CN212921405U

CN212921405U - Bus connection module

Info

Publication number: CN212921405U
Application number: CN202021272613.8U
Authority: CN
Inventors: 叶化英; 李翔; 孟倩; 王娜娜
Original assignee: Continental Automotive Body Electronic System Wuhu Co Ltd
Current assignee: Vitesco Automotive Wuhu Co Ltd; Continental Automotive Body Electronic System Wuhu Co Ltd
Priority date: 2020-07-02
Filing date: 2020-07-02
Publication date: 2021-04-09
Anticipated expiration: 2030-07-02

Abstract

The utility model provides a bus connection module, including the PCB board, be provided with first connector, transceiver chip, second connector and third connector on the PCB board, first connector is used for through first pencil connecting bus, and the second connector is used for connecting electron device through the second pencil, and the third connector is used for through third pencil connecting power. The utility model provides a bus connection module connects bus and electron device, constructs bus development environment with low costs, is convenient for generally apply to post such as electron device's development, debugging, test, has improved work efficiency.

Description

Bus connection module

Technical Field

The utility model relates to an automotive filed, concretely relates to bus connection module.

Background

The company Canoe (CAN open environment) is a bus development environment developed by Vector of Germany for developing an automobile bus. The CANoe is used for modeling, simulating, testing and developing a CAN communication network at the early stage, and a LIN, an Ethernet, a FlexRay, a MOST and other networks are added later.

In the development and production processes of automobile instruments, such as the production of the instruments and the debugging of hardware, a bus development environment is required for many stations, but the Canoe is expensive and cannot be generally applied to the occasions, so that the working efficiency of the stations is influenced.

Disclosure of Invention

To the problem that exists among the prior art, the to-be-solved problem of the utility model is to provide a bus connection module, connect bus and electron device, construct bus development environment with low costs, the universal application in post such as electron device's development, debugging, test of being convenient for has improved work efficiency.

The utility model provides a bus connection module, including the PCB board, be provided with first connector, transceiver chip, second connector and third connector on the PCB board, first connector is used for through first pencil connecting bus, and the second connector is used for connecting electron device through the second pencil, and the third connector is used for through third pencil connecting power.

Furthermore, a bus connecting end of the first connector is connected with a bus pin of the transceiver chip through the first resistor, and a transmitting end and a receiving end of the second connector are respectively connected with a transmitting pin and a receiving pin of the transceiver chip.

Furthermore, a bus pin of the transceiver chip is connected with the anode of the power supply through a first diode and a second resistor, and is grounded through a first capacitor.

Furthermore, a power pin of the transceiver chip is connected with the anode of the power supply through a second diode and a third resistor, and is grounded through a third capacitor or a third capacitor and a fourth capacitor which are connected in parallel.

Furthermore, an enable pin of the transceiver chip is connected with the anode of the power supply through a second diode, a third resistor and a fourth resistor.

Furthermore, the connection point of the third resistor and the fourth resistor is grounded through the first voltage regulator tube.

Furthermore, the connection point of the third resistor and the fourth resistor is grounded through the first voltage regulator tube and the fifth capacitor which are connected in parallel, or the connection point of the third resistor and the fourth resistor is grounded through the first voltage regulator tube, the fifth capacitor and the sixth capacitor which are connected in parallel.

Furthermore, a receiving pin of the transceiver chip is connected with the anode of the power supply through a second diode, a third resistor and a fifth resistor, and is connected with a receiving end of the second connector.

Further, a transmission pin of the transceiver chip is connected with a transmission end of the second connector.

Further, the bus is a CAN bus, a LIN bus, a FlexRay bus, a MOST bus or an Ethernet, and the transceiver chip is correspondingly a CAN transceiver chip, a LIN transceiver chip, a FlexRay transceiver chip, a MOST transceiver chip or an Ethernet transceiver chip.

