CN212921015U - Transfer device and transfer device assembly of semiconductor machine - Google Patents

Abstract

The application discloses move of semiconductor board moves and carries device and move and carry device subassembly, the disclosed move and carry the device and include: the first connecting structures are sequentially arranged on the bracket in a first direction, and the first direction is the height direction of the transfer device; the bearing frame is arranged on the support and provided with a second connecting structure, the second connecting structure is detachably connected with at least one of the first connecting structures, the bearing frame is provided with a bearing surface used for bearing the semiconductor machine table, and the height between the bearing surface and the ground is adjustable; the turning wheel mechanism is arranged on the support, and the bearing surface is located on one side of the turning wheel mechanism. The problem of the inconvenient transport of vertical furnace machine can be solved to above-mentioned scheme.

Description

Transfer device and transfer device assembly of semiconductor machine

Technical Field

The application relates to the technical field of semiconductor equipment, in particular to a transfer device and a transfer device assembly of a semiconductor machine.

Background

In the semiconductor industry, the vertical furnace 20 may perform a medium-high temperature oxidation process, a Low temperature annealing process, an LPCVD (Low Pressure Chemical Vapor Deposition), a piq (polyimide isondoro quinazondion) packaging process, and the like. The vertical furnace 20 has become an indispensable device in a semiconductor factory.

At present, the vertical furnace 20 is generally transported by using the manual hydraulic vehicle 10 during the transportation of the vertical furnace 20, but during the transportation of the vertical furnace 20 by using the manual hydraulic vehicle 10, the vertical furnace 20 is lifted to a large height, and the vertical furnace 20 lifted to a large height is difficult to pass through the access door due to the strict height limitation of the access door of the semiconductor factory, so that the vertical furnace 20 is difficult to transport into the semiconductor factory, meanwhile, referring to fig. 1, the length of the current vertical furnace 20 is also large, the length of the manual hydraulic vehicle 10 is also large, so that the turning radius of the vertical furnace 20 during the transportation is large, the dashed circle in fig. 1 represents the turning space required by the vertical furnace 20 during the transportation, so that the vertical furnace 20 is difficult to turn during the transportation, and the safety carrying area (the area indicated by the hatching in fig. 1) of the manual hydraulic vehicle 10 is small, causing the vertical furnace 20 to easily turn on its side during transportation. It can be seen that the vertical type furnace 20 has a problem of inconvenient transportation.

Of course, the present disclosure is not limited to vertical furnace 20, and other types of equipment (e.g., a tank cleaning equipment) also suffer from the above-described problems.

SUMMERY OF THE UTILITY MODEL

The application discloses move and carry device and move and carry device subassembly of semiconductor board can solve the inconvenient problem of carrying of vertical furnace machine.

In order to solve the above technical problem, the present application is implemented as follows:

the embodiment of the application discloses a device is carried in moving of semiconductor board, move and carry the device and include:

the first connecting structures are sequentially arranged on the bracket in a first direction, and the first direction is the height direction of the transfer device;

the bearing frame is arranged on the support and provided with a second connecting structure, the second connecting structure is detachably connected with at least one of the first connecting structures, the bearing frame is provided with a bearing surface used for bearing the semiconductor machine table, and the height between the bearing surface and the ground is adjustable;

the turning wheel mechanism is arranged on the support, and the bearing surface is located on one side of the turning wheel mechanism.

The embodiment of the application also discloses a shifting device assembly of the semiconductor machine, which comprises at least two shifting devices, wherein the bearing surfaces of the at least two shifting devices form a bearing area, when the shifting devices carry the semiconductor machine, at least part of the semiconductor machine covers the bearing area, and the center of gravity of the semiconductor machine is positioned in the bearing area.

