completed, the first photosensitive film layer 181 is dissolved by using a developing solution, wherein the developing solution may be a potassium hydroxide solution (KOH). The part of the first photosensitive film layer 181 irradiated by the ultraviolet light is decomposed or degraded to be preferentially dissolved in the developing solution (for a positive developing solution), and the part of the first photosensitive film layer 181 not irradiated by the ultraviolet light is cured to form a structure similar to a protective film, that is, only the unexposed part of the first photosensitive film layer 181 is left on the surface of the first conductive layer 110 away from the second conductive layer 120 after the development, that is, a positive pattern is formed. Similarly, after the second photosensitive film layer 181 is exposed, the second photosensitive film layer 182 is dissolved by using a developing solution, wherein the developing solution may be a potassium hydroxide solution (KOH). The part of the second photosensitive film 182 irradiated by the ultraviolet light is decomposed or degraded to be preferentially dissolved in the developing solution (for a positive developing solution), and the part of the second photosensitive film 182 not irradiated by the ultraviolet light is cured to form a structure similar to a protective film, that is, only the unexposed part of the second photosensitive film 182 is left on the surface of the second conductive layer 120 away from the first conductive layer 110 after the development, that is, a positive pattern in the industry is formed.

Specifically, in step S4, after the first photosensitive film layer 181 is developed, the first conductive layer 110 is etched by using an etching solution, wherein the etching solution may be a high-concentration sodium hydroxide solution (NaOH). In other words, the first photosensitive film layer 181 can prevent the shielded first conductive layer 110 from being etched by the etching solution, just like a protective film, so that the first conductive layer 110 etched by the etching solution only has a portion covered by the first photosensitive film layer 181, that is, the first electrode 111 is obtained. Similarly, after the second photosensitive film 182 is developed, the second conductive layer 120 is etched by using an etching solution, where the etching solution may be a low-concentration sodium hydroxide solution (NaOH). In other words, the second photosensitive film 182 acts as a protective film to prevent the blocked second conductive layer 120 from being etched by the etching solution, so that only the portion of the second conductive layer 120 covered by the second photosensitive film 182 remains after etching by the etching solution, i.e. the second electrode 121 is obtained. It should be noted that the concentrations of the etching solution for etching the first conductive layer 110 and the etching solution for etching the second conductive layer 120 are different, and the specific conductive layer has a high concentration, which needs to be determined according to the material of the conductive layer, for example, the concentration of the etching solution for etching the constantan layer is higher than the concentration of the etching solution for etching the copper layer.

Specifically, in step S5, the remaining first photosensitive film layer 181 and the remaining second photosensitive film layer 182 are peeled off.

It is understood that, after the first conductive layer 110 and the second conductive layer 120 are etched to form the first electrode 111 and the second electrode 121, the first electrode 111 and the second electrode 121 are completely exposed to the air, so that there is a possibility of oxidation or corrosion of the first electrode 111 and the second electrode 121, and in order to prevent the first electrode 111 and the second electrode 121 from being oxidized or corroded, specifically, as shown in fig. 7, the following steps may be further performed after step S5:

step S6, forming an insulating protection layer 170 on a side of the first electrode 111 facing away from the second electrode 121; and an insulating protective layer 170 is formed on a side of the second electrode 121 facing away from the first electrode 111.

In step S6, the insulating protective layer 170 may be a PAS layer, and in the step of the present embodiment, a silicon dioxide layer is used as the insulating protective layer 170, considering that the thermocouple 100 manufactured by the manufacturing method can be used for high temperature measurement. The insulating protective layer 170 may be disposed on a side of the first electrode 111 away from the second electrode 121 and a side of the second electrode 121 away from the first electrode 111 by electroplating, and the insulating protective layer 170 may also be disposed on a side of the first electrode 111 away from the second electrode 121 and a side of the second electrode 121 away from the first electrode 111 by spraying, and the insulating protective layer 170 may be electroplated by electron beam evaporation plating.

The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (10)

1. A thin film thermocouple, comprising:

a first conductive layer having a first electrode;

a second conductive layer formed on one surface of the first conductive layer, the second conductive layer having a second electrode;

the first electrode and the second electrode are at least partially overlapped to form a thermoelectric junction, the thermoelectric junction is used for being contacted with a component to be tested, one end of the first electrode, which is far away from the thermoelectric junction, and one end of the second electrode, which is far away from the thermoelectric junction, are used for leading out a first binding terminal and a second binding terminal, and the first binding terminal and the second binding terminal are arranged on the same side of the thermoelectric junction and are used for being externally connected with a circuit.

2. A thermocouple as in claim 1,

the first electrode comprises a first main body part and a first connecting part connected with the first main body part;

the second electrode comprises a second main body part and a second connecting part connected with the second main body part;

the first connecting portion and the second connecting portion are at least partially overlapped to form the thermoelectric junction, one end of the first main body portion, which is far away from the thermoelectric junction, is used for leading out the first binding terminal, and one end of the second main body portion, which is far away from the thermoelectric junction, is used for leading out the second binding terminal.

3. A thermocouple as in claim 2,

the overlapping part of the first connecting part and the second connecting part accounts for 1/3-2/3 of the extension direction length of the first connecting part; and/or the overlapping part of the second connecting part and the first connecting part accounts for 1/3-2/3 of the extension direction length of the second connecting part.

4. A thermocouple as in claim 2,

the first main body part is vertically connected with the first connecting part; and/or

The second main body part is vertically connected with the second connecting part.

5. A thermocouple as in claim 1,

the first electrodes and the second electrodes are multiple in number, the first electrodes and the second electrodes are alternately arranged at intervals and are connected in series, the first electrodes and the second electrodes are adjacent, at least part of the first electrodes and the second electrodes are overlapped to form thermoelectric junctions, the first electrodes and the second electrodes are multiple, the two ends of the first electrodes and the second electrodes after being connected in series are respectively a head end and a tail end, the head end is used for leading out the first binding terminal, and the tail end is used for leading out the second binding terminal.

6. A thermocouple as in claim 5,

one end of each first electrode, which is positioned between the head end and the tail end and faces away from the thermoelectric junction, and one end of the adjacent second electrode, which faces away from the thermoelectric junction, are used for forming cold electric junctions, and one cold electric junction is used for leading out a third binding terminal;

the first binding terminal and the second binding terminal are used for an external circuit; or

The first binding terminal and the third binding terminal are used for an external circuit.

7. A thermocouple as in claim 1,

the first conductive layer is a copper layer, the second conductive layer is a constantan layer, and the thickness dimension of the first conductive layer in the direction perpendicular to the first conductive layer is between 50 micrometers and 200 micrometers; and/or the second conductive layer has a thickness dimension in a direction perpendicular to the second conductive layer of between 50 and 200 microns.

8. A thermocouple as in claim 1,

and an insulating protective layer is further arranged on one side of the first electrode, which is far away from the second electrode, and one side of the second electrode, which is far away from the first electrode.

9. A thermocouple as in claim 8,

the insulating protective layer is a silicon dioxide layer.

10. An electronic device, characterized by comprising a thermocouple according to any one of claims 1 to 9.

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