Compared with the prior art, the utility model provides a bus connection module has following beneficial effect: the bus and the electronic device are connected, a bus development environment is established at low cost, the bus development environment is conveniently and generally applied to the posts of development, debugging, testing and the like of the electronic device, and the working efficiency is improved.

Drawings

Fig. 1 is a schematic connection diagram of a bus connection module according to an embodiment of the present invention;

fig. 2 is a circuit diagram of the bus connection module shown in fig. 1.

Detailed Description

As shown in fig. 1 and fig. 2, the bus connection module CM according to an embodiment of the present invention includes a PCB board, and the PCB board is provided with a first connector C1, a transceiver chip TR, a second connector C2, and a third connector C3.

The first connector C1 is used to connect to a bus, in this embodiment, the first connector C1 is DB9, and in other embodiments, the first connector may be USB and is connected to the bus through the first wire harness W1.

In this embodiment, the bus is a LIN bus, and correspondingly the transceiver chip TR is a LIN bus transceiver chip, model number TLE7259-3GE S08.

In other embodiments, the bus is a CAN bus, a FlexRay bus, a MOST bus or an Ethernet, and the transceiver chip is a CAN transceiver chip, a FlexRay transceiver chip, a MOST transceiver chip or an Ethernet transceiver chip, respectively.

The second connector C2 is used to connect electronic devices, such as a controller of a meter IC, through the second harness W2, and perform development, debugging, testing, and the like of the meter IC. In this embodiment, the second connector C2 is DB9, but in other embodiments, it may be USB.

The third connector C3 is used to connect a power supply Bat to supply power to the bus connection module CM through the third wire harness W3, in this embodiment, the power supply Bat is 12V, and the PIN 1-power supply positive electrode Vin of the third connector C3 is grounded through the second capacitor C2.

Other devices DEV1, DEV2, such as a PC, a controller, etc., are connected to the LIN bus.

For the development station, DEV1(PC) and DEV2(BCM, vehicle body control module) are connected via LIN bus, for example, the PC has development environment, the BCM can provide states of various sensors, and development, debugging and the like can be performed on the combination meter IC; for the test station, the instrument cluster IC may be tested, for example, via the LIN bus connection DEV2 (BCM).

The bus connection module CM in the embodiment can connect the bus and the electronic device, construct a bus development environment with low cost, is convenient for being generally applied to posts of development, debugging, testing and the like of the electronic device, and improves the working efficiency.

As shown in fig. 2, the BUS connection terminal (PIN 7) of the first connector C1 is connected to the BUS PIN of the LIN BUS transceiver chip TR through the first resistor R1, PIN 6 is grounded, and the other connection terminals are floating.

The transmitting terminal (PIN 3) and the receiving terminal (PIN 2) of the second connector C2 are connected to the transmitting TXD PIN and the receiving RXD PIN of the transceiver chip TR, respectively.

The connection ends of the first connector C1 and the second connector C2 may be configured according to specific applications, and are not limited to the configuration in the embodiment.

The BUS PIN of the transceiver chip TR is connected with the PIN 1-power positive electrode Vin of the third connector C3 through the first diode D1 and the second resistor R2, and is grounded through the first capacitor C1, PIN 4 and PIN 7 are suspended, and other connecting ends are grounded. The first diode D1 is used to protect the power source Bat from being damaged by reverse voltage, and the first capacitor C1 is used to eliminate high frequency interference.

The power VS PIN of the transceiver chip TR is connected to the PIN 1-power supply positive electrode Vin of the third connector C3 through the second diode D2 and the third resistor R3, and is grounded through the third capacitor R3 and the fourth capacitor R4 connected in parallel, and the capacitance values of the third capacitor R3 and the fourth capacitor R4 may be different, so as to eliminate high-frequency interference of different frequencies. In other embodiments, the ground can be connected only through the third capacitor R3 for eliminating high frequency interference.