The technical scheme adopted by the application can achieve the following beneficial effects:

in the transfer device disclosed in the application, the second connecting structure is detachably connected with at least one of the first connecting structures, so that the bearing surface can move in the first direction, and the height between the bearing surface and the ground can be adjusted. In the handling process, the height of the lifted semiconductor machine is small, so that the situation that the semiconductor machine is difficult to pass through a carrying-in door due to the fact that the carrying-in door is limited in height can be prevented, the semiconductor machine can be carried at a low height, the length size of the carrying device is small, the carrying device can turn in a narrow space through the turning wheel mechanism, the turning radius is small, turning operation of the semiconductor machine in the handling process is facilitated, and the semiconductor machine is convenient to carry. Meanwhile, in the specific carrying process of the semiconductor machine, the bearing surfaces of the plurality of transfer devices bear the semiconductor machine, so that the semiconductor machine is stressed uniformly, meanwhile, the plurality of transfer devices can form a bearing area with a large area, the semiconductor machine is difficult to turn over in the carrying process, the semiconductor machine is prevented from being damaged due to the fact that the semiconductor machine turns over, or workers are injured, the reliability and the safety in the carrying process of the semiconductor machine are improved, and the problem that the vertical furnace is inconvenient to carry can be solved.

Drawings

FIG. 1 is a schematic view of a vertical furnace in the prior art, wherein a circle with a dotted line indicates a turning space required by the vertical furnace during the transportation process, and a cross-sectional area indicates a safety carrying area of a manual hydraulic vehicle;

fig. 2 is a schematic view of a transfer device disclosed in an embodiment of the present application;

fig. 3 is a schematic view of a transfer device disclosed in an embodiment of the present application from another perspective;

fig. 4 is a sectional view of a transfer device disclosed in an embodiment of the present application;

fig. 5 is a schematic view of a transfer device disclosed in an embodiment of the present application during a specific working process;

fig. 6 is a schematic view illustrating a transfer device according to an embodiment of the present application when the transfer device is used for transferring a semiconductor stage;

fig. 7 is a schematic view of fig. 6 from another perspective.

Description of reference numerals:

10-manual hydraulic vehicle, 20-vertical furnace machine;

100-a semiconductor machine;

200-bracket, 210-first connecting structure, 220-main body part, 230-connecting bracket;

300-a bearing frame, 310-a second connecting structure, 320-a bearing surface, 330-a first section, 340-a second section;

400-a turning wheel mechanism, 410-a universal wheel and 420-a mounting rack;

500-a protective pad;

600-a bolster block;

700-a rotating shaft;

800-traction part.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. The objects distinguished by "first", "second", and the like are usually a class, and the number of the objects is not limited, and for example, the first object may be one or a plurality of objects. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 2 to 7, the embodiment of the present application discloses a transfer device, which is used for transporting a semiconductor machine 100, the semiconductor machine 100 may be a vertical furnace machine, or may be other types of equipment, which is not limited in the embodiment of the present application. The transfer device includes a holder 200, a carriage 300, and a direction-changing wheel mechanism 400.

The support 200 is a base member of the transfer device, the support 200 can provide an installation foundation for other components of the transfer device, the support 200 is generally a steel structure support, steel materials are connected by welding or screwing to form the support 200, in order to enable the support 200 to support the semiconductor machine 100 with a large weight, the strength of the support 200 needs to be set to be large, of course, the support 200 may also be a structural member made of an alloy material, and the material of the support 200 is not limited in the embodiment of the present application. The bracket 200 is sequentially provided with a plurality of first connection structures 210 in a first direction, that is, the bracket 200 is provided with a plurality of first connection structures 210 at intervals in the first direction. The first direction is a height direction of the transfer device.

The carrier 300 is disposed on the bracket 200, the carrier 300 is provided with a second connecting structure 310, and the second connecting structure 310 is detachably connected to at least one of the plurality of first connecting structures 210, that is, the carrier 300 is connected to the first connecting structure 210 on the bracket 200 through the second connecting structure 310, so that the carrier 300 is disposed on the bracket 200. The carrier 300 has a supporting surface 320, the supporting surface 320 is used for supporting the semiconductor machine 100, and the height between the supporting surface 320 and the ground is adjustable, that is, the supporting surface 320 can move in a first direction. Specifically, since the second connection structure 310 is detachably connected to at least one of the plurality of first connection structures 210, the second connection structure 310 is switchably connected to at least one of the plurality of first connection structures 210, and the carrier 300 is movable in the first direction under the condition that the second connection structure 310 is switchably connected to at least one of the plurality of first connection structures 210, that is, the carrier 300 is movable between a plurality of positions in the first direction, so that the carrier surface 320 is movable in the first direction, and the height between the carrier surface 320 and the ground is adjustable, and when the carrier surface 320 carries the semiconductor machine 100, the height of the semiconductor machine 100 during the transportation process can be adjusted by adjusting the height of the carrier surface 320.

The turning wheel mechanism 400 realizes the movement and turning of the transfer device, the turning wheel mechanism 400 is arranged on the support 200, and the bearing surface 320 is positioned at one side of the turning wheel mechanism 400, that is, the bearing frame 300 is arranged at one side of the turning wheel mechanism 400, so that the bearing surface 320 is difficult to be limited by the turning wheel mechanism 400 when moving in the first direction, and thus the height between the bearing surface 320 and the ground is prevented from being larger due to the limitation of the turning wheel mechanism 400, and further the height between the bearing surface 320 and the ground can be smaller.

In the specific transportation process of the semiconductor apparatus 100, referring to fig. 6 and 7 again, a plurality of transfer devices may be disposed at intervals around the semiconductor apparatus 100, and the plurality of carrying surfaces 320 of the plurality of transfer devices carry the semiconductor apparatus 100, so as to transport the semiconductor apparatus 100 by moving the transfer devices.

In the transfer device disclosed in the present application, the second connecting structure 310 is detachably connected to at least one of the plurality of first connecting structures 210, so that the bearing surface 320 can move in the first direction, and thus the height between the bearing surface 320 and the ground can be adjusted, meanwhile, the turning wheel mechanism 400 is disposed on the bracket 200, and the bearing surface 320 is located at one side of the turning wheel mechanism 400, so that the bearing surface 320 is less limited by the turning wheel mechanism 400 when moving in the first direction, and thus the height between the bearing surface 320 and the ground due to the limitation of the turning wheel mechanism 400 is avoided from being large, and further the height between the bearing surface 320 and the ground can be small. In the carrying process, the lifted height of the semiconductor machine 100 is smaller, so that the semiconductor machine 100 can be prevented from being difficult to pass through the carrying-in door due to the fact that the carrying-in threshold is high, the semiconductor machine 100 can be carried at a low height, the length of the carrying device is smaller, the carrying device can turn in a narrow space through the turning wheel mechanism 400, the turning radius is smaller, turning operation of the semiconductor machine 100 in the carrying process is facilitated, and the semiconductor machine 100 is convenient to carry. Meanwhile, in the specific transportation process of the semiconductor machine 100, the plurality of carrying surfaces 320 of the plurality of transfer devices carry the semiconductor machine 100, so that the stress on the semiconductor machine 100 is relatively uniform, and meanwhile, the plurality of transfer devices can form a carrying area with a large area, so that the semiconductor machine 100 is difficult to turn on one side in the transportation process, and the semiconductor machine 100 is prevented from being damaged or workers are injured due to the fact that the semiconductor machine 100 turns on one side, thereby improving the reliability and safety in the transportation process of the semiconductor machine 100, and further solving the problem that the vertical furnace is inconvenient to transport.

Further, the turning wheel mechanism 400 may have a bottom end and a top end opposite to each other in the first direction, the bottom end of the turning wheel mechanism 400 is a portion where the turning wheel mechanism 400 contacts with the ground, and the bearing surface 320 is located between the bottom end and the top end, so that the height of the bearing surface 320 is lower, and compared with the bearing surface of the manual hydraulic vehicle, the bearing surface 320 of the transfer device can be lower than the bearing surface of the manual hydraulic vehicle.

As described above, the carrier 300 is provided with the second connecting structure 310, the second connecting structure 310 is detachably connected to at least one of the plurality of first connecting structures 210, the carrier 300 has the carrying surface 320, and the carrying surface 320 moves in the first direction, specifically, the carrier 300 may include the first section 330 extending towards the first direction and the second section 340 extending towards the direction away from the support 200, the first section 330 may be provided with the second connecting structure 310, and the first section 330 is connected to the support 200, and the second section 340 may have the carrying surface 320. When the second connection structure 310 is switchably connected to at least one of the first connection structures 210, the first segment 330 can move in the first direction, so that the carrier 300 moves in the first direction, and the carrier surface 320 on the second segment 340 moves in the first direction, so that the carrying height of the transfer device can be adjusted, and the transfer device can adaptively adjust the height of the carrier surface 320 according to the semiconductor tool 100, so that the transfer device can be used in various carrying scenarios.