The second diode D2 is used to protect the power Bat from being damaged by the reverse voltage, in this embodiment, the second diode D2 is a schottky diode, and because the schottky barrier height is lower than the PN junction barrier height, the forward conduction threshold voltage and the forward voltage drop are both lower than those of the PN junction diode, and because the reverse recovery charge of the SBD is very small, the switching speed is very fast, the switching loss is also very small, and the diode is particularly suitable for high frequency applications.

The enable EN PIN of the transceiver chip TR is connected to the PIN 1-power supply positive electrode Vin of the third connector C3 through the second diode D2, the third resistor R3, and the fourth resistor R4.

The junction of the third resistor R3 and the fourth resistor R4 is grounded via the first regulator tube Z1 to stabilize the voltage applied to the enable EN pin and the receiving terminal RXD, and in particular, to maintain the voltage within the voltage operating range of the pin TR of the transceiver chip (datasheet defines that the maximum voltage cannot exceed 5.5v, and the typical operating voltage is 5 v).

The connection point of the third resistor R3 and the fourth resistor R4 is grounded through the fifth capacitor C5 and the sixth capacitor C6 connected in parallel, and the capacitance values of the fifth capacitor R5 and the sixth capacitor R6 may be different, so as to eliminate high-frequency interference of different frequencies. In other embodiments, the connection point of the third resistor R3 and the fourth resistor R4 may also be grounded only through the fifth capacitor C5.

The PIN RXD of the transceiver chip TR is connected to the PIN 1-power supply positive electrode Vin of the third connector C3 through the second diode D2, the third resistor R3, and the fifth resistor R5, and is connected to the receiving terminal (PIN 2) of the second connector C2.

The transmit TXD PIN of the transceiver chip TR is connected to the transmit side (PIN 3) of the second connector C2.

Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited thereto. Various changes and modifications can be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is to be determined by the appended claims.

Claims

1. The utility model provides a bus connection module, its characterized in that, bus connection module includes the PCB board, is provided with first connector, transceiver chip, second connector and third connector on the PCB board, and first connector is used for through first pencil connecting bus, and the second connector is used for through second pencil connection electron device, and the third connector is used for through third pencil connecting power.

2. The bus connection module as claimed in claim 1, wherein the bus connection terminal of the first connector is connected to the bus pin of the transceiver chip through the first resistor, and the transmission terminal and the reception terminal of the second connector are connected to the transmission pin and the reception pin of the transceiver chip, respectively.

3. The bus connection module of claim 1, wherein the bus pin of the transceiver chip is connected to the positive power supply terminal through a first diode, a second resistor, and to ground through a first capacitor.

4. The bus connection module of claim 1, wherein the power pin of the transceiver chip is connected to the positive power supply terminal through a second diode, a third resistor, and is grounded through a third capacitor or a third capacitor and a fourth capacitor connected in parallel.

5. The bus connection module of claim 1, wherein the enable pin of the transceiver chip is connected to the positive power supply via a second diode, a third resistor, and a fourth resistor.

6. The bus connection module of claim 5, wherein a connection point of the third resistor and the fourth resistor is grounded through the first voltage regulator tube.

7. The bus connection module as claimed in claim 5, wherein the connection point of the third resistor and the fourth resistor is grounded through the first voltage regulator tube and the fifth capacitor connected in parallel, or the connection point of the third resistor and the fourth resistor is grounded through the first voltage regulator tube, the fifth capacitor and the sixth capacitor connected in parallel.

8. The bus connection module of claim 1, wherein the receiving pin of the transceiver chip is connected to the positive power supply terminal through a second diode, a third resistor, and a fifth resistor, and is connected to the receiving terminal of the second connector.

9. The bus connection module of claim 1, wherein a transmit pin of the transceiver chip is connected to a transmit end of the second connector.

10. The bus connection module as claimed in claim 1, wherein the bus is a CAN bus, a LIN bus, a FlexRay bus, a MOST bus or an Ethernet, and the transceiver chip is a CAN transceiver chip, a LIN transceiver chip, a FlexRay transceiver chip, a MOST transceiver chip or an Ethernet transceiver chip, respectively.