Meanwhile, the second segment 340 having the supporting surface 320 enables the area of the supporting surface 320 to be larger, so that the supporting surface 320 can stably support the semiconductor apparatus 100, thereby improving the stability of the semiconductor apparatus 100 during the transportation process and preventing the semiconductor apparatus 100 from being turned over during the transportation process.

Further, the first segment 330 may have a first end and a second end opposite to each other in the first direction, the first end may be close to the direction-changing wheel mechanism 400, and the second segment 340 may be disposed at the first end, that is, the second segment 340 is located at an end of the first segment 330 close to the direction-changing wheel mechanism 400, so that the bearing frame 300 is in a down-pulling manner, so that the bearing surface 320 on the second segment 340 can be arranged lower, and in the carrying process, the lifted height of the semiconductor machine 100 is smaller, thereby preventing the semiconductor machine 100 from being difficult to pass through the carrying-in door due to the high carrying-in threshold, and further enabling the semiconductor machine 100 to be carried lower.

In the embodiment of the present application, the second connection structure 310 may be switchably connected to at least one of the plurality of first connection structures 210, so that a worker may adjust the height of the semiconductor machine 100 during the transportation process by adjusting the height of the bearing surface 320, specifically, the second connection structure 310 may be a bolt, the first connection structure 210 may be a threaded hole, the bolt may be switchably connected to at least one of the plurality of threaded holes, the bolt is connected to the threaded hole in a simple manner, the arrangement is convenient, and the connection is reliable, and meanwhile, the bolt is connected to the threaded hole in a manner that the bolt is convenient for the worker to adjust the height of the bearing surface 320, so that the worker can conveniently transport the semiconductor machine 100.

In order to prevent the semiconductor machine 100 from being scratched during the process of transporting the semiconductor machine 100 by the transfer device, the plastic-sprayed surface of the semiconductor machine 100 is scratched, and the appearance of the semiconductor machine 100 is poor. In view of this, in an alternative embodiment, the transfer device may further include a protection pad 500, and the protection pad 500 may be disposed on the carrying surface 320 for protecting the semiconductor tool 100 from being damaged by pressure when the transfer device carries the semiconductor tool 100, and particularly, in the case that the transfer device carries the semiconductor tool 100, the protection pad 500 is located between the carrying surface 320 and the semiconductor tool 100. The protection pad 500 can better protect the semiconductor machine 100 from being scratched during the transportation process, and prevent the plastic-sprayed surface of the semiconductor machine 100 from being scratched to a greater extent, thereby ensuring the aesthetic appearance of the semiconductor machine 100. Specifically, the protection pad 500 may be a silicone pad or a rubber pad.

Further, the protection pad 500 may be provided with anti-slip patterns for protecting the semiconductor device 100 from slipping off from the transferring device, and the anti-slip patterns can prevent the semiconductor device 100 from slipping during the transportation process, so that the transferring device can stably transport the semiconductor device 100, and the stability of the semiconductor device 100 during the transportation process is improved.

In order to improve the stability of the transfer device during the transportation of the semiconductor machine 100 and prevent the transfer device from turning sideways, the support 200 may optionally have an upper end and a lower end in the first direction, and the turning wheel mechanism 400 may be disposed at the lower end and connected to the lower end; the transfer device may further include a supporting pad block 600, and the supporting pad block 600 may be disposed at the upper end portion and connected to the upper end portion; the spacers 600 and the carrier 300 are located on the same side of the support 200, and when the transfer device carries the semiconductor apparatus 100, the spacers 600 contact the side surfaces of the semiconductor apparatus 100. Referring to fig. 7 again, the supporting pads 600 are supported on the side surface of the semiconductor apparatus 100 to provide a strong support for the transfer device, so as to prevent the transfer device from turning sideways, thereby improving the stability of the transfer device during the process of transporting the semiconductor apparatus 100, facilitating the operation of the transfer device by the operator, and facilitating the operator to transport the semiconductor apparatus 100.

As described above, the turning wheel mechanism 400 realizes the movement and turning of the transfer device, the turning wheel mechanism 400 is disposed on the support 200, specifically, the turning wheel mechanism 400 may include two universal wheels 410 and a mounting bracket 420, the two universal wheels 410 may be disposed on the mounting bracket 420, the mounting bracket 420 may be hinged to the support 200, the two universal wheels 410 are respectively located on two sides of the rotation axis of the mounting bracket 420, and the rotation axis of the mounting bracket 420 is perpendicular to the first direction. The universal wheels 410 can realize the movement and turning of the transfer device, so as to facilitate the movement of the transfer device, and meanwhile, referring to fig. 5 again, since the mounting frame 420 is hinged to the support 200, when the ground is uneven, the mounting frame 420 rotates in comparison with the support 200, so that the two universal wheels 410 are respectively in contact with the uneven ground, and the horizontal state of the carrying surface 320 can be ensured, thereby enabling the carrying surface 320 to stably carry the semiconductor machine 100, preventing the semiconductor machine 100 from sliding out of the carrying surface 320 due to the inclination of the carrying surface 320, and further improving the stability of the semiconductor machine 100 during the carrying process.

Further, the bracket 200 may include a main body 220 and two connection frames 230, and the two connection frames 230 may be disposed on opposite sides of the main body 220 to form a mounting space between the two connection frames 230. The turning wheel mechanism 400 is partially located in the installation space, so that the height of the support 200 can be reduced, the carrying surface 320 can be set lower, and the lifted height of the semiconductor machine 100 is smaller in the carrying process, thereby preventing the semiconductor machine 100 from being difficult to pass through the carrying-in door due to the high carrying-in door, and further enabling the semiconductor machine 100 to be carried lower.

Specifically, the transfer device may further include a rotating shaft 700 disposed in the installation space, and the mounting frame 420 is hinged to the rotating shaft 700. The mounting rack 420 is hinged to the support 200 through the rotating shaft 700, the mounting rack 420 and the support 200 can be conveniently hinged in the arrangement mode, the connection is reliable, the structure of the transfer device is simplified, and the design difficulty of designers is reduced.

In order to facilitate the movement of the transferring device driven by the operator and to conveniently carry the semiconductor equipment 100, optionally, the transferring device may further include a pulling portion 800, and the pulling portion 800 may be located on a side of the support 200 away from the carrier 300. In a specific carrying process, the worker can drive the transfer device to move through the traction part 800, and the traction part 800 can facilitate the worker to drive the transfer device to move, so that the semiconductor machine 100 can be carried conveniently.

In order to make the stress of the transfer device during the process of transporting the semiconductor apparatus 100 more uniform, and to make more areas of the semiconductor apparatus 100 located within the carrying area of the transfer device, optionally, the transfer device may include at least two carrying frames 300, and the carrying surfaces 320 of the at least two carrying frames 300 are coplanar. The at least two supporting frames 300 undoubtedly have at least two supporting surfaces 320, the at least two supporting surfaces 320 undoubtedly enable the transferring device to be stressed more uniformly in the process of carrying the semiconductor apparatus 100, meanwhile, an area enclosed by a connecting line between the at least two supporting surfaces 320 is larger, the area is a carrying area of the transferring device, and under the condition that more areas of the semiconductor apparatus 100 are located in the carrying area, the stability of the transferring device in the process of carrying the semiconductor apparatus 100 can be higher.

It should be noted that the carrying area represents the carrying surface 320 and an area surrounded by the carrying surface 320, and in the case of one carrying surface 320, the carrying surface 320 is the carrying area; in the case of two carrying surfaces 320, both the two carrying surfaces 320 and the area between the two carrying surfaces 320 are carrying areas; in the case of multiple supporting surfaces 320, the supporting surfaces 320 and the regions surrounded by the supporting surfaces 320 are all supporting regions.

Based on the transfer device disclosed in the embodiment of the present application, the embodiment of the present application further discloses a transfer device assembly, the disclosed transfer device assembly includes at least two transfer devices as described in any of the above embodiments, when the semiconductor apparatus 100 needs to be transported, the at least two transfer devices are combined for use, specifically, the carrying surfaces 320 of the at least two transfer devices form a carrying area, when the transfer devices transport the semiconductor apparatus 100, at least a part of the semiconductor apparatus 100 covers the carrying area, and the center of gravity of the semiconductor apparatus 100 is located within the carrying area. The at least two transfer devices can form a bearing area with a large area, so that the semiconductor machine 100 is difficult to turn over during the transportation process, the semiconductor machine 100 is prevented from being damaged due to the fact that the semiconductor machine 100 turns over, or workers are injured, and the reliability and the safety of the semiconductor machine 100 during the transportation process are improved.

In a specific transportation process, firstly, a special tool (which may be a crane) is used to lift the semiconductor machine 100, then a plurality of transfer devices are uniformly (or symmetrically) arranged around the semiconductor machine 100, the bearing frame 300 is inserted into the bottom of the semiconductor machine 100, then the special tool is used to slowly lower the semiconductor machine 100 so that the semiconductor machine 100 contacts and presses the bearing surface 320, in the process, the position of the transfer device is finely adjusted so that the supporting pad 600 is attached to and presses the side surface of the semiconductor machine 100, then the special tool is used to completely put down the semiconductor machine 100 so that the semiconductor machine 100 is borne by the transfer device, then a small shaking force is used to shake each transfer device, whether each transfer device is firmly installed with the semiconductor machine 100 is checked, after the check is finished, the transfer device is driven to move by the traction part 800, the semiconductor tool 100 is transported.

In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims (10)

1. A transfer device of a semiconductor machine is characterized in that the transfer device comprises:

the transfer device comprises a bracket (200), wherein a plurality of first connecting structures (210) are sequentially arranged on the bracket (200) in a first direction, and the first direction is the height direction of the transfer device;

the bearing frame (300), the bearing frame (300) is arranged on the support (200), the bearing frame (300) is provided with a second connecting structure (310), the second connecting structure (310) is detachably connected with at least one of the first connecting structures (210), the bearing frame (300) is provided with a bearing surface (320) for bearing the semiconductor machine table (100), and the height between the bearing surface (320) and the ground is adjustable;

the turning wheel mechanism (400), turning wheel mechanism (400) set up in on support (200), bearing surface (320) are located one side of turning wheel mechanism (400).

2. Transfer device according to claim 1, characterized in that the carrier (300) comprises a first section (330) extending in the first direction and a second section (340) extending in a direction away from the carrier (200), and that the first section (330) is connected to the carrier (200), and that the second section (340) has the carrying surface (320).

3. The transfer device according to claim 1, further comprising a protective pad (500), wherein the protective pad (500) is disposed on the carrying surface (320); and the surface of the protective pad (500) is provided with anti-skid lines.

4. The transfer device according to claim 1, characterized in that the carrier (200) has an upper end and a lower end in the first direction, the diverting wheel mechanism (400) being arranged at the lower end and being connected thereto; the transfer device further comprises a supporting cushion block (600), and the supporting cushion block (600) is arranged at the upper end part and is connected with the upper end part; the supporting cushion blocks (600) and the bearing frame (300) are both positioned on the same side of the support (200), and when the transferring device transfers the semiconductor machine (100), the supporting cushion blocks (600) are in contact with the side surface of the semiconductor machine (100).

5. The transfer device according to claim 1, wherein the turning wheel mechanism (400) comprises two universal wheels (410) and a mounting frame (420), the two universal wheels (410) are both disposed on the mounting frame (420), the mounting frame (420) is hinged to the support (200), the two universal wheels (410) are respectively located on two sides of a rotation axis of the mounting frame (420), and the rotation axis of the mounting frame (420) is perpendicular to the first direction.

6. The transfer device according to claim 5, wherein the rack (200) comprises a main body portion (220) and two connecting frames (230), the two connecting frames (230) being disposed on both sides of the main body portion (220) to form an installation space between the two connecting frames (230).

7. The transfer device according to claim 6, further comprising a rotating shaft (700) disposed in the installation space, wherein the mounting rack (420) is hinged by the rotating shaft (700).

8. Transfer device according to claim 1, characterized in that the transfer device further comprises a pulling part (800), which pulling part (800) is located on the side of the carrier (200) facing away from the carrier (300).

9. Transfer device according to claim 1, characterized in that the transfer device comprises at least two carriers (300) and that the carrying surfaces (320) of the at least two carriers (300) are coplanar.

10. A transfer device assembly for a semiconductor tool, comprising at least two transfer devices as claimed in any one of claims 1 to 9, wherein the carrying surfaces (320) of at least two of the transfer devices form a carrying area, when the transfer devices are used for carrying the semiconductor tool (100), at least a portion of the semiconductor tool (100) covers the carrying area, and the center of gravity of the semiconductor tool (100) is located within the carrying area.